Circuit board assembly, combined circuit board and TWS earphone

Abstract

The utility model discloses a circuit board assembly part, a combined circuit board and a TWS earphone, and relates to the technical field of TWS earphone parts, the circuit board assembly part comprises a substrate and a support part, the substrate is provided with at least two welding parts, and the welding parts are respectively arranged at two opposite ends of the substrate; the periphery of the substrate is convexly provided with a connecting part; the supporting piece is arranged on the connecting part, and the supporting piece and the welding parts are located on the same side of the substrate. According to the technical scheme of the utility model, the supporting piece is welded and fixed with other circuit boards, the circuit board assembly piece and other circuit boards are positioned and fixedly connected, and then the welding parts at the two ends of the substrate are welded and fixed with other circuit boards, so that board-to-board combination can be realized, more components can be installed in a small board frame, and the installation efficiency is improved. The development requirement of miniaturization of TWS earphones is met; in the assembling process, positioning is carried out through the supporting pieces, the technological process of combination is simplified, a special bearing clamp does not need to be adopted, and the manufacturing cost of plate-to-plate combination is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of TWS earphone parts, in particular to a circuit board assembly, a combined circuit board and a TWS earphone. Background Art

[0002] TWS earphones refer to earphones without traditional connecting wires, such as Bluetooth earphones, infrared earphones, etc. With the continuous update and iteration of TWS earphones, in order to make users wear them more comfortably, the vast majority of TWS earphones are developing in the direction of miniaturization and refinement.

[0003] In order to be placed in a miniaturized TWS earphone, while the board frame of the PCBA board applied to the TWS earphone becomes smaller, the number of components that can be installed on the PCBA board is more, so a form of board - plus - board combination has evolved to enable more components to be installed in a small board frame.

[0004] Due to the limitations of the structure of the existing circuit board, when combining boards, the surface - mount technology is generally used for assembly. However, the surface - mount technology requires high precision for surface - mounting. To achieve high surface - mounting precision, a special process flow needs to be designed and a special carrying fixture is required, resulting in high manufacturing costs. Summary of the Utility Model

[0005] The main purpose of the utility model is to propose a circuit board assembly, a combined circuit board and a TWS earphone, aiming to reduce the manufacturing cost of the board - plus - board combination process.

[0006] To achieve the above object, the circuit board assembly proposed by the utility model is applied to a TWS earphone, and the circuit board assembly includes:

[0007] A substrate having at least two welding parts, each of the welding parts being located at opposite ends of the substrate; a connecting part is convexly provided on the periphery of the substrate; and

[0008] A support member provided on the connecting part, the support member and each of the welding parts being on the same side of the substrate.

[0009] The utility model also proposes a combined circuit board, which is assembled by two of the above - mentioned circuit board assemblies. The support member in one circuit board assembly is fixedly connected to the support member in the other circuit board assembly, and the two welding parts in one circuit board assembly are fixedly connected to the two welding parts in the other circuit board assembly in one - to - one correspondence.

[0010] The utility model also proposes a TWS earphone, which includes a housing and the above - mentioned combined circuit board, and the combined circuit board is arranged in the housing. Description of the Drawings

[0011] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0012] Figure 1 It is a schematic structural diagram of an embodiment of a circuit board assembly provided by the present invention;

[0013] Figure 2 It is a schematic structural diagram of another embodiment of a circuit board assembly provided by the present invention;

[0014] Figure 3 It is a schematic structural diagram of an embodiment of a combined circuit board provided by the present invention.

[0015] Explanation of the reference numerals in the drawings:

[0016] 100, circuit board assembly; 1, substrate; 11, welding part; 12, connecting part; 2, chip; 3, support; 31, positioning protrusion; 4, exposed copper alignment line; 5, conductive elastic sheet;

[0017] 200, combined circuit board; 6, epoxy glue protective layer.

[0018] The realization of the purpose, functional characteristics and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0020] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0021] In addition, if the descriptions such as "first" and "second" are involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be construed as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. In addition, the technical solutions between the respective embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0022] The present utility model provides a circuit board assembly 100.

