Anti-reflow soldering material head lowering structure
By introducing liquid tin soldering and bending pin design of bare copper layer and steel mesh layer into the S2 joint, the problem of heavy head of the S2 joint when installing the PCB board is solved, convenient installation and high-strength connection are achieved, and production costs are reduced.
Patent Information
- Application Number
- CN202422379633.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The existing S2 connectors are prone to heavy heads when installed on PCB boards, resulting in increased production costs and manual correction is required.
A head-down structure for anti-reflow soldering materials is designed, and the head-down structure of bare copper layer and the steel mesh layer are contacted with the PCB board. The steel mesh layer and the PCB board are pulled by liquid tin soldering, and multiple bent pins are set to fix the threaded interface body to reduce the degree of head-down.
Effectively prevent heavy heads and light bodies, reduce manual correction needs, reduce production costs, and improve connection strength and stability of welding structure.
Smart Images
Figure CN223141059U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radio frequency manufacturing, in particular to a reflow soldering prevention material head lowering structure. Background Art
[0002] In the TV industry, the RF radio frequency input interface is mainly used, commonly known as the "cable TV interface". The video and audio signals of the TV interface are combined on one line for transmission, and the signals interfere with each other relatively seriously, so its picture output quality is the worst of all interfaces. Its advantage is that it is suitable for long-distance transmission. This interface can receive TV programs provided by local cable TV operators by connecting to cable TV lines. This interface is divided into T2 and S2. T2 uses OFDM modulation and is a straight head interface. S2 is LDPC+BCH modulation and is a threaded connector. The S2 threaded connector is divided into two types: "external thread + jack" and "internal thread + pin".
[0003] When most of the existing S2 connectors are installed and connected to the PCB board, the threaded connector at the front is heavy. The pins are bent and fixed to the PCB board during mounting, which easily causes the top to be heavy and the back end to float and warp. Manual pressing at the back end or correction after production is required, which increases the labor cost during production. It is necessary to design a reflow-proof material head-lowering structure to solve the above-mentioned problems. Utility Model Content
[0004] The utility model aims to solve the shortcomings in the prior art and proposes a reflow soldering prevention material head lowering structure.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A reflow soldering prevention material head-lowering structure, comprising a threaded interface body and a PCB board, wherein a threaded joint is arranged at the middle of the front side of the threaded interface body, a rear side plate is fixedly connected to the rear side of the threaded interface body, bare copper layers are fixedly connected to the left and right ends of the rear side of the rear side plate, and a steel mesh layer is arranged at the bottom end of the bare copper layer; bent pins are arranged at the four corners of the bottom end of the threaded interface body and the left and right ends of the front side of the bottom end, and a plurality of pin holes are equidistantly arranged at the upper part of the PCB board;
[0007] Through the above technical solution, the bare copper layer and the steel mesh layer are in contact with the PCB board, and the steel mesh layer and the PCB board are pulled together by liquid tin welding, thereby preventing the phenomenon of top-heavy body and light body. In addition, a plurality of bent pins are provided, and the positions can connect the four corners of the bottom end and the front part of the bottom end of the threaded interface body to the PCB board, thereby reducing the degree of lowering the head and preventing breakage after pulling by liquid tin welding.
[0008] Furthermore, the threaded joint is provided with external threads;
[0009] Through the above technical solution, the threaded joint of the external thread facilitates the insertion of other access plugs. At the same time, the connection strength after insertion is increased. Other access plugs can be made into internal threads, and the thickness of the external thread that can be made is increased, preventing the thread from wearing out and causing slipping after multiple connections.
[0010] Furthermore, the pin holes correspond to the positions of the bent pins.
[0011] Through the above technical solution, it is convenient for the bent pins to be inserted into the pin holes, increasing the convenience of mounting the threaded interface body on the PCB board.
[0012] Furthermore, the width of the bare copper layer is 1.2 times the thickness of the threaded interface body, and the length of the bare copper layer is 1 / 5 of the length of the rear end of the threaded interface body.
[0013] Through the above technical solution, the bare copper layer with this thickness and length has strong structural strength, facilitating welding with the rear side plate. At the same time, the bottom area is large, increasing the area of contact between the steel mesh layer and the PCB board for welding.
[0014] Furthermore, the thickness of the steel mesh layer is 1.2 mm.
[0015] Through the above technical solution, the 1.2-mm steel mesh layer can fill more liquid tin in the middle void, increasing the structural strength after welding. At the same time, the 1.2-mm steel mesh layer is convenient to be woven and manufactured by steel wires. During disassembly and assembly, it will not be pulled and broken, affecting secondary mounting.
[0016] Furthermore, the thickness of the bent pins is 1 mm.
[0017] Through the above technical solution, the 1-mm bent pins are convenient to bend, not easily damaged, and will not rust and reduce the structural strength after long-term use. After bending, the threaded interface body can be connected to the PCB board.
[0018] The utility model has the following beneficial effects:
[0019] In the utility model, first place the threaded interface body on the upper part of the PCB board, insert the bent pins into the inner sides of the corresponding pin holes respectively, and bend the bent pins inward to fix the threaded interface body on the upper part of the PCB board. Then the bare copper layer and the steel mesh layer are in contact with the PCB board. By means of liquid tin welding, the steel mesh layer is connected to the PCB board, preventing the phenomenon of top-heavy and bottom-light, making the rear end of the threaded interface body float and warp. There is no need for manual pressing at the rear end or post-production correction, reducing the labor cost during production. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1Schematic diagram of the left rear three-dimensional structure of a structure for preventing the lowering of reflow soldering materials proposed by the present utility model;
[0021] Figure 2 Bottom view of the left rear three-dimensional structure of a structure for preventing the lowering of reflow soldering materials proposed by the present utility model;
[0022] Figure 3 Bottom view of the left rear three-dimensional structure of the threaded interface body of a structure for preventing the lowering of reflow soldering materials proposed by the present utility model;
[0023] Figure 4 Enlarged view of part A of a structure for preventing the lowering of reflow soldering materials proposed by the present utility model;
[0024] Figure 5 Enlarged view of part B of a structure for preventing the lowering of reflow soldering materials proposed by the present utility model;
[0025] Figure 6 Schematic diagram of the three-dimensional structure of the PCB board of a structure for preventing the lowering of reflow soldering materials proposed by the present utility model.
