Silicon wafer hooking mechanism

By configuring hook parts on the conveying mechanism and using the drive device to push the locking of the silicon wafer, the problem of silicon wafer locking in the flower basket in the silicon wafer automation production line is solved, and efficient transportation of the silicon wafer is achieved.

CN223140756UActive Publication Date: 2025-07-22基则曼(苏州)科技有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422023669.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-20
Publication Date
2025-07-22
Estimated Expiration
2034-08-20

AI Technical Summary

Technical Problem

The conveying mechanism in the traditional silicon wafer automation production line is difficult to deal with the conveying problem when the top-down silicon wafer stacked in the flower basket is blocked, which affects the conveying efficiency of the silicon wafer.

Method used

The hook material is arranged on the conveying mechanism, and the hook material is driven to move in the first direction through the first driving device to push the jammed silicon wafer in the flower basket and make it discharge smoothly.

Benefits of technology

It improves the handling efficiency of silicon wafers, ensures the smooth discharge and transportation of silicon wafers, and is practical.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223140756U_ABST
    Figure CN223140756U_ABST
Patent Text Reader

Abstract

The utility model discloses a silicon wafer material hooking mechanism which comprises a conveying mechanism and a material hooking piece, the conveying mechanism horizontally conveys silicon wafers along a first direction, and the material hooking piece is arranged on the conveying mechanism. A material hooking part which is relatively positioned at the upper part of the conveying mechanism and has a blocking effect on silicon wafers placed on the conveying mechanism is formed on the conveying mechanism; the first driving device is arranged on the conveying mechanism and used for driving the material hooking piece to move on the conveying mechanism in the first direction. The silicon wafer conveying mechanism can solve the problem that the silicon wafer conveying mechanism does not have the function of removing the faults of the clamped silicon wafers in the flower basket.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production equipment, and particularly relates to a silicon wafer hook feeding mechanism. Background Art

[0002] In the production process of silicon wafers, it is necessary to use a production line to automatically convey the silicon wafers. In the automatic silicon wafer production line, there are a flower basket for storing or discharging the silicon wafers and a conveying mechanism for discharging the silicon wafers in the flower basket. The conveying mechanism in the traditional automatic silicon wafer production line generally only has the function of conveying the silicon wafers. However, when the silicon wafers stacked from top to bottom in the flower basket are stuck, it is difficult for the conveying mechanism to convey the stuck silicon wafers in the flower basket, and it is necessary for the staff to troubleshoot in time, which affects the conveying efficiency of the silicon wafers. Summary of the Utility Model

[0003] In order to overcome the above disadvantages, the purpose of the utility model is to provide a silicon wafer hook feeding mechanism.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model includes:

[0005] A conveying mechanism and a hook feeding member. The conveying mechanism forms a horizontal conveyance of the silicon wafers along a first direction. The hook feeding member is arranged on the conveying mechanism and has a hook feeding portion that is relatively located above the conveying mechanism and has a blocking effect on the silicon wafers placed on the conveying mechanism.

[0006] A first driving device, which is arranged on the conveying mechanism and is used to drive the hook feeding member to move along the first direction on the conveying mechanism.

[0007] By arranging a hook feeding member with a hook feeding portion on the conveying mechanism in the present application, in a way of pushing the silicon wafers stuck at the bottom of the flower basket, the discharging efficiency of the silicon wafers in the flower basket can be effectively guaranteed, the handling efficiency of the silicon wafers can be improved, and it has practicability.

[0008] In the preferred technical solution of the above silicon wafer hook feeding mechanism, the conveying mechanism includes a frame body, a conveyor belt arranged on the frame body along the first direction, and a second driving device for controlling the rotation of the conveyor belt.

[0009] In the preferred technical solution of the above silicon wafer hook feeding mechanism, the first driving device is a driving cylinder.

[0010] In the preferred technical solution of the above silicon wafer hook feeding mechanism, the hook feeding portion is relatively located at the feeding port of the conveyor belt.

[0011] In the preferred technical solution of the above silicon wafer hook feeding mechanism, a guide rail is arranged on the frame body along the first direction, and the hook feeding member is slidably arranged on the guide rail through a slider.

