Testing device

Abstract

The embodiment of the utility model provides a test device, which is applied to a test process of a test module, and comprises a shell, a test module, a power supply module and a power supply module, the temperature sensor is used for detecting the temperature of the test module; the fan is arranged in the accommodating cavity; and the controller is electrically connected with the fan and the temperature sensor, and is configured to receive the temperature detected by the temperature sensor and control the rotating speed of the fan based on the temperature. The embodiment of the utility model provides a testing device which is applied to the testing process of a testing module, heat dissipation in the testing process of the module is achieved through a fan and a controller, the fan is enabled to start a proper rotating speed at different temperatures, and energy can be saved while heat dissipation is achieved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of module testing, and particularly to a testing device. Background Art

[0002] Since current module testing is usually carried out in a shielded box environment, during the testing process, due to the small and enclosed space, the testing module generates severe heat and cannot dissipate heat. The internal temperature of the testing module has reached the protection temperature designed for the chip, triggering the thermal protection mechanism, resulting in inaccurate test data.

[0003] To improve the accuracy of test data, a heat dissipation device needs to be added to the testing device, and usually a fan is used as the heat dissipation device. However, there are still problems such as the fan speed being too small to completely cool down or the fan speed being too large resulting in excessive energy consumption. Utility Model Content

[0004] Embodiments of the present disclosure provide a testing device, which is at least beneficial to solving the problem that the rotation speed of the fan cannot be adjusted according to the temperature of the testing module.

[0005] According to some embodiments of the present disclosure, there is provided a testing device applied to the testing process of a testing module, including: a housing, the housing enclosing to form an accommodation cavity, and the testing module is located in the accommodation cavity for testing; a temperature sensor for detecting the temperature of the testing module; a fan disposed in the accommodation cavity; and a controller electrically connected to the fan and the temperature sensor respectively, and configured to receive the temperature detected by the temperature sensor and control the rotation speed of the fan based on the temperature.

[0006] In some embodiments, it further includes: a metal block, the metal block includes a first part and a second part, the fan is disposed on a surface of the first part away from the second part, and the second part abuts against the testing module.

[0007] In some embodiments, it further includes: a first fixing plate, the first fixing plate is provided with an opening facing the second part in the direction of the second part facing the testing module, and the second part passes through the opening and abuts against the testing module.

[0008] In some embodiments, it further includes: a fixing member, the first part includes at least four first fixing holes, the first fixing plate is provided with second fixing holes facing the first fixing holes in the direction of the first part facing the testing module, and the fixing member sequentially passes through the first fixing holes and the second fixing holes to fixedly connect the first fixing plate and the first part.

[0009] In some embodiments, the fan is provided with a third fixing hole facing the first fixing hole in the direction towards the first fixing plate, and the fixing member sequentially passes through the first fixing hole, the second fixing hole, and the third fixing hole.

[0010] In some embodiments, it further includes: a heat dissipation silica gel, and the heat dissipation silica gel is attached to at least a part of the surface of the test module facing the fan.

[0011] In some embodiments, the heat dissipation silica gel has a mesh structure.

[0012] In some embodiments, it further includes: a first data line, and the controller is electrically connected to the fan through the first data line; a second data line, and the controller is electrically connected to the temperature sensor through the second data line.

[0013] In some embodiments, the controller is disposed outside the accommodation cavity, and the housing is provided with through holes for the first data line and the second data line to pass through.

[0014] In some embodiments, the housing is provided with a ventilation opening opposite to the fan, and the air outlet of the fan is communicated with the ventilation opening to form a heat dissipation channel.

[0015] The technical solutions provided by the embodiments of the present disclosure have at least the following advantages:

[0016] The embodiments of the present disclosure provide a test device, which is applied to the test process of a test module, and includes: a housing, the housing encloses to form an accommodation cavity, and the test module is located in the accommodation cavity for testing; a temperature sensor, the temperature sensor is used to detect the temperature of the test module; a fan, the fan is disposed in the accommodation cavity; a controller, the controller is electrically connected to the fan and the temperature sensor respectively, and is configured to, the controller receives the temperature detected by the temperature sensor, and controls the rotation speed of the fan based on the temperature. The embodiments of the present disclosure realize the heat dissipation of the test device by setting a fan, a temperature sensor, and a controller. Since the fan can, under the action of the controller, start an appropriate rotation speed according to the temperature of the test module, the test device provided by the embodiments of the present disclosure can save energy while realizing heat dissipation. Description of the Drawings

