Video conference equipment
By using thermally conductive materials and structural design in video conferencing equipment, the problem of poor heat dissipation effect is solved, efficient heat dissipation of the motherboard and lens module is achieved, and the normal operation of the equipment is ensured.
Patent Information
- Application Number
- CN202422329532.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-23
AI Technical Summary
The heat dissipation effect inside the video conferencing equipment is poor, resulting in too high temperatures of components such as the motherboard and lens module, affecting normal operation.
The base shell and heat conducting member made of thermally conductive materials are located between the heating element and the inner wall of the base shell. The heat conducting member is transmitted to the outside of the base shell through the heat conducting member, and combined with structures such as heat pipes, heat conducting sheets and heat dissipation fins to achieve multi-path heat dissipation.
Effectively reduce the temperature of heating components, improve heat dissipation efficiency, ensure the normal operation of components such as the motherboard and lens module, and avoid excessive temperatures.
Smart Images
Figure CN223142002U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of conference equipment, and particularly to a video conferencing device. Background Art
[0002] Video conferencing devices are commonly used for organizing and participating in remote meetings. They can distribute various information such as human images, voices, texts, pictures, etc. to the terminal devices of each user, enabling participants in different locations to communicate face-to-face as if they were attending a meeting in the same venue.
[0003] In related technologies, a main board is provided inside a video conferencing device. The main board coordinates and connects functional components such as a lens module inside the video conferencing device to ensure the normal realization of their respective functions. However, components such as chips on the main board are heat-generating components. During operation, heat-generating components generate a large amount of heat, which not only accumulates on the heat-generating components but also fills the inside of the video conferencing device and is difficult to dissipate.
[0004] As a result, the temperature inside the video conferencing device is too high, and the overall heat dissipation effect is poor, which will affect the normal operation of components such as the main board and the lens module. Utility Model Content
[0005] To solve the above technical problems, this application provides a video conferencing device for improving the heat dissipation effect of components such as the main board and the lens module to ensure their normal operation.
[0006] This application is implemented through the following technical solutions.
[0007] This application provides a video conferencing device, including a housing, a lens module, a main board, and a heat conducting member. The housing includes a base housing and a lens housing. A cavity is formed inside the base housing. The base housing is made of a heat conducting material. The lens housing is connected to the base housing, and an opening facing away from the base housing is formed on the lens housing. The lens module is disposed at the opening. The main board is disposed inside the cavity. The main board includes a board body and heat-generating components disposed on the board body. The heat conducting member is disposed inside the cavity and is located between the heat-generating components and the inner wall of the base housing. The heat conducting member is in contact with the heat-generating components and the inner wall of the base housing respectively.
[0008] In the technical solution of the embodiment of this application, a main board is provided inside the base housing. The main board coordinates and connects functional components such as the lens module to ensure the normal realization of their respective functions.
[0009] There are heat-generating components on the main board. Since the heat-conducting member is located between the heat-generating component and the inner wall of the base case and is in contact with the heat-generating component and the inner wall of the base case respectively, and the base case is made of heat-conducting material, the heat on the heat-generating component can be conducted to the base case through the heat-conducting member. Then, the heat on the base case will be dissipated into the air outside the cavity, thereby quickly conducting the heat on the heat-generating component to the outside of the cavity, reducing the heat on the heat-generating component, avoiding the concentration of heat on the heat-generating component, and at the same time avoiding the over-high temperature inside the cavity, so as to improve the heat dissipation effect and ensure the normal operation of components such as the lens module and the main board.
[0010] In addition, since the lens module is located on the lens housing rather than inside the cavity, the presence of the lens housing can also make the lens module in an environment with a relatively low temperature, further ensuring the normal operation of the lens module.
[0011] In some embodiments of the present application, the heat-conducting member includes a heat-conducting plate and at least one heat pipe. The heat-conducting plate includes a heat-receiving portion and a heat-conducting portion connected to each other, and the heat-receiving portion is in contact with the heat-generating component. At least one heat pipe is disposed on the heat-conducting plate, the evaporation section of the heat pipe is in contact with the heat-receiving portion, and the condensation section of the heat pipe is in contact with the heat-conducting portion.
[0012] Through the above arrangement, the heat on the heat-generating component will be conducted to the heat-receiving portion. A part of the heat on the heat-receiving portion will be directly conducted to the heat-conducting portion. Due to the arrangement of the heat pipe, another part of the heat on the heat-receiving portion will be conducted to the heat-conducting portion through the heat pipe. In this way, the heat on the heat-receiving portion and the heat-conducting portion can quickly tend to be balanced, avoiding the over-high temperature of the heat-receiving portion in contact with the heat-generating component, so as to facilitate the heat dissipation of the heat-generating component.
[0013] In some embodiments of the present application, at least one heat pipe includes at least one first heat pipe, and the first heat pipe is located between the heat-receiving portion and the heat-generating component, and the evaporation section of the first heat pipe is also in contact with the heat-generating component.
[0014] In this way, the evaporation section of the first heat pipe is not only in contact with the heat-receiving portion but also in contact with the heat-generating component. Therefore, a part of the heat on the heat-generating component can be directly conducted to the heat-receiving portion and then to the heat-conducting portion, and another part of the heat on the heat-generating component can be conducted to the evaporation section of the first heat pipe and then through the first heat pipe to the heat-conducting portion. In this way, the heat of the heat-generating component has two conduction paths, which can accelerate heat dissipation and improve heat dissipation efficiency.
[0015] In some embodiments of the present application, the heat-conducting member further includes a first heat-conducting sheet, which is located between the evaporation section of the first heat pipe and the heat-generating component. One side surface of the first heat-conducting sheet is in contact with the evaporation section of the first heat pipe, and the other side surface of the first heat-conducting sheet is in contact with the heat-generating component.
[0016] In this way, the heat on the heat-generating component will be conducted to the first heat pipe through the first heat-conducting member. The existence of the first heat-conducting sheet can ensure that the indirect contact area between the evaporation section of the first heat pipe and the heat-generating component is increased, ensuring the rapid transfer of the heat on the heat-generating component and improving the heat dissipation efficiency.
[0017] In some embodiments of the present application, a positioning groove is formed on the surface of the heat-receiving portion facing the heat-generating component, and the heat-generating component extends into the positioning groove to contact the heat-receiving portion.
[0018] By providing the positioning groove, the positioning groove can provide positioning for the contact between the heat-generating component and the heat-receiving portion, facilitating the contact of the heat-generating component at a suitable position on the heat-receiving portion.
[0019] In some embodiments of the present application, the heat-conducting portion includes a substrate and a plurality of first heat-dissipating fins. The substrate is connected to the heat-receiving portion. The plurality of first heat-dissipating fins are disposed between the substrate and the inner wall surface of the base shell and are connected to the substrate. The first heat-dissipating fins are in contact with the inner wall of the base shell.
[0020] In this way, the heat on the heat-conducting portion can be conducted to the substrate and then to the first heat-dissipating fins. Since the heat-dissipating fins have a large surface area, more heat can be conducted to the base shell at one time, thus improving the heat dissipation efficiency.
[0021] In some embodiments of the present application, the base shell is further provided with a plurality of heat-dissipating through holes communicating with the cavity; the heat-conducting member further includes a plurality of second heat-dissipating fins, and the second heat-dissipating fins are disposed on the side of the substrate away from the first heat-dissipating fins and are in contact with the substrate; the heat-dissipating through holes face the second heat-dissipating fins.
