In-mold electronic panel with heating structure

Abstract

The utility model discloses an in-mold electronic panel with a heating structure, which relates to the technical field of panels and comprises a shell, a first layer of membrane and a second layer of membrane are sequentially mounted in the shell from top to bottom, an ink layer is arranged on the upper surface of the first layer of membrane, the heating structure is mounted on the first layer of membrane, and an ink layer is arranged on the lower surface of the second layer of membrane. A conductive circuit is installed on the upper surface of the second layer membrane, a light-emitting structure is installed at the lower end of the second layer membrane, and the heating structure and the light-emitting structure are both electrically connected with the conductive circuit. The heating structure comprises a heating copper wire and a copper pad, and the heating copper wire is installed at the bottom of the first layer of membrane in an embedded mode to achieve the temperature sensing and heating functions. According to the utility model, the heating structure is arranged and can be used for heating the first layer of membrane and the second layer of membrane so as to prevent the sheets from influencing the performance of the electronic panel or causing damage due to supercooling, thereby ensuring the normal operation of the electronic panel and prolonging the service life of the electronic panel.

Description

Technical Field

[0001] The utility model relates to the technical field of panels, in particular to an in-mold electronic panel with a heating structure. Background Art

[0002] In-mold electronic panels are widely used in various technical fields such as automotive interiors, home appliance control panels, smart homes, remote control devices, etc. Moreover, with the continuous development and maturity of technology, in-mold electronics are gradually being applied to the aviation field due to their relatively small overall weight and excellent stability. Currently, when in-mold electronic panels are applied in different places, the performance of the electronic panel is often affected or damaged due to the sheet material being too cold, which affects the normal operation of the electronic panel and reduces its service life. Therefore, an in-mold electronic panel with a heating structure is needed to improve the above problems. Summary of the Utility Model

[0003] The purpose of the utility model is to provide an in-mold electronic panel with a heating structure, aiming to solve the above technical problems. By setting the heating structure, the utility model can be used to heat the first layer of film and the second layer of film to prevent the sheet material from affecting the performance of the electronic panel or causing damage due to being too cold, thereby ensuring the normal operation of the electronic panel and extending its service life.

[0004] To achieve the above purpose, the utility model is realized through the following technical solutions:

[0005] An in-mold electronic panel with a heating structure includes a housing. Inside the housing, a first layer of film and a second layer of film are sequentially installed from top to bottom. An ink layer is provided on the upper surface of the first layer of film. A heating structure is installed on the first layer of film. A conductive circuit is installed on the upper surface of the second layer of film. A light-emitting structure is installed at the lower end of the second layer of film. Both the heating structure and the light-emitting structure are electrically connected to the conductive circuit. The conductive circuit is used to transmit current. The housing serves to fix the positions of the first layer of film and the second layer of film.

[0006] Preferably, the heating structure includes a heating copper wire and a copper pad. The heating copper wire is embedded at the bottom of the first layer of film to achieve the function of sensing temperature and generating heat.

[0007] Preferably, one end of the copper pad is welded to the heating copper wire, and the other end of the copper pad is installed on the housing.

[0008] Preferably, the light-emitting structure includes an LED light strip, and the LED light strip is welded to the bottom of the second layer of film to achieve the function of product light emission.

[0009] Preferably, the thickness of the first layer of film is 0.2 mm - 0.5 mm.

[0010] Preferably, the thickness of the second layer of diaphragm is 0.2 mm - 0.5 mm.

[0011] Preferably, the material of the housing is any one of PC material, ABS material or PMMA material.

[0012] Preferably, an upper through hole is provided on the first layer of diaphragm, and a lower through hole is provided on the second layer of diaphragm, and the upper through hole communicates with the lower through hole.

[0013] Preferably, a fixing part is provided on one side of the housing, and a plurality of connection holes are provided on the fixing part.

[0014] The in-mold electronic panel with a heating structure of the present utility model has the following beneficial effects:

[0015] 1. The in-mold electronic panel with a heating structure of the present utility model can be used to heat the first layer of diaphragm and the second layer of diaphragm by setting the heating structure, so as to prevent the sheet material from affecting the performance of the electronic panel or causing damage due to excessive cold, thereby ensuring the normal operation of the electronic panel and extending its service life;

[0016] 2. The in-mold electronic panel with a heating structure of the present utility model uses the IME process to screen-print the conductive circuit on the surface of the second layer of diaphragm, eliminating the large-volume printed circuit board, greatly reducing the product thickness, reducing the overall weight of the product, reducing the processing cost, and improving the reliability and durability of the product;