[0017] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute limitations on the embodiments. Unless otherwise stated, the figures in the drawings do not constitute a scale limitation; in order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of a test device provided by an embodiment of the present disclosure;

[0019] Figure 2 It is another schematic structural diagram of a test device provided by an embodiment of the present disclosure. Detailed implementation manners

[0020] As can be seen from the background art, there are problems that the fan speed is too small to cool down completely or the fan speed is too large and the energy consumption is also too large.

[0021] The embodiment of the present disclosure realizes the heat dissipation of the test device by setting a fan, a temperature sensor and a controller. Since the fan can, under the action of the controller, start a suitable speed according to the temperature of the test module, the test device provided by the embodiment of the present disclosure can save energy while realizing heat dissipation.

[0022] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality" is more than two, unless otherwise specifically defined.

[0023] Referring to "embodiment" in this article means that the specific features, structures or characteristics described in combination with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0024] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: there is A, there is both A and B at the same time, and there is B. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0025] In the description of the embodiments of the present application, the term "plurality" means two or more (including two). Similarly, "multiple groups" means two or more groups (including two groups), and "multiple pieces" means two or more pieces (including two pieces).

[0026] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application.

[0027] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0028] In the corresponding drawings of the embodiments of the present application, for better understanding and convenience of description, the thickness and area of the layer are enlarged. When describing a component (such as a layer, film, region, or substrate) on or on the surface of another component, the component can be "directly" on the surface of the other component, or there can be a third component between the two components. On the contrary, when describing a component on the surface of another component or when another component is formed or provided on the surface of a component, it means that there is no third component between the two components. In addition, when describing a component "substantially" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor on a partial edge of the entire surface.

[0029] In the description of the embodiments of the present application, when a certain component "includes" another component, unless otherwise stated, other components are not excluded, and other components may further be included. In addition, when a component such as a layer, film, region, or plate is referred to as being "on / located on" another component, it may be "directly on" another component (i.e., located on the surface of another component with no other components therebetween), or there may be other components therebetween. In addition, when a component such as a layer, film, region, plate, etc. is "directly located on" another component, or when a component such as a layer, film, region, plate, etc. is located on the surface of another component, it means that no other components are located therebetween.

[0030] The terms used in the description of the various embodiments herein are only for the purpose of describing specific embodiments and are not intended to be limiting. As used in the description of the various embodiments and the appended claims, "the part" is also intended to include the plural form unless the context clearly indicates otherwise. Among them, the component includes components such as a layer, film, region, or plate.

[0031] The embodiments of the present application will be described in detail below with reference to the drawings. However, those of ordinary skill in the art can understand that in the embodiments of the present application, many technical details are presented for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.

[0032] The embodiments of the present disclosure provide a test device, which is at least helpful to solve the problem that the rotation speed of the fan cannot be adjusted according to the temperature of the test module.

[0033] Figure 1 It is a schematic structural diagram of the test device provided by the embodiments of the present disclosure. Figure 2 It is another schematic structural diagram of the test device provided by the embodiments of the present disclosure.

[0034] With reference to Figure 1 and Figure 2 , the embodiments of the present disclosure provide a test device, which is applied to the test process of the test module 12 and includes: a housing 1, the housing 1 encloses to form a receiving cavity, and the test module 12 is located in the receiving cavity for testing; a temperature sensor 2, the temperature sensor 2 is used to detect the temperature of the test module 12; a fan 3, the fan 3 is arranged in the receiving cavity; a controller 4, the controller 4 is electrically connected to the fan 3 and the temperature sensor 2 respectively, and is configured such that the controller 4 receives the temperature detected by the temperature sensor 2 and controls the rotation speed of the fan 3 based on the temperature.