[0022] By providing the second heat-dissipating fins, the heat on the substrate can also be conducted to the second heat-dissipating fins. Since the base shell is provided with heat-dissipating through holes, the air outside the cavity and the air inside the cavity can exchange through the heat-dissipating through holes, thereby realizing heat exchange. Since the heat-dissipating through holes face the heat-dissipating fins, the air outside the cavity can also directly take away a part of the heat on the surface of the second heat-dissipating fins, thus further improving the heat dissipation efficiency.
[0023] In some embodiments of the present application, the plurality of second heat-dissipating fins are arranged at intervals in a direction parallel to the plane where the substrate is located, and the side surface of the plurality of second heat-dissipating fins arranged in a direction has heat-dissipating through holes.
[0024] With such a setting, the heat-dissipating through holes can face the channel between two adjacent second heat-dissipating fins. Since the channel is formed by the side surfaces of the second heat-dissipating fins and the side surface area of the second heat-dissipating fins is large, the heat dissipation efficiency of the second heat-dissipating fins can be improved, and further the heat dissipation efficiency of the heat-generating component can be improved.
[0025] In some embodiments of the present application, the heat conducting member further includes a second heat conducting sheet disposed between the heat conducting plate and the inner wall of the base housing, and the second heat conducting sheet is in contact with the heat conducting plate and the inner wall of the base housing respectively.
[0026] By providing the second heat conducting sheet, the heat on the heat conducting plate can be conducted to the base housing through the second heat conducting sheet, so that another heat dissipation path can be provided for the heat conducting plate, thereby improving the heat dissipation efficiency of the heat conducting plate and the heat dissipation efficiency of the heat generating components.
[0027] In some embodiments of the present application, the base housing includes a first housing portion and a second housing portion, the heat conducting plate is in contact with the inner wall of the first housing portion; the second heat conducting sheet is disposed between the heat conducting plate and a heat conducting seat on the second housing portion, and the second heat conducting sheet is in contact with the heat conducting plate and the heat conducting seat respectively.
[0028] By setting the base housing to be composed of the first housing portion and the second housing portion, it is convenient to arrange components such as the main board inside the base housing. Since the heat conducting plate is in contact with the inner wall of the first housing portion, a part of the heat on the heat conducting plate will be directly conducted to the first housing portion. Since the heat conducting plate is also in contact with the heat conducting seat on the second housing portion through the second heat conducting sheet, another part of the heat on the heat conducting plate will be conducted to the second housing portion through the second heat conducting sheet. In this way, the heat concentration on the base housing can be avoided, thereby improving the heat dissipation efficiency.
[0029] In some embodiments of the present application, a receiving cavity communicating with the opening is formed on the lens housing, and the lens module is disposed in the receiving cavity; the lens module includes a fixed lens and a heat conducting bracket, the heat conducting bracket is connected to the lens housing, and the fixed lens is connected to the heat conducting bracket. The video conferencing device further includes a third heat conducting sheet disposed in the receiving cavity and located between the heat conducting bracket and the heat generating components of the fixed lens, and is in contact with the heat conducting bracket and the heat generating components of the fixed lens respectively.
[0030] Through the above arrangement, the heat dissipated by the heat generating components on the fixed lens will be conducted to the heat conducting bracket through the third heat conducting sheet, and then conducted to the outside of the receiving cavity, so as to achieve the heat dissipation of the fixed lens and ensure the normal operation of the fixed lens.
[0031] In some embodiments of the present application, the lens module further includes a moving lens and a moving bracket, the moving bracket is connected to the lens housing, the moving lens is connected to the moving bracket, and the moving bracket is used to drive the moving lens to move; the moving bracket is made of a heat conducting material; a heat radiation material is coated on the moving bracket and / or an endothermic material is coated on the inner wall of the receiving cavity.
[0032] Through the above settings, the heat on the moving lens will be conducted to the moving bracket, and then to the air in the accommodating cavity, and then to the lens housing. Since the moving bracket is coated with a heat radiation material and / or the inner wall of the accommodating cavity is coated with a heat absorbing material, the heat on the moving bracket can be better conducted to the air in the accommodating cavity through radiation, and / or the heat in the air in the accommodating cavity will be better absorbed by the lens housing and then dissipated to the outside of the accommodating cavity, so as to achieve heat dissipation of the moving lens and ensure the normal operation of the moving lens. In addition, this heat dissipation method is a non-contact heat dissipation, so it will not interfere with the movement of the moving bracket. Description of the Drawings
[0033] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. Moreover, in all the drawings, the same reference numerals are used to represent the same components. In the drawings:
[0034] Figure 1 It is a schematic diagram of an external structure of a video conferencing device provided by some embodiments of the present application;
[0035] Figure 2 It is an exploded view of a video conferencing device provided by some embodiments of the present application;
[0036] Figure 3 It is a cross-sectional view of a video conferencing device provided by some embodiments of the present application;
[0037] Figure 4 It is a top view of a main board provided by some embodiments of the present application;
[0038] Figure 5 It is a side view of a main board provided by some embodiments of the present application;
[0039] Figure 6 It is a bottom view of a main board provided by some embodiments of the present application;
[0040] Figure 7 It is a cross-sectional view of a housing, a main board and a heat conducting member provided by some embodiments of the present application;
[0041] Figure 8 It is an exploded view of a main board and a heat conducting member provided by some embodiments of the present application;
[0042] Figure 9 It is an exploded view of a heat conducting member provided by some embodiments of the present application;
[0043] Figure 10External structural schematic diagram of the heat conduction plate provided by some embodiments of the present application;
[0044] Figure 11 Partial external structural schematic diagram of the housing provided by some embodiments of the present application;
[0045] Figure 12 Another exploded view of the heat conduction member provided by some embodiments of the present application;
[0046] Figure 13 External structural schematic diagram of a part of the video conferencing device provided by some embodiments of the present application;
[0047] Figure 14 Cross-sectional schematic diagram of the video conferencing device provided by some embodiments of the present application.
[0048] Explanation of reference numerals
[0049] 01 - Video conferencing device;
[0050] 1 - Housing; 11 - Base housing; 111 - First housing part; 112 - Second housing part; a - Cavity; d - Heat dissipation through hole; 12 - Lens housing; e - Opening; f - Accommodation cavity;
[0051] 2 - Lens module; 21 - Fixed lens; 211 - Heat generating component; 22 - Heat conduction bracket; 23 - Moving lens; 24 - Moving bracket;
[0052] 3 - Main board; 31 - Board body; 32 - Heat generating components; 321 - Heat generating chip; A1 - Circuit board; A2 - Central processing unit board; A3 - Storage board.
[0053] 4 - Heat conduction member; 41 - Heat conduction plate; b - Installation groove; 411 - Heat receiving part; 412 - Heat conduction part; C1 - Substrate; C2 - First heat dissipation fin; c - Positioning groove; 42 - Heat pipe; B1 - Evaporation section; B2 - Condensation section; 421 - First heat pipe; 422 - Second heat pipe; 43 - First heat conduction sheet; 44 - Second heat conduction sheet; 45 - Heat conduction seat; 46 - Second heat dissipation fin; 47 - Carrier plate; 48 - Third heat conduction sheet;
[0054] 5 - Installation bracket; 6 - Interface board. Detailed implementation manners
[0055] Hereinafter, embodiments of the technical solution of the present application will be described in detail with reference to the drawings. The following embodiments are only used to illustrate the technical solution of the present application more clearly, and thus are only examples and cannot be used to limit the protection scope of the present application.
