Vertical electroplating equipment

Abstract

The vertical electroplating equipment comprises an anode unit, an electroplating bath, a cathode unit, a driving mechanism and a power supply, the anode unit is jointly composed of a plurality of anode assemblies, and the anode assemblies are distributed at intervals or continuously in the preset direction to form the anode unit; each anode assembly comprises an anode piece extending in a preset direction; the anode unit is arranged in the electroplating bath, and the electroplating bath is further filled with electroplating liquid; the cathode unit is configured to mount a to-be-electroplated part; the driving mechanism is configured to push the cathode unit to move in the anode unit; the power supply anode is connected with the anode unit, and the power supply cathode is connected with the cathode unit. The driving mechanism pushes the cathode unit to move in the anode unit and drives the to-be-electroplated part installed in the cathode unit to move in the anode unit, so that the to-be-electroplated part can move in the electroplating liquid, and the electroplating efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating, and particularly relates to a vertical electroplating device. Background Art

[0002] According to the orientation of the workpiece to be electroplated during electroplating, the electroplating process can be divided into horizontal electroplating and vertical electroplating. In vertical electroplating, the workpiece to be electroplated is immersed in the electroplating solution in a vertical state through a mounting member. The workpiece to be electroplated is electrically connected to the negative electrode of the power supply to form a cathode unit. An anode unit is installed in the electroplating tank and is electrically connected to the positive electrode of the power supply. Under the action of the electric field, the cations in the electroplating solution will migrate to the vicinity of the workpiece to be electroplated and form a coating on the workpiece to be electroplated.

[0003] In the existing vertical electroplating device, the workpiece to be electroplated generally remains stationary during electroplating, and the electroplating solution is made to flow to ensure the uniformity of electroplating, resulting in low electroplating efficiency. The workpiece to be electroplated is not produced in a production line manner, and the production efficiency is low.

[0004] In order to improve the electroplating efficiency and production efficiency, the applicant has improved the structure of the vertical electroplating device so that the workpiece to be electroplated can move in the electroplating solution. However, the applicant has encountered the following technical problems: how to drive the workpiece to be electroplated to move stably in the electroplating solution, specifically including how to reduce the swing amplitude of the workpiece to be electroplated during movement or avoid the swing of the workpiece to be electroplated during movement, how to reduce the risk of the workpiece to be electroplated falling and breaking during movement; how to drive the continuously loaded workpieces to be electroplated to move in the electroplating solution; how to energize the workpiece to be electroplated during movement; how to ensure the electroplating uniformity.

[0005] A fixed anode member is used in the anode unit. The anode member itself is not easy to be installed and disassembled, and the distance between the anode member and the workpiece to be electroplated cannot be adjusted. Furthermore, it is not convenient to adjust the electroplating effect by changing the distance between the anode member and the workpiece to be electroplated. Secondly, during electroplating, in order to improve the electroplating effect, it is necessary to spray the recycled electroplating solution or newly added electroplating solution into the electroplating solution near the workpiece to be electroplated through a spraying device. The existing spraying devices are generally arranged on one side or both sides of the workpiece to be electroplated, which will prevent the distance between the anode member and the workpiece to be electroplated from being reduced, affecting the electroplating effect.

[0006] The pipelines of the vertical electroplating device are generally arranged beside the electroplating tank body, occupying a certain floor area. Therefore, the floor area of the entire vertical electroplating device is increased, making it necessary to improve the structure of the vertical electroplating device.

[0007] Therefore, there is an urgent need to design a vertical electroplating device to solve at least one of the above technical problems. Utility Model Content

[0008] The purpose of the present application is to provide a vertical electroplating device, which solves at least one of the problems in the background art.

[0009] To achieve the above object, the present application provides a vertical electroplating device, including:

[0010] An anode unit, which is jointly composed of a plurality of anode components. The plurality of anode components are spaced or continuously distributed along a preset direction to form the anode unit; each anode component includes an anode member extending along the preset direction;

[0011] An electroplating tank, in which the anode unit is arranged, and the electroplating tank is also filled with electroplating solution;

[0012] A cathode unit, which is configured to mount the workpiece to be electroplated;

[0013] A driving mechanism, which is configured to push the cathode unit to move in the anode unit;

[0014] A power supply, the positive pole of which is connected to the anode unit, and the negative pole of which is connected to the cathode unit.

