Wafer tray overturning jig

Abstract

The utility model relates to the field of semiconductor manufacturing, in particular to a wafer tray overturning jig, which is characterized in that a jig assembly is arranged at the right part of a workbench, the workbench is connected with the jig assembly through an overturning assembly connected to the right part of the workbench, a detection assembly is connected to the top surface of the left part of the workbench, and the jig assembly comprises a placing tray connected to the overturning assembly; a through groove is formed in the middle of the containing disc, the upper side and the lower side of the containing disc are rotationally and slidably connected with at least one rotating rod, grooves are formed in the rotating rods, the left side and the right side of the containing disc are sleeved with limiting rods in a threaded mode, and one end of each limiting rod is matched with the corresponding groove. According to the utility model, through the arrangement of the jig assembly, after the overturning assembly rotates by 180 degrees, the miniature electric push rod located at the upper part is started, and then through a series of transmission, the top block located at the upper part does not clamp a wafer any more and avoids the position of the through groove, so that the industrial camera can perfectly detect the back surface of the wafer; and the influence of the shielding of the top block is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a wafer turnover jig. Background Art

[0002] A wafer is a core component in the semiconductor manufacturing process, also known as a chip substrate or semiconductor wafer. The wafer manufacturing process includes multiple steps such as wafer growth, cutting, polishing, inspection, and cleaning. The inspection of the back of the wafer is a crucial step in the wafer manufacturing process, aiming to verify the quality, structure, and characteristics of the back of the wafer to ensure that the manufactured wafers meet the expected quality standards and technical requirements.

[0003] Existing wafer flipping jigs, such as the up-and-down clamping cover type wafer visual inspection and flippable jig disclosed in Chinese document CN202322924847.6, drive the mounting frame and the clamping device to flip through a flipping motor, so that the wafer held by the clamping device flips, facilitating the inspection of the other side of the wafer. However, during actual inspection, due to partial occlusion by the pressing plate, the entire back of the wafer cannot be fully inspected. Areas on the back that are not inspected may hide positional defects or contaminants, and these problems may cause equipment failures or product performance degradation in subsequent processes. In view of this, the utility model proposes a wafer turnover jig to solve the problem that the back of the wafer cannot be fully inspected due to jig occlusion. Summary of the Utility Model

[0004] To solve the problem that the back of the wafer cannot be fully inspected due to jig occlusion, the purpose of the utility model is to provide a wafer turnover jig.

[0005] The technical solution is as follows: A wafer turnover jig includes a workbench. A jig component is arranged on the right part of the workbench. The workbench and the jig component are connected to each other through a flipping component connected to the right part of the workbench. A detection component is connected to the top surface of the left part of the workbench. The jig component includes a placement disk connected to the flipping component. A through groove is arranged in the middle of the placement disk. At least one rotating rod is rotatably and slidably connected to both the upper and lower sides of the placement disk. A groove is arranged on the rotating rod. Limiting rods are threadedly sleeved on both the left and right sides of the placement disk. One end of the limiting rod cooperates with the groove. A connecting block is fixedly connected to the rotating rod. A top block is installed on the connecting block. A gear is fixedly connected to one end of the rotating rod. At least one rack is slidably connected to both the upper and lower sides inside the placement disk. The rack meshes with the gear. One end of the rack is fixedly connected to a connecting plate. Miniature electric push rods are installed on both the upper and lower sides inside the placement disk. The telescopic rod of the miniature electric push rod is fixedly connected to the connecting plate.

[0006] Furthermore, a contact sensor is fixedly installed inside the top block.

[0007] Further, an ear handle facilitating the grasping of the flipping assembly is fixedly connected to the left side surface of the placing tray.

[0008] Further, the flipping assembly includes a base fixedly connected to the upper left part of the workbench. A rotating shaft is rotatably connected to the upper part of the base. A rotating block is fixedly connected to the rotating shaft. A clamping cylinder is fixedly connected to the side surface of the rotating block. The clamping jaws of the clamping cylinder are in contact with the ear handle. A rotating motor is installed on the base. The rotating motor and the rotating shaft are connected to each other through a synchronous pulley assembly.