[0017] 3. The in-mold electronic panel with a heating structure of the present utility model has the LED light strip welded at the bottom of the second layer of diaphragm to realize the light-emitting function of the product. The light generated by the LED light strip can also have various colors through the light presented on the electronic panel by the ink layer, which is convenient for users to quickly identify each operation position of the panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the overall structural schematic diagram of the in-mold electronic panel with a heating structure of the present utility model;

[0019] Figure 2 is the structural split schematic diagram of the in-mold electronic panel with a heating structure of the present utility model Figure 1 ;

[0020] Figure 3 is the structural split schematic diagram of the in-mold electronic panel with a heating structure of the present utility model Figure 2 ;

[0021] The reference numerals in the figure are:

[0022] 1. Housing; 2. First layer of diaphragm; 3. Second layer of diaphragm; 4. Ink layer; 5. Heating structure; 6. Heating copper wire; 7. Copper pad; 8. Upper through-hole; 9. Lower through-hole; 10. Fixing part; 11. Connecting hole. Detailed implementation manner

[0023] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the products of the present invention will be further described in detail below in conjunction with embodiments and the accompanying drawings.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element; when an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific implementation manners and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] As Figures 1 to 3 shown, an in-mold electronic panel with a heating structure includes a housing 1. Inside the housing 1, a first layer of diaphragm 2 and a second layer of diaphragm 3 are sequentially installed from top to bottom. An ink layer 4 is provided on the upper surface of the first layer of diaphragm 2. A heating structure 5 is installed on the first layer of diaphragm 2. A conductive circuit (not shown in the figure) is installed on the upper surface of the second layer of diaphragm 3. A light-emitting structure (not shown in the figure) is installed at the lower end of the second layer of diaphragm 3. Both the heating structure 5 and the light-emitting structure are electrically connected to the conductive circuit.

[0027] It should be noted that the ink layer 4 is screen-printed on the upper surface of the first layer of diaphragm 2. The ink layer 4 can print ink patterns of different colors and different types, so that there can be more choices for the surface color appearance of the product, meeting the needs of users and having strong practicability;

[0028] In this embodiment, the IME process is used to screen-print the conductive circuit on the surface of the second layer of diaphragm 3, eliminating the large-volume printed circuit board, greatly reducing the thickness of the product, reducing the overall weight of the product, reducing the processing cost, and improving the reliability and durability of the product.

[0029] As Figure 1 and Figure 2As shown, the heating structure 5 includes a heating copper wire 6 and a copper pad 7. One end of the copper pad 7 is welded to the heating copper wire 6, and the other end of the copper pad 7 is mounted on the housing 1. The heating copper wire 6 is embedded at the bottom of the first layer of diaphragm 2 to achieve the function of sensing temperature and generating heat.

[0030] It should be noted that by setting the heating structure 5, it can be used to heat the first layer of diaphragm 2 and the second layer of diaphragm 3 to prevent the sheet material from affecting the performance of the electronic panel or causing damage due to being too cold. At the same time, by setting the heating copper wire 6 at the bottom of the first layer of diaphragm 2, local overheating or overcooling of the sheet material can be effectively avoided, thus ensuring the normal operation of the electronic panel and extending its service life. When used in conjunction with the PCB board, the heating intensity can be adjusted. When the temperature of the heating copper wire 6 is too low, it is heated to a suitable temperature and stops heating after reaching a certain temperature, realizing the adjustment and maintenance of the temperature.

[0031] It should be further noted that the heating principle of the heating copper wire 6: the heating copper wire 6 converts electrical energy into heat energy, and uses the resistance characteristics of the thin wire material to generate high temperature, thus realizing the function of sensing temperature and generating heat.

[0032] It should be noted that the setting of the ink layer 4 and the first layer of diaphragm 2 can effectively protect the heating copper wire 6 at the bottom of the first layer of diaphragm 2 and the conductive circuit on the second layer of diaphragm 3, avoid the failure of the electronic function of the product due to the breakage of the circuit, and improve the durability of the present invention.

[0033] As Figure 1 and Figure 2 shown, the light-emitting structure includes an LED light strip. The LED light strip is welded to the bottom of the second layer of diaphragm 3 to achieve the light-emitting function. The LED light strip is soldered to the bottom of the second layer of diaphragm 3 to achieve the light-emitting function of the product. The LED light strip can be installed at a suitable position at the bottom of the second layer of diaphragm 3 according to actual needs.

[0034] It should be noted that the light generated by the LED light strip and presented on the electronic panel through the ink layer 4 can also have various colors, which is convenient for users to quickly identify the respective operation positions of the panel.

