Fluid heating device

Abstract

A fluid heating device comprises an interface plate, a heater, a heat conducting plate, a heat conducting groove, an interface hole and a connector hole. Screw holes are formed in the periphery of the interface plate and the periphery of the heat conduction plate, the interface plate and the heat conduction plate are fixed through bolts, a heat conduction groove is formed in the heat conduction plate and is in a zigzag snake shape, a heater is arranged below the heat conduction groove, an interface hole and a connector hole are formed in the interface plate and are blind holes, one end of the interface hole is communicated with the connector hole in an L shape, and the other end of the interface hole is communicated with the connector hole in an L shape. The other end of the interface hole is vertically connected with the heat-conducting groove; according to the utility model, through the L-shaped interface hole and the joint hole, the whole heat conduction groove is in a sealed state, and fluid directly enters the device instead of directly heating a fluid pipeline, so that uneven temperature heating caused by heat transfer of the pipeline is avoided; meanwhile, by arranging a temperature sensor, it can be guaranteed that the internal fluid is in a constant-temperature state, the fluid can be directly used when needing to be used, and heating does not need to be waited.

Description

Technical Field

[0001] The utility model relates to a fluid heating device, in particular to a fluid heating device for narrow spaces or small flow scenarios, and more particularly to a fluid heating device for inkjet printers. Background Art

[0002] Identification technologies are widely used in various industries and fields. Inkjet printing is an important form of identification technology. It is widely used in production and life due to its low cost, simple implementation, and high reliability.

[0003] Inkjet identification is achieved by converting ink into ink droplets and ejecting them onto the object to be identified to form specific marks. Industrial continuous inkjet printing technology is a main way to achieve inkjet printing identification. Its principle is to split the ink flow into ink dots by vibrating the print head through a crystal oscillator under the condition of providing a stable ink flow, and make the flying ink dots carry different electric charges. When these ink dots fly through the electric field, they deflect different distances due to different electric charges of the ink dots, thus generating a row of ink dots. Spraying this row of deflected ink dots onto a moving object will produce characters and graphics composed of ink dots.

[0004] Among them, the pressure and temperature before ink splitting are crucial for printing quality. Since the environmental temperature varies greatly in different regions and seasons in China; and at different temperatures, the ink properties are different and the splitting characteristics are also different; therefore, if the temperature before ink splitting is not controlled, the printing quality will be very unstable with the change of environmental temperature.

[0005] Most of the existing technologies directly heat the ink pipeline, which will cause uneven heat distribution and impose a greater burden on the ink delivery pipeline.

[0006] Based on the above problems, the utility model proposes a fluid heating device to preheat the ink before inkjet printing and avoid uneven heating of the ink at the same time. Summary of the Utility Model

[0007] In order to solve the above problems, the utility model proposes a fluid heating device, and this structure can solve the problems of unstable printing quality and uneven ink temperature when the environmental temperature difference is large.

[0008] To solve the above problems, the technical solution of the utility model is as follows:

[0009] The utility model discloses a fluid heating device, which includes an interface board, a heater, a heat conducting plate, a heat conducting groove, an interface hole and a connector hole; screw holes are opened around the interface board and the heat conducting plate, and the interface board and the heat conducting plate are fixed by bolts. A heat conducting groove is opened on the heat conducting plate, and the heat conducting groove is a zigzag snake shape. A heater is arranged below the heat conducting groove. The interface board is provided with an interface hole and a connector hole. Both the connector hole and the interface hole are blind holes. One end of the interface hole is connected to the connector hole in an "L" shape, and the other end of the interface hole is vertically connected to the heat conducting groove.

[0010] Further, a heat conducting glue is also arranged between the heater and the heat conducting plate; through the arrangement of the heat conducting glue, the heat generated by the heater is evenly transferred into the heat conducting groove through the heat conducting glue, so that the fluid inside the heat conducting groove is heated evenly.

[0011] Further, a sealing ring accommodating groove is also arranged on the heat conducting plate. The sealing ring accommodating groove is a closed groove connected end to end and surrounds the heat conducting groove.

[0012] Further, a sealing ring is arranged in the sealing ring accommodating groove. The sealing ring is made of rubber material; through the interface hole and the connector hole connected in an "L" shape, and the interface hole vertically connected to the heat conducting groove, the whole heat conducting groove can be wrapped within the sealing ring, which can avoid external contamination and reduce heat loss at the same time, saving energy.

[0013] Further, a pipe connector is embedded and installed at the connector hole. One end of the pipe connector is connected to an external pipeline, and the other end is communicated with the interface hole.

[0014] Further, the interface board is integrally made of engineering plastic material.

[0015] Further, a temperature sensor is also arranged inside the heat conducting plate.

[0016] Further, a flow disturbance structure is arranged on the inner wall of the heat conducting groove.