[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above description of the drawings are intended to cover non-exclusive inclusion.
[0057] In the description of the embodiments of this application, the technical terms "first", "second", "third", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, "a plurality of" means two or more unless otherwise specifically defined.
[0058] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0059] In the description of the embodiments of this application, the term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.
[0060] In the description of the embodiments of this application, the orientation or positional relationship indicated by technical terms such as "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of this application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed, operated or used in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of this application.
[0061] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0062] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "contact" should be understood in a broad sense, and may be direct contact or contact through an intermediate medium layer. It may be contact with essentially no interaction force between the two contacting parties, or it may be contact with interaction force between the two contacting parties.
[0063] Below, this application is described in detail.
[0064] Video conferencing equipment is a commonly used device for organizing and participating in remote conferences. It can distribute a variety of information such as personal images, voice, text, pictures, etc. to each user's terminal device, allowing participants in different locations to communicate face to face, just like participating in a meeting in the same venue.
[0065] Based on this, Figure 1 , Figure 2 As shown, the present application provides a video conferencing device 01, which includes a housing 1, a lens module 2 and a main board 3. The housing 1 includes a base housing 11 and a lens housing 12. A cavity a is formed inside the base housing 11. The lens housing 12 is connected to the base housing 11. An opening e is formed on the lens housing 12 away from the base housing 11. The lens module 2 is arranged at the opening e. The main board 3 includes a board body 31 and a heat generating component 32 arranged on the board body 31. The main board 3 is arranged in the cavity a.
[0066] In some examples, the mainboard 3 is electrically connected to the lens module 2 , and the mainboard 3 is used to coordinate and connect the lens module 2 to ensure the normal operation of the lens module 2 .
[0067] With such arrangement, the mainboard 3 can coordinate and connect the lens module 2 so that the lens module 2 can distribute information such as person impacts and pictures in the offline venue to the terminal devices of each user to meet the needs of the users.
[0068] However, components such as chips on the main board 3 are heat-generating components 32. When the video conferencing device 01 is working, the heat-generating components 32 will generate a large amount of heat. The heat will not only remain on the heat-generating components 32, but also fill the cavity a and is difficult to dissipate. As a result, the temperature inside the video conferencing device 01 is too high, and the overall heat dissipation effect is poor, which will affect the normal operation of the main board 3 and other functional components.
[0069] Based on this, as Figure 2 、 Figure 3 shown, in some embodiments, the base shell 11 is made of a heat-conducting material. The video conferencing device 01 provided in this application further includes a heat-conducting member 4. The heat-conducting member 4 is disposed in the cavity a and is located between the heat-generating component 32 and the inner wall of the base shell 11. The heat-conducting member 4 is in contact with the heat-generating component 32 and the inner wall of the base shell 11 respectively.
[0070] It can be understood that, as Figures 4 - 6 shown, the heat-generating component 32 is disposed on the board body 31, mainly on the side surface (large surface) of the board body 31. In addition, the board body 31 is the main board 3 circuit board A1 (Printed circuit board; PCB).
[0071] In some examples, the heat-conducting material for making the base shell 11 may include metal heat-conducting materials, non-metal heat-conducting materials, etc. Among them, the metal heat-conducting materials may include copper, aluminum, or iron, etc. The non-metal heat-conducting materials may include ceramics, etc. This application does not list them one by one here, and any material with heat-conducting performance is acceptable.
[0072] Exemplarily, the heat-conducting material includes copper. Copper has a low price and excellent heat-conducting performance, so the cost performance is relatively high. In addition, the base shell 11 made of copper also has a relatively high structural strength and can meet the requirements for installing and accommodating functional components.
[0073] In some examples, as Figure 2 、 Figure 3 shown, the video conferencing device 01 in this application further includes a mounting bracket 5. The mounting bracket 5 is disposed in the cavity a and is connected to the base shell 11. The board body 31 is connected to the mounting bracket 5. By setting the mounting bracket 5, the mounting bracket 5 can provide support for the board body 31, thereby ensuring the stability of the setting of the main board 3.
[0074] Exemplarily, the mounting bracket 5 has a mounting surface opposite to the side surface of the board body 31, so that the side surface of the board body 31 away from the heat-generating component 32 is attached and connected to the mounting surface, so as to ensure the stability of the connection between the board body 31 and the mounting bracket 5.
[0075] With the above settings, since the heat conducting member 4 is in contact with the heat generating component 32 and the inner wall of the base case 11 respectively, and the base case 11 is made of heat conducting material, the heat on the heat generating component 32 can be conducted to the base case 11 through the heat conducting member 4, and then the heat on the base case 11 will be dissipated into the air outside the cavity a. In this way, the heat on the heat generating component 32 will be quickly conducted to the outside of the cavity a, thereby reducing the heat on the heat generating component 32, avoiding the concentration of heat on the heat generating component 32, and at the same time avoiding the overhigh temperature inside the cavity a, so as to improve the heat dissipation effect and ensure the normal operation of components such as the lens module 2 and the main board 3.
[0076] In addition, since the lens module 2 is located on the lens housing 12 instead of inside the cavity a, the existence of the lens housing 12 can also make the lens module 2 in an environment with a relatively low temperature, further ensuring the normal operation of the lens module 2.
[0077] There are many types of heat generating components 32 on the main board 3. We can make the heat conducting member 4 contact all the heat generating components 32 to dissipate heat from all the heat generating components 32, or we can also choose to dissipate heat from some high-power heat generating components 32.
[0078] Based on this, in some embodiments, as Figure 7 shown, the heat generating component 32 in the present application includes a heat generating chip 321. The heat generating chip 321 includes a circuit board A1, a central processing unit board A2 and a storage board A3 which are stacked in sequence. The circuit board A1 is arranged on the board body 31, and the heat conducting member 4 is in contact with the storage board A3.
[0079] In some examples, the heat generating chip 321 includes a system on module (SOM). The SOM includes a circuit board A1 (printed circuit board; PCB), a central processing unit (CPU) board A2 and a storage board A3 which are stacked.
[0080] Exemplarily, the storage board A3 may include a double data rate (DDR) board.
[0081] With such a setting, not only the heat on the storage board can be conducted to the base case 11 through the heat conducting member 4, but also the heat on the circuit board A1 and the central processing unit board A2 will be conducted to the heat conducting member 4 through the storage board A3 and then conducted to the base case 11, so as to realize the overall heat dissipation of the heat generating chip 321. Since the storage board A3 is located on the outermost layer, making the storage board A3 in contact with the heat conducting member 4 can facilitate the contact between the heat conducting member 4 and the heat generating chip 321 and is convenient to set.
[0082] By dissipating heat from the main heat source, i.e., the heating chip 321, in the heat-generating component 32, not only can the normal operation of the heating chip 321 be ensured, but also the heat radiated from the heating chip 321 into the air in the cavity a can be reduced, thereby greatly lowering the temperature in the cavity a and ensuring the normal operation of components such as the main board 3 in the cavity a.
[0083] The setting form of the heat-conducting component 4 can be diverse. For example, the heat-conducting component 4 can include a heat pipe 42, a plate made of a heat-conducting material, or a combination of the two. The following is a specific introduction.
