Slide glass device and coating equipment

Abstract

The utility model relates to a substrate carrying device, which comprises boat pages, a plurality of boat pages are mutually fixed and are arranged at intervals along a first direction, each boat page is provided with a plurality of bearing positions for bearing substrates, and the bearing positions on each boat page are arranged in an array; the boat pages are transversely arranged, and at least two rows of bearing positions are arranged in the height direction. By adopting the substrate carrying device, each boat page is provided with a plurality of bearing positions for bearing substrates, and the bearing positions on each boat page are arranged in an array; the boat pages are transversely arranged, and the bearing positions are arranged in at least two rows in the height direction, so that the wafer carrying amount of each boat page is increased. Meanwhile, the slide glass quantity on each boat page is increased, so that the slide glass quantity does not need to be increased by increasing the number of the boat pages, the width of the slide glass device does not need to be increased, the mechanical strength of the slide glass device can be effectively ensured, and the coating uniformity is ensured. The utility model further relates to coating equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of tube coating equipment, in particular to a wafer carrier device and a coating equipment. Background Art

[0002] Existing PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment usually uses graphite boats to carry silicon wafers. In order to increase the wafer loading capacity of the graphite boat, it is generally achieved by increasing the number of boat pages of the graphite boat. However, this method will increase the width of the graphite boat, which not only results in poor mechanical strength and reduced reliability of the graphite boat, but also deteriorates the coating uniformity. Summary of the Utility Model

[0003] Based on this, in view of the problem that increasing the number of boat pages of the existing graphite boat to increase the wafer loading capacity results in poor mechanical strength of the graphite boat, it is necessary to provide a wafer carrier device and a coating equipment that can increase the wafer loading capacity of the graphite boat and ensure the mechanical strength of the graphite boat.

[0004] A wafer carrier device includes boat pages, and multiple boat pages are fixed to each other and arranged at intervals along a first direction;

[0005] Each boat page is provided with a plurality of loading positions for loading substrates, and the loading positions on each boat page are arranged in an array; the boat pages are arranged horizontally, and the loading positions have at least two rows in the height direction.

[0006] In one embodiment, the boat pages include first boat pages and second boat pages, and multiple first boat pages and multiple second boat pages are alternately arranged at intervals along the first direction;

[0007] Both ends of the wafer carrier device in a second direction are provided with a first electrical connection group and a second electrical connection group, and the first electrical connection group at one end cooperates with the second electrical connection group at the other end to connect multiple first boat pages or multiple second boat pages.

[0008] In one embodiment, the first electrical connection group is provided with a connection notch, and the first electrical connection group is supported on a sitting electrode through the connection notch to be electrically connected to the sitting electrode.

[0009] In one embodiment, the second electrical connection group is provided with a connection hole, and the second electrical connection group is electrically connected to a hole electrode through the connection hole.

[0010] In one embodiment, first boat ears are formed at both ends of each boat page, and the first electrical connection group and the second electrical connection group are respectively connected to the corresponding first boat ears.

[0011] In one embodiment, the wafer carrier device further comprises a first fastener and a second fastener, and a second boat ear is formed at the end of each boat leaf;

[0012] The first fastener is connected to the second boat ear on the first boat leaf to form a first fastening end at one end of the wafer carrier in the second direction;

[0013] The second fastening member is connected to the second boat ear on the second boat page to form a second fastening end at the other end of the wafer carrier in the second direction.

[0014] In one embodiment, the wafer carrier device further includes a third fastener, wherein the third fastener is passed through and connected between the plurality of boat pages along the first direction to fix the plurality of boat pages, and the third fastener has at least two rows in the height direction.

[0015] In one embodiment, the third fastener is disposed at a middle position of the boat leaf.

[0016] In one embodiment, a plurality of limiting posts are disposed at each of the carrying positions of the boat page, and the plurality of limiting posts are arranged at intervals to cooperate with each other to carry the substrate.

[0017] A coating device comprises the above-mentioned wafer carrier device.