[0017] Further, a flow disturbance structure is arranged at the corresponding position of the interface board and the heat conducting groove.

[0018] Compared with the prior art, the advantages and positive effects of the utility model are as follows:

[0019] 1. Through the interface hole and the connector hole arranged in an "L" shape in the utility model, the whole heat conducting groove is in a sealed state, and the fluid directly enters the device instead of directly heating the fluid pipeline, which avoids uneven temperature heating caused by heat transfer of the pipeline. At the same time, through the arrangement of the temperature sensor, it can also ensure that the fluid inside is in a constant temperature state, and it can be directly used when needed without waiting for heating. Brief Description of the Drawings

[0020] Figure 1Schematic cross-sectional structure diagram of a fluid heating device of the present utility model;

[0021] Figure 2 Plan view of the interface board of a fluid heating device of the present utility model;

[0022] Figure 3 Plan view of the heat conduction plate of a fluid heating device of the present utility model.

[0023] Legend description:

[0024] 1. Interface board; 2. Sealing ring; 3. Heater; 4. Thermal conductive adhesive; 5. Heat conduction plate; 6. Sealing ring accommodation groove; 7. Heat conduction groove; 8. Pipe joint; 9. Interface hole; 10. Joint hole. Detailed implementation manners

[0025] In order to more clearly understand the above objects, features, and advantages of the present utility model, the following further describes the present utility model with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0026] Many specific details are set forth in the following description to facilitate a thorough understanding of the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the specific embodiments disclosed in the following specification.

[0027] The following details the implementation manners of the present utility model with reference to the drawings: Embodiment 1

[0028] As Figures 1 to 3 shown:

[0029] A fluid heating device includes an interface board 1, a heater 3, a heat conduction plate 5, a heat conduction groove 7, an interface hole 9, and a joint hole 10; the surface of the interface board 1 is flat and smooth, with screw holes opened around it, and the heat conduction plate 5 has corresponding screw holes at the place corresponding to the interface board 1. The interface board 1 and the heat conduction plate 5 are fixed by bolts. The heat conduction plate 5 is provided with a heat conduction groove 7, and the heat conduction groove 7 is a serpentine channel that winds back and forth from one end of the heat conduction plate 5 to the other end. The heater 3 is arranged below the heat conduction plate 5. Both ends of the interface board 1 are provided with an interface hole 9 and a joint hole 10. The interface hole 9 and the joint hole 10 are both blind holes. The end of the interface hole 9 is connected to the end of the joint hole 10 to form an "L"-shaped channel. The head end of the joint hole 10 is connected to an external pipe, and the head end of the interface hole 9 is vertically connected to the heat conduction groove 7.

[0030] The interface board 1 is used to set the fluid inlet and outlet and seal the top of the heat conduction groove 7, so that the heat conduction groove 7 forms a closed pipeline to prevent fluid overflow. The heater 3 is used to provide the heat required to heat the fluid. The heat conduction plate 5 is used to transfer the heat generated by the heater 3 to the fluid to heat the fluid. The heat conduction groove 7 is used to provide a fluid flow pipeline so that the fluid can be heated after passing through the heat conduction groove 7. The interface hole 9 is used to connect the inlet and outlet of the heat conduction groove 7, and the joint hole 10 is used to connect the external inlet and outlet pipelines.

[0031] The heat conduction groove 7 with a serpentine channel allows the fluid to have enough time to be heated when flowing through the heat conduction groove 7. At the same time, when not in use, a certain amount of fluid can be stored inside.

[0032] In this embodiment, a heat conduction adhesive 4 is further provided between the heater 3 and the heat conduction plate 5. By setting the heat conduction adhesive 4, the heat released by the heater 3 can be more evenly distributed on the heat conduction plate 5, avoiding damage to the internal fluid due to uneven heating caused by uneven temperature. At the same time, the heat conduction plate 5 is made of a metal heat conduction material, with faster and more uniform heat conduction.

[0033] As Figure 3 shown, a sealing ring accommodation groove 6 is also opened around the heat conduction plate 5. The sealing ring accommodation groove 6 is a closed groove connected end to end. A sealing ring 2 is provided in the sealing ring accommodation groove 6. The sealing ring 2 is made of rubber material. Under the pressure of the bolt, the interface board 1 and the sealing ring 2 seal the heat conduction groove 7, further preventing the internal fluid of the heat conduction groove 7 from leaking, corroding the equipment and damaging the equipment. At the same time, it also prevents external dust and the like from entering the heat conduction groove 7 and polluting the internal fluid. At the same time, since the joint hole 10 and the interface hole 9 are "L"-shaped connected and the interface hole 9 is vertically connected to the heat conduction groove 7, the sealing ring 2 completely seals around the heat conduction groove 7 to avoid external pollution and reduce heat loss at the same time.