[0012] In the preferred technical solution of the above-mentioned silicon wafer hooking mechanism, the hooking part includes a supporting structure and a blocking structure disposed on the supporting structure.

[0013] In the preferred technical solution of the above-mentioned silicon wafer hooking mechanism, the blocking structure is made of an elastic sheet, and a magnet is disposed on the supporting structure on the side away from the conveyor belt.

[0014] In the preferred technical solution of the above-mentioned silicon wafer hooking mechanism, at least two groups of the blocking structures are disposed on the supporting structure along the second direction.

[0015] In the preferred technical solution of the above-mentioned silicon wafer hooking mechanism, a stop rod is disposed on the frame body. The stop rod is located on the side away from the conveyor belt relative to the hooking part, and the stop rod is relatively located between the blocking structure and the magnet.

[0016] In the preferred technical solution of the above-mentioned silicon wafer hooking mechanism, a rubber cushion layer is coated on the surface of the blocking structure.

[0017] The beneficial effect of the present utility model is that by disposing a hooking member with a hooking part on the conveying mechanism and using the first driving device to drive the hooking member to move along the first direction, the silicon wafers that are stacked at the bottom and are stuck inside the flower basket are pushed to move along the first direction, so that the silicon wafers can be smoothly dropped onto the conveyor belt for discharging and conveying, improving the handling efficiency of the silicon wafers and having practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the front view of the present utility model;

[0019] Figure 2 is the right view of the present utility model;

[0020] Figure 3 is the structural schematic diagram of the hooking member;

[0021] Figure 4 is the position relationship diagram of the silicon wafer hooking mechanism and the flower basket;

[0022] Figure 5 is Figure 4 the partial enlarged view at A in

[0023] In the figure: conveying mechanism 1, frame body 11, conveyor belt 12, second driving device 13, hooking member 2, hooking part 21, supporting structure 211, blocking structure 212, first driving device 3, flower basket 4, discharge port 41, bearing plate 42, guide rail 51, slider 52. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present utility model and are not intended to limit the protection scope of the present utility model.

[0025] It should be noted that in the description of the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] In addition, it should also be noted that in the description of the present utility model, unless otherwise clearly specified and defined, the terms "set", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] As Figures 1 to 5 shown, the silicon wafer picking mechanism of the present utility model includes: a conveying mechanism 1 and a picking member 2. The conveying mechanism 1 forms a horizontal conveyance of the silicon wafers in the first direction. The picking member 2 is disposed on the conveying mechanism 1 and is formed with a picking portion 21 that is located relatively above the conveying mechanism 1 and has a blocking effect on the silicon wafers placed on the conveying mechanism 1; a first driving device 3, which is disposed on the conveying mechanism 1 and is used to drive the picking member 2 to move along the first direction on the conveying mechanism 1.

[0028] See Figure 4 、 Figure 5 , the flower basket 4 has a discharge port 41. The flower basket 4 is formed with a horizontal placement bearing plate 42 for the silicon wafers in the height direction. A plurality of silicon wafers can be stacked on the bearing plates 42 at different heights in sequence to achieve the collection of the silicon wafers. The bottom of the flower basket 4 is provided with an opening, and the silicon wafer picking mechanism is relatively located within the opening; it should be noted that the flower basket 4 can be driven by a driving module to move up or down relative to the silicon wafer picking mechanism, so that the silicon wafers in the flower basket 4 can fall onto the conveying mechanism 1 for conveyance. The driving module can be a linear module.

[0029] See Figure 1 、 Figure 4 , the first direction is the direction in which the conveying mechanism 1 conveys the silicon wafers for blanking.

[0030] See Figures 1 to 3, the silicon wafer hooking mechanism includes a conveying mechanism 1 for conveying the silicon wafers discharged from the carrier 4, a hooking member 2 disposed on the conveying mechanism 1, and a first driving device 3 for driving the hooking member 2 to move in the first direction; wherein, the hooking portion 21 formed by the hooking member 2 in the first direction can push the silicon wafers stuck in the carrier 4 or on the conveying mechanism 1 to move the silicon wafers in the first direction.