[0015] In some embodiments, when each anode component contains two anode members, there is a certain distance between the two anode members to form an anode channel, and a plurality of the anode channels are connected to form an electroplating channel.

[0016] In some embodiments, the vertical electroplating device further includes:

[0017] An anode base, on which a liquid passing channel and an installation groove are arranged. The installation groove is arranged on both sides of the liquid passing channel, and the anode member is installed in the installation groove;

[0018] A liquid circulation mechanism, which is connected to the electroplating tank and is configured to drive the electroplating solution to circulate and form a liquid loop;

[0019] A liquid supply assembly, which is used to supply the electroplating solution into the electroplating channel;

[0020] The liquid circulation mechanism is connected to the liquid supply assembly, and the liquid supply assembly is connected to the liquid passing channel to supply the electroplating solution into the electroplating channel.

[0021] In some embodiments, a first partition is horizontally arranged in the electroplating tank, and the electroplating tank is divided into an electroplating sub-tank and a liquid supply chamber by the first partition. The electroplating sub-tank is located above the liquid supply chamber;

[0022] The anode unit is arranged in the electroplating sub-tank, and a liquid supply assembly is arranged in the liquid supply chamber, and the electroplating solution is supplied to the electroplating sub-tank through the liquid supply assembly.

[0023] In some embodiments, the liquid supply assembly at least includes a shunt pipe;

[0024] The shunt pipe is communicated with the liquid circulation mechanism through the flow equalizing assembly. The flow equalizing assembly includes a liquid supply pipe and a flow equalizing pipe. Both ends of the liquid supply pipe are respectively communicated with the flow equalizing pipe and the liquid circulation mechanism. The liquid supply pipe is connected to the middle position in the length direction of the flow equalizing pipe. Both ends of the flow equalizing pipe extend equidistantly away from the connection point of the liquid supply pipe as the center point;

[0025] One end of the shunt pipe is arranged on the flow equalizing pipe and communicated with the flow equalizing pipe, and the other end is communicated with the electroplating channel to convey electroplating solution into the electroplating channel.

[0026] In some embodiments, the liquid supply assembly further includes a jet pipe. The jet pipe includes a jet main pipe and jet branch pipes. One end of the jet main pipe is communicated with the liquid circulation mechanism, and the other end is connected with the jet branch pipes;

[0027] The jet branch pipes are provided with nozzles, and the nozzles are communicated with the electroplating sub-tank;

[0028] A plurality of liquid supply ports are arranged on the first partition board, and the liquid passing channel corresponds to at least one of the liquid supply ports in position;

[0029] The number of the liquid supply ports and the nozzles located below the same electroplating channel is equal, and the positions are vertically corresponding. The nozzles pass through the liquid supply ports and are communicated with the electroplating channel, so that the electroplating solution flows into the liquid passing channel through the jet pipe.

[0030] In some embodiments, the liquid circulation mechanism at least includes a liquid storage barrel, a circulation pump and a circulation pipeline;

[0031] The circulation pipeline includes a circulation inlet pipe and a circulation outlet pipe. The liquid supply pipe and the jet pipe are both communicated with the circulation outlet pipe. The circulation outlet pipe is connected with the liquid outlet of the liquid storage barrel;

[0032] A second partition board is further arranged in the electroplating tank. Through the horizontally arranged first partition board and the second partition board, the electroplating tank is sequentially divided into an electroplating sub-tank, a liquid supply chamber and a liquid storage tank from top to bottom. The liquid storage tank is located below the liquid supply chamber and is independent of the liquid supply chamber;

[0033] The electroplating sub-tank has a circulation tank communicated with the liquid storage tank, and the circulation tank is independent of the liquid supply chamber;

[0034] One end of the circulation inlet pipe is connected with the circulation pump, and the other end is connected with the liquid storage tank. The circulation pump is connected with the liquid storage barrel;

[0035] One end of the circulating liquid inlet pipe connected to the liquid storage tank is provided with a filter, the filter is located in the liquid storage tank, a plurality of filter holes are formed in the filter, and the electroplating solution in the electroplating sub-tank flows through the circulating tank, the liquid storage tank, the filter and the circulating liquid inlet pipe in sequence and enters the liquid storage barrel.