[0018] With the above-mentioned wafer carrier, each boat page is provided with a plurality of carrying positions for carrying substrates, and the carrying positions on each boat page are arranged in an array; the boat pages are arranged horizontally, and the carrying positions have at least two rows in the height direction, thereby increasing the wafer carrying capacity of each boat page. At the same time, since the wafer carrying capacity on each boat page is increased, it is not necessary to increase the wafer carrying capacity by increasing the number of boat pages, and it is also not necessary to increase the width of the wafer carrier, which can effectively ensure the mechanical strength of the wafer carrier and ensure the uniformity of the coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of a wafer carrier device provided in one embodiment of the present application;

[0021] Figure 2 for Figure 1Schematic structural diagram of the carrier device from another angle as shown;

[0022] Figure 3 For Figure 1 Partial schematic structural diagram of the boat page in the carrier device as shown;

[0023] Figure 4 For Figure 1 Schematic structural diagram of the first boat page in the carrier device as shown;

[0024] Figure 5 For Figure 1 Schematic structural diagram of the second boat page in the carrier device as shown;

[0025] Figure 6 Schematic structural diagram of the coating equipment provided by another embodiment of the present application. Detailed implementation manners

[0026] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0029] In this application, unless otherwise clearly specified or defined, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In this application, unless otherwise clearly specified or defined, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0032] On the one hand, as Figure 1 and Figure 2 shown, this application provides a wafer carrier device 10, including wafer pages 110. Multiple wafer pages 110 are fixed to each other and arranged at intervals along the first direction.

[0033] Each wafer page 110 is provided with a plurality of carrying positions 111 for carrying substrates 20, and the carrying positions 111 on each wafer page 110 are arranged in an array; the wafer pages 110 are arranged horizontally, and the carrying positions 111 have at least two rows in the height direction.

[0034] Specifically Figure 1 in the illustrated embodiment, the first direction is the X direction.

[0035] With the above-mentioned wafer carrier device, a plurality of loading positions for loading wafers are provided on each boat page, and the loading positions on each boat page are arranged in an array; the boat pages are arranged horizontally, and the loading positions have at least two rows in the height direction, thereby increasing the wafer loading capacity of each boat page. At the same time, since the wafer loading capacity of each boat page is increased, there is no need to increase the number of boat pages to increase the wafer loading capacity, and there is no need to increase the width of the wafer carrier device, which can effectively ensure the mechanical strength of the wafer carrier device and ensure the coating uniformity.

[0036] It should be further explained that the wafer carrier device can specifically be a graphite boat. The heat source for heating the graphite boat is usually located on the outer periphery of the wafer carrier device. When increasing the total wafer loading capacity by increasing the number of boat pages 110, since the width of the wafer carrier device will increase, the outer boat pages 110 in the wafer carrier device will be closer to the heat source, and the temperature increase rate thereof is much greater than that of the inner boat pages 110, resulting in a process environment difference between the outer boat pages and the inner boat pages, which will not only extend the preheating time but also reduce the coating uniformity. However, when increasing the total wafer loading capacity by increasing the wafer loading capacity of each boat page 110, the width of the wafer carrier device will not be increased, thereby reducing the thermal radiation distance in the width direction, avoiding too large a difference in the temperature increase rate between the outer and inner boat pages 110, effectively improving the temperature difference problem between the outer and inner boat pages 110, shortening the preheating time of the wafer carrier device, and improving the coating uniformity.

[0037] In addition, the wafer carrier device further includes a first fastener 210 and a second fastener 220. Second boat ears 112 are formed at the ends of each boat page 110; the first fastener 210 is connected to the second boat ear 112 at one end of the wafer carrier device to form a first fastening end at one end of the wafer carrier device in the second direction; the second fastener 220 is connected to the second boat ear 112 at the other end of the wafer carrier device to form a second fastening end at the other end of the wafer carrier device in the second direction.

[0038] It can be understood that by providing the first fastener 210 and the second fastener 220, multiple boat pages 110 can be fastened to improve the mechanical strength. At the same time, since the wafer carrier device in this embodiment is applied to a horizontal coating equipment, the first fastening end and the second fastening end can be used as grasping parts to cooperate with mechanisms such as a manipulator to transfer the wafer carrier device, and the boat pages 110 will not be damaged, with high safety.