[0009] Further, the detection assembly includes a hydraulic cylinder installed on the upper left part of the workbench. A mounting plate is fixedly connected to the telescopic rod of the hydraulic cylinder. An industrial camera is installed on the bottom surface of the mounting plate.

[0010] Further, an air nozzle is installed on the bottom surface of the mounting plate.

[0011] The beneficial effects of the present utility model are as follows: By providing a jig assembly, the micro electric push rod located at the upper part is started, and then through a series of transmissions, the top block located at the upper part clamps the wafer. Then, it is rotated 180 degrees by the flipping assembly to turn the back surface of the wafer upwards. Next, the micro electric push rod located at the upper part after flipping is started, and then through a series of transmissions, the top block located at the upper part no longer clamps the wafer and avoids the position of the through groove, enabling the industrial camera to perfectly detect the back surface of the wafer without being affected by the occlusion of the top block, improving the accuracy and reliability of the back surface detection, ensuring the quality of the wafer during the production process, and reducing the false judgment caused by the visual detection dead angle. Description of the Drawings

[0012] Figure 1 is a three-dimensional structural schematic diagram of the present utility model.

[0013] Figure 2 is a structural schematic diagram of the flipping assembly and the jig assembly of the present utility model.

[0014] Figure 3 is a structural schematic diagram of components such as the flip gear, rack, and rotating rod of the present utility model.

[0015] Figure 4 is a cross-sectional view of components such as the contact sensor, limit rod, and rack of the present utility model.

[0016] Among them, the above-mentioned drawings include the following reference numerals: 1 - workbench, 201 - base, 202 - rotating motor, 203 - rotating shaft, 204 - rotating block, 205 - clamping cylinder, 206 - synchronous pulley assembly, 301 - hydraulic cylinder, 302 - mounting plate, 303 - industrial camera, 304 - air nozzle, 401 - placing tray, 4011 - through groove, 402 - rotating rod, 4021 - groove, 403 - rack, 404 - gear, 405 - limiting rod, 406 - connecting plate, 407 - micro electric push rod, 408 - top block, 4081 - contact sensor, 409 - connecting block, 411 - ear handle. Detailed implementation manner

[0017] The technical solution of the present utility model will be further described below in conjunction with the drawings.