[0084] In the first possible embodiment, as Figure 8 shown, the heat-conducting component 4 includes a heat-conducting plate 41 and at least one heat pipe 42. The heat-conducting plate 41 includes a heat-receiving portion 411 and a heat-conducting portion 412 that are connected to each other. The heat-receiving portion 411 is in contact with the heat-generating component 32. At least one heat pipe 42 is disposed on the heat-conducting plate 41. The evaporation section B1 of the heat pipe 42 is in contact with the heat-receiving portion 411, and the condensation section B2 of the heat pipe 42 is in contact with the heat-conducting portion 412.
[0085] It can be understood that the division of the heat-receiving portion 411 and the heat-conducting portion 412 on the heat-conducting plate 41 can be arbitrary, and specifically needs to be divided according to the contact position between the heat-generating component 32 and the heat-conducting plate 41, as well as the shape of the heat-conducting plate 41. The following is an example for illustration.
[0086] In some examples, the heat-conducting plate 41 is a circular plate. Along the radial direction of the heat-conducting plate 41, the heat-receiving portion 411 is located in the central region of the heat-conducting plate 41, while the heat-conducting portion 412 is located in the peripheral region of the heat-conducting plate 41.
[0087] In other examples, as Figure 8 shown, the heat-conducting plate 41 is a rectangular plate. Along the length direction of the heat-conducting plate 41, the heat-conducting plate 41 is divided into two sections by the dotted line L shown in Figure 8 , which are the heat-receiving portion 411 and the heat-conducting portion 412 respectively.
[0088] In addition, it can be understood that whether it is the evaporation section B1 of the heat pipe 42, the condensation section B2 of the heat pipe 42, or the heat-receiving portion 411 and the heat-conducting portion 412 of the heat-conducting plate 41, they can all be in contact with the inner wall of the base shell 11, so that the heat on the heat-generating component 32 is finally conducted to the base shell 11.
[0089] In some examples, both the heat receiving part 411 and the heat conducting part 412 are in contact with the inner wall of the base shell 11. In this case, the existence of the heat pipe 42 is mainly to transfer the heat on the heat receiving part 411 to the heat conducting part 412, so as to ensure that the heat on the heat receiving part 411 and the heat conducting part 412 quickly reaches equilibrium, facilitating the heat conduction from the heat generating component 32 to the heat receiving part 411.
[0090] Exemplarily, in the plane where the heat conducting plate 41 is located, the heat receiving part 411 and the heat conducting part 412 are respectively located in different regions. The main board 3 is located on one side of the heat conducting plate 41, and the heat generating component 32 is in contact with the side surface of the heat receiving part 411. The side surfaces of the heat receiving part 411 and the heat conducting part 412 facing away from the heat generating component 32 are both in contact with the inner wall of the base shell 11. With such a setting, the heat on both the heat receiving part 411 and the heat conducting part 412 can be conducted to the base shell 11, ensuring the heat dissipation efficiency.
[0091] In some examples, as Figure 3 shown, the video conferencing device 01 in the present application further includes an interface board 6. The interface board 6 is arranged in the cavity a. The interface board 6 has the function of connecting and converting signals. The interface board 6 is fixed on the heat conducting plate 41, that is to say, the heat conducting plate 41 also serves as a carrier for the interface board 6.
[0092] In some examples, the number of heat pipes 42 can be multiple. For example, the number of heat pipes 42 can be two, three, four, five or six.
[0093] Exemplarily, multiple heat pipes 42 are arranged around the arrangement direction of the heat receiving part 411 and the heat conducting part 412, which can avoid interference between multiple heat pipes 42 and facilitate the arrangement of multiple heat pipes 42.
[0094] For example, the number of heat pipes 42 is two, and the two heat pipes 42 are respectively arranged on two side surfaces of the heat conducting plate 41.
[0095] Of course, the number of heat pipes 42 can also be one.
[0096] Through the above settings, the heat on the heat generating component 32 will be conducted to the heat receiving part 411. A part of the heat on the heat receiving part 411 will be directly conducted to the heat conducting part 412. Due to the setting of the heat pipe 42, another part of the heat on the heat receiving part 411 will be conducted to the heat conducting part 412 through the heat pipe 42. In this way, the heat on the heat receiving part 411 and the heat conducting part 412 can quickly tend to be balanced, avoiding the over-high temperature of the heat receiving part 411 in contact with the heat generating component 32, and facilitating the heat dissipation of the heat generating component 32.
[0097] In a second possible implementation, the heat conducting member 4 includes a heat conducting plate 41. One side surface of the heat conducting plate 41 is in close contact with the heat generating component 32, and the other side surface of the heat conducting plate 41 is in close contact with the inner wall of the base shell 11. Since the heat conducting plate 41 has a large heat dissipation area, the heat dissipation efficiency can be improved.
[0098] In a third possible implementation, the heat conducting member 4 includes a heat pipe 42. The evaporation section B1 of the heat pipe 42 is in contact with the heat generating component 32, and the condensation section B2 of the heat pipe 42 is in contact with the inner wall of the base shell 11. The heat on the heat generating component 32 is conducted to the base shell 11 through the heat pipe 42, thereby realizing the heat dissipation of the heat generating component 32. The heat pipe 42 realizes heat transfer through the transformation of the liquid and gas states of the refrigerant inside it. Therefore, the heat transfer efficiency is relatively high, and the heat dissipation efficiency can be improved.
[0099] After the heat conducting member 4 is set in the form of the heat conducting plate 41 and the heat pipe 42, it is not only necessary to ensure the stable setting of the heat conducting plate 41 and the heat pipe 42, but also necessary to ensure the normal transfer of heat. Therefore, targeted designs are required between the heat conducting plate 41 and the base shell 11, and between the heat pipe 42 and the heat conducting plate 41.
[0100] In some embodiments, a heat conducting gel is provided between the heat conducting plate 41 and the inner wall of the base shell 11.
[0101] It can be understood that a heat conducting gel is provided between the heat conducting plate 41 and the inner wall of the base shell 11. It can be that a heat conducting gel is provided between the heat receiving part 411 and the inner wall of the base shell 11, or a heat conducting gel is provided between the heat conducting part 412 and the inner wall of the base shell 11, or heat conducting gels are provided between both the heat receiving part 411 and the inner wall of the base shell 11 and the heat conducting part 412 and the inner wall of the base shell 11.
[0102] By providing a heat conducting gel between the heat conducting plate 41 and the inner wall of the base shell 11, the heat conducting gel has good heat conductivity and physical and chemical stability. Therefore, it can ensure the stable transfer of heat between the heat conducting plate 41 and the base shell 11, ensure the heat dissipation efficiency, and at the same time can stably bond the heat conducting plate 41 to the base shell 11 in a high-temperature environment, thereby ensuring the stable setting of the heat conducting plate 41 and the stable progress of heat dissipation.
[0103] For the heat pipe 42 and the heat conducting plate 41, the connection methods between the heat pipe 42 and the heat conducting plate 41 are also diverse. For example, they can be welding, clamping, screw fastening, bonding, etc. Specific introductions are as follows.
[0104] In some embodiments, the heat pipe 42 is welded to the heat conducting plate 41.
[0105] In some examples, the entire heat pipe 42 can be welded to the heat conducting plate 41.
