Double-loop water-cooling heat dissipation device
Through the dual-loop water-cooled heat dissipation device, the use of dense fins and S-type pipeline designs solves the problem of insufficient traditional air-cooled heat dissipation efficiency, and achieves efficient heat dissipation effects to ensure stable operation of the equipment.
Patent Information
- Application Number
- CN202422388899.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-30
AI Technical Summary
Traditional air-cooled heat dissipation methods are insufficient in high-power and high-density computing devices, resulting in excessive temperature of the computer host and affecting the normal use of the equipment.
A dual-loop water-cooled heat dissipation device is adopted, including a first cooling circuit and a second cooling circuit, which is connected through a heat dissipation circuit, and uses dense heat dissipation fins and S-type cooling pipeline design to increase the contact area and flow path, so as to achieve uniform distribution and efficient circulation of coolant.
Improves heat dissipation efficiency, ensures stable operation of equipment in areas such as high-performance computers and data centers, and reduces the risk of excessive temperatures.
Smart Images
Figure CN223140131U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a double-loop water-cooled heat dissipation device. Background Art
[0002] With the continuous improvement of the performance of computer hardware, especially the power consumption and heat generation of core components such as CPUs and GPUs have increased significantly, and the power consumption of computers has been increasing continuously. Therefore, a power supply with a larger capacity is required to support the normal operation of computer hardware. However, a power supply with a large capacity generates a relatively high amount of heat, and it is necessary to dissipate the heat of the computer power supply. If these high temperatures cannot be dissipated in time, it will seriously affect the stability and service life of the computer. The heat dissipation method of the power supply in the computer main chassis is mainly to improve the heat dissipation efficiency of the circuit board and the electronic components thereon by guiding the air flow.
[0003] The traditional air-cooled heat dissipation method is insufficient when dealing with high-power and high-density computing devices. Water-cooled heat dissipation has gradually become the mainstream choice due to its high heat dissipation performance and low noise level. As an advanced form of water-cooled heat dissipation technology, the double-loop water-cooled heat dissipation device has been widely used in high-performance computers, data centers, industrial control and other fields with its excellent heat dissipation effect and stability. When the heat dissipation effect of the computer main chassis is limited, the heat dissipation is reduced, the temperature becomes too high, and the normal use of the device is affected. In view of this, a double-loop water-cooled heat dissipation device is provided. Summary of the Utility Model
[0004] The main purpose of the utility model is to provide a double-loop water-cooled heat dissipation device to solve the problem that the heat dissipation of the computer main chassis is reduced and the temperature becomes too high, affecting the normal use of the device, which is proposed in the related technology.
[0005] To achieve the above purpose, according to one aspect of the utility model, a double-loop water-cooled heat dissipation device is provided, including a device main body. The device main body includes a first cooling loop and a second cooling loop, and the first cooling loop and the second cooling loop are connected through a heat dissipation loop. The heat dissipation loop is used to cool the first cooling loop and pump the coolant to the second cooling loop. The second cooling loop is used to cool the back of the heat source and return the cooled coolant to the first cooling loop. The first cooling loop and the second cooling loop are symmetrically arranged up and down.
[0006] As a preferred technical solution of the present utility model, the heat dissipation circuit at least includes a first housing, and a first heat dissipation fin is fixedly arranged in the first housing. An inlet pipe and a drain pipe are respectively penetrated through the first heat dissipation fin, and a micro water pump for controlling the circulation of the coolant is fixedly installed at one end of the inlet pipe. A first water-cooled fan is fixedly installed on one side of the first heat dissipation fin, and the first water-cooled fan discharges the heat energy in the coolant.
[0007] As a preferred technical solution of the present utility model, the first cooling circuit at least includes a second housing, and a second heat dissipation fin is fixedly arranged in the second housing. A first cooling pipe is penetrated through the second heat dissipation fin, and a second water-cooled fan is fixedly installed on one side of the second heat dissipation fin, and the second water-cooled fan discharges the heat energy in the coolant.