[0035] The controller 4 is configured with the correspondence between the temperature value of the test module 12 and the rotation speed of the fan 3, where the rotation speed of the fan 3 is at least sufficient to cool the corresponding temperature value of the test module 12 to the normal operating temperature value of the test module 12. Specifically, the correspondence between the temperature value of the test module 12 and the rotation speed of the fan 3 includes the correspondence between the first temperature value and the first rotation speed, the correspondence between the second temperature value and the second rotation speed, the correspondence between the third temperature value and the third rotation speed, and the correspondence between the fourth temperature value and the fourth rotation speed; wherein, the controller 4 compares the current temperature value of the test module 12 with the first temperature value, the second temperature value, the third temperature value, and the fourth temperature value. If the current temperature value of the test module 12 is greater than the first temperature value and less than the second temperature value, the controller 4 controls the rotation speed of the fan 3 to be the first rotation speed. If the current temperature value of the test module 12 is greater than or equal to the second temperature value and less than the third temperature value, the controller 4 controls the rotation speed of the fan 3 to be the second rotation speed. If the current temperature value of the test module 12 is greater than or equal to the third temperature value and less than the fourth temperature value, the controller 4 controls the rotation speed of the fan 3 to be the third rotation speed. If the current temperature value of the test module 12 is greater than or equal to the fourth temperature value, the controller 4 controls the rotation speed of the fan 3 to be the fourth rotation speed.

[0036] Further, the first temperature value can be 25 degrees Celsius to 46.25 degrees Celsius, the second temperature value can be 46.25 degrees Celsius to 67.5 degrees Celsius, the third temperature value can be 67.5 degrees Celsius to 88.75 degrees Celsius, and the fourth temperature value can be 88.75 degrees Celsius to 110 degrees Celsius; the first rotation speed can be 4000 RPM, the second rotation speed can be 5000 RPM, the third rotation speed can be 6000 RPM, and the fourth rotation speed can be 8000 RPM. In some other embodiments of the present disclosure, the correspondence between the temperature value of the test module and the rotation speed of the fan can also be set according to other types of fans and test modules in the actual application process.

[0037] In the embodiment of the present disclosure, the controller 4 is configured to receive the temperature detected by the temperature sensor 2 and control the rotation speed of the fan 3 based on the temperature. Thus, on the one hand, the rotation speed of the fan 3 can be sufficient to achieve the heat dissipation of the test device, and on the other hand, the rotation speed of the fan 3 will not be too large so that the energy consumption of the fan 3 is too high.

[0038] In the embodiment of the present disclosure, the controller 4 is further configured that the controller 4 compares the current temperature value of the test module 12 with the first temperature value. If the current temperature value of the test module 12 is less than or equal to the first temperature value, the controller 4 controls the fan 3 to turn off. At the same time, the controller 4 compares the current temperature value of the test module 12 with the first temperature value. If the current temperature value of the test module 12 is greater than the first temperature value, the controller 4 controls the fan 3 to turn on to the first rotation speed.

[0039] In some other embodiments of the present disclosure, the test device can also be applied to the test process of n test modules 12, where n is a positive integer. Specifically, the n test modules 12 are located in the accommodation cavity for testing; n temperature sensors 2 are provided, and the temperature sensors 2 are used to detect the temperatures of the n modules respectively; n fans 3 and n controllers 4 are provided, and the n controllers 4 are electrically connected to the n fans 3 and the n temperature sensors 2 respectively. The controller 4 receives the temperature detected by the temperature sensor 2 and controls the rotation speed of the fan 3 based on the temperature. Thus, the heat dissipation processes of the respective test modules 12 do not interfere with each other.

[0040] In the embodiments of the present disclosure, the heat dissipation of the test device is realized by providing the fan 3, the temperature sensor 2, and the controller 4. Since the fan 3 can, under the action of the controller 4, start at an appropriate rotation speed according to the temperature of the test module 12, the test device provided by the embodiments of the present disclosure can save energy while realizing heat dissipation.

[0041] Continue to refer to Figure 1 and Figure 2 , in the embodiments of the present disclosure, it further includes: a metal block 5, the metal block 5 includes a first part 51 and a second part 52, and the fan 3 is disposed on a surface of the first part 51 away from the second part 52, and the second part 52 abuts against the test module 12.

