Copper deposition device for multilayer printed circuit board

Abstract

The utility model discloses a multilayer printed circuit board copper deposition device which comprises a traction mechanism, the lower end of the traction mechanism is connected with a bearing frame, one side of the bearing frame is fixedly provided with a mounting plate, the mounting plate is provided with an air cylinder, the tail end of a piston rod of the air cylinder is rotatably connected with two pull rods, and the two pull rods are arranged on the bearing frame. Sliding grooves are formed between the opposite side walls in the bearing frame, two sliding blocks are installed in one sliding groove on the same side and connected through a connecting rod, one end of one pull rod on the same side is rotationally connected to one side of one sliding block on the same side, a connecting plate is jointly fixed between the two sliding blocks, and the two sliding blocks are connected through a connecting rod. A movable plate is fixed to the lower end of the connecting plate. According to the utility model, the contact range and area of the printed circuit board in molten copper can be effectively improved, the rapid reaction of the printed circuit board can be ensured, the reaction efficiency of the printed circuit board is effectively enhanced, the reaction time is shortened, and the processing speed and the practicability and rapidity are enhanced on the premise of ensuring the quality.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board processing, in particular to a copper deposition device for multi-layer printed circuit boards. Background Art

[0002] As a carrier for electronic components, printed circuit boards have been widely used in the field of electronic devices to achieve connections between electronic components.

[0003] The copper wires used to connect complex circuits on printed circuit boards are completed by the copper deposition process. Chemical copper deposition is a self-catalytic oxidation-reduction reaction; the circuit board to be copper-deposited is immersed in the copper deposition solution, and Cu2+ in the copper deposition solution gains electrons and is reduced to metallic copper and deposited on the circuit board. Chemical copper deposition can deposit copper on any non-conductive substrate, making copper deposition widely used in the field of printed circuit board manufacturing.

[0004] However, traditional chemical copper deposition is carried out in a tank. The circuit board to be copper-deposited is immersed in the copper deposition solution in the tank. As the oxidation-reduction reaction proceeds, the concentration distribution of the copper deposition solution becomes more and more uneven, resulting in large differences in the deposition amount and deposition speed of the deposition areas on each part of the circuit board, uneven deposition quality, reducing the quality of the circuit board, and waiting for its slow reaction, with low efficiency. Therefore, we propose a copper deposition device for multi-layer printed circuit boards to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the deficiencies existing in the prior art and propose a copper deposition device for multi-layer printed circuit boards.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A copper deposition device for multi-layer printed circuit boards includes a traction mechanism. A carrier is connected to the lower end of the traction mechanism. A mounting plate is fixed to one side of the carrier. A cylinder is mounted on the mounting plate. The end of the piston rod of the cylinder is rotatably connected to two pull rods. A chute is provided between the opposite side walls inside the carrier. Two sliders are mounted in one chute on the same side, and the two sliders are connected by a connecting rod. One end of a pull rod on the same side is rotatably connected to one side of a slider on the same side. A connecting plate is commonly fixed between the two sliders. A moving plate is fixed to the lower end of the connecting plate. The lower end of the moving plate is movably connected to an installation box. A plurality of baffles are equidistantly arranged between the opposite side walls inside the installation box, and the baffles are opposite to each other in pairs.

[0008] Preferably, a suspension rope is connected to the lower end of the traction mechanism. Suspension ears are fixed to both sides of the upper end of the carrier, and the suspension rope is connected to the suspension ears.

[0009] Preferably, fixing plates are fixed on both sides of the upper end of the installation box. A stud is threadedly sleeved on the fixing plate. The upper end of the stud is rotatably connected to the lower end of the moving plate, and a nut is threadedly sleeved on the stud.

[0010] Preferably, one end of the air cylinder is connected with an air delivery pipe.

[0011] Preferably, the moving plate is fixed on the connecting plate by screws.

[0012] Preferably, the installation box is made of a filter net.

[0013] In the present utility model, when the circuit board needs to be immersed in the copper water, it is pre-inserted between multiple baffles, and then the carrier is driven to descend by the traction mechanism, and then the installation box is driven to sink into the copper water for immersion. During the immersion, the air cylinder drives the pull rod to move through the telescopic movement of the piston rod, and then the movement of the slider in the chute is realized. As the slider moves, the four sliders move reciprocally simultaneously through the connecting rod. The movement of the slider drives the moving plate to move reciprocally, and then drives the installation box at the lower end to move reciprocally, so as to drive the printed circuit board to reciprocally contact the copper water in the copper water, improving its immersion efficiency and simultaneously improving the immersion quality.

[0014] The present utility model can not only effectively increase the contact range and area of the printed circuit board in the copper water, but also ensure its rapid reaction, effectively enhancing its reaction efficiency, reducing the reaction time, improving the processing speed on the premise of ensuring the quality, and enhancing the practicability and rapidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the structural diagram of the present utility model;

[0016] Figure 2 is the top view of the carrier of the present utility model;

[0017] Figure 3 is the structural diagram of the installation of the moving plate and the stud of the present utility model;

[0018] Figure 4 is the external structural diagram of the carrier of the present utility model;

[0019] Figure 5 is Figure 2 the enlarged view of the structure at A of

[0020] In the figure: 1 carrier, 2 lifting lugs, 3 air delivery pipe, 4 fixing plate, 5 stud, 6 installation box, 7 traction mechanism, 8 suspension rope, 9 nut, 10 baffle, 11 mounting plate, 12 chute, 13 slider, 14 connecting rod, 15 moving plate, 16 pull rod, 17 air cylinder, 18 connecting plate, 19 screw. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0022] Referring to Figures 1-5 , a copper deposition device for a multi-layer printed circuit board, including a traction mechanism 7. A carrier 1 is connected to the lower end of the traction mechanism 7. A suspension rope 8 is connected to the lower end of the traction mechanism 7. Suspension lugs 2 are fixed on both sides of the upper end of the carrier 1. The suspension rope 8 is connected to the suspension lugs 2. Through the combination of the suspension rope 8, the lower carrier 1 can be stably lifted and lowered.