[0023] Please refer to Figure 1 and Figure 2 , the circuit board assembly 100 includes a substrate 1 and a support member 3. The substrate 1 has at least two welding portions 11, and each welding portion 11 is respectively located at opposite ends of the substrate 1; a connecting portion 12 is convexly provided on the periphery of the substrate 1; the support member 3 is provided on the connecting portion 12, and the support member 3 and each welding portion 11 are located on the same side of the substrate 1.

[0024] The technical solution of the present utility model realizes the position positioning and fixed connection of the circuit board assembly 100 and other circuit boards by welding and fixing the support member 3 with other circuit boards, and then welding and fixing the welding portions 11 at both ends of the substrate 1 with other circuit boards. In this way, the combination of board and board can be realized, and more components can be installed in a small board frame, meeting the development requirements of the miniaturization of TWS earphones; during assembly, positioning is carried out through the support member 3, simplifying the process flow of the combination, and there is no need to use a special carrying fixture, reducing the manufacturing cost of the board and board combination.

[0025] In an embodiment of the present utility model, the substrate 1 has two welding portions 11, and the two welding portions 11 are respectively located at opposite ends of the substrate 1. The welding portions 11 at both ends of the substrate 1 are respectively welded to other circuit boards, so that the substrate 1 can be firmly connected to other circuit boards, avoiding damage to the combined board of the board and board caused by the loosening of the substrate 1.

[0026] It can be understood that in order to better save space and make the combined board formed by combining the present circuit board assembly 100 with other circuit boards more miniaturized, after the welding portions 11 are welded to other circuit boards, the user can cut and separate the connecting portion 12 on the substrate 1 together with the support member 3, and only leave the main body portion of the substrate 1, meeting the development requirements of the miniaturization of TWS earphones.

[0027] Please refer to Figure 1 In an embodiment of the present utility model, a positioning protrusion 31 is formed on one side of the support member 3 facing away from the connection portion 12. Forming the positioning protrusion 31 on one side of the support member 3 facing away from the connection portion 12 can effectively assist in positioning the support member 3, making the welding position between the circuit board assembly 100 and other circuit boards more accurate, thereby improving the structural stability after the combination of the circuit board assembly 100 and other circuit boards; the design of the positioning protrusion 31 enables the support member 3 to be more standardized during the installation process, and the automatic assembly equipment can recognize the positioning protrusion 31, so as to automatically assemble the circuit board assembly 100 and other circuit boards. In this way, the assembly efficiency of the circuit board assembly 100 and other circuit boards can be improved in large-scale production.

[0028] At least one connection portion 12 protrudes from the periphery of the substrate 1, and the circuit board assembly 100 includes a support member 3 provided on each connection portion 12. Please refer to Figure 1 and Figure 2 In an embodiment of the present utility model, the substrate 1 includes two relatively arranged first sides and two relatively arranged second sides, and each first side connects two adjacent second sides; four connection portions 12 protrude from the periphery of the substrate 1, two of the connection portions 12 are spaced apart on one first side, and the other two connection portions 12 are spaced apart on the other first side; the circuit board assembly 100 includes four support members 3, and each support member 3 is provided on a connection portion 12. By providing two spaced connection portions 12 on two opposite first sides of the substrate 1 and evenly distributing the four support members 3 on both sides of the substrate 1, the circuit board assembly 100 is more stable when welded and connected to other circuit boards, facilitating the positioning and fixing of the circuit board assembly 100 and improving the welding efficiency.

[0029] Please refer to Figure 1 In an embodiment of the present utility model, the circuit board assembly 100 further includes four copper-exposed alignment lines 4, and each copper-exposed alignment line 4 is provided on a connection portion 12 and is disposed close to a support member 3. The copper-exposed alignment line 4 is located on the connection portion 12 and close to the support member 3, which helps to provide an accurate alignment reference during the assembly process of the circuit board assembly 100 and other circuit boards, ensuring correct welding. The copper-exposed alignment line 4 can be used as part of the electrical connection to provide a good conduction path and ensure stable current transmission.