[0039] It should be noted that the above-mentioned loading positions 111 are provided on the inner sides of the two outermost boat pages 110 in the wafer carrier device, and the above-mentioned loading positions 111 are provided on both sides of the remaining intermediate boat pages 110 along the first direction, and the loading positions 111 on each side are arranged in an array.

[0040] Specifically Figure 1In the illustrated embodiment, the carrying positions 111 on each boat page 110 are evenly divided into two rows in the second direction, and the multiple carrying positions 111 in each row are arranged at intervals along the third direction. Of course, in other embodiments, in order to further increase the amount of wafers carried and ensure mechanical strength, more rows of carrying positions 111 can be divided in the second direction. Correspondingly, the suction cups on the manipulator for transferring substrates can be designed into two rows, so that when vertically penetrating into the gap between adjacent boat pages 110, the sheets on the two rows of carrying positions can be picked up and placed.

[0041] The second direction and the third direction are both perpendicular to the first direction. Figure 1 In the embodiment shown, the first direction, the second direction, and the third direction are perpendicular to each other, and the second direction is Figure 1 The Z direction in the middle, the third direction is Figure 1 in the Y direction.

[0042] In one embodiment, the wafer carrier device further includes third fasteners 120. The third fasteners 120 are connected between the plurality of boat pages 110 along the first direction to fix the plurality of boat pages 110, and the third fasteners 120 have at least two rows in the height direction.

[0043] Optionally, the third fastener 120 is a ceramic rod to insulate the plurality of boat pages 110 while fixing the plurality of boat pages 110. The third fastener 120 can improve the overall structural strength of the wafer carrier device, and the distribution of at least two rows can also provide structural reinforcement for the multi-row bearing position design of the boat page to adapt to the greater load brought by the greater amount of wafer carriers.

[0044] The third fastener 120 is disposed at the middle position of the boat leaf 110, so as to cooperate with the first fastening end and the second fastening end at both ends of the wafer carrier device to achieve overall structural reinforcement.

[0045] In this embodiment, the first fastener 210 and the second fastener 220 may also be ceramic rods. Of course, the first fastener 210 and the second fastener 220 may also be made of other materials, which is not limited here.

[0046] Specific to Figure 1 In the illustrated embodiment, the third fasteners 120 are divided into three rows along the second direction, the two outer rows are located at the edges of the boat leaf 110, and the inner row is located in the middle of the boat leaf 110. In addition, the third fasteners 120 in each row are arranged at intervals along the third direction, and two third fasteners 120 are provided in each row at the middle position of the boat leaf 110 along the third direction, so as to further improve the stability of the connection of the multiple boat leaves 110.

[0047] See also Figure 3, in one embodiment, a plurality of limiting posts 130 are provided at each bearing position 111 of the boat page 110. The plurality of limiting posts 130 are arranged at intervals to cooperate with each other to carry the substrate 20 and carry the substrate 20 at the bearing position 111. In this embodiment, the limiting post 130 may specifically be a graphite boat clamping point structure, and the materials of the boat page 110 and the limiting post 130 are both graphite.

[0048] Further, each bearing position 111 has an opening for inserting or removing the substrate 20. When the bearing positions 111 are divided into two rows along the second direction, the opening directions of the bearing positions 111 in each row are the same. In this way, when the wafer carrier device is in a horizontal position, it is more convenient to remove the substrate.

[0049] Specifically, 5 limiting posts 130 are correspondingly arranged at each bearing position 111 to improve the stability of carrying the substrate 20.

[0050] Combined with Figure 3 It should be noted that when the 5 limiting posts 130 are arranged at intervals at the bearing position 111, the 5 limiting posts 130 are located on three sides of the bearing position 111, and the remaining side of the bearing position 111 is an opening. The substrate 20 can be inserted into the bearing position 111 through this opening. At this time, the 5 limiting posts 130 respectively support three sides of the substrate 20.