[0036] In some embodiments, the cathode unit includes a conductive component and a mounting component;

[0037] The mounting component at least includes a cathode support frame and a cathode connecting rod, the cathode support frame is used for mounting the workpiece to be electroplated, and the cathode support frame is mounted on the cathode connecting rod;

[0038] The conductive component at least includes a conductive block, a substrate is arranged along the length of the electroplating tank, a conductive strip is arranged on the substrate, the conductive block is connected to the end of the cathode connecting rod, and the conductive block is in contact with the conductive strip;

[0039] Wherein, the workpiece to be electroplated is electrically connected to the conductive block through a conductive wire, and the negative pole of the power supply is electrically connected to the conductive strip; when the driving mechanism pushes the cathode unit and the cathode unit moves along the length of the electroplating tank, the conductive block transmits the electric energy obtained by its contact with the conductive strip to the workpiece to be electroplated.

[0040] In some embodiments, the cathode support frame includes a support frame body and a bearing frame body, the support frame body is connected to the bearing frame body, the bearing frame body has a bearing groove, and the bearing groove can be used for mounting the workpiece to be electroplated;

[0041] The orthographic projection area of the bearing groove on a preset vertical plane is larger than the orthographic projection area of the workpiece to be electroplated on the same preset vertical plane;

[0042] A plurality of bearing blocks are arranged in the bearing groove, and the plurality of bearing blocks are arranged along the inner wall of the bearing groove. When the workpiece to be electroplated is mounted in the bearing groove, the bearing blocks are in contact with the edge of the workpiece to be electroplated to support the workpiece to be electroplated;

[0043] A fifth baffle and a sixth baffle are arranged on the cathode support frame. When the workpiece to be electroplated is mounted in the bearing groove, the fifth baffle corresponds to the lower edge position of the workpiece to be electroplated, and the sixth baffle corresponds to the upper edge position of the workpiece to be electroplated.

[0044] In some embodiments, the support frame body has a first support portion and a second support portion, both ends of the first support portion are respectively connected to the two second support portions, and the ends of the second support portion away from the first support portion extend to both sides respectively and are connected to the bearing frame body;

[0045] A connecting rod support groove for installing the first support portion is formed on the cathode connecting rod;

[0046] Two support blocks are arranged on the first support portion, and the distance between the two support blocks is adapted to the width of the cathode connecting rod, so that the cathode connecting rod can be clamped between the two support blocks to limit the moving range of the cathode support frame.

[0047] In some embodiments, the driving mechanism at least includes a driving bracket, a transmission member, a driving source and a pushing member;

[0048] The transmission member is rotatably arranged on the driving bracket, the pushing member is connected to the transmission member, and the driving source is arranged on the driving bracket and connected to the transmission member to drive the transmission member to drive the pushing member to rotate in a cycle;

[0049] When the pushing member rotates above the electroplating tank, it contacts the cathode connecting rod and pushes it to move along the length of the electroplating tank.

[0050] In some embodiments, the transmission member rotates in a cycle on the driving bracket in an elliptical trajectory. The driving source includes a transmission wheel and a motor. The motor and the transmission wheel are respectively arranged on two surfaces of the driving bracket. The transmission member is sleeved on the transmission wheel, and the output shaft of the motor passes through the driving bracket and is connected to the transmission wheel to drive the transmission wheel to drive the transmission member to rotate.

[0051] In some embodiments, the transmission member arranged on the driving bracket rotates in a cycle in the vertical direction. When the transmission member rotates in a cycle, it has two horizontal moving regions and two rotating regions. The two horizontal moving regions are respectively at a first height and a second height. The distance between the first height and the electroplating tank is L1, and the distance between the second height and the electroplating tank is L2, and L1 < L2; when the pushing member is at the first height, the end of the pushing member away from the transmission member can contact the cathode connecting rod, and the pushing member applies a thrust to the cathode connecting rod under the drive of the transmission member, so that the cathode connecting rod moves following the pushing member; when the pushing member is at the second height, the end of the pushing member away from the transmission member can be separated from the cathode connecting rod;

[0052] The pushing member includes a pushing base and a pushing rod. The pushing base is connected to the transmission member, and one end of the pushing rod is arranged on the pushing base, and the other end extends in a direction away from the pushing base to the middle of the cathode connecting rod;

[0053] The pushing rod is rotatably connected to the pushing base in the vertical direction to adjust the height of the pushing rod;

[0054] A push plate is provided on the push rod;

[0055] Magnetic attraction structures that cooperate with each other are provided on the push plate and the cathode connecting rod.

