Sheet taking arm for polishing machine

Abstract

The utility model discloses a piece taking arm for a polishing machine. The piece taking arm comprises a connecting block, a suction cup, a telescopic rod and a driving device. The sucking disc is fixedly connected with the connecting block; one end of the telescopic rod is fixedly connected with the connecting block, the other end of the telescopic rod is connected with the driving device, and the telescopic rod can drive the connecting block and the suction cup to reciprocate under the action of the driving device; a dustproof baffle is arranged between the connecting block and the suction cup. The wafer taking arm of the polishing machine is further improved, and the dustproof baffle is additionally arranged on the arm, so that chippings generated by the guide rail and the air cylinder rod fall onto the dustproof baffle in the wafer taking and placing process of the arm, and the situation that the chippings fall onto the surface of the wafer, and consequently the quality abnormity of flatness, metal, particles and the like of a product occurs is avoided; and the product yield can be effectively improved. Therefore, the wafer taking arm of the polishing machine has good practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and particularly relates to a wafer picking arm for a polishing machine. Background Art

[0002] In the process of manufacturing semiconductor wafers, wafer polishing is a very important process. The main purpose is to improve various defects left in the previous process of wafer processing, and at the same time make the wafer surface flat enough. The machine used for wafer polishing is mainly a polishing machine. The polishing machine is mainly divided into a wafer sticking area and a polishing area according to functions. The function of the wafer sticking area is to stick the wafer to the ceramic disk for easy polishing in the polishing area. An arm is installed in the wafer sticking area for picking and placing wafers. This arm has a telescopic function and can take out the wafer from the wafer cassette and place it at other workstations.

[0003] In the actual production process of the polishing machine, when a box of wafers is placed at the designated position in the wafer sticking area of the polishing machine and the machine is started, then a tray takes out one wafer, and then the wafer picking arm moves above the wafer. After the wafer picking arm extends outwards and descends a certain distance to contact the wafer surface, the suction cup on the wafer picking arm sucks the wafer, and finally the wafer picking arm rises and retracts inwards to complete the action of picking the wafer. Subsequently, the arm will place the wafer at other workstations through moving and telescoping actions. Since the existing wafer picking arm will generate metal debris due to mechanical friction during the telescoping process, and there is no protection mechanism to isolate the debris, the metal debris will fall onto the wafer surface during the picking and placing and telescoping process of the arm. The debris on the wafer surface will directly cause the processed wafers to have out-of-spec phenomena such as flatness, metal, and particles, seriously affecting the product quality.

[0004] Therefore, further improvement of the wafer picking arm of the polishing machine, so that the metal debris generated during the wafer picking and placing process does not fall on the wafer surface, has important technical value for improving the yield of wafer polishing, reducing costs, and increasing the operation rate in the subsequent process. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a wafer picking arm for a polishing machine to solve the deficiencies of the existing technology.

[0006] The purpose of the utility model is achieved by the following technical solutions:

[0007] A wafer picking arm for a polishing machine includes a connecting block, a suction cup, a telescopic rod, and a driving device;

[0008] The suction cup is fixedly connected to the connecting block;

[0009] One end of the telescopic rod is fixedly connected to the connecting block, and the other end is connected to the driving device. Under the action of the driving device, the connecting block and the suction cup can be driven to move reciprocally.

[0010] A dust-proof baffle is provided between the connecting block and the suction cup.

[0011] Preferably, the dust-proof baffle includes a relatively small side and a relatively large side. The large side is close to the telescopic rod side, and the edge of the large side is larger than the edge of the wafer sucked by the suction cup.

[0012] Preferably, the edge of the small side coincides with the edge of the suction cup.

[0013] Preferably, a connecting mechanism is provided between the suction cup and the connecting block;

[0014] The connecting mechanism includes a connecting rod located on the suction cup, a jack located on the connecting block for cooperating with the connecting rod, and a snap ring for locking the connection between the connecting rod and the jack.

[0015] Preferably, the suction cup is provided with an air extraction hole and an adsorption groove.

[0016] Preferably, the wafer picking arm further includes a fixing seat for connecting to a polishing machine, and the driving device is fixed on the fixing seat.

[0017] Preferably, the driving device is a cylinder, and the telescopic rod is a cylinder rod;

[0018] The fixing seat is provided with a connection hole for fixing the cylinder.