[0051] As in the above embodiment, bearing positions 111 are provided on both sides of the middle boat page 110. At the same time, the limiting post 130 is connected to the boat page 110, and both ends of the limiting post 130 extend out from both sides of the boat page 110 respectively to form bearing positions 111 on both sides of the boat page 110 respectively.

[0052] In addition, it should be further noted that a through hole is correspondingly formed through each bearing position 111, and a plurality of mounting holes are spaced apart from the edge of the through hole. Each mounting hole is used to mount a limiting post 130, so as to form bearing positions 111 on both sides of the boat page 110.

[0053] In one embodiment, the plurality of boat pages 110 include a plurality of first boat pages 113 and a plurality of second boat pages 114. The plurality of first boat pages 113 and the plurality of second boat pages 114 are alternately arranged at intervals along the first direction. The first fastener 210 is connected to the second boat ears 112 of the plurality of first boat pages 113, and the second fastener 220 is connected to the second boat ears 112 of the plurality of second boat pages 114.

[0054] It should be noted that as Figure 1As shown, multiple first boat pages 113 and multiple second boat pages 114 are fixed by a third fastener 120. The second boat ears 112 of the multiple first boat pages 113 are located at one end of the wafer carrier device along the third direction and are connected to a first fastener 210. The second boat ears 112 of the multiple second boat pages 114 are located at the other end of the wafer carrier device along the third direction and are connected to a second fastener 220. In this way, the connection stability of the multiple boat pages 110 can be further improved.

[0055] Specifically Figure 4 and Figure 5 in the embodiment shown, first boat ears 115 are formed at both ends of each boat page 110 along the third direction, and the first boat ears 115 at both ends are offset in the third direction, that is, as Figure 4 and Figure 5 shown, the first boat ears 115 at both ends are arranged one above the other for electrical connection of the wafer carrier device.

[0056] In addition, in practical applications, the second boat ears 112 are all located at the top of one end of the boat page 110 to facilitate grasping the wafer carrier device through the second boat ears 112 and the fasteners, the first fastener 210 and the second fastener 220.

[0057] At the same time, the structures of the first boat page 113 and the second boat page 114 are the same, but when forming the wafer carrier device, as Figure 4 and Figure 5 shown, the arrangement directions of the first boat page 113 and the second boat page 114 are opposite.

[0058] In one embodiment, first electrical connection groups 310 and second electrical connection groups 320 are provided at both ends of the wafer carrier device along the second direction, and the first electrical connection group 310 at one end and the second electrical connection group 320 at the other end cooperate to connect multiple first boat pages 113 or multiple second boat pages 114.

[0059] The first electrical connection group 310 is provided with a connection notch 311, and the first electrical connection group 310 is supported on the sitting electrode 30 through the connection notch 311 to be electrically connected to the sitting electrode 30.

[0060] Combined with Figure 2 it can be understood that the shape of the connection notch 311 matches the sitting electrode 30 so that the sitting electrode 30 is supported and connected to the first electrical connection group 310 through the connection notch 311.

[0061] The second electrical connection group 320 is provided with a connection hole 321, and the second electrical connection group 320 is electrically connected to the hole electrode through the connection hole 321. In other embodiments, the sitting electrode 30 is not limited to Figure 2 the structure in, and it can be made into a hollow ring structure so as to be sleeved on the ceramic rod to realize the combination of the bearing structure and the electrode structure.

[0062] It should be noted that the hole-type electrode has the defect of alignment deviation, while the sitting-type electrode 30 has the defect of conductive film insulation. In the prior art, if all electrode feeding methods adopt the hole-type electrode or the sitting-type electrode 30, the defects of both will be amplified, affecting the conductive life of the electrode feeding. However, in this application, a mixed feeding method of the hole-type electrode and the sitting-type electrode 30 is adopted to avoid amplifying the defects of both. At the same time, the defects of both will not affect each other, so the conductive life of the electrode feeding is extended, and the reliability of the use of the wafer carrier device is increased.

[0063] In addition, the first electrical connection group 310 and the second electrical connection group 320 located at the same end of the wafer carrier device can be either the same polarity or different polarities, so as to facilitate the routing of the electrodes and be applicable to different coating equipment.