[0106] In some other examples, a part of the heat pipe 42 can also be welded to the heat conducting plate 41.
[0107] For example, the evaporation section B1 of the heat pipe 42 is welded to the heat conducting plate 41; or, the condensation section B2 of the heat pipe 42 is welded to the heat conducting plate 41; or, the part between the evaporation section B1 and the condensation section B2 of the heat pipe 42 is welded to the heat conducting plate 41.
[0108] Connecting the heat pipe 42 to the heat conducting plate 41 by welding can not only ensure the connection strength between the heat pipe 42 and the heat conducting plate 41, but also the solder (such as soldering tin) used for welding is a heat conducting material. Therefore, the existence of the solder will not affect the heat transfer between the evaporation section B1 of the heat pipe 42 and the heat receiving part 411, nor will it affect the heat transfer between the condensation section B2 of the heat pipe 42 and the heat conduction part 412. On the basis of ensuring the connection stability between the heat pipe 42 and the heat conducting plate 41, the heat transfer between the heat pipe 42 and the heat conducting plate 41 can be ensured.
[0109] In some other embodiments, a heat conducting gel is provided between the heat pipe 42 and the heat conducting plate 41.
[0110] In some examples, the heat conducting gel can be provided between the entire heat pipe 42 and the heat conducting plate 41, so as to fix the entire heat pipe 42 on the heat conducting plate 41.
[0111] In some other examples, the heat conducting gel can also be provided between a part of the heat pipe 42 and the heat conducting plate 41.
[0112] For example, the heat conducting gel is provided between the evaporation section B1 of the heat pipe 42 and the heat conducting plate 41; or, the heat conducting gel is provided between the condensation section B2 of the heat pipe 42 and the heat conducting plate 41; or, the heat conducting gel is provided between the part between the evaporation section B1 and the condensation section B2 of the heat pipe 42 and the heat conducting plate 41.
[0113] Bonding the heat pipe 42 to the heat conducting plate 41 through the heat conducting gel, the heat conducting gel has good heat conducting performance and stable physical and chemical stability, and can ensure the heat transfer between the heat pipe 42 and the heat conducting plate 41 on the basis of ensuring the connection stability between the heat pipe 42 and the heat conducting plate 41.
[0114] In some embodiments, as Figure 8 shown, at least one heat pipe 42 includes at least one first heat pipe 421. The first heat pipe 421 is located between the heat receiving part 411 and the heat generating component 32, and the evaporation section B1 of the first heat pipe 421 is also in contact with the heat generating component 32.
[0115] In some examples, the number of the first heat pipes 421 can be multiple. For example, the number of the first heat pipes 421 can be two, three, four, five, and so on.
[0116] In some examples, the number of the heat pipes 42 is multiple. The multiple heat pipes 42 include at least one first heat pipe 421 and at least one second heat pipe 422. The evaporation section B1 of the second heat pipe 422 does not contact the heat generating component 32. That is to say, the second heat pipe 422 only conducts the heat of the heat receiving part 411 to the heat conducting part 412.
[0117] Exemplarily, the second heat pipe 422 can be arranged on the side of the heat receiving part 411 away from the first heat pipe 421.
[0118] With such an arrangement, the evaporation section B1 of the first heat pipe 421 not only contacts the heat receiving part 411 but also contacts the heat generating component 32. Therefore, a part of the heat on the heat generating component 32 can be directly conducted to the heat receiving part 411, and then conducted to the heat conducting part 412. Another part of the heat on the heat generating component 32 can be conducted to the evaporation section B1 of the first heat pipe 421, and then conducted to the heat conducting part 412 through the first heat pipe 421. In this way, the heat of the heat generating component 32 has two conduction paths, which can accelerate heat dissipation, improve the heat dissipation efficiency, and enhance the heat dissipation effect.
[0119] On this basis, as Figure 8 shown, in some embodiments, the heat conducting member 4 further includes a first heat conducting sheet 43. The first heat conducting sheet 43 is located between the evaporation section B1 of the first heat pipe 421 and the heat generating component 32. One side surface of the first heat conducting sheet 43 contacts the evaporation section B1 of the first heat pipe 421, and the other side surface of the first heat conducting sheet 43 contacts the heat generating component 32.
[0120] In some examples, the first heat conducting sheet 43 also contacts the heat receiving part 411. In this way, a part of the heat on the heat generating component 32 can be conducted to the evaporation section B1 of the first heat pipe 421 through the first heat conducting sheet 43, while another part of the heat on the heat generating component 32 is conducted to the heat receiving part 411 through the first heat conducting sheet 43. In this way, the heat dissipation efficiency of the heat generating component 32 can be improved.
[0121] In some examples, the material of the first heat conducting sheet 43 includes heat conducting materials. For example, the heat conducting materials can be metal heat conducting materials or non-metal heat conducting materials. Among them, the metal heat conducting materials can include copper, aluminum, iron, etc. The non-metal heat conducting materials can include ceramics, etc.
[0122] Exemplarily, the first heat conducting sheet 43 is a copper sheet. Copper has a low price and excellent heat conducting performance, so it has a high cost performance.
[0123] By setting the first heat conducting sheet 43, the heat on the heat generating component 32 will be conducted to the first heat pipe 421 through the first heat conducting sheet 43. The presence of the first heat conducting sheet 43 can ensure that the indirect contact area between the evaporation section B1 of the first heat pipe 421 and the heat generating component 32 is increased, and can ensure the rapid transfer of the heat on the heat generating component 32, thereby improving the heat dissipation efficiency.
[0124] In some embodiments, as Figure 9 shown, at least one mounting groove b is formed on the heat conducting plate 41. The mounting groove b extends along the extending direction of the heat pipe 42 and extends from the heat receiving portion 411 to the heat conducting portion 412. The heat pipe 42 is accommodated in the mounting groove b.
[0125] It can be understood that in this case, when the heat pipe 42 is welded to the heat conducting plate 41, the heat pipe 42 is welded in the mounting groove b. When the heat pipe 42 and the heat conducting plate 41 are bonded together by a heat conducting gel, the heat conducting gel is coated between the outer wall of the heat pipe 42 and the inner wall of the mounting groove b.
[0126] In some examples, the mounting groove b and the heat pipe 42 are mutually adapted, that is, the heat pipe 42 is exactly installed in the mounting groove b, and the inner wall of the mounting groove b can be in contact with the outer wall of the heat pipe 42. In this way, the contact area between the evaporation section B1 of the heat pipe 42 and the heat receiving portion 411 can be increased, and the contact area between the condensation section B2 of the heat pipe 42 and the heat conducting portion 412 can be increased, thereby improving the heat conduction efficiency of the heat pipe 42.
[0127] In some examples, along the depth direction of the mounting groove b, the groove depth of the mounting groove b is the same as the size of the heat pipe 42. In this way, the entire heat pipe 42 is embedded in the heat conducting plate 41. The presence of the heat pipe 42 will not affect the contact between the heat conducting plate 41 and the base shell 11 and the heat generating component 32. At the same time, along the depth direction of the mounting groove b, the overall sizes of the heat conducting plate 41 and the heat pipe 42 can also be effectively controlled, which is convenient for the miniaturized design of the video conferencing device 01.