[0019] Preferably, the wafer picking arm further includes a guide rail arranged in parallel with the telescopic rod;

[0020] One end of the guide rail is connected to the connecting block, and the other end passes through the fixing seat and can reciprocally move along the fixing seat under the drive of the telescopic rod.

[0021] Preferably, the fixing seat is provided with a guide rail seat for installing the guide rail.

[0022] Preferably, the fixing seat is provided with an installation hole for connecting to a polishing machine.

[0023] This application further improves the wafer picking arm of the polishing machine by adding a dust-proof baffle on the arm, so that the debris generated by the guide rail and the cylinder rod during the process of picking and placing the wafer falls onto the dust-proof baffle, thereby preventing the debris from falling onto the wafer surface and causing quality abnormalities such as flatness, metal, and particles of the product, and effectively improving the product yield. Therefore, the wafer picking arm provided by this application has good practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process. Description of the Drawings

[0024] Figure 1 is the overall structural schematic diagram of the wafer picking arm;

[0025] Figure 2 is the side structural schematic diagram of the wafer picking arm;

[0026] Figure 3 is the upper side structural schematic diagram of the wafer picking arm;

[0027] Figure 4 is the lower side structural schematic diagram of the wafer picking arm;

[0028] Figure 5 is the structural schematic diagram of some parts in the wafer picking arm;

[0029] Figure 6 is the structural schematic diagram of the suction cup and the dust-proof baffle in the wafer picking arm.

[0030] Among them, 1 - cylinder; 2 - fixed seat; 3 - guide rail; 4 - first screw; 5 - suction cup; 6 - dust-proof baffle; 7 - wafer; 8 - second screw; 9 - connection block; 10 - guide rail seat; 11 - third screw; 12 - snap ring; 13 - connecting rod; 14 - jack. Detailed Implementation Manner

[0031] The wafer picking arm for the polishing machine provided by this application, as Figures 1 to 6 shown, includes a connection block 9, a suction cup 5, a telescopic rod, and a driving device; the suction cup is fixedly connected to the connection block, and the suction cup 5 is used to suck the wafer 7 for subsequent transfer. One end of the telescopic rod is fixedly connected to the connection block 9, preferably fixedly connected by a second screw 8, and the other end is connected to the driving device. The driving device can drive the telescopic rod to extend or retract, thereby driving the connection block and the suction cup 5 connected to the connection block to reciprocate, realizing the picking and placing of the wafer 7. During the reciprocating movement of the telescopic rod, debris will be generated due to mechanical friction. In this application, a dust-proof baffle 6 is provided between the connection block and the suction cup, which can block the debris and prevent the debris from falling onto the wafer surface and causing quality abnormalities such as flatness, metal, and particles of the product.

[0032] The driving device preferably uses a cylinder 1, and the telescopic rod is the cylinder rod.

[0033] Preferably, the dust-proof baffle 6 includes opposite small-side and large-side edges. The large-side edge is close to the telescopic rod side, and the edge of the large-side is larger than the edge of the wafer 7 sucked by the suction cup. Thus, the dust-proof baffle can cover the part of the wafer 7 below the telescopic rod. In this way, the debris generated by the telescopic rod during the process of the arm picking and placing the wafer 7 will fall onto the dust-proof baffle 6, thereby preventing the debris from falling onto the wafer surface.

[0034] Further preferably, the edge of the small-side coincides with the edge of the suction cup 5, so as to minimize the area of the dust-proof baffle 6 as much as possible and prevent it from affecting the normal suction of the wafer 7 by the suction cup 5.

[0035] Preferably, a connecting mechanism is provided between the suction cup and the connecting block; the connecting mechanism includes a connecting rod 13 located on the suction cup, a jack 14 located on the connecting block for cooperating with the connecting rod, and a snap ring 12 for locking the connection between the connecting rod and the jack. By providing the connecting rod, the jack and the snap ring, the quick installation and disassembly of the suction cup can be realized, facilitating the use and maintenance of the suction cup.

[0036] Preferably, the suction cup 5 is provided with a plurality of air extraction holes and a plurality of adsorption grooves for sucking the wafer 7 by evacuating the air in the air extraction holes and the grooves when picking up the wafer 7. The air extraction holes can be round holes, square holes, etc., and preferably round holes are adopted.

[0037] Preferably, the wafer picking arm further includes a fixed seat 2, and the driving device is fixed on the fixed seat 2. The entire wafer picking arm can be fixed at a designated position of the polishing machine through the fixed seat. Further preferably, a plurality of mounting holes are provided at the top of the fixed seat 2, and the fixed seat 2 can be mounted on the polishing machine by screws.