[0031] See Figure 4 , in the initial state, the conveying mechanism 1 is located inside the opening at the bottom of the carrier 4, the hooking portion 21 is located above the bottom of the carrier 4, and the hooking portion 21 extends in the first direction to the rear position of the silicon wafers stored in the carrier 4.

[0032] When discharging and conveying the silicon wafers, the driving module is used to control the carrier 4 to move downwards so that the lowermost stacked silicon wafers in the carrier 4 can be discharged onto the conveying mechanism 1, and then the conveying mechanism 1 is used to convey the silicon wafers in the first direction for discharging.

[0033] When the silicon wafers are stuck in the carrier 4, control the carrier 4 to move downwards so that the rear end position of the silicon wafers is directly opposite to the hooking portion 21 of the hooking member 2, that is, the silicon wafers and the hooking portion 21 are at the same height. Then, use the first driving device 3 to control the hooking portion 21 of the hooking member 2 to move in the first direction so that the hooking portion 21 abuts against the silicon wafers. The hooking portion 21 applies pressure to the silicon wafers stuck in the carrier 4 so that the silicon wafers can move relative to the carrier 4. Then, control the carrier 4 to move downwards and fall onto the conveying mechanism 1 and be conveyed and discharged in the first direction by the conveying mechanism 1.

[0034] When the silicon wafers are stuck on the conveying mechanism 1 and difficult to discharge, directly use the first driving device 3 to control the hooking portion 21 of the hooking member 2 to move in the first direction to approach and abut against the silicon wafers, so as to apply an external force to the silicon wafers, enabling the conveying mechanism 1 to discharge the silicon wafers.

[0035] In this application, by configuring the hooking member 2 with the hooking portion 21 on the conveying mechanism 1 to push the silicon wafers stuck at the bottom of the carrier 4, the discharging efficiency of the silicon wafers in the carrier 4 can be effectively guaranteed, the handling efficiency of the silicon wafers can be improved, and it has practicality.

[0036] In one or more embodiments, the conveying mechanism 1 includes a frame 11, a conveyor belt 12 disposed on the frame 11 along the first direction, and a second driving device 13 for controlling the rotation of the conveyor belt 12.

[0037] See Figures 1 to 3 , the frame 11 can be placed inside the opening of the carrier 4. There are two groups of conveyor belts 12 disposed on the frame 11 along the first direction. The conveyor belts 12 are connected to the drive shaft end of the second driving device 13 through pulleys and belts. The second driving device 13 can be a servo motor; the hooking portion 21 of the hooking member 2 is relatively located at the feeding port of the conveyor belt 12.

[0038] During operation, the control basket 4 is moved downward so that the wafers stacked at the bottom in the basket 4 fall onto the conveyor belt 12. After that, the second driving device 13 is used to control the rotation of the conveyor belt 12, so that the conveyor belt 12 controls the feeding of the wafers in the first direction, which has the characteristics of simple structure and convenient operation.

[0039] In one or more embodiments, the first driving device 3 is a driving cylinder. Refer to Figure 2 , the driving cylinder is installed on the frame 11 in the first direction, the driving cylinder is relatively located at the lower position of the conveyor belt 12, and the extending shaft end of the driving cylinder is connected to the hook member 2; when pushing the wafers, only the driving cylinder needs to be controlled to move the hook member 2 in the first direction, which has the characteristics of stable structure and convenient operation.

[0040] In one or more embodiments, a guide rail 51 is arranged on the frame 11 in the first direction, and the hook member 2 is slidably arranged on the guide rail 51 through a slider 52.

[0041] Refer to Figure 2 , by sliding the hook member 2 on the guide rail 51 only in the first direction by using the slider 52, the movement stability of the hook member 2 can be improved, and the position deviation of the hook member 2 can be avoided.

[0042] In one or more embodiments, the hook portion 21 includes a support structure 211 and a blocking structure 212 arranged on the support structure 211; the blocking structure 212 is made of an elastic sheet, and a magnet is arranged on the support structure 211 on the side away from the conveyor belt 12; at least two groups of the blocking structure 212 are arranged on the support structure 211 in the second direction; the second direction is the width direction of the basket 4.