[0008] As a preferred technical solution of the present utility model, the second cooling circuit at least includes a third housing, a second cooling pipe is arranged in the third housing, and a third water-cooled fan is fixedly installed on one side of the third housing, and the third water-cooled fan discharges the heat energy in the coolant.
[0009] As a preferred technical solution of the present utility model, one ends of the inlet pipe and the drain pipe are respectively connected to both ends of the first cooling pipe.
[0010] As a preferred technical solution of the present utility model, the other ends of the inlet pipe and the drain pipe are respectively connected to both ends of the second cooling pipe.
[0011] As a preferred technical solution of the present utility model, the inlet pipe, the drain pipe, the first cooling pipe and the second cooling pipe form a circulating closed loop.
[0012] As a preferred technical solution of the present utility model, the first heat dissipation fin and the second heat dissipation fin are rectangular, and are arranged longitudinally as a whole.
[0013] As a preferred technical solution of the present utility model, the outlet of the micro water pump is connected to one end of the first cooling pipe, and the inlet of the micro water pump is connected to one end of the inlet pipe.
[0014] As a preferred technical solution of the present utility model, the material of the heat dissipation fin is copper.
[0015] Compared with the prior art, the present utility model has the following beneficial effects:
[0016] In this dual-loop water-cooled heat dissipation device, dense first heat dissipation fins are arranged in the heat dissipation loop to increase the contact area with the liquid inlet pipe and the liquid outlet pipe. Dense second heat dissipation fins are arranged in the first cooling pipe to increase the contact area with the first cooling pipe, absorb more heat energy of the coolant therein, and the cooling pipes in the cooling loop are distributed in an S shape to increase the flow path of the coolant, extend the cooling time, and improve the heat dissipation efficiency. Two cooling loops are arranged in this device, enabling the coolant to be more evenly distributed near the heat source and improving the overall heat dissipation efficiency. Brief Description of the Drawings
[0017] Figure 1 Figure 1 is a schematic diagram of the overall dual-loop water-cooled heat dissipation device in a preferred embodiment of the present invention;
[0018] Figure 2 Figure 2 is a schematic diagram of the overall heat dissipation loop in a preferred embodiment of the present invention;
[0019] Figure 3 Figure 3 is a plan view of the first cooling loop in a preferred embodiment of the present invention;
[0020] Figure 4 Figure 4 is a plan view of the second cooling loop in a preferred embodiment of the present invention.
[0021] Illustration:
[0022] 1. Heat dissipation loop; 11. Micro water pump; 12. First heat dissipation fins; 13. Liquid inlet pipe; 14. Drain pipe; 15. First water-cooled fan; 16. First housing;
[0023] 2. First cooling loop; 21. Second heat dissipation fins; 22. Second water-cooled fan; 23. First cooling pipe; 24. Second housing;
[0024] 3. Second cooling loop; 31. Third water-cooled fan; 32. Second cooling pipe; 33. Third housing;
[0025] 4. Device main body. Detailed Embodiment
[0026] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined utility model purpose, the following combines the drawings and preferred embodiments to detail the specific implementation manner, structure, features, and effects according to the present invention as follows.
[0027] Please refer to Figures 1 - 4As shown in the figure, the purpose of this embodiment is to provide a double-loop water-cooled heat dissipation device, including a device main body 4. The device main body 4 includes a first cooling loop 2 and a second cooling loop 3. The first cooling loop 2 at least includes a second housing 24. A second heat sink fin 21 is fixedly arranged in the second housing 24. A first cooling pipe 23 penetrates through the second heat sink fin 21. And a second water-cooled fan 22 is fixedly installed on one side of the second heat sink fin 21 to discharge the heat energy in the coolant by the second water-cooled fan 22.