[0056] The advantages of the vertical electroplating equipment in the embodiments of the present application include: the driving mechanism pushes the cathode unit to move in the anode unit, and drives the workpieces to be electroplated installed in the cathode unit to move in the anode unit, so that the workpieces to be electroplated can move in the electroplating solution, improving the electroplating efficiency. In addition, the liquid circulation mechanism can drive the electroplating solution to circulate, which can supplement the concentration loss of the electroplating solution around the workpieces to be electroplated, further improving the electroplating efficiency and being beneficial to electroplating uniformity. In addition, the pusher rotates in a cycle, and can cyclically push a plurality of continuously loaded cathode units, realizing the continuous production of the workpieces to be electroplated, thereby improving the production efficiency. In addition, in the vertical electroplating equipment, the electroplating tank is sequentially divided into an electroplating sub-tank, a liquid supply chamber and a liquid storage tank from top to bottom, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved. Description of the Drawings

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0058] Figure 1 It is a schematic structural diagram of an anode assembly in an embodiment provided by the present application;

[0059] Figure 2 It is a schematic structural diagram of an anode assembly in an embodiment provided by the present application;

[0060] Figure 3 It is a schematic structural diagram of an anode assembly in an embodiment provided by the present application;

[0061] Figure 4 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0062] Figure 5 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0063] Figure 6 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0064] Figure 7 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0065] Figure 8 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0066] Figure 9 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0067] Figure 10 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0068] Figure 11 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0069] Figure 12 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0070] Figure 13 It is Figure 12 A partial enlarged view of part A in;

[0071] Figure 14 It is Figure 12 A partial enlarged view of part B in;

[0072] Figure 15 It is Figure 12 A partial enlarged view of part C in;

[0073] Figure 16 It is Figure 12 A partial enlarged view of part D in;

[0074] Figure 17 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0075] Figure 18 It is Figure 17 A partial enlarged view of part E in;

[0076] Figure 19 It is Figure 17 A partial enlarged view of part F in;

[0077] Figure 20 It is Figure 17 A partial enlarged view of part G in;

[0078] Figure 21 It is a schematic diagram of the power connection of a vertical electroplating device in an embodiment provided by the present application;

[0079] Figure 22 It is a schematic structural diagram of a liquid supply assembly in an embodiment provided by the present application;

[0080] Figure 23 It is a schematic structural diagram of a liquid supply component in another embodiment provided by the present application;

[0081] Figure 24 It is a schematic diagram of the flow direction of electroplating solution in an embodiment provided by the present application;

[0082] Figure 25 It is a control logic diagram of a vertical electroplating device and a schematic structural diagram of a temperature control component in an embodiment provided by the present application;

[0083] Figure 26 It is a schematic structural diagram of a driving mechanism in an embodiment provided by the present application;

[0084] Figure 27 It is a schematic structural diagram of the cooperation between a driving mechanism and a cathode unit in an embodiment provided by the present application;

[0085] Figure 28 Figure 27 Partial enlarged view of part H therein;

[0086] Figure 29 It is a schematic structural diagram of a mounting component in an embodiment provided by the present application;

[0087] Figure 30 It is a schematic structural diagram of a mounting component in an embodiment provided by the present application;

[0088] Figure 31 It is a schematic structural diagram of a mounting component in an embodiment provided by the present application.