[0018] A wafer turnover jig, as Figures 1 - 4As shown in the figure, it includes a workbench 1. A jig component is arranged on the right part of the workbench 1. The workbench 1 and the jig component are connected to each other through a flipping component connected to the right part of the workbench 1. A detection component is connected to the top surface of the left part of the workbench 1. The jig component includes a placement plate 401 connected to the flipping component. The placement plate 401 is made of silicon nitride. Silicon nitride has excellent mechanical properties, hardness and high-temperature resistance, and at the same time has good chemical stability and anti-static characteristics. The placement plate 401 is internally provided with a battery for supplying power to the electrical components on the placement plate 401 and a control circuit board for controlling the electrical components on the placement plate 401. At the same time, the control circuit board is provided with a Bluetooth module for connecting to an external control system. A through groove 4011 is arranged in the middle of the placement plate 401. Two rotating rods 402 are rotatably and slidably connected to both the upper and lower sides of the placement plate 401. The two rotating rods 402 on the same side are symmetrically arranged. A groove 4021 is arranged on the rotating rod 402. The groove 4021 is divided into two sections. One end is arc-shaped, and the other end is an inclined arc with the bottom surface of the rotating rod 402 as the reference surface. The left and right sides of the placement plate 401 are threadedly sleeved with limit rods 405. One end of the limit rod 405 cooperates with the groove 4021. Through the cooperation of the limit rod 405 and the groove 4021, the up and down sliding of the rotating rod 402 can be realized. A connecting block 409 is fixedly connected to the rotating rod 402. A top block 408 is installed on the connecting block 409 in the direction towards the placement plate 401. The top block 408 is made of nylon. Nylon can effectively reduce the risk of surface damage to the wafer when contacting the wafer. A contact sensor 4081 is fixedly installed inside the top block 408. A gear 404 is fixedly connected to the end of the rotating rod 402 that rotates and slides inside the placement plate 401. Two racks 403 are slidably connected to both the upper and lower sides inside the placement plate 401. The racks 403 are meshed with the gear 404. The mutual cooperation of the racks 403 and the gear 404 can realize the rotation of the rotating rod 402. And under the cooperation of the limit rod 405 and the groove 4021, the rotation angle of the rotating rod 402 is 90 degrees. One end of the rack 403 is fixedly connected to a connecting plate 406. Miniature electric push rods 407 are installed on both the upper and lower sides inside the placement plate 401. The telescopic rod of the miniature electric push rod 407 is fixedly connected to the connecting plate 406. During operation, the wafer is placed in the through groove 4011 of the placement plate 401 by a manipulator. The through groove 4011 is slightly larger than the wafer to facilitate better placement of the wafer. The wafer enters the through groove 4011 and contacts the lower top block 408. Then the contact sensor 4081 located below senses the signal and then transmits the signal to the control circuit board. The control circuit board controls the start of the miniature electric push rod 407 located above. Then the telescopic rod of the miniature electric push rod 407 extends, driving the connecting plate 406 to extend, causing the rack 403 to slide inside the placement plate 401. Then the rack 403 drives the gear 404 to rotate through meshing transmission. Then the gear 404 drives the rotating rod 402 to rotate. Then the rotating rod 402 drives the top block 408 to rotate.While the rotating rod 402 rotates, the groove 4021 on the rotating rod 402 cooperates with the limiting rod 405, so that the rotating rod 402 moves downward, and then drives the top block 408 to move downward. Then, the four top blocks 408 above and below clamp the wafer simultaneously. Then, the contact sensor 4081 located in the upper part senses the signal, and then transmits the signal to the control circuit board. The control circuit board transmits the signal to the external control system through the Bluetooth module. The external control system starts the flipping component to rotate the jig component by 180 degrees. After the jig component rotates 180 degrees, the micro electric push rod 407 located in the upper part is started. The micro electric push rod 407 located in the upper part retracts, so that the rack 403 slides reversely in the placement tray 401. Then, the rack 403 drives the gear 404 to rotate reversely through meshing transmission. Then, the gear 404 drives the rotating rod 402 to rotate reversely. Then, the rotating rod 402 drives the top block 408 to rotate reversely. While the rotating rod 402 rotates reversely, the groove 4021 on the rotating rod 402 cooperates with the limiting rod 405, so that the rotating rod 402 moves upward, and then drives the top block 408 to move upward. Then, the two top blocks 408 located in the upper part no longer clamp the wafer, and at the same time, they both avoid the position of the through groove 4011, so that the detection component can perfectly detect the back of the wafer without being affected by the occlusion of the top block 408, improving the accuracy and reliability of the back detection, ensuring the quality of the wafer during the production process, and reducing the misjudgment caused by the visual detection dead angle.

[0019] Further, an ear handle 411 convenient for the flipping component to grab is fixedly connected to the left side surface of the placement tray 401. The flipping component includes a base 201 fixedly connected to the upper left part of the workbench 1. A rotating shaft 203 is rotatably connected to the upper part of the base 201. A rotating block 204 is fixedly connected to the rotating shaft 203. A clamping cylinder 205 is fixedly connected to the side surface of the rotating block 204. The claw of the clamping cylinder 205 is in contact with the ear handle 411. A rotating motor 202 is installed on the base 201. The rotating motor 202 and the rotating shaft 203 are connected to each other through a synchronous pulley assembly 206. During operation, when the jig component rotates 180 degrees, the external control system controls the rotating motor 202 to start. The output shaft of the rotating motor 202 drives the rotating shaft 203 to rotate through the synchronous pulley assembly 206. Then, the rotating shaft 203 drives the rotating block 204 to rotate. Then, the rotating block 204 drives the jig component to rotate 180 degrees.