[0026] Legend:
[0027] 1. Threaded interface body; 2. PCB board; 3. Threaded joint; 4. Rear side plate; 5. Bare copper layer; 6. Steel mesh layer; 7. Bent pin; 8. Pin hole. Specific implementation manners
[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0029] Refer to Figure 1-6The utility model provides an embodiment: a reflow soldering prevention material head-lowering structure, comprising a threaded interface body 1 and a PCB board 2, a threaded joint 3 is arranged in the middle of the front side of the threaded interface body 1, a rear side plate 4 is fixedly connected to the rear side of the threaded interface body 1, and a bare copper layer 5 is fixedly connected to the left and right ends of the rear side of the rear side plate 4, and a steel mesh layer 6 is arranged at the bottom end of the bare copper layer 5; bending pins 7 are arranged at the four corners of the bottom end of the threaded interface body 1 and the left and right ends of the front side of the bottom end, and a plurality of pin holes 8 are equidistantly arranged on the upper part of the PCB board 2, the bare copper layer 5 and the steel mesh layer 6 are in contact with the PCB board 2, and the steel mesh layer 6 is pulled and connected to the PCB board 2 by liquid tin welding, so as to prevent the phenomenon of heavy head and light body, and a plurality of bending pins 7 are arranged, and the position can connect the four corners of the bottom end of the threaded interface body 1 and the front part of the bottom end with the PCB board 2, so as to reduce the head-lowering degree and prevent the liquid tin welding from breaking after pulling.
[0030] The threaded connector 3 is an external thread setting, which is convenient for plugging in other access plugs. At the same time, the connection strength after plugging in is increased. Other access plugs can be made into internal threads, and the thickness of the external threads can be increased to prevent thread slippage caused by thread wear after multiple connections. The positions of the pin holes 8 and the bent pins 7 correspond to each other, which facilitates the insertion of the bent pins 7 into the pin holes 8, thereby increasing the convenience of mounting the threaded interface body 1 and the PCB board 2. The width of the bare copper layer 5 is 1.2 times the thickness of the threaded interface body 1, and the length of the bare copper layer 5 is 1 / 5 of the length of the rear end of the threaded interface body 1. The bare copper layer 5 of this thickness and length has a strong structural strength, which is convenient. It is used for welding with the rear side plate 4, and the bottom area is larger, so that the welding contact area of the steel mesh layer 6 and the PCB board 2 is increased, and the thickness of the steel mesh layer 6 is 1.2mm. The middle gap of the 1.2mm steel mesh layer 6 can be filled with more liquid tin, so that the structural strength after welding is increased, and the 1.2mm steel mesh layer 6 is convenient for weaving and manufacturing with steel wire. During disassembly and assembly, it will not be pulled to cause breakage and affect the secondary mounting. The thickness of the bent pin 7 is 1mm, and the 1mm bent pin 7 is easy to bend and is not easy to be damaged. It will not rust after long-term use to cause a decrease in structural strength. After bending, the threaded interface body 1 can be connected to the PCB board 2.
[0031] Working principle: first, place the threaded interface body 1 on the upper part of the PCB board 2, insert the bent pins 7 into the inner sides of the corresponding pin holes 8, and bend the bent pins 7 inwards, fix the threaded interface body 1 on the upper part of the PCB board 2, and then the bare copper layer 5 and the steel mesh layer 6 are in contact with the PCB board 2, and the steel mesh layer 6 is pulled and connected to the PCB board 2 by liquid tin welding to prevent the phenomenon of top-heavy body.
[0032] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A structure for preventing the material from drooping during reflow soldering, comprising a threaded interface body (1) and a PCB board (2), characterized in that: A threaded joint (3) is provided in the middle of the front side of the threaded interface body (1). A rear side plate (4) is fixedly connected to the rear side of the threaded interface body (1). Bare copper layers (5) are fixedly connected to the left and right ends of the rear side of the rear side plate (4). Steel mesh layers (6) are provided at the bottom ends of the bare copper layers (5). Bending pins (7) are provided at the four corners of the bottom end of the threaded interface body (1) and at the left and right ends of the front side of the bottom end. A plurality of pin holes (8) are equidistantly provided in the upper part of the PCB board (2).
2. The anti-reflow soldering material head-down structure according to claim 1, wherein: The threaded joint (3) is provided with external threads.
3. The anti-reflow soldering material head-down structure according to claim 1, characterized in that: The positions of the pin holes (8) correspond to the positions of the bending pins (7).
4. The anti-reflow soldering material head-down structure according to claim 1, characterized in that: The width of the bare copper layer (5) is 1.2 times the thickness of the threaded interface body (1), and the length of the bare copper layer (5) is 1 / 5 of the length of the rear end of the threaded interface body (1).
5. The anti-reflow soldering material head-down structure according to claim 1, wherein: The thickness of the steel mesh layer (6) is 1.2 mm.
6. The anti-reflow soldering material head-down structure according to claim 1, characterized in that: The thickness of the bending pin (7) is 1 mm.