[0030] Please refer to Figure 2, in an embodiment of the present utility model, the circuit board assembly 100 further includes a chip 2. The chip 2 is connected to the substrate 1, and the chip 2 and the welding part 11 are respectively located on both sides of the substrate 1. The chip 2 and the welding part 11 being respectively located on both sides of the substrate 1 saves space, enables the structure of the circuit board assembly 100 to be more compact, and contributes to the miniaturization of the board-to-board combination board. At the same time, placing the chip 2 and the welding part 11 on both sides of the substrate 1 respectively can reduce the electrical interference between them, improving the stability of the circuit and the clarity of the signal.

[0031] Please refer to Figure 2 , in an embodiment of the present utility model, the circuit board assembly 100 includes a conductive elastic sheet 5. The conductive elastic sheet 5 is disposed on the substrate 1 and is electrically connected to the chip 2. The electrical connection between the conductive elastic sheet 5 and the chip 2 can ensure stable current transmission. The conductive elastic sheet 5 can reduce circuit noise and ensure the clarity of signal transmission. In a limited space, the conductive elastic sheet 5 can support high-density circuit assembly, thereby integrating more components in a limited space, which is beneficial to the miniaturization of the board-to-board combination board.

[0032] The present utility model also proposes a combined circuit board 200, which is assembled by two circuit board assemblies 100. The specific structure of the circuit board assembly 100 refers to the above embodiments. Since the combined circuit board 200 adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one. Among them, the support member 3 in one circuit board assembly 100 is fixedly connected to the support member 3 in the other circuit board assembly 100, and the two welding parts 11 in one circuit board assembly 100 are fixedly connected to the two welding parts 11 in the other circuit board assembly 100 in one-to-one correspondence. By welding the support members 3 on the two circuit board assemblies 100 correspondingly, the welding parts 11 on the two circuit board assemblies 100 can be fixedly connected in one-to-one correspondence, ensuring the precise alignment between the two circuit board assemblies 100, improving the welding success rate between the two circuit board assemblies 100, and thus reducing the probability of damage to the combined circuit board 200 caused by the loosening of the welding parts 11 between the two circuit board assemblies 100.

[0033] It can be understood that, in order to better save space and make the combined circuit board 200 more miniaturized, after the welding parts 11 of the two circuit board assemblies 100 are welded correspondingly, the user can cut and separate the connecting parts 12 on the substrates 1 of the two circuit board assemblies 100 together with the support members 3, and only leave the main parts of the substrates 1 of the two circuit board assemblies 100. In this way, the structure of the combined circuit board 200 is more compact, meeting the development requirements of the miniaturization of TWS earphones.

[0034] Please refer to Figure 3, in an embodiment of the present utility model, the combined circuit board 200 further includes two epoxy glue protective layers 6. One side of each of the two epoxy glue protective layers 6 is respectively connected to two welding parts 11 in a circuit board fitting 100, and the other side of each of the two epoxy glue protective layers 6 is respectively connected to two welding parts 11 in another circuit board fitting 100. The epoxy glue protective layer 6 can serve as an additional fixing and supporting structure to improve the overall mechanical stability and durability of the combined circuit board 200, and reinforce the welding of the welding parts 11 of the two circuit board fittings 100; the epoxy glue protective layer 6 helps to disperse the force and reduce the risk of damage to the welding parts 11 caused by external forces; at the same time, the epoxy glue protective layer 6 can effectively isolate the adverse effects of the external environment on the welding joints of the welding parts 11, such as moisture, dust, chemical substances, etc., thereby improving the reliability and durability of the combined circuit board 200.

[0035] It can be understood that the substrate 1 can be made of a hard material or a soft material. That is, the combination form of the substrates 1 in the two circuit board fittings 100 assembled into the combined circuit board 200 can be: 1. PCB board and PCB board; 2. PCB board and FPC board; 3. FPC board and FPC board.

[0036] The materials of the PCB board include but are not limited to glass fiber reinforced epoxy resin, aluminum substrate 1, ceramic substrate 1, etc.; the materials of the FPC board include but are not limited to polyimide, polyester film, copper foil, etc.

