Switch temperature control device

Abstract

The utility model relates to the technical field of heat dissipation of switches, in particular to a temperature control device of a switch, which comprises a sampling module, a comparison module, a heat dissipation control module and a heat dissipation module, the heat dissipation module comprises a semiconductor chilling plate, and the sampling module comprises a thermistor RTD; the input end of the comparison module is connected with the thermistor RTD and used for obtaining voltage data of the thermistor RTD and judging the environment temperature according to the voltage data change of the thermistor RTD, and the output end of the comparison module is connected with the heat dissipation control module. The heat dissipation control module controls whether the semiconductor chilling plate works or not according to the received output data of the comparison module. The switch temperature control device provided by the utility model has the advantages of no noise, good heat dissipation, environmental protection effect, capability of automatically adjusting heat dissipation power and temperature and the like, greatly saves design cost, and improves machine reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of switch heat dissipation, in particular to a temperature control device for a switch. Background Technique

[0002] With the rapid development of information technology, the types of switches in the market are becoming increasingly rich, and the communication rate is also continuously increasing. However, with the enhancement of the processing capacity of the switch, the heat generated by the whole machine also increases accordingly, and the heat dissipation problem has become an important challenge in the design of high-speed switches. The common heat dissipation method is to use a high-speed fan for heat dissipation, but this method has many defects:

[0003] Noise problem: The noise generated by the high-speed fan during operation is relatively large, which not only affects the user experience but also may interfere with the working environment.

[0004] Cost problem: The cost of high-performance fans is relatively high, increasing the overall cost of the switch.

[0005] Design complexity: If intelligent control of the fan speed is required to adapt to the heat dissipation requirements under different working conditions, the design circuit will become quite complex, increasing the design difficulty and cost.

[0006] Reliability problem: As a mechanical device, the fan is prone to failure during long-term operation, affecting the stability and reliability of the whole machine. Summary of the Invention

[0007] The utility model provides a temperature control device for a switch aiming at the problems of the prior art. By using a semiconductor refrigeration chip, it realizes the advantages of no noise, good heat dissipation, environmental protection effect, and can automatically adjust the heat dissipation power and temperature, etc., greatly saving the design cost and improving the reliability of the machine.

[0008] To solve the above technical problems, the utility model adopts the following technical scheme: A temperature control device for a switch, including a sampling module, a comparison module, a heat dissipation control module, and a heat dissipation module. The heat dissipation module includes a semiconductor refrigeration chip, and the sampling module includes a thermistor RTD; the input end of the comparison module is connected to the thermistor RTD and is used to obtain the voltage data of the thermistor RTD, judge the ambient temperature according to the change of the voltage data of the thermistor RTD, the output end of the comparison module is connected to the heat dissipation control module, and the heat dissipation control module controls whether the semiconductor refrigeration chip works according to the received output data of the comparison module.

[0009] Preferably, the sampling module further includes a resistor R2, a resistor R9, and a resistor R6. The power supply voltage is connected to one end of the thermistor RTD through the resistor R2, the other end of the thermistor RTD is grounded through the resistor R9, and the input end of the comparison module is connected to one end of the thermistor RTD through the resistor R6.

[0010] Preferably, the comparison module includes a voltage comparator U2, a resistor R3, a resistor R7, a resistor R10, a resistor R5, a resistor R4, a resistor R1, a diode D1, a diode D2, and a diode D3. The supply voltage is connected to one end of the resistor R3 and the resistor R5. The other end of the resistor R5 is connected to the first input terminal of the voltage comparator U2. The second input terminal of the voltage comparator U2 is connected to the resistor R6. The resistor R3 is connected to one end of the resistor R7 and the resistor R10 through the resistor R7. The other end of the resistor R10 is grounded. The first output terminal of the voltage comparator U2 is connected to one end of the resistor R4 through the resistor R4. The other end of the resistor R1 is connected to the second output terminal of the voltage comparator U2. The third input terminal of the voltage comparator U2 is connected to the first output terminal of the voltage comparator U2. The fourth input terminal of the voltage comparator U2 is connected to the anode of the diode D1. The cathode of the diode D1 is connected to the anode of the diode D3 through the diode D2. The cathode of the diode D3 is grounded. The fourth input terminal of the voltage comparator U2 is connected to the supply voltage through the resistor R12.