[0089] Reference numerals:

[0090] 10 - Anode assembly; 101 - Anode base; 1011 - Liquid passing channel; 1012 - Mounting groove; 102 - Anode part; 103 - Conductive copper bar; 104 - Fixed rod; 105 - First baffle; 106 - Baffle groove; 107 - Second baffle; 1071 - Drainage port; 108 - Third baffle; 109 - Fourth baffle; 110 - Overflow plate; 111 - Overflow tank; 112 - Anode channel; 113 - Electroplating channel;

[0091] 20 - Workpiece to be electroplated;

[0092] 30 - Electroplating tank; 301 - First partition; 302 - Second partition; 303 - Electroplating sub - tank; 304 - Liquid supply chamber; 305 - Liquid storage tank; 306 - Circulation tank; 307 - Circulation partition;

[0093] 40 - Cathode unit; 401 - Conductive component; 4011 - Conductive block; 40111 - Conductive fixing base; 4012 - Conductive bar; 4013 - Substrate; 4014 - Conductive connecting rod; 4015 - Guide roller; 4016 - Roller mounting seat; 4017 - Guide protrusion; 402 - Mounting component; 4021 - Cathode support frame; 40211 - Support frame body; 40212 - First support part; 40213 - Second support part; 40214 - Support block; 40215 - Carrying frame body; 40216 - Carrying groove; 40217 - Carrying block; 40218 - Carrying area; 4023 - Fifth baffle; 4024 - Sixth baffle; 4025 - Cathode connecting rod;

[0094] 50 - Driving mechanism; 501 - Driving bracket; 5011 - Slide rail; 502 - Transmission part; 503 - Driving source; 5031 - Transmission wheel; 5032 - Motor; 504 - Pushing part; 5041 - Pushing base; 5042 - Pushing roller; 5043 - Pushing rod; 5044 - Pushing plate;

[0095] 60 - Power supply;

[0096] 70 - Liquid circulation mechanism; 701 - Liquid storage barrel; 702 - Circulation pipeline; 7021 - Circulation inlet pipe; 7022 - Circulation outlet pipe; 703 - Filter; 7031 - Filter holes;

[0097] 80 - Liquid supply component; 801 - Diverging pipe; 802 - Liquid supply pipe; 8021 - Main liquid supply pipe; 8022 - Liquid supply branch pipe; 803 - Flow - equalizing pipe; 804 - Jet flow main pipe; 805 - Jet flow branch pipe; 806 - Sprinkler pipe; 90 - Controller; 91 - Liquid level sensor; 92 - Flow sensor; 93 - Temperature sensor; 94 - Adjusting valve; 95 - Solenoid valve;

[0098] 100 - Temperature control component; 1001 - Heat exchanger; 1002 - Liquid supply barrel; 1003 - First heat - exchange pipeline; 1004 - Second heat - exchange pipeline; 1005 - Third heat - exchange pipeline; 1006 - Fourth heat - exchange pipeline. Detailed implementation manners

[0099] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe the embodiments of this application in detail with reference to the accompanying drawings. Relative spatial position terms used in this application, such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end", etc., are for the purpose of facilitating description of the relationship between one unit or feature and another unit or feature as shown in the accompanying drawings. The relative spatial position terms may be intended to include different orientations of the device in use or operation other than the orientation shown in the figures. For example, if the device in the figure is flipped, the unit described as being "below" or "beneath" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the upper and lower orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein can be interpreted accordingly.

[0100] In addition, the terms "installed", "set up", "provided with", "connected", "slidably connected", "fixed", "socketed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. When the term "connected" is used for the connection between a pipeline and other components, it is judged according to the scenario. The pipeline and other components may be in a communicating state. That is, in some scenarios, the connection between the pipeline and other components also means that the pipeline communicates with other components.