[0128] Of course, along the depth direction of the mounting groove b, the groove depth of the mounting groove b and the size of the heat pipe 42 may not be the same. For example, the groove depth of the mounting groove b is greater than the size of the heat pipe 42, or the groove depth of the mounting groove b is less than the size of the heat pipe 42.
[0129] In some examples, the number of the heat pipes 42 is multiple, and the number of the mounting grooves b is also multiple. At least one heat pipe 42 is arranged in each mounting groove b.
[0130] Exemplarily, the number of the heat pipes 42 and the mounting grooves b are both two, and one heat pipe 42 is arranged in each mounting groove b.
[0131] By providing the installation groove b, the heat pipe 42 is at least partially embedded in the heat conducting plate 41. In this way, when fixing the heat pipe 42 and the heat conducting plate 41, the fixing stability between the heat conducting plate 41 and the heat pipe 42 can be improved. In addition, the contact area between the evaporation section B1 of the heat pipe 42 and the heat conducting plate 41 and the contact area between the condensation section B2 of the heat pipe 42 and the heat conducting plate 41 can be increased, thereby improving the heat transfer efficiency of the heat pipe 42. And in the depth direction of the installation groove b, the influence of the presence of the heat pipe 42 on the contact between the heat conducting plate 41 and the base shell 11 and the heat generating component 32 will also be weakened or eliminated.
[0132] In some embodiments, as Figure 3 、 Figure 9 shown, a positioning groove c is formed on the surface of the heat receiving part 411 facing the heat generating component 32, and the heat generating component 32 extends into the positioning groove c to contact the heat receiving part 411.
[0133] In some examples, along the depth direction of the positioning groove c, the groove depth of the positioning groove c is consistent with the size of the heat generating component 32. The heat generating component 32 just extends into the positioning groove c and contacts the bottom of the positioning groove c. Since the heat generating component 32 is arranged on the plate body 31, the distance between the side surface of the plate body 31 and the surface of the heat receiving part 411 will be very small, or even the two are in close contact. Therefore, the space utilization rate in the cavity a along the depth direction of the positioning groove c can be improved, which is convenient for the miniaturized design of the base shell 11.
[0134] In some examples, as Figure 9 shown, when the installation groove b and the positioning groove c are arranged on the same side, the installation groove b can partially extend into the positioning groove c.
[0135] In some examples, the positioning groove c can be a regular shape such as a square groove or a circular groove, or it can also be an irregular shape.
[0136] By providing the positioning groove c, the positioning groove c can provide positioning for the contact between the heat generating component 32 and the heat receiving part 411, facilitating the contact of the heat generating component 32 at a suitable position on the heat receiving part 411. In addition, along the depth direction of the positioning groove c, the presence of the positioning groove c can shorten the distance between the plate body 31 and the heat receiving part 411, thereby improving the space utilization rate between the plate body 31 and the heat receiving part 411, which is convenient for the miniaturized design of the video conferencing device 01.
[0137] In some embodiments, as Figure 10 shown, the heat conduction part 412 includes a substrate C1 and a plurality of first heat dissipation fins C2. The substrate C1 is connected to the heat receiving part 411. The plurality of first heat dissipation fins C2 are arranged between the substrate C1 and the inner wall surface of the base shell 11 and are connected to the substrate C1, and the first heat dissipation fins C2 contact the inner wall of the base shell 11.
[0138] It can be understood that the number of the first heat dissipation fins C2 can be set as required. For example, the number of the first heat dissipation fins C2 can be two, five, ten, fifteen, etc., and is specifically set according to the requirements.
[0139] In some examples, a plurality of the first heat dissipation fins C2 are arranged at intervals in a direction parallel to the plane where the substrate C1 is located.
[0140] Exemplarily, the substrate C1 and the heat receiving portion 411 are located in the same plane, the substrate C1 and the heat receiving portion 411 are arranged in sequence along the first direction, and a plurality of the first heat dissipation fins C2 are arranged at intervals along the first direction.
[0141] In some examples, the plane where the first heat dissipation fins C2 are located is perpendicular to the plane where the substrate C1 is located.
[0142] In some examples, when the mounting groove b is formed on the heat conducting plate 41 and extends to the heat conducting portion 412, the first heat dissipation fins C2 should make way.
[0143] Wherein, the mounting groove b can pass through some of the first heat dissipation fins C2, or can also pass through all of the first heat dissipation fins C2, and is specifically designed according to the length of the heat pipe 42.
[0144] By setting the heat conducting portion 412 as the structure of the substrate C1 and the first heat dissipation fins C2, the heat on the heat conducting portion 412 can be conducted to the substrate C1, and then conducted to the first heat dissipation fins C2. Since the first heat dissipation fins C2 have a large surface area, more heat can be conducted to the base shell 11 at one time, so that the heat dissipation efficiency can be improved.
[0145] In order to ensure the heat dissipation efficiency of the heat generating component 32, in this application, the heat on the heat generating component 32 can not only be dissipated to the outside of the cavity a through the heat conducting member 4 and the base shell 11, but also be directly dissipated to the outside of the cavity a through the heat conducting member 4.
[0146] Based on this, in some embodiments, as Figures 11 - 13 shown, a plurality of heat dissipation through holes d communicating with the cavity a are further formed on the base shell 11. The heat conducting member 4 further includes a plurality of second heat dissipation fins 46, and the second heat dissipation fins 46 are arranged on the side of the substrate C1 away from the first heat dissipation fins C2 and are in contact with the substrate C1. The heat dissipation through holes d face the second heat dissipation fins 46.
[0147] In some examples, the heat dissipation through holes d can be holes with regular shapes such as circular holes and square holes. Of course, the heat dissipation through holes d can also be holes with irregular shapes.
[0148] In some examples, the number of heat dissipation through-holes d is multiple, and the multiple heat dissipation through-holes d can be arranged in an array of shapes such as square, circular, etc. on the base case 11.
[0149] Exemplarily, the number of heat dissipation through-holes d can be two, five, ten, twenty, etc.
[0150] In some examples, the heat dissipation through-holes d can adopt a cloth covering process, which can increase the aesthetic appearance.
[0151] In some examples, as Figure 12 shown, a carrier plate 47 is provided between the second heat dissipation fin 46 and the substrate C1. The carrier plate 47 is connected to and fits with the substrate C1, and the second heat dissipation fin 46 is connected to the carrier plate 47. In this way, the heat on the substrate C1 can be conducted to the carrier plate 47, and then to the second heat dissipation fin 46. Since the heat dissipation through-hole d faces the second heat dissipation fin 46, the heat on the second heat dissipation fin 46 can be conducted to the outside of the cavity a through the heat dissipation through-hole d.
[0152] Exemplarily, the first heat pipe 421 is disposed between the carrier plate 47 and the substrate C1, and the condensation section B2 of the first heat pipe 421 is in contact with the substrate C1 and the carrier plate 47 respectively. In this way, the heat of the heat receiving portion 411 can also be conducted to the condensation section B2 of the first heat pipe 421 through the evaporation section B1 of the first heat pipe 421, and then to the substrate C1 and the carrier plate 47, which can further improve the heat conduction efficiency.
[0153] In some examples, some of the heat dissipation through-holes d also face the heat conduction portion 412. In this way, part of the heat on the heat conduction portion 412 can also be conducted to the outside of the cavity a through the heat dissipation through-holes d, which can further improve the heat dissipation efficiency.