[0064] It should be noted that the first electrical connection group 310 and the second electrical connection group 320 are respectively connected to the corresponding first boat ears 115. That is, one of the first electrical connection groups 310 is connected to the first boat ear 115 of the first boat page 113, and the other first electrical connection group 310 is connected to the first boat ear 115 of the second boat page 114. One of the second electrical connection groups 320 is connected to the first boat ear 115 of the first boat page 113, and the other second electrical connection group 320 is connected to the first boat ear 115 of the second boat page 114.

[0065] In addition, it can be understood that the first electrical connection group 310 is composed of a plurality of first connection blocks, the second electrical connection group 320 is composed of second connection blocks, the first connection blocks and the second connection blocks both have conductivity, and are respectively connected to the first boat ear 115 of the first boat page 113 and the first boat ear 115 of the second boat page 114.

[0066] Optionally, the first connection blocks and the second connection blocks are graphite blocks.

[0067] On the other hand, this application also provides a coating equipment, which includes the wafer carrier device 10 in the above embodiment.

[0068] It should be noted that this coating equipment is a horizontal equipment.

[0069] Please refer to Figure 6 , further, the coating equipment further includes a process container 40. The wafer carrier device 10 can extend into the process container 40 to process the substrate 20 on the wafer carrier device within the process container 40.

[0070] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered that the scope described in this specification is covered.

[0071] The above embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several variations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A wafer carrier device, comprising a boat page (110), wherein a plurality of boat pages (110) are fixed to each other and arranged at intervals along a first direction, characterized in that: Each of the boat pages (110) is provided with a plurality of carrying positions (111) for carrying substrates (20), and the carrying positions (111) on each of the boat pages (110) are arranged in an array; the boat pages (110) are arranged in a transverse direction, and the carrying positions (111) have at least two rows in a height direction; The wafer carrier device further comprises a third fastener (120), wherein the third fastener (120) is arranged along the first direction to pass through and connect between the plurality of boat pages (110) so as to fix the plurality of boat pages (110), and the third fastener (120) has at least two rows in the height direction; The third fastener (120) is arranged at a middle position of the boat leaf (110).

2. The slide device according to claim 1, characterized in that, The boat leaf (110) comprises a first boat leaf (113) and a second boat leaf (114), and a plurality of the first boat leaves (113) and a plurality of the second boat leaves (114) are alternately arranged along the first direction; The wafer carrier device is provided with a first electrical connection group (310) and a second electrical connection group (320) at both ends along the second direction. The first electrical connection group (310) at one end and the second electrical connection group (320) at the other end cooperate to connect multiple pieces of the first boat pages (113) or multiple pieces of the second boat pages (114).

3. The carrier device according to claim 2, wherein The first electrical connection group (310) is provided with a connection notch (311), and the first electrical connection group (310) is supported on the sitting electrode (30) through the connection notch (311) so as to be electrically connected to the sitting electrode (30).

4. The slide device according to claim 3, characterized in that, The second electrical connection group (320) is provided with a connection hole (321), and the second electrical connection group (320) is electrically connected to the hole-type electrode through the connection hole (321).

5. The carrier device according to claim 4, wherein, A first boat ear (115) is formed at both ends of each boat leaf (110), and the first electrical connection group (310) and the second electrical connection group (320) are respectively connected to the corresponding first boat ear (115).

6. The slide device according to claim 2, wherein The wafer carrier device further comprises a first fastener (210) and a second fastener (220), and a second boat ear (112) is formed at the end of each boat leaf (110); The first fastener (210) is connected to the second boat ear (112) on the first boat leaf (113) to form a first fastening end at one end of the wafer carrier in the second direction; The second fastener (220) is connected to the second boat ear (112) on the second boat page (114) to form a second fastening end at the other end of the wafer carrier in the second direction.

7. The slide device according to claim 1, characterized in that, A plurality of limiting columns (130) are provided at each of the bearing positions (111) of the boat page (110), and the plurality of limiting columns (130) are arranged at intervals to cooperate with each other to bear the substrate (20).

8. A coating device, characterized in that, A wafer carrier device comprising any one of claims 1-7.

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