[0043] Refer to Figure 3 , in the initial state, the blocking structure 212 is in a vertical state and is not adsorbed by the magnet.

[0044] When the wafers stacked at the bottom in the basket 4 are stuck, the blocking structure 212 is used to push the wafers in the first direction. When the wafers are stuck, it is difficult for the blocking structure 212 to push the wafers. To avoid the blocking structure 212 damaging the wafers, the blocking structure 212 in this application is configured as an elastic sheet structure, so that after the wafers are stuck, the blocking structure 212 is squeezed by the wafers and moves towards the magnet and is adsorbed by the magnet. At this time, the blocking structure 212 no longer contacts the wafers. Under the action of the first driving device 3, the blocking structure 212 can move in the first direction below the stuck wafers, thereby avoiding the phenomenon that the blocking structure 212 applies a large pressure to the wafers and causes the wafers to be damaged. At the same time, the deformed blocking structure 212 is adsorbed by the magnet, avoiding the blocking structure 212 from scratching the lower surface of the wafers, and further forming protection for the wafers.

[0045] In one or more embodiments, a stop bar is disposed on the frame body 11. The stop bar is located on the side away from the conveyor belt 12 relative to the hook material portion 21, and the stop bar is located between the blocking structure 212 and the magnet.

[0046] The accompanying drawings do not show the stop bar. The stop bar is disposed on the frame body 11 and does not move relative to the blocking structure 212. When the blocking structure 212 is adsorbed by the magnet, the first driving device 3 is used to control the blocking structure 212 to move in the reset direction, so that the stop bar enters between the blocking structure 212 and the magnet, and the stop bar separates the magnet and the blocking structure 212. Through this setting, the process of manually separating the blocking structure 212 from the magnet can be reduced, and the degree of automation is high.

[0047] In one or more embodiments, the surface of the blocking structure 212 is coated with a rubber cushion layer. Through this setting, flexible contact between the blocking structure 212 and the silicon wafer can be achieved, and the problem of damage to the silicon wafer when it is pushed by the blocking structure 212 can be reduced.

[0048] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it. It should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer hook material mechanism, characterized in that, Comprising: A conveying mechanism and a hook material component. The conveying mechanism forms a horizontal conveyance of wafers in a first direction. The hook material component is disposed on the conveying mechanism and has a hook material portion that is relatively located above the conveying mechanism and has a blocking effect on the wafers placed on the conveying mechanism. A first driving device, which is disposed on the conveying mechanism and is used to drive the hook material component to move on the conveying mechanism in the first direction.

2. The silicon wafer hook material mechanism according to claim 1, characterized in that: The conveying mechanism includes a frame body, a conveyor belt disposed on the frame body in the first direction, and a second driving device for controlling the rotation of the conveyor belt.

3. The silicon wafer hook material mechanism according to claim 1, characterized in that: The first driving device is a driving cylinder.

4. The slicon wafer hook material mechanism according to claim 2, characterized in that: The hook material portion is relatively located at the feeding port of the conveyor belt.

5. The silicon wafer hook material mechanism according to claim 2, wherein: A guide rail is disposed on the frame body in the first direction, and the hook material component is slidably disposed on the guide rail through a slider.

6. The silicon wafer hook material mechanism according to claim 2, characterized in that: The hook material portion includes a support structure and a blocking structure disposed on the support structure.

7. The silicon wafer hook material mechanism according to claim 6, characterized in that: The blocking structure is made of an elastic sheet, and a magnet is disposed on the support structure on the side away from the conveyor belt.

8. The silicon wafer hook material mechanism according to claim 6 or 7, characterized in that: At least two groups of the blocking structures are disposed on the support structure in a second direction.

9. The silicon wafer hook material mechanism according to claim 7, characterized in that: A stop bar is disposed on the frame body. The stop bar is relatively located on the side away from the conveyor belt with respect to the hook material portion, and the stop bar is relatively located between the blocking structure and the magnet.

10. The silicon wafer hook material mechanism according to claim 7, characterized in that: A rubber cushion layer is coated on the surface of the blocking structure.