Composite insulation mylar film with high stability

Abstract

The utility model relates to the technical field of insulating sheets, in particular to a composite insulating mylar with high stability, which comprises an insulating mylar substrate, insulating mylar sunken sheets are integrally formed at two ends of the insulating mylar substrate, and silica gel heat-conducting sheets are inserted into the insulating mylar sunken sheets. A silica gel insertion block is fixed on the bottom surface of the silica gel heat-conducting sheet and penetrates through the bottom plate of the sunken sheet of the insulating Mylar sheet; the beneficial effects are that according to the composite insulation mylar film with high stability provided by the utility model, the silica gel heat-conducting sheet is inserted in the recessed sheet of the insulation mylar film, the silica gel heat-conducting sheet not only fills the groove body of the recessed sheet of the insulation mylar film, but also leads out the heat on the surface of the PCB body through the heat-conducting performance of the silica gel heat-conducting sheet, thereby realizing the effective cooling of the PCB body. And meanwhile, the surface of the silica gel heat-conducting fin is provided with the through holes and the preformed holes, so that the heat dissipation area is further increased, and heat can be dissipated more quickly.

Description

Technical Field

[0001] The utility model relates to the field of insulating sheets, in particular to a composite insulating Mylar sheet with high stability. Background Art

[0002] In electronic devices, insulating Mylar sheets are often used between PCB boards and power supply housings to prevent current from passing directly through the housing, thereby avoiding the risk of short circuits or electric shock.

[0003] However, traditional insulating Mylar sheets are insufficient in heat dissipation, especially in high-power or long-running electronic devices. If the heat generated by the PCB board cannot be dissipated in time, it may cause device performance degradation or even damage.

[0004] Therefore, there is a need for a composite insulating Mylar sheet that can provide good insulation performance and effectively dissipate heat. Utility Model Content

[0005] The utility model aims to provide a composite insulating Mylar sheet with high stability to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a composite insulating Mylar sheet with high stability, comprising an insulating Mylar sheet substrate, both ends of the insulating Mylar sheet substrate are integrally formed with insulating Mylar sheet sunken sheets, a silicone thermal conductive sheet is inserted inside the insulating Mylar sheet sunken sheet, a silicone plug is fixed to the bottom surface of the silicone thermal conductive sheet, and the silicone plug passes through the bottom plate of the insulating Mylar sheet sunken sheet.

[0007] Preferably, the insulating Microlar sheet sunken sheet is in the shape of a "匚" character, the width of the insulating Microlar sheet sunken sheet is equal to the width of the insulating Microlar sheet substrate, a plurality of insulating Microlar sheet substrates are provided, the insulating Microlar sheet substrates and the insulating Microlar sheet sunken sheets are alternately distributed, the thickness of the insulating Microlar sheet sunken sheet is greater than the thickness of the insulating Microlar sheet substrate, and the top surface of the insulating Microlar sheet sunken sheet is coplanar with the top surface of the insulating Microlar sheet substrate.

[0008] Preferably, the silicone thermally conductive sheet is a square sheet, and the size of the silicone thermally conductive sheet matches the size of the groove body of the insulating Mylar sheet sunken sheet. After the silicone thermally conductive sheet is inserted into the groove body of the insulating Mylar sheet sunken sheet, it is fixed in the groove body of the insulating Mylar sheet sunken sheet by glue, and the top surface of the silicone thermally conductive sheet is coplanar with the top surface of the insulating Mylar sheet substrate.

[0009] Preferably, a plurality of jacks are provided on the bottom plate of the insulating Mylar sheet sunken sheet, and the plurality of jacks are arranged at equal distances and in equal sizes along the long side of the insulating Mylar sheet sunken sheet, and the silicone plugs correspond to the jacks one by one, and the silicone plugs are plugged into the jacks.

[0010] Preferably, a notch is formed in the bottom surface of the silica gel insertion block.