[0042] Specifically, the first part 51 and the second part 52 constituting the metal block 5 can be fixedly connected by welding, and the first part 51 and the second part 52 can also be integrally formed. At the same time, the metal block 5 can be a metal block 5 with heat conductivity, such as a copper block or an aluminum block, etc. Thus, the metal block 5 can better conduct the heat generated by the test module 12 to the side facing the fan 3, improving the heat dissipation efficiency and heat dissipation effect.

[0043] In the embodiments of the present disclosure, it further includes: a first fixing plate 6, the first fixing plate 6 is provided with an opening facing the second part 52 in the direction of the second part 52 facing the test module 12, and the second part 52 passes through the opening and abuts against the test module 12.

[0044] In the embodiments of the present disclosure, the cross-section of the metal block 5 in the air inlet direction of the fan 3 is in a "T" shape. Thus, the second part 52 passes through the opening and abuts against the test module 12, and the surface of the first part 51 facing the second part 52 can abut against the surface of the first fixing plate 6 facing the first part 51, so that the structure between the metal block 5, the first fixing plate 6, and the test module 12 can be more stable.

[0045] In the embodiment of the present disclosure, it further includes: a fixing member 7. The first part 51 includes at least four first fixing holes 8. The first fixing plate 6 is provided with second fixing holes 9 opposite to the first fixing holes 8 in the direction of the first part 51 facing the test module 12. The fixing member 7 sequentially passes through the first fixing holes 8 and the second fixing holes 9 to fixedly connect the first fixing plate 6 to the first part 51.

[0046] Specifically, the first fixing holes 8 and the second fixing holes 9 may be threaded holes, and the fixing member 7 may be a threaded screw, whereby the threaded connection between the first fixing plate 6 and the first part 51 can be achieved. In some other embodiments of the present disclosure, the fixing member 7 may also be a pin, and then the first fixing holes 8 and the second fixing holes 9 are corresponding pin holes.

[0047] The first part 51 may also include a plurality of first fixing holes 8, such as five or six, as long as the number of the second fixing holes 9 and the fixing member 7 corresponds to the number of the first fixing holes 8, and the stability of the fixed connection between the first fixing plate 6 and the first part 51 is satisfied, which is not limited herein.

[0048] In the embodiment of the present disclosure, the fan 3 is provided with third fixing holes 10 opposite to the first fixing holes 8 in the direction facing the first fixing plate 6. The fixing member 7 sequentially passes through the first fixing holes 8, the second fixing holes 9 and the third fixing holes 10.

[0049] Specifically, the fan 3 is divided into a housing and a blower. The blower is sleeved in the housing, and the third fixing holes 10 are opened in the housing for the fixed connection of the fan 3 to the first part 51. The third fixing holes 10 may be threaded holes or pin holes corresponding to the first fixing holes 8.

[0050] In the embodiment of the present disclosure, it further includes: a heat dissipation silica gel 11. The heat dissipation silica gel 11 is attached to at least part of the surface of the test module 12 facing the fan 3.

[0051] Specifically, the heat dissipation silica gel 11 can enhance the heat transfer of the test module 12, so that the heat generated by the test module 12 converges at the heat dissipation silica gel 11. At the same time, at least part of the fan 3 is directly opposite to the heat dissipation silica gel 11, which can further improve the heat dissipation efficiency.

[0052] In the embodiment of the present disclosure, the heat dissipation silica gel 11 has a mesh structure. Setting the heat dissipation silica gel 11 as a mesh structure can, on the one hand, converge the heat generated by the test module 12, so that the fan 3 can cool the test module 12 more efficiently, and on the other hand, the fan 3 can also directly cool the outer surface of the test module 12.

[0053] In the embodiment of the present disclosure, it further includes: a first data line 13. The controller 4 is electrically connected to the fan 3 through the first data line 13; a second data line 14. The controller 4 is electrically connected to the temperature sensor 2 through the second data line 14.

[0054] The first data line 13 and the second data line 14 can adopt data lines capable of transmitting at commands. Thus, the controller 4 can receive the signal containing the temperature value of the test module 12 output by the temperature sensor 2 and adjust the rotation speed of the fan 3 according to the signal.

[0055] In the embodiment of the present disclosure, the controller 4 is arranged outside the accommodation cavity, and the housing 1 is provided with through holes for the first data line 13 and the second data line 14 to pass through.