[0011] Preferably, the heat dissipation control module includes a switching transistor Q1, a switching transistor Q2, a resistor R11, and a resistor R8. The first output terminal of the voltage comparator U2 is connected to the control terminal of the switching transistor Q1 through the resistor R8. The second output terminal of the voltage comparator U2 is connected to the control terminal of the switching transistor Q2 through the resistor R11. One switching terminal of the switching transistor Q2 is grounded. The other switching terminal of the switching transistor Q2 is connected to the control terminal of the switching transistor Q1 through the resistor R8. One switching terminal of the switching transistor Q1 is grounded. The other switching terminal of the switching transistor Q1 is connected to the ground terminal of the thermoelectric cooler. The power supply terminal of the thermoelectric cooler is connected to the supply voltage.

[0012] Preferably, the switching transistor Q1 is a MOS transistor, and the switching transistor Q2 is a triode.

[0013] Preferably, the thermistor RTD is a platinum resistor.

[0014] Preferably, the model of the thermoelectric cooler is DS18B20.

[0015] Advantages of the present invention:

[0016] A temperature control device for a switch provided by the present invention. The thermistor RTD changes the voltage according to the change of the ambient temperature and feeds the voltage back to the comparison module. The comparison module compares the voltage of the thermistor RTD with the set voltage in real time, so as to adjust the operation of the thermoelectric cooler according to the actual ambient temperature. The heat dissipation effect of the thermoelectric cooler of the present invention is quieter, reduces the generation of noise, and has the advantages of automatically adjusting the heat dissipation power and temperature, etc., greatly saving the design cost and improving the reliability of the machine. Description of the Drawings

[0017] Figure 1 is the signal block diagram of the present utility model;

[0018] Figure 2 is the circuit schematic diagram of the sampling module and the comparison module of the present utility model;

[0019] Figure 3 is the circuit schematic diagram of the heat dissipation control module and the heat dissipation module of the present utility model.

[0020] In Figures 1 to 3 the reference numerals include:

[0021] 1 - sampling module, 2 - comparison module, 3 - heat dissipation control module, 4 - heat dissipation module. Specific embodiments

[0022] For the convenience of those skilled in the art to understand, the present utility model will be further described below in conjunction with embodiments and the accompanying drawings. The content mentioned in the embodiments does not limit the present utility model. The present utility model will be described in detail below with reference to the accompanying drawings.

[0023] A switch temperature control device provided in this embodiment, as Figures 1 to 3 , includes a sampling module 1, a comparison module 2, a heat dissipation control module 3, and a heat dissipation module 4. The heat dissipation module 4 includes a thermoelectric cooler. The sampling module 1 includes a thermistor RTD. The input end of the comparison module 2 is connected to the thermistor RTD and is used to obtain the voltage data of the thermistor RTD, judge the ambient temperature according to the change of the voltage data of the thermistor RTD. The output end of the comparison module 2 is connected to the heat dissipation control module 3, and the heat dissipation control module 3 controls whether the thermoelectric cooler works according to the received output data of the comparison module 2.

[0024] Specifically, as Figure 1 shown, this embodiment preferably uses a thermistor RTD to detect the ambient temperature. It changes the voltage according to the change of the ambient temperature and feeds the changed voltage back to the comparison module 2. The comparison module 2 compares the voltage of the thermistor RTD with the set voltage in real time, converts the temperature into a voltage signal, and judges the change of the temperature through the comparison of the comparison module 2, so as to be able to adjust the operation of the thermoelectric cooler according to the actual ambient temperature. The heat dissipation effect of the thermoelectric cooler in this embodiment is quieter, reduces the generation of noise, and has the advantages of automatically adjusting the heat dissipation power and temperature, etc. It can save costs, avoid resource waste caused by long-term heat dissipation, and can improve the reliability of the machine.

[0025] Among them, the sampling module 1 of this embodiment is as Figure 2As shown, it includes a thermistor RTD, a resistor R2, a resistor R9, and a resistor R6. Preferably, the thermistor RTD is a platinum resistor. The power supply voltage is connected to one end of the thermistor RTD through the resistor R2, and the other end of the thermistor RTD is grounded through the resistor R9. The input end of the comparison module 2 is connected to one end of the thermistor RTD through the resistor R6.