[0038] Preferably, a connection hole for fixing the cylinder is provided on the fixed seat 2. When the cylinder is a cylindrical cylinder, the connection hole is preferably a circular through hole, and the top of the cylindrical cylinder is fixed in the circular through hole, thereby fixing the cylinder rod (i.e., the telescopic rod), the connecting block connected to the cylinder rod, and the suction cup on the fixed seat.

[0039] Preferably, the wafer picking arm further includes a guide rail 3 arranged in parallel with the telescopic rod; one end of the guide rail 3 is connected to the connecting block 9, and the other end passes through the fixed seat 2 and can reciprocate along the fixed seat 2 driven by the telescopic rod (i.e., the cylinder rod). When the wafer picking arm needs to extend or retract, the cylinder rod of the cylinder 1 will be controlled to extend or retract. At the same time, the connecting block 9 will move back and forth together with the guide rail 3. The guide rail is arranged in parallel with the cylinder rod and moves together, which can keep the connecting block 9 in a horizontal state, ensuring the accuracy and stability of the wafer picking and placing position.

[0040] Preferably, a guide rail seat 10 for installing a guide rail is provided on the fixed seat 2. Further preferably, four holes are formed on the guide rail seat 10, and the guide rail seat 10 is fixed to the fixed seat 2 by four third screws 11. The guide rail 3 is installed on the guide rail seat 10 and passes through the holes on the side surface of the fixed seat 2, and the guide rail 3 can move back and forth along the guide rail seat 10. Two mounting holes are formed at the front end of the guide rail 3, and the guide rail 3 is connected to the connecting block 9 by two first screws 4.

[0041] Therefore, by further improving the wafer picking arm of the polishing machine in this application, a dust-proof baffle is added to the arm, so that the debris generated by the guide rail and the cylinder rod during the process of picking and placing the wafer falls onto the dust-proof baffle, thereby avoiding the debris falling onto the wafer surface and causing quality abnormalities such as flatness, metal, and particles of the product, and effectively improving the product yield. Therefore, the wafer picking arm of the polishing machine provided in this application has good practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process.

[0042] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art can make various changes and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A wafer pick-up arm for a polishing machine, characterized in that, It includes a connecting block, a suction cup, a telescopic rod and a driving device; The suction cup is fixedly connected to the connecting block; One end of the telescopic rod is fixedly connected to the connecting block, and the other end is connected to the driving device, and under the action of the driving device, it can drive the connecting block and the suction cup to move reciprocally; A dust-proof baffle is provided between the connecting block and the suction cup.

2. The wafer picking arm for a polishing machine according to claim 1, wherein The dust-proof baffle includes an opposite small side and a large side, the large side is close to the telescopic rod side, and the edge of the large side is larger than the edge of the wafer sucked by the suction cup.

3. The wafer picking arm for a polishing machine according to claim 2, wherein The edge of the small side coincides with the edge of the suction cup.

4. The wafer picking arm for a polishing machine according to claim 1, wherein A connecting mechanism is provided between the suction cup and the connecting block; The connecting mechanism includes a connecting rod located on the suction cup, a jack located on the connecting block for cooperating with the connecting rod, and a snap ring for locking the connection between the connecting rod and the jack.

5. The wafer picking arm for a polishing machine according to claim 1, wherein The suction cup is provided with an air extraction hole and an adsorption groove.

6. The wafer picking arm for a polishing machine according to claim 1, wherein The wafer picking arm further includes a fixing seat for connecting to the polishing machine, and the driving device is fixed on the fixing seat.

7. The wafer picking arm for a polishing machine according to claim 6, wherein The driving device is a cylinder, and the telescopic rod is a cylinder rod; The fixing seat is provided with a connection hole for fixing the cylinder.

8. The wafer picking arm for a polishing machine according to claim 6, wherein The wafer picking arm further includes a guide rail arranged parallel to the telescopic rod; One end of the guide rail is connected to the connecting block, and the other end passes through the fixing seat, and it can move reciprocally along the fixing seat under the drive of the telescopic rod.

9. The wafer picking arm for a polishing machine according to claim 8, wherein The fixing seat is provided with a guide rail seat for installing the guide rail.

10. The wafer picking arm for a polishing machine according to claim 6, wherein The fixing seat is provided with a mounting hole for connecting to the polishing machine.

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