[0023] An installation plate 11 is fixed on one side of the carrier 1. A cylinder 17 is installed on the installation plate 11. The end of the piston rod of the cylinder 17 is rotatably connected to two pull rods 16. An air delivery pipe 3 is connected to one end of the cylinder 17. When the piston rod of the cylinder 17 expands and contracts, an air pump connected through the air delivery pipe 3 performs the air delivery movement to realize the expansion and contraction of the piston rod.

[0024] Chute 12 is provided between the opposite side walls inside the carrier 1. Two sliders 13 are installed in one chute 12 on the same side, and the two sliders 13 are connected by a connecting rod 14. One end of a pull rod 16 on the same side is rotatably connected to one side of a slider 13 on the same side. A connecting plate 18 is jointly fixed between the two sliders 13. A moving plate 15 is fixed to the lower end of the connecting plate 18. The moving plate 15 is fixed to the connecting plate 18 by screws 19, which is convenient for its installation and disassembly and replacement of different types of installation boxes 6.

[0025] The lower end of the moving plate 15 is movably connected to an installation box 6. The installation box 6 is made of a filter screen, which is convenient for the entry of copper solution. A plurality of baffles 10 are equidistantly arranged between the opposite side walls inside the installation box 6, and the baffles 10 are opposite to each other in pairs. The circuit boards to be soaked are inserted between the baffles 10, which can stably install and clamp them to ensure stability during soaking.

[0026] Fixed plates 4 are fixed on both sides of the upper end of the installation box 6. Studs 5 are threadedly sleeved on the fixed plates 4. The upper ends of the studs 5 are rotatably connected to the lower end of the moving plate 15. Nuts 9 are threadedly sleeved on the studs 5. By adjusting the nuts 9, the height of the installation box 6 can be adjusted, and thus full adaptation can be achieved.

[0027] In the present utility model, when the circuit board needs to be immersed in the copper water, it is pre-inserted between a plurality of baffles 10, and then the traction mechanism 7 drives the carrier 1 to descend, and then drives the installation box 6 to sink into the copper water for immersion. During the immersion, the cylinder 17 drives the pull rod 16 to move through the telescopic movement of the piston rod, and then realizes the movement of the slider 13 in the chute 12. As the slider 13 moves, the four sliders 13 move reciprocally simultaneously through the connecting rod 14. The movement of the slider 13 drives the moving plate 15 to move reciprocally, and then drives the installation box 6 at the lower end to move reciprocally, so as to drive the printed circuit board to reciprocally contact the copper water in the copper water, improving its immersion efficiency and at the same time improving the immersion quality.

[0028] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A copper deposition device for a multi-layer printed circuit board, comprising a traction mechanism (7), characterized in that, The lower end of the traction mechanism (7) is connected to a carrier (1). One side of the carrier (1) is fixed with a mounting plate (11). A cylinder (17) is mounted on the mounting plate (11). The end of the piston rod of the cylinder (17) is rotatably connected to two pull rods (16). A chute (12) is provided between the opposite side walls inside the carrier (1). Two sliders (13) are mounted in one chute (12) on the same side, and the two sliders (13) are connected by a connecting rod (14). One end of a pull rod (16) on the same side is rotatably connected to one side of a slider (13) on the same side. A connecting plate (18) is fixedly arranged between the two sliders (13). The lower end of the connecting plate (18) is fixed with a moving plate (15). The lower end of the moving plate (15) is movably connected to a mounting box (6). A plurality of baffles (10) are equidistantly arranged between the opposite side walls inside the mounting box (6), and the baffles (10) are opposite to each other in pairs.

2. The copper deposition device for a multi-layer printed circuit board according to claim 1, wherein: A suspension rope (8) is connected to the lower end of the traction mechanism (7). Suspension lugs (2) are fixed on both sides of the upper end of the carrier (1). The suspension rope (8) is connected to the suspension lugs (2).

3. A copper deposition device for a multi-layer printed circuit board according to claim 1, characterized in that: Fixing plates (4) are fixed on both sides of the upper end of the mounting box (6). A stud (5) is threadedly sleeved on the fixing plate (4). The upper end of the stud (5) is rotatably connected to the lower end of the moving plate (15). A nut (9) is threadedly sleeved on the stud (5).

4. A copper deposition device for a multi-layer printed circuit board according to claim 1, characterized in that: One end of the cylinder (17) is connected to an air delivery pipe (3).

5. A copper deposition device for a multi-layer printed circuit board according to claim 1, characterized in that: The moving plate (15) is fixed to the connecting plate (18) by screws (19).

6. The copper deposition device for a multi-layer printed circuit board according to claim 1, wherein: The mounting box (6) is made of a filter net.

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