[0034] A pipe joint 8 is embedded at the joint hole 10. The pipe joint 8 is used to connect the heat conduction groove 7 and the external inlet and outlet pipelines. The external fluid flows through the interface hole 9 through the pipe joint 8 and enters the heat conduction groove 7. After heating is completed, it flows out from the other end of the heat conduction groove 7. After passing through the interface hole 9 at the other end, it flows out from the pipe joint 8 at the other end. Embodiment 2

[0035] The difference between this embodiment and Embodiment 1 is as follows: In this embodiment, the interface board 1 can also serve as a mounting base to connect the fluid heating device to the usage scenario. A temperature sensor is also provided on the heat conducting plate 5. Through real-time monitoring and feedback by the temperature sensor, the heating power or heating intermittent time of the heater 3 can be controlled to adjust the temperature of the fluid inside the heat conducting groove 7. When not in use, a part of the fluid can be stored in the serpentine heat conducting groove 7, and the fluid stored inside the heat conductor 7 can also maintain a constant temperature without being used. When in need of use, there is no need to wait for the fluid to be reheated. Just open the pipe joint 8 at the fluid outlet, and it can be used immediately, saving time. Embodiment 3

[0036] In this embodiment, the difference from Embodiment 1 is that the interface board 1 and the heat conducting plate 3 are fixed by bolts. The pressure generated by the bolts on the interface board 1 and the heat conducting plate 3 acts on the sealing ring 2, so that the heat conducting groove 7 between the interface board 1 and the heat conducting plate 3 forms a sealed pipeline. When the fluid flows through the heat conducting groove 7, it is heated through the heat conducting groove 7. Since the interface board 1 does not generate heat, in order to avoid uneven heating of the fluid, bumps are provided on the inner wall of the heat conducting groove 7. At the same time, bumps are also provided at the positions corresponding to the heat conducting groove 7 on the interface board 1. The bumps are used to disturb the fluid inside the heat conducting groove 7, avoiding uneven heating of the fluid due to the heat generated by the heat conducting groove 7 while the interface board 1 generates heat, which affects the outflow temperature of the fluid.

[0037] Specific working process: Turn on the power switch, and the heater 3 starts to work, transferring heat to the heat conducting adhesive 4. The heat conducting adhesive 4 evenly transfers the heat to the heat conducting plate 5. The fluid flows through the interface hole 9 through the pipe joint 8 at the inlet of the interface board 1 and enters the heat conducting groove 7. The fluid is heated inside the heat conducting groove 7. When the fluid flows from the inlet end of the heat conducting groove 7 to the other end, the fluid heating is completed and flows out through the pipe joint 8 provided at the outlet end of the interface board 1. When the use is stopped midway, a part of the fluid will be stored inside the serpentine heat conducting groove 7, and this part of the fluid will maintain a constant temperature in the heat conducting groove 7. When it is needed to use again, it can be directly used without waiting.

[0038] The above is only a preferred embodiment of the present invention, and it is not a limitation to the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A fluid heating device, characterized in that: It includes an interface board, a heater, a heat conducting plate, a heat conducting groove, an interface hole, and a connector hole; screw holes are provided around the interface board and the heat conducting plate, and the interface board and the heat conducting plate are fixed by bolts. A heat conducting groove is provided on the heat conducting plate, and the heat conducting groove is a zigzag snake shape. A heater is provided below the heat conducting groove. The interface board is provided with an interface hole and a connector hole. Both the connector hole and the interface hole are blind holes. One end of the interface hole is connected to the connector hole in an "L" shape, and the other end of the interface hole is vertically connected to the heat conducting groove.

2. The fluid heating device according to claim 1, characterized in that: A heat conducting adhesive is further provided between the heater and the heat conducting plate.

3. A fluid heating device according to claim 1, characterized in that: A sealing ring accommodation groove is further provided on the heat conducting plate. The sealing ring accommodation groove is a closed groove connected end to end and surrounds the heat conducting groove.

4. A fluid heating device according to claim 3, characterized in that: A sealing ring is provided in the sealing ring accommodation groove, and the sealing ring is made of rubber material.

5. A fluid heating device according to claim 1, characterized in that: A pipe connector is embeddedly installed at the connector hole. One end of the pipe connector is connected to an external pipeline, and the other end is communicated with the interface hole.

6. A fluid heating device according to claim 1, wherein: The interface board is integrally made of engineering plastic material.

7. A fluid heating device according to any one of claims 1 - 6, characterized in that: A temperature sensor is further provided in the heat conducting plate.

8. A fluid heating device according to any one of claims 1-6, characterized in that: A flow disturbance structure is provided on the inner wall of the heat conducting groove.

9. A fluid heating device according to any one of claims 1 - 6, characterized in that: A flow disturbance structure is provided at the position of the interface board corresponding to the heat conducting groove.

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