[0035] As Figure 1 and Figure 2 shown, the thickness of the first layer of diaphragm 2 is 0.2 mm - 0.5 mm. In this embodiment, the thickness of the first layer of diaphragm 2 can be 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm. Preferably, it is 0.3 mm. By setting the thickness of the first layer of diaphragm 2 not less than 0.2 mm, the durability can be ensured; the thickness of the first layer of diaphragm 2 not higher than 0.5 mm can improve the overall thinness and lightness of the product as much as possible.

[0036] As Figure 1 andFigure 2 As shown, the thickness of the second diaphragm 3 is 0.2 mm - 0.5 mm. The thickness of the second diaphragm 3 in the embodiment can be 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm. Preferably, it is 0.3 mm. By setting the thickness of the second diaphragm 3 to be not less than 0.2 mm, the durability can be ensured; and by setting the thickness of the second diaphragm 3 to be not more than 0.5 mm, the overall thin and light degree of the product can be improved as much as possible.

[0037] As Figure 1 and Figure 2 As shown, the housing 1 is made of PC, ABS or other transparent materials such as PMMA, and has good light transmission effect. In this embodiment, the housing 1 is made of PC material. The PC material is heat-resistant and inexpensive, has better toughness, is less likely to break or be damaged when impacted by external force, thus providing better protection. At the same time, it also has excellent transparency and lighting effect, as well as good weather resistance, and can maintain good physical properties in various environments.

[0038] As Figure 1 and Figure 2 As shown, the materials of the first diaphragm 2 and the second diaphragm 3 in this embodiment can be PC, PET, PMMA or other common materials.

[0039] As Figure 2 As shown, an upper through hole 8 is further provided on the first diaphragm 2, and a lower through hole 9 is further provided on the second diaphragm 3. The upper through hole 8 communicates with the lower through hole 9. The upper through hole 8 and the lower through hole 9 are used for the leakage of other related devices or components, so that the related devices or components are exposed on the surface of the product.

[0040] As Figure 2 As shown, a fixing part 10 is further provided on one side of the housing 1, and a plurality of connection holes 11 are provided on the fixing part 10. The fixing part 10 is used to fix the PCB board or other devices.

[0041] The above is only the preferred embodiment of the present invention, and it does not impose any form of limitation on the present invention; any ordinary technician in the industry can smoothly implement the present invention according to the illustrations in the specification and the above description; however, any slight changes, modifications and evolutions made by those skilled in the art within the scope of the technical solution of the present invention by using the technical content disclosed above are all equivalent embodiments of the present invention; at the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. An in-mold electronic panel with a heating structure, characterized in that: It includes a housing (1), inside which a first-layer diaphragm (2) and a second-layer diaphragm (3) are successively installed from top to bottom. An ink layer (4) is provided on the upper surface of the first-layer diaphragm (2). A heating structure (5) is installed on the first-layer diaphragm (2). A conductive circuit is installed on the upper surface of the second-layer diaphragm (3). A light-emitting structure is installed at the lower end of the second-layer diaphragm (3). Both the heating structure (5) and the light-emitting structure are electrically connected to the conductive circuit.

2. The in-mold electronic panel with a heating structure according to claim 1, wherein: The heating structure (5) includes a heating copper wire (6) and a copper pad (7), and the heating copper wire (6) is embedded and installed at the bottom of the first-layer diaphragm (2).

3. The in-mold electronic panel with a heating structure according to claim 2, characterized in that: One end of the copper pad (7) is welded to the heating copper wire (6), and the other end of the copper pad (7) is installed on the housing (1).

4. The in-mold electronic panel with a heating structure according to claim 1, wherein: The light-emitting structure includes an LED light strip, and the LED light strip is welded to the bottom of the second-layer diaphragm (3).

5. The in-mold electronic panel with a heating structure according to claim 1, wherein: The thickness of the first-layer diaphragm (2) is 0.2 mm - 0.5 mm.

6. The in-mold electronic panel with a heating structure according to claim 1, wherein: The thickness of the second-layer diaphragm (3) is 0.2 mm - 0.5 mm.

7. The in-mold electronic panel with a heating structure according to claim 1, wherein: The material of the housing (1) is any one of PC material, ABS material or PMMA material.

8. The in-mold electronic panel with a heating structure according to claim 1, characterized in that: An upper through hole (8) is further provided on the first-layer diaphragm (2), and a lower through hole (9) is further provided on the second-layer diaphragm (3). The upper through hole (8) communicates with the lower through hole (9).

9. The in-mold electronic panel with a heating structure according to claim 1, wherein: A fixing part (10) is further provided on one side of the housing (1), and a plurality of connection holes (11) are provided on the fixing part (10).

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