[0026] The comparison module 2 of this embodiment is as Figure 2 shown, and it includes a voltage comparator U2, a resistor R3, a resistor R7, a resistor R10, a resistor R5, a resistor R4, a resistor R1, a diode D1, a diode D2, and a diode D3. The power supply voltage is connected to one end of the resistor R5 through the resistor R3, and the other end of the resistor R5 is connected to the first input end of the voltage comparator U2. The second input end of the voltage comparator U2 is connected to the resistor R6. The resistor R3 is connected to one end of the resistor R10 through the resistor R7, and the other end of the resistor R10 is grounded; the first output end of the voltage comparator U2 is connected to one end of the resistor R4 through the resistor R4, and the other end of the resistor R1 is connected to the second output end of the voltage comparator U2; the third input end of the voltage comparator U2 is connected to the first output end of the voltage comparator U2, the fourth input end of the voltage comparator U2 is connected to the anode of the diode D1, the cathode of the diode D1 is connected to the anode of the diode D3 through the diode D2, and the cathode of the diode D3 is grounded; the fourth input end of the voltage comparator U2 is connected to the power supply voltage through the resistor R12. The specific circuit connection of the comparison module 2 is as Figure 2 shown.

[0027] The heat dissipation control module 3 of this embodiment is as Figure 3 shown, and it includes a switching transistor Q1, a switching transistor Q2, a resistor R11, and a resistor R8. The first output end of the voltage comparator U2 is connected to the control end of the switching transistor Q1 through the resistor R8, the second output end of the voltage comparator U2 is connected to the control end of the switching transistor Q2 through the resistor R11. One switching end of the switching transistor Q2 is grounded, and the other switching end of the switching transistor Q2 is connected to the control end of the switching transistor Q1 through the resistor R8. One switching end of the switching transistor Q1 is grounded, and the other switching end of the switching transistor Q1 is connected to the ground end of the semiconductor refrigeration sheet. The power supply end of the semiconductor refrigeration sheet is connected to the power supply voltage. Preferably, the switching transistor Q1 is a MOS transistor, the switching transistor Q2 is a triode, and the model of the semiconductor refrigeration sheet is DS18B20.

[0028] The specific working principle of this embodiment is:

[0029] 1. When the switch is powered on and starts to boot, due to its own power consumption problem, the switch starts to heat up. At this time, the resistance value of the thermistor RTD is 109.8 ohms. Calculated according to the room temperature of 25 degrees Celsius, R = Ro(1 + aT), a = 0.00392; Ro = 100R,

[0030] The resistor compared with the thermistor RTD is R7. The resistance value of R7 is 125 ohms. The temperature required for the thermistor RTD to reach a resistance value of 125 ohms is 65 degrees Celsius, which is equivalent to determining the temperature at 65 degrees. During sampling, when the thermistor RTD is affected by temperature and its resistance value starts to increase, when it is lower than 125 ohms (the machine temperature is lower than 65 degrees), the circuit does not perform heat dissipation processing. When the resistance value of the thermistor RTD is higher than 125 ohms (the machine temperature is higher than 65 degrees), the heat dissipation circuit part starts to operate for heat dissipation.

[0031] 2. When the thermistor RTD is affected by temperature and its resistance value starts to change, the 3rd pin (+ phase input) and the 2nd pin (- phase input) of the voltage comparator U2 are respectively connected to the same 12V series voltage division circuit. Only at the voltage sampling point, the thermistor RTD connected to the 3rd pin is affected by temperature and its resistance value changes, while the voltage division point of the 2nd pin is connected to the resistor R7 with a fixed resistance value of 125 ohms. When the resistance value of the thermistor RTD is less than 125 ohms (the machine temperature is less than 65 degrees), the voltage of the 2nd pin of the voltage comparator U2 is higher than that of the 3rd pin at this time, and the first - path output (Control1) of the comparator is at a low level (0V). At this time, the 5th pin (+ phase input) and the 6th pin (- phase input) of the voltage comparator U2 are respectively connected in series with three diodes, namely diode D1, diode D2, and diode D3 to the ground, and pulled up to 12V through the resistor R12, so that the voltage of the 5th pin (+ phase input) is about a fixed 2.1V, as well as the Control1 control pin. When the output of the Control1 control pin is low, the + phase input of the second - path of the voltage comparator U2 is greater than the - phase input, and the second - path output is at a high level. At this time, the Control1 control pin and the Control2 control pin respectively control the heat dissipation circuit part.