[0011] Preferably, a through hole is formed in the surface of the silica gel heat conducting sheet, and a plurality of reserved holes are formed in the top surface of the silica gel heat conducting sheet, and the reserved holes are communicated with the through hole.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] The composite insulating mylar sheet with high stability proposed by the present utility model inserts a silica gel heat conducting sheet into the sunken sheet of the insulating mylar sheet. The silica gel heat conducting sheet not only fills the groove of the sunken sheet of the insulating mylar sheet, but also conducts the heat on the surface of the PCB board through its heat conducting performance, realizing effective cooling of the PCB board. At the same time, through holes and reserved holes are formed in the surface of the silica gel heat conducting sheet, further increasing the heat dissipation area and enabling the heat to dissipate more quickly; the insulating mylar sheet substrate and the sunken sheet of the insulating mylar sheet are distributed alternately, and the thickness of the sunken sheet is greater than that of the substrate. This design not only enhances the overall structural stability, but also makes the installed composite insulating mylar sheet more firm and not easy to loosen or fall off; while the silica gel heat conducting sheet cooperates with the jack as a heat conducting structure, it also plays a buffering role. When the PCB board is impacted or knocked, the silica gel heat conducting sheet and the jack can absorb part of the impact force, thereby protecting the PCB board from damage. Description of the Drawings

[0014] Figure 1 is a schematic structural diagram of the present utility model;

[0015] Figure 2 is a schematic bottom structural diagram of the present utility model;

[0016] Figure 3 is a top view of the structure of the present utility model;

[0017] Figure 4 is Figure 3 a sectional view of the structure at A-A in ;

[0018] Figure 5 is Figure 4 a schematic enlarged view of the structure at A in ;

[0019] Figure 6 is a schematic connection structure diagram of the insulating mylar sheet substrate and the sunken sheet of the insulating mylar sheet of the present utility model;

[0020] Figure 7 is a schematic structural diagram of the silica gel heat conducting sheet of the present utility model.

[0021] In the figure: insulating mylar sheet substrate 1, sunken sheet of insulating mylar sheet 2, silica gel heat conducting sheet 3, through hole 4, reserved hole 5, jack 6, silica gel insertion block 7, notch 8. Detailed Embodiment

[0022] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figures 1-7 The utility model provides a technical solution: a composite insulating microsheet with high stability, comprising an insulating microsheet substrate 1, both ends of the insulating microsheet substrate 1 are integrally formed with insulating microsheet sinking pieces 2, the insulating microsheet sinking pieces 2 are in the shape of a "匚" character, the width of the insulating microsheet sinking pieces 2 is equal to the width of the insulating microsheet substrate 1, the insulating microsheet substrate 1 is provided with a plurality of insulating microsheet substrates 1 and insulating microsheet sinking pieces 2 are alternately distributed, the thickness of the insulating microsheet sinking pieces 2 is greater than the thickness of the insulating microsheet substrate 1, and the top surface of the insulating microsheet sinking pieces 2 is coplanar with the top surface of the insulating microsheet substrate 1; the plate body formed by the insulating microsheet substrate 1 and the insulating microsheet sinking pieces 2 is used for mounting between a PCB board and a power supply housing to prevent the current from directly passing through the housing and causing a short circuit or electric shock risk.

[0024] A silicone thermal conductive sheet 3 is inserted into the interior of the insulating microsheet sinking sheet 2. The silicone thermal conductive sheet 3 is a square sheet. The size of the silicone thermal conductive sheet 3 matches the size of the groove body of the insulating microsheet sinking sheet 2. After the silicone thermal conductive sheet 3 is inserted into the groove body of the insulating microsheet sinking sheet 2, it is fixed in the groove body of the insulating microsheet sinking sheet 2 by glue, and the top surface of the silicone thermal conductive sheet 3 is coplanar with the top surface of the insulating microsheet substrate 1; a silicone plug 7 is fixed to the bottom surface of the silicone thermal conductive sheet 3, and the silicone plug 7 penetrates the bottom plate of the insulating microsheet sinking sheet 2; a plug hole 6 is provided on the bottom plate of the insulating microsheet sinking sheet 2, and a plurality of plug holes 6 are arranged and distributed at equal distances and sizes along the long side of the insulating microsheet sinking sheet 2, and the silicone plug 7 corresponds to the plug hole 6 one by one, and the silicone plug 7 is plugged into the plug hole 6, and a notch 8 is provided on the bottom surface of the silicone plug 7.