[0037] In an embodiment of the present utility model, the materials of the substrates 1 in the two circuit board fittings 100 are both glass fiber reinforced epoxy resin. Glass fiber reinforced epoxy resin is a hard material. The materials of the substrates 1 in the two circuit board fittings 100 are both glass fiber reinforced epoxy resin, which can make the overall structural strength of the combined circuit board 200 higher.

[0038] In an embodiment of the present utility model, the material of the substrate 1 in one circuit board fitting 100 is glass fiber reinforced epoxy resin, and the material of the substrate 1 in the other circuit board fitting 100 is polyimide. Glass fiber reinforced epoxy resin is a hard material, and polyimide is a soft material. The materials of the substrates 1 in the two circuit board fittings 100 are glass fiber reinforced epoxy resin and polyimide respectively. The combination of the soft circuit board and the hard circuit board can achieve a complex three-dimensional layout in a limited space, making the space layout of the combined circuit board more compact.

[0039] In an embodiment of the present utility model, the substrate 1 in the two circuit board assemblies 100 is made of polyimide. Polyimide is a soft material. Since the substrate 1 in the two circuit board assemblies 100 is made of polyimide, the combined circuit board 200 formed by combining two flexible circuit boards can be freely bent and folded, making the design more flexible and capable of adapting to various complex and irregular spatial layouts.

[0040] The present utility model also provides a pair of TWS earphones. The TWS earphones include a housing and a combined circuit board 200. The combined circuit board 200 is disposed inside the housing, and the housing can protect the combined circuit board 200 from being damaged by external objects.

[0041] The above are only exemplary embodiments of the present utility model, and do not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. A circuit board assembly, applied to TWS earphones, characterized in that The circuit board assembly includes: a substrate having at least two soldering parts respectively disposed at opposite ends of the substrate; a connecting part protruding from the periphery of the substrate; and a support member disposed on the connecting part, and the support member and each of the soldering parts are on the same side of the substrate.

2. The circuit board assembly according to claim 1, wherein, A positioning protrusion is formed on a side of the support member facing away from the connecting part.

3. The circuit board assembly according to claim 2, characterized in that, The substrate includes two opposite first sides and two opposite second sides, and each first side connects two adjacent second sides; four connecting parts protrude from the periphery of the substrate, two of the connecting parts are spaced apart and disposed on one first side, and the other two connecting parts are spaced apart and disposed on the other first side; the circuit board assembly includes four support members, and each support member is disposed on one connecting part.

4. The circuit board assembly according to claim 3, characterized in that, The circuit board assembly further includes four exposed copper alignment lines, and each exposed copper alignment line is disposed on one connecting part and is disposed close to one support member.

5. The circuit board assembly according to any one of claims 1 to 4, wherein The circuit board assembly further includes a chip, the chip is connected to the substrate, and the chip and the soldering parts are respectively on two sides of the substrate.

6. The circuit board assembly according to claim 5, wherein The circuit board assembly further includes a conductive elastic sheet, the conductive elastic sheet is disposed on the substrate and is electrically connected to the chip.

7. A combined circuit board, characterized in that, The combined circuit board is assembled from two circuit board assemblies according to any one of claims 1 to 6, the support member in one circuit board assembly is fixedly connected to the support member in the other circuit board assembly, and the two soldering parts in one circuit board assembly are fixedly connected to the two soldering parts in the other circuit board assembly in one-to-one correspondence.

8. The combined circuit board according to claim 7, characterized in that, The combined circuit board further includes two epoxy glue protective layers, one side of each of the two epoxy glue protective layers is respectively connected to the two soldering parts in one circuit board assembly, and the other side of each of the two epoxy glue protective layers is respectively connected to the two soldering parts in the other circuit board assembly.

9. The combined circuit board according to claim 7, characterized in that, The substrates in the two circuit board assemblies are both made of glass fiber reinforced epoxy resin; or, the substrate in one circuit board assembly is made of glass fiber reinforced epoxy resin, and the substrate in the other circuit board assembly is made of polyimide.

10. A TWS earphone, characterized in that, The TWS earphone includes a housing and a combined circuit board according to any one of claims 7 to 9, and the combined circuit board is disposed in the housing.

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