[0154] In some examples, the arrangement direction of the multiple first heat dissipation fins C2 is the same as that of the multiple second heat dissipation fins 46.
[0155] By providing the second heat dissipation fin 46, the heat on the substrate C1 can also be conducted to the second heat dissipation fin 46. Since the heat dissipation through-holes d are provided on the base case 11, the air outside the cavity a and the air inside the cavity a can exchange through the heat dissipation through-holes d, thereby realizing heat exchange. Since the heat dissipation through-holes d face the heat dissipation fins, the air outside the cavity a can also blow the second heat dissipation fin 46 to directly take away part of the heat on the surface of the second heat dissipation fin 46. Through the cooperation of the second heat dissipation fin 46 and the heat dissipation through-holes d, the air-cooled heat dissipation method is increased, and the heat dissipation efficiency is further improved.
[0156] On this basis, in some embodiments, as Figure 12 、 Figure 13As shown, a plurality of second heat dissipation fins 46 are arranged at intervals in a direction parallel to the plane where the substrate C1 is located, and heat dissipation through holes d are provided on the side surfaces of the plurality of second heat dissipation fins 46 in the arrangement direction.
[0157] In some examples, heat dissipation through holes d are provided on both the first side and the second side of the plurality of second heat dissipation fins 46 in the arrangement direction, and the arrangement directions of the first side and the second side are parallel to the plane where the substrate C1 is located. In this way, the air outside the cavity a can enter the cavity a through the heat dissipation through holes d on the first side, and then pass through the channels between two adjacent second heat dissipation fins 46, and then be discharged from the heat dissipation through holes d on the second side to the outside of the cavity a. During the air circulation process, the air can contact the side surfaces of the second heat dissipation fins 46, thereby taking away the heat on the second heat dissipation fins 46, so as to achieve heat dissipation of the second heat dissipation fins 46. Since the heat dissipation through holes d on the first side, the channels between two adjacent second fins, and the heat dissipation through holes d on the second side form a flow channel, the heat dissipation efficiency can be improved.
[0158] Through the above settings, the heat dissipation through holes d can face the channels between two adjacent second heat dissipation fins 46. Since the channels are formed by the side surfaces of the second heat dissipation fins 46, and the side surface area of the second heat dissipation fins 46 is relatively large, the heat dissipation efficiency of the second heat dissipation fins 46 can be improved in this way, and then the heat dissipation efficiency of the heat generating components 32 can be improved.
[0159] In some embodiments, as Figure 3 、 Figure 13 shown, the heat conducting member 4 further includes a second heat conducting sheet 44, and the second heat conducting sheet 44 is disposed between the heat conducting plate 41 and the inner wall of the base shell 11, and the second heat conducting sheet 44 is in contact with the heat conducting plate 41 and the inner wall of the base shell 11 respectively.
[0160] In some examples, the contact position of the second heat conducting sheet 44 with the inner wall of the base shell 11 is different from the contact position of the heat conducting plate 41 with the inner wall of the base shell 11. In this way, the heat on the heat conducting plate 41 can be conducted to different positions on the base shell 11, so as to improve the heat dissipation efficiency of the heat conducting plate 41.
[0161] It can be understood that the second heat conducting sheet 44 can be in contact with the heat receiving portion 411 and / or the heat conducting portion 412.
[0162] Exemplarily, the second heat conducting sheet 44 is in contact with the heat receiving portion 411. Since the heat on the heat generating components 32 will be first conducted to the heat receiving portion 411, by providing the second heat conducting sheet 44, the heat on the heat conducting plate 41 can be conducted to the base shell 11 more directly and quickly, so as to improve the heat dissipation efficiency.
[0163] In some examples, the material of the second heat conducting sheet 44 includes a metal heat conducting material or a non-metal heat conducting material. Among them, the metal heat conducting material may include copper, aluminum, iron, etc. The non-metal heat conducting material may include ceramics, graphite, etc. The present application does not list them one by one here, and any material with heat conducting performance is acceptable.
[0164] In some examples, the second heat conducting sheet 44 may include a graphite copper sheet, which not only has high structural strength but also has good heat conductivity.
[0165] By providing the second heat conducting sheet 44, a part of the heat on the heat conducting plate 41 can be conducted to the base shell 11 through the second heat conducting sheet 44, and another part of the heat on the heat conducting plate 41 can be directly conducted to the base shell 11. Thus, by reasonably setting the contact positions of the second heat conducting sheet 44 and the base shell 11, and the contact positions of the heat conducting plate 41 and the base shell 11, the heat on the heat conducting plate 41 can be conducted to different positions on the base shell 11, avoiding heat concentration on the base shell 11, thereby improving the heat dissipation efficiency of the heat conducting plate 41 and the heat dissipation efficiency of the heat generating component 32.
[0166] In some embodiments, as Figure 3 shown, the base shell 11 includes a first shell part 111 and a second shell part 112, and the heat conducting plate 41 is in contact with the inner wall of the first shell part 111. The second heat conducting sheet 44 is disposed between the heat conducting plate 41 and a heat conducting seat 45 on the second shell part 112, and the second heat conducting sheet 44 is in contact with the heat conducting plate 41 and the heat conducting seat 45 respectively.
[0167] In some examples, the first shell part 111 and the second shell part 112 are buckled with each other to form a cavity a.
[0168] In some examples, the heat conducting seat 45 is in a plate-like structure, and the surface of the heat conducting seat 45 is in fitting contact with the inner wall of the second shell part 112. In this way, the contact area between the heat conducting seat 45 and the surface of the second shell part 112 can be increased, and when the second heat conducting sheet 44 is in contact with the heat conducting seat 45, the efficiency of conducting the heat on the heat conducting plate 41 to the second shell part 112 can be increased.
[0169] In some examples, the material of the heat conducting seat 45 includes a metal heat conducting material or a non-metal heat conducting material. Among them, the metal heat conducting material may include copper, aluminum, iron, etc. The non-metal heat conducting material may include ceramics, graphite, etc. The present application does not list them one by one here, and any material with heat conducting performance is acceptable.
[0170] By setting the base shell 11 into two parts, namely the first shell part 111 and the second shell part 112, it is convenient to arrange components such as the main board 3 inside the base shell 11. Since the heat conducting plate 41 is in contact with the inner wall of the first shell part 111, a part of the heat on the heat conducting plate 41 will be directly conducted to the first shell part 111. Since the heat conducting plate 41 is also in contact with the heat conducting seat 45 on the second shell part 112 through the second heat conducting sheet 44, another part of the heat on the heat conducting plate 41 will be conducted to the second shell part 112 through the second heat conducting sheet 44. In this way, the heat on the heat conducting plate 41 can be conducted to different positions of the base shell 11, avoiding heat concentration on the base shell 11 and thus improving the heat dissipation efficiency.
[0171] In some embodiments, as Figure 3 shown, a receiving cavity f communicating with the opening e is formed on the lens housing 12, and the lens module 2 is arranged in the receiving cavity f. The lens module 2 includes a fixed lens 21 and a heat conducting bracket 22. The heat conducting bracket 22 is connected to the lens housing 12, and the fixed lens 21 is connected to the heat conducting bracket 22. The video conferencing device 01 further includes a third heat conducting sheet 48. The third heat conducting sheet 48 is arranged in the receiving cavity f and is located between the heat conducting bracket 22 and the heat generating component 211 of the fixed lens 21, and is in contact with the heat conducting bracket 22 and the heat generating component 211 of the fixed lens 21 respectively.