[0028] The second cooling loop 3 at least includes a third housing 33. A second cooling pipe 32 is arranged in the third housing 33. And a third water-cooled fan 31 is fixedly installed on one side of the third housing 33 to discharge the heat energy in the coolant by the third water-cooled fan 31. And the first cooling loop 2 and the second cooling loop 3 are symmetrically arranged up and down.
[0029] Among them, the cooling pipe has a suitable pipe diameter and wall thickness to ensure smooth flow of the coolant and no excessive pressure loss. The flow path of the coolant is in an S shape to ensure that the coolant can fully contact and take away the heat generated by the heat source. The cooling pipe has no right-angle bends to reduce the resistance of the coolant during the flow process.
[0030] And the first cooling loop 2 and the second cooling loop 3 are connected through a heat dissipation loop 1. The heat dissipation loop 1 is used to cool the first cooling loop 2 and pump the coolant to the second cooling loop 3. The second cooling loop 3 is used to cool the back of the heat source and return the cooled coolant to the first cooling loop 2. The heat dissipation loop 1 at least includes a first housing 16. A first heat sink fin 12 is fixedly arranged in the first housing 16. An inlet pipe 13 and a drain pipe 14 penetrate through the first heat sink fin 12 respectively. And a micro water pump 11 for controlling the flow of the coolant is fixedly installed at one end of the inlet pipe 13. The outlet of the micro water pump 11 is connected to one end of the first cooling pipe 23. The inlet of the micro water pump 11 is connected to one end of the inlet pipe 13. And a first water-cooled fan 15 is fixedly installed on one side of the first heat sink fin 12 to discharge the heat energy in the coolant by the first water-cooled fan 15.
[0031] One end of the inlet pipe 13 and the drain pipe 14 are respectively connected to both ends of the first cooling pipe 23. The other ends of the inlet pipe 13 and the drain pipe 14 are respectively connected to both ends of the second cooling pipe 32. And the inlet pipe 13, the drain pipe 14, the first cooling pipe 23 and the second cooling pipe 32 form a circulating closed loop to realize the circulating cooling of the coolant.
[0032] In this device, the dense heat dissipation fins can increase the heat exchange area between the coolant and air or the external environment to improve the heat dissipation efficiency. The first heat dissipation fins 12 and the second heat dissipation fins 21 are rectangular and are arranged longitudinally as a whole. The material of the heat dissipation fins is copper, which improves the heat conduction performance and corrosion resistance of the heat dissipation fins. Moreover, the liquid inlet pipe 13, the liquid discharge pipe 14, the first cooling pipe 23 and the second cooling pipe 32 are all arranged in an S-shaped loop and penetrate through the heat dissipation fins, so as to increase the contact area between each coolant pipe and the heat dissipation fins, thereby improving the heat dissipation efficiency.
[0033] When the present utility model is specifically used, first, this device is fixedly installed on the integrated diversion plate power supply, and then the device is turned on. Under the action of the micro water pump 11, the coolant enters one end of the first cooling pipe 23 from one end of the liquid inlet pipe 13 and flows to one end of the liquid discharge pipe 14, and then enters one end of the second cooling pipe 32 from the other end of the liquid discharge pipe 14 and flows to the other end of the liquid inlet pipe 13 to form a closed loop for cyclic operation. The coolant in the second cooling loop 3 flows. Since the coolant in the second cooling pipe 32 has passed through the heat dissipation loop 1 at this time, by blowing air to the back of the heat source through the third water-cooled fan 31, while cooling the back of the heat source, the temperature of the coolant flowing back to the heat dissipation loop 1 is further reduced through the third water-cooled fan 31; the coolant in the first cooling loop 2 continuously flows, carrying part of the heat energy of the heat source, and the heat absorption efficiency is improved through the second heat dissipation fins 21. The heat energy of the second heat dissipation fins 21 is discharged through the second water-cooled fan 22. The heat energy in the heat dissipation loop 1 is transferred to the first heat dissipation fins 12 through the liquid discharge pipe 14 and discharged from the device through the first water-cooled fan 15. The double-loop water-cooled heat dissipation of the heat source is realized by the first cooling loop 2 and the second cooling loop 3.