[0032] 3. The heat dissipation circuit consists of a semiconductor refrigeration chip U1 (adopting the heat dissipation principle of the Peltier effect), a MOS Q1 for controlling the on / off of the refrigeration chip, and a triode Q2 for controlling the on / off of the gate of MOS Q1. The Control1 control pin is connected to the gate of MOS tube Q1, and the Control2 control pin is connected to the base of the triode Q2 for controlling the on / off of the gate of MOS Q1. When the thermistor RTD is affected by temperature and its resistance value is greater than 125 ohms (the machine temperature exceeds 65 degrees), the first path comparison of the voltage comparator U2 has the + phase input greater than the - phase input, and the Control1 control pin outputs a high level. At this time, the second path + phase input of the voltage comparator is less than the - phase input, and the Control2 control pin outputs a low level. Because the Control1 control pin outputs a high level, it will drive MOS tube Q1 to turn on, and the semiconductor refrigeration chip U1 starts to cool and dissipate heat. When the machine temperature is lower than 65 degrees after being cooled by the semiconductor refrigeration chip, at this time, the resistance value of the thermistor RTD is less than 125 ohms, the first path comparison of the voltage comparator U2 has the + phase input less than the - phase input, and the Control1 control pin outputs a low level. At this time, the second path + phase input of the voltage comparator is less than the - phase input, and the Control2 control pin outputs a high level. Because the Control1 control pin outputs a low level, MOS tube Q1 will turn off. At the same time, the high level output of the Control2 control pin will drive the triode Q2 to conduct to the ground, pulling down the gate voltage of MOS tube Q1 and turning off the cooling and heat dissipation effect of the semiconductor refrigeration chip U1. Repeating this process can achieve a good temperature control effect for the machine.

[0033] The above description is only a preferred embodiment of the present invention, and it does not impose any form of limitation on the present invention. Although the present invention is disclosed above in a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, when making some changes or modifications using the above-disclosed technical content into equivalent embodiments of equivalent changes, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical means of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. A temperature control device for a switch, characterized in that: It includes a sampling module, a comparison module, a heat dissipation control module and a heat dissipation module. The heat dissipation module includes a thermoelectric cooler. The sampling module includes a thermistor RTD. The input end of the comparison module is connected to the thermistor RTD and is used to obtain the voltage data of the thermistor RTD, and judge the ambient temperature according to the change of the voltage data of the thermistor RTD. The output end of the comparison module is connected to the heat dissipation control module, and the heat dissipation control module controls whether the thermoelectric cooler works according to the received output data of the comparison module.

2. The temperature control device for a switch according to claim 1, wherein: The sampling module further includes a resistor R2, a resistor R9 and a resistor R6. The supply voltage is connected to one end of the thermistor RTD through the resistor R2, and the other end of the thermistor RTD is grounded through the resistor R9. The input end of the comparison module is connected to one end of the thermistor RTD through the resistor R6.

3. The temperature control device for a switch according to claim 2, wherein: The comparison module includes a voltage comparator U2, a resistor R3, a resistor R7, a resistor R10, a resistor R5, a resistor R4, a resistor R1, a diode D1, a diode D2 and a diode D3. The supply voltage is connected to one end of the resistor R5 through the resistor R3. The other end of the resistor R5 is connected to the first input end of the voltage comparator U2. The second input end of the voltage comparator U2 is connected to the resistor R6. The resistor R3 is connected to one end of the resistor R10 through the resistor R7. The other end of the resistor R10 is grounded. The first output end of the voltage comparator U2 is connected to one end of the resistor R4 through the resistor R4. The other end of the resistor R1 is connected to the second output end of the voltage comparator U2. The third input end of the voltage comparator U2 is connected to the first output end of the voltage comparator U2. The fourth input end of the voltage comparator U2 is connected to the anode of the diode D1. The cathode of the diode D1 is connected to the anode of the diode D2 through the diode D2, and the cathode of the diode D3 is grounded. The fourth input end of the voltage comparator U2 is connected to the supply voltage through the resistor R12.

4. The temperature control device for a switch according to claim 3, wherein: The heat dissipation control module includes a switching transistor Q1, a switching transistor Q2, a resistor R11 and a resistor R8. The first output end of the voltage comparator U2 is connected to the control end of the switching transistor Q1 through the resistor R8. The second output end of the voltage comparator U2 is connected to the control end of the switching transistor Q2 through the resistor R11. One switching end of the switching transistor Q2 is grounded. The other switching end of the switching transistor Q2 is connected to the control end of the switching transistor Q1 through the resistor R8. One switching end of the switching transistor Q1 is grounded. The other switching end of the switching transistor Q1 is connected to the ground end of the thermoelectric cooler. The supply end of the thermoelectric cooler is connected to the supply voltage.

5. The temperature control device for a switch according to claim 4, characterized in that: The switching transistor Q1 is a MOS transistor, and the switching transistor Q2 is a triode.

6. The temperature control device for a switch according to claim 1, characterized in that: The thermistor RTD is a platinum resistor.

7. The temperature control device for a switch according to claim 1, characterized in that: The model of the thermoelectric cooler is DS18B20.

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