[0172] In some examples, the materials of the third heat conducting sheet 48 and the heat conducting bracket 22 include metal heat conducting materials or non-metal heat conducting materials. Among them, the metal heat conducting materials can include copper, aluminum, iron, etc. The non-metal heat conducting materials can include ceramics, graphite, etc. The present application does not list them one by one here, and any material with heat conducting performance is acceptable.
[0173] In some examples, the heat generating component 211 can include a sensor, etc.
[0174] Through the above arrangement, the heat dissipated by the heat generating component 211 on the fixed lens 21 will be conducted to the heat conducting bracket 22 through the third heat conducting sheet 48, and then conducted to the outside of the receiving cavity f, so as to realize the heat dissipation of the fixed lens 21 and ensure the normal operation of the fixed lens 21.
[0175] In some embodiments, as Figure 14 shown, the lens module 2 further includes a moving lens 23 and a moving bracket 24. The moving bracket 24 is connected to the lens housing 12, the moving lens 23 is connected to the moving bracket 24, and the moving bracket 24 is used to drive the moving lens 23 to move; the moving bracket 24 is made of a heat conducting material; a heat radiation material is coated on the moving bracket 24 and / or an endothermic material is coated on the inner wall of the receiving cavity f.
[0176] In some examples, there are two openings e, and the moving lens 23 and the fixed lens 21 are respectively arranged at one opening e.
[0177] In some examples, the motion support 24 includes a pan-tilt head that can drive the motion lens 23 to rotate up and down.
[0178] In some examples, the material of the motion support 24 includes a metal heat-conducting material or a non-metal heat-conducting material. Among them, the metal heat-conducting material may include copper, aluminum, iron, etc. The non-metal heat-conducting material may include ceramics, graphite, etc. The present application does not list them one by one here, and any material with heat-conducting properties is acceptable.
[0179] In some examples, the heat-radiating material may include carbon black, carbon nanotube blackbody, or highly absorbent black paint, etc.
[0180] In some examples, the heat-absorbing material may include highly absorbent black paint, black chromium, black nickel, or nano-composite metal, etc.
[0181] Through the above settings, the heat on the motion lens 23 will be conducted to the motion support 24, and then conducted to the air in the accommodation cavity f, and then conducted to the lens housing 12. Since the heat-radiating material is coated on the motion support 24 and / or the heat-absorbing material is coated on the inner wall of the accommodation cavity f, the heat on the motion support 24 can be better conducted to the air in the accommodation cavity f through radiation, and / or the heat in the air in the accommodation cavity f will be better absorbed by the lens housing 12 and then dissipated to the outside of the accommodation cavity f, so as to realize the heat dissipation of the motion lens 23 and ensure the normal operation of the motion lens 23. In addition, this heat dissipation method is a non-contact heat dissipation, so it will not interfere with the movement of the motion support 24.
[0182] The above are only preferred embodiments, and do not limit the scope of the patent accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be included in the scope of patent protection by the same token.
Claims
1. A video conferencing device, characterized in that, Comprising: A housing, including a base shell and a lens shell. A cavity is formed inside the base shell. The base shell is made of a heat-conducting material. The lens shell is connected to the base shell, and an opening facing away from the base shell is formed on the lens shell. A lens module, disposed at the opening. A main board, disposed inside the cavity. The main board includes a board body and heat-generating components disposed on the board body. A heat-conducting member, disposed inside the cavity and located between the heat-generating components and the inner wall of the base shell. The heat-conducting member is in contact with the heat-generating components and the inner wall of the base shell respectively.
2. The video conferencing device according to claim 1, wherein The heat-conducting member includes: A heat-conducting plate, which includes a heat-receiving portion and a heat-conducting portion connected to each other. The heat-receiving portion is in contact with the heat-generating components. At least one heat pipe, disposed on the heat-conducting plate. The evaporation section of the heat pipe is in contact with the heat-receiving portion, and the condensation section of the heat pipe is in contact with the heat-conducting portion.
3. The video conferencing device according to claim 2, characterized in that, The at least one heat pipe includes at least one first heat pipe, which is located between the heat-receiving portion and the heat-generating components, and the evaporation section of the first heat pipe is also in contact with the heat-generating components.
4. The video conferencing device according to claim 3, characterized in that, The heat-conducting member further includes a first heat-conducting sheet, located between the evaporation section of the first heat pipe and the heat-generating components. One side surface of the first heat-conducting sheet is in contact with the evaporation section of the first heat pipe, and the other side surface of the first heat-conducting sheet is in contact with the heat-generating components.
5. The video conferencing device according to claim 2, characterized in that, A positioning groove is formed on one side surface of the heat-receiving portion facing the heat-generating components, and the heat-generating components extend into the positioning groove to be in contact with the heat-receiving portion.
6. The video conferencing device according to claim 2, wherein The heat-conducting portion includes: A substrate, connected to the heat-receiving portion. A plurality of first heat-dissipating fins, disposed between the substrate and the inner wall surface of the base shell and connected to the substrate. The first heat-dissipating fins are in contact with the inner wall of the base shell.
7. The video conferencing device according to claim 6, wherein A plurality of heat-dissipating through holes communicating with the cavity are further formed on the base shell. The heat-conducting member further includes a plurality of second heat-dissipating fins, which are disposed on the side of the substrate away from the first heat-dissipating fins and in contact with the substrate. The heat-dissipating through holes face the second heat-dissipating fins.
8. The video conferencing device according to claim 7, characterized in that, The plurality of second heat-dissipating fins are arranged at intervals in a direction parallel to the plane where the substrate is located, and the side surface in the arrangement direction of the plurality of second heat-dissipating fins has the heat-dissipating through holes.
9. The video conferencing device according to claim 2, characterized in that, The heat-conducting member further includes a second heat-conducting sheet, disposed between the heat-conducting plate and the inner wall of the base shell. The second heat-conducting sheet is in contact with the heat-conducting plate and the inner wall of the base shell respectively.
10. The video conferencing device according to claim 9, characterized in that, The base shell includes a first shell portion and a second shell portion. The heat-conducting plate is in contact with the inner wall of the first shell portion. The second heat-conducting sheet is disposed between the heat-conducting plate and a heat-conducting seat on the second shell portion. The second heat-conducting sheet is in contact with the heat-conducting plate and the heat-conducting seat respectively.
11. The video conferencing device according to any one of claims 1 to 10, characterized in that, An accommodation cavity communicating with the opening is formed on the lens shell. The lens module is disposed in the accommodation cavity. The lens module includes a fixed lens and a heat-conducting bracket. The heat-conducting bracket is connected to the lens shell, and the fixed lens is connected to the heat-conducting bracket. The video conferencing device further includes a third heat conducting sheet, which is disposed in the accommodation cavity and located between the heat conducting bracket and the heat generating component of the fixed lens, and is in contact with the heat conducting bracket and the heat generating component of the fixed lens respectively.
12. The video conferencing device according to claim 11, wherein The lens module further includes a moving lens and a moving bracket. The moving bracket is connected to the lens housing, and the moving lens is connected to the moving bracket. The moving bracket is used to drive the moving lens to move; the moving bracket is made of a heat conducting material; a heat radiation material is coated on the moving bracket and / or an endothermic material is coated on the inner wall of the accommodation cavity.