[0034] The above is only the preferred embodiment of the present utility model and does not impose any form of limitation on the present utility model. Although the present utility model has been disclosed above with the preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to it as an equivalent embodiment within the scope of the technical solution of the present utility model. However, as long as it does not depart from the content of the technical solution of the present utility model, any brief modification, equivalent change and modification made to the above embodiment based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.
Claims
1. A double-loop water-cooled heat dissipation device, comprising a device main body (4), characterized in that, The device main body (4) includes a first cooling circuit (2) and a second cooling circuit (3), and the first cooling circuit (2) and the second cooling circuit (3) are connected through a heat dissipation circuit (1). The heat dissipation circuit (1) is used to cool the first cooling circuit (2) and pump the coolant to the second cooling circuit (3). The second cooling circuit (3) is used to cool the back of the heat source and return the cooled coolant to the first cooling circuit (2). The first cooling circuit (2) and the second cooling circuit (3) are symmetrically arranged up and down.
2. The double-loop water-cooled heat dissipation device according to claim 1, wherein, The heat dissipation circuit (1) at least includes a first housing (16). A first heat dissipation fin (12) is fixedly arranged in the first housing (16). A liquid inlet pipe (13) and a liquid discharge pipe (14) are respectively arranged through the first heat dissipation fin (12). One end of the liquid inlet pipe (13) is fixedly installed with a micro water pump (11) for controlling the flow of the coolant. A first water-cooled fan (15) is fixedly installed on one side of the first heat dissipation fin (12), and the first water-cooled fan (15) discharges the heat energy in the coolant.
3. The double-loop water-cooled heat dissipation device according to claim 2, wherein, The first cooling circuit (2) at least includes a second housing (24). A second heat dissipation fin (21) is fixedly arranged in the second housing (24). A first cooling pipe (23) is arranged through the second heat dissipation fin (21). A second water-cooled fan (22) is fixedly installed on one side of the second heat dissipation fin (21), and the second water-cooled fan (22) discharges the heat energy in the coolant.
4. The dual-loop water-cooled heat dissipation device according to claim 3, wherein The second cooling circuit (3) at least includes a third housing (33). A second cooling pipe (32) is arranged in the third housing (33). A third water-cooled fan (31) is fixedly installed on one side of the third housing (33), and the third water-cooled fan (31) discharges the heat energy in the coolant.
5. The double-loop water-cooled heat dissipation device according to claim 3, wherein, One ends of the liquid inlet pipe (13) and the liquid discharge pipe (14) are respectively connected to two ends of the first cooling pipe (23).
6. The dual-loop water-cooled heat dissipation device according to claim 4, characterized in that, The other ends of the liquid inlet pipe (13) and the liquid discharge pipe (14) are respectively connected to two ends of the second cooling pipe (32).
7. The dual-loop water-cooled heat dissipation device according to claim 4, wherein The liquid inlet pipe (13), the liquid discharge pipe (14), the first cooling pipe (23) and the second cooling pipe (32) form a circulating closed loop.
8. The dual-loop water-cooled heat dissipation device according to claim 3, wherein The first heat dissipation fin (12) and the second heat dissipation fin (21) are rectangular and are arranged longitudinally as a whole.
9. The double-loop water-cooled heat dissipation device according to claim 2, characterized in that, The water outlet of the micro water pump (11) is connected to one end of the first cooling pipe (23), and the water inlet of the micro water pump (11) is connected to one end of the liquid inlet pipe (13).
10. The dual-loop water-cooled heat dissipation device according to claim 3, characterized in that, The materials of the first heat dissipation fin (12) and the second heat dissipation fin (21) are both copper.