[0020] Further, the detection component includes a hydraulic cylinder 301 installed at the upper left part of the workbench 1. A mounting plate 302 is fixedly connected to the telescopic rod of the hydraulic cylinder 301. An industrial camera 303 and a gas nozzle 304 are installed on the bottom surface of the mounting plate 302. During operation, first, the gas nozzle 304 is connected to an external gas tank. After the jig component is flipped 180 degrees, the external control system activates the industrial camera 303 to detect the back of the wafer. When foreign objects are detected, the hydraulic cylinder 301 is activated, and the telescopic rod of the hydraulic cylinder 301 extends, thereby driving the mounting plate 302 to move downward, making the gas nozzle 304 close to the back of the wafer. Then, the gas nozzle 304 is activated, and the gas nozzle 304 sprays the gas in the gas tank to remove the dust and impurities on the back of the wafer. After the detection is completed, the hydraulic cylinder 301 resets, and then the wafer is taken out by a manipulator. Then, the jig component is reset by the flipping component. When the jig is reset, all the electrical components in the placement tray 401 are reset for repeated operations.

[0021] In other embodiments, the jig component loaded with the wafer can be conveyed to the flipping component by a conveying device, and then the flipping component rotates the jig component 180 degrees for detection. After the detection is completed, the jig component is conveyed to the next process by the conveying device.

[0022] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A wafer turnover fixture, comprising a workbench (1), characterized in that, A fixture assembly is provided on the right part of the workbench (1). The workbench (1) and the fixture assembly are connected to each other through a flipping assembly connected to the right part of the workbench (1). A detection assembly is connected to the top surface of the left part of the workbench (1). The fixture assembly includes a placement plate (401) connected to the flipping assembly. A through groove (4011) is provided in the middle of the placement plate (401). At least one rotating rod (402) is rotatably and slidably connected to both the upper and lower sides of the placement plate (401). A groove (4021) is provided on the rotating rod (402). Limiting rods (405) are threadedly sleeved on both the left and right sides of the placement plate (401). One end of the limiting rod (405) cooperates with the groove (4021). A connecting block (409) is fixedly connected to the rotating rod (402). A top block (408) is installed on the connecting block (409). A gear (404) is fixedly connected to one end of the rotating rod (402). At least one rack (403) is slidably connected to both the upper and lower sides inside the placement plate (401). The rack (403) meshes with the gear (404). One end of the rack (403) is fixedly connected to a connecting plate (406). Miniature electric push rods (407) are installed on both the upper and lower sides inside the placement plate (401). The telescopic rods of the miniature electric push rods (407) are fixedly connected to the connecting plate (406).

2. The wafer turnover fixture according to claim 1, characterized in that, A contact sensor (4081) is fixedly installed inside the top block (408).

3. A wafer turnover jig according to claim 2, characterized in that, An ear handle (411) convenient for the flipping assembly to grab is fixedly connected to the left side surface of the placement plate (401).

4. A wafer turnover fixture according to claim 3, characterized in that, The flipping assembly includes a base (201) fixedly connected to the upper left part of the workbench (1). A rotating shaft (203) is rotatably connected to the upper part of the base (201). A rotating block (204) is fixedly connected to the rotating shaft (203). A clamping cylinder (205) is fixedly connected to the side surface of the rotating block (204). The jaws of the clamping cylinder (205) are in contact with the ear handle (411). A rotating motor (202) is installed on the base (201). The rotating motor (202) and the rotating shaft (203) are connected to each other through a synchronous pulley assembly (206).

5. The wafer turnover jig according to claim 4, characterized in that, The detection assembly includes a hydraulic cylinder (301) installed on the upper left part of the workbench (1). A mounting plate (302) is fixedly connected to the telescopic rod of the hydraulic cylinder (301). An industrial camera (303) is installed on the bottom surface of the mounting plate (302).

6. The wafer turnover fixture according to claim 5, wherein, An air nozzle (304) is installed on the bottom surface of the mounting plate (302).

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