[0056] In the embodiment of the present disclosure, the housing can be a shielding box. Setting the housing as a shielding box can avoid the influence of external signals on the signal transmission inside the shielding box, thereby avoiding affecting the heat dissipation effect during the test process.

[0057] Specifically, the through holes can be strip-shaped holes, so that both the first data line 13 and the second data line 14 can pass through the through holes to be connected to the controller 4. In some other embodiments of the present disclosure, several through holes can also be set according to the total number of data lines, and the through holes can be round holes with an inner diameter adapted to the diameter of the first data line 13 or the second data line 14.

[0058] In the embodiment of the present disclosure, the housing 1 is provided with ventilation openings at the position facing the fan 3, and the air outlet of the fan 3 is communicated with the ventilation openings to form a heat dissipation channel.

[0059] The embodiment of the present disclosure further includes a second fixing plate 15 for carrying the test module 12. The second fixing plate 15 can also be a circuit board, and the temperature sensor 2 and the test module 12 can be electrically connected to the circuit board respectively.

[0060] The embodiment of the present disclosure provides a test device applied to the test process of the test module 12, including: a housing 1, the housing 1 encloses to form an accommodation cavity, and the test module 12 is located in the accommodation cavity for testing; a temperature sensor 2 for detecting the temperature of the test module 12; a fan 3 placed in the accommodation cavity; a controller 4 electrically connected to the fan 3 and the temperature sensor 2 respectively, and configured to receive the temperature detected by the temperature sensor 2 and control the rotation speed of the fan 3 based on the temperature. The embodiment of the present disclosure realizes the heat dissipation of the test device by setting the fan 3, the temperature sensor 2 and the controller 4. Since the fan 3 can operate at an appropriate rotation speed according to the temperature of the test module 12 under the action of the controller 4, the test device provided by the embodiment of the present disclosure can save energy while realizing heat dissipation.

[0061] Those of ordinary skill in the art can understand that the above embodiments are specific examples for implementing the present disclosure. In actual applications, various changes can be made to them in form and details without departing from the spirit and scope of the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the scope defined by the claims.

Claims

1. A test device, which is applied to the test process of a test module, and is characterized in that Comprising: A housing that encloses to form a receiving cavity, and the test module is located in the receiving cavity for testing; A temperature sensor for detecting the temperature of the test module; A fan disposed in the receiving cavity; A controller electrically connected to the fan and the temperature sensor respectively, and configured to receive the temperature detected by the temperature sensor and control the rotational speed of the fan based on the temperature.

2. The test device according to claim 1, characterized in that, Further comprising: A metal block including a first part and a second part, the fan is disposed on a surface of the first part away from the second part, and the second part abuts against the test module.

3. The test device according to claim 2, wherein, Further comprising: A first fixing plate having an opening facing the second part in a direction of the second part facing the test module, and the second part passes through the opening and abuts against the test module.

4. A test device according to claim 3, characterized in that, Further comprising: A fixing member, the first part includes at least four first fixing holes, the first fixing plate is provided with second fixing holes facing the first fixing holes in a direction of the first part facing the test module, and the fixing member sequentially passes through the first fixing holes and the second fixing holes to fixedly connect the first fixing plate to the first part.

5. The test device according to claim 4, characterized in that, The fan is provided with third fixing holes facing the first fixing holes in a direction facing the first fixing plate, and the fixing member sequentially passes through the first fixing holes, the second fixing holes and the third fixing holes.

6. The test device according to claim 1, characterized in that, Further comprising: Thermal silica gel adhered to at least a part of a surface of the test module facing the fan.

7. A testing device according to claim 6, wherein The thermal silica gel has a mesh structure.

8. A test device according to claim 1, characterized in that, Further comprising: A first data line through which the controller is electrically connected to the fan; A second data line through which the controller is electrically connected to the temperature sensor.

9. A test device according to claim 8, characterized in that The controller is disposed outside the receiving cavity, and the housing is provided with through holes for the first data line and the second data line to pass through.

10. A testing device according to claim 1, wherein The housing is provided with a ventilation opening opposite to the fan, and an air outlet of the fan is communicated with the ventilation opening to form a heat dissipation channel.

Images