[0025] During use, a silicone thermal conductive sheet 3 is installed in the sunken sheet 2 of the insulating Mylar sheet. That is, after applying glue to the bottom surface of the silicone thermal conductive sheet 3, it is pushed into the sunken sheet 2 of the insulating Mylar sheet. At this time, the silicone insert block 7 passes through the jack 6. After the silicone thermal conductive sheet 3 is inserted into the sunken sheet 2 of the insulating Mylar sheet and the glue solidifies, the silicone thermal conductive sheet 3 is firmly installed in the sunken sheet 2 of the insulating Mylar sheet. The silicone thermal conductive sheet 3 not only fills the groove of the sunken sheet 2 of the insulating Mylar sheet, but also the silicone thermal conductive sheet 3 and the jack 6 cooperate as a heat conduction structure to export the heat on the surface of the PCB board body, realizing the cooling of the PCB board body. Moreover, the cooperation of the silicone thermal conductive sheet 3 and the jack 6 also plays a buffering role to prevent the PCB board from being impacted and knocked.

[0026] A through hole 4 is formed on the surface of the silicone thermal conductive sheet 3, and a plurality of reserved holes 5 are formed on the top surface of the silicone thermal conductive sheet 3. The reserved holes 5 are communicated with the through hole 4. The reason for forming the through hole 4 and the reserved holes 5 on the surface of the silicone thermal conductive sheet 3 is to increase the heat dissipation area of the silicone thermal conductive sheet 3 and facilitate the rapid dissipation of the heat adsorbed by the silicone thermal conductive sheet 3.

[0027] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A composite insulating Mylar sheet with high stability, comprising an insulating Mylar sheet substrate (1), characterized in that: Both ends of the insulating Mylar sheet substrate (1) are integrally formed with insulating Mylar sheet sunken sheets (2), a silicone heat conductive sheet (3) is inserted into the interior of the insulating Mylar sheet sunken sheet (2), a silicone plug (7) is fixed to the bottom surface of the silicone heat conductive sheet (3), and the silicone plug (7) passes through the bottom plate of the insulating Mylar sheet sunken sheet (2).

2. The high-stability composite insulating mylar sheet according to claim 1, wherein: The insulating micro-pulling sheet sinking sheet (2) is in the shape of a "匚" character. The width of the insulating micro-pulling sheet sinking sheet (2) is equal to the width of the insulating micro-pulling sheet substrate (1). The insulating micro-pulling sheet substrate (1) is provided with a plurality of insulating micro-pulling sheet substrates (1). The insulating micro-pulling sheet substrate (1) and the insulating micro-pulling sheet sinking sheet (2) are alternately distributed. The thickness of the insulating micro-pulling sheet sinking sheet (2) is greater than the thickness of the insulating micro-pulling sheet substrate (1). The top surface of the insulating micro-pulling sheet sinking sheet (2) is coplanar with the top surface of the insulating micro-pulling sheet substrate (1).

3. A composite insulating mylar sheet with high stability according to claim 1, characterized in that: The silicone heat conductive sheet (3) is a square sheet, and the size of the silicone heat conductive sheet (3) matches the size of the groove body of the insulating Mylar sheet sinking sheet (2). After the silicone heat conductive sheet (3) is inserted into the groove body of the insulating Mylar sheet sinking sheet (2), it is fixed in the groove body of the insulating Mylar sheet sinking sheet (2) by glue, and the top surface of the silicone heat conductive sheet (3) and the top surface of the insulating Mylar sheet substrate (1) are coplanar.

4. The high-stability composite insulating mylar sheet according to claim 1, characterized in that: The bottom plate of the insulating Mylar sheet sinking sheet (2) is provided with a plug hole (6), a plurality of the plug holes (6) are provided, and the plurality of plug holes (6) are arranged and distributed at equal distances and in equal sizes along the long side of the insulating Mylar sheet sinking sheet (2), the silicone plug blocks (7) correspond to the plug holes (6) one by one, and the silicone plug blocks (7) are plugged into the plug holes (6).

5. A composite insulating mylar sheet with high stability according to claim 1, characterized in that: The bottom surface of the silica gel plug (7) is provided with a notch (8).

6. The high-stability composite insulating mylar sheet according to claim 1, wherein: A through opening (4) is provided on the surface of the silicone heat conductive sheet (3), and a plurality of reserved holes (5) are provided on the top surface of the silicone heat conductive sheet (3), wherein the reserved holes (5) are connected to the through opening (4).

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