[0101] Embodiments of the present application provide an anode assembly with adjustable anode position, and a vertical electroplating device including the anode assembly. The anode assembly includes an anode base and an anode member. By providing a liquid passing channel and a mounting groove on the anode base, the liquid passing channel is used for spraying electroplating solution, and the mounting groove is used for mounting the anode member. Part or all of the position of the liquid passing channel coincides with the processing position. During operation, the electroplating solution can be sprayed below the workpiece to be electroplated, avoiding the need to set spraying devices on one or both sides of the workpiece to be electroplated. This allows the distance between the anode member and the workpiece to be electroplated to be further reduced, improving the electroplating effect. On the premise of the same electroplating tank width, more anode members can be arranged to electroplate more workpieces to be electroplated, improving the electroplating efficiency. On the other hand, if there are multiple mounting grooves on the same side of the processing position, the distances between the multiple mounting grooves on the same side of the processing position and the liquid passing channel are set to increase sequentially, so that the anode member can be installed in the mounting groove at the corresponding position according to requirements, thereby adjusting the distance between the processing position and the mounting groove. Since part or all of the position of the liquid passing channel coincides with the processing position, when the workpiece to be electroplated is directly above the liquid passing channel station and the anode member is installed in the mounting groove, the distance between the processing position and the mounting groove is the distance between the anode member and the workpiece to be electroplated, effectively improving the position adjustment efficiency of the anode member and the electroplating effect of the workpiece to be electroplated. Herein, the processing position is the area covered by the orthographic projection of the workpiece to be electroplated on the anode base during electroplating, or the area covered by the orthographic projection on a preset horizontal plane. Its function is to mark a reference position for the installation of other components.

[0102] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments of the present application are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0103] The anode assembly 10 provided in the embodiments of the present application is used to provide electroplating metal for the electroplating device and carry the electroplating metal so that it can be stably installed in the electroplating device. When the electroplating device is in the working state, the electroplating metal will ionize into cations and enter the electroplating solution, and flow to the workpiece 20 to be electroplated, depositing a metal film on all or part of the surface of the workpiece 20 to be electroplated. Herein, the workpiece 20 to be electroplated can be a product that needs to endow certain special physical properties or decorative properties, such as a PCB board, a solar cell, a silicon wafer, a chip, etc.; for another example, the electroplating metal can be an insoluble anode, which is made by coating a noble metal oxide coating with high electrocatalytic performance on a titanium substrate (mesh, plate, strip, tube, etc.), or the electroplating metal is a soluble anode that can dissolve into cations and enter the solution by itself.

[0104] Please refer toFigures 1 - 8 , an anode assembly 10, at least including an anode base 101 and an anode member 102. A liquid passage 1011 and a mounting groove 1012 are provided on the anode base 101, and the mounting groove 1012 is configured for mounting the anode member 102. The mounting groove 1012 extends along a preset direction, and the anode member 102 in the mounting groove 1012 also extends along the preset direction. When the workpiece to be electroplated 20 is located on one side of the anode member 102, under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed from the anode member 102 and the cations originally in the electroplating solution will be enriched on the surface of the workpiece to be electroplated 20 and deposited to form a metal coating. A liquid passage 1011 is formed on the anode base 101, and the liquid passage 1011 is configured for the electroplating solution to flow through. Among them, part or all of the position of the liquid passage 1011 coincides with the processing position. See Figure 4 , when performing single-sided electroplating on the workpiece to be electroplated 20, the number of the mounting grooves 1012 can be set to one and located on one side of the processing position. The anode member 102 is installed in the mounting groove 1012. Specifically, the bottom of the anode member 102 is installed in the mounting groove 1012, and the electroplating surface of the workpiece to be electroplated 20 is arranged opposite to the installation of the anode member 102, that is, the orthographic projection area of the workpiece to be electroplated 20 on a preset vertical plane partially or completely coincides with the orthographic projection area of the anode member 102 on the same preset vertical plane. When the workpiece to be electroplated 20 is moved manually or automatically above the liquid passage 1011 or suspended above the liquid passage 1011, the electroplating solution flows through the liquid passage 1011 to between the electroplating surface and the anode member 102. Under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed from the anode member 102 or the cations originally in the electroplating solution are enriched on the surface of the workpiece to be electroplated 20 and deposited to form a metal coating, so as to complete the single-sided electroplating of the workpiece to be electroplated 20. Compared with the structure without the liquid passage 1011 on the anode base 101, the opening of the liquid passage 1011 enables the electroplating solution to flow through the liquid passage 1011 to between the electroplating surface and the anode member 102. In addition, the electroplating solution flowing in through the liquid passage 1011 can adopt an electroplating solution with a higher cation concentration. The cation concentration of the electroplating solution may decrease after long-term use, resulting in uneven thickness of the coating deposited on the surface of the workpiece to be electroplated 20. Or, see Figures 1 - 3 , Figures 4 - 8, the number of the installation grooves 1012 is two or more. Taking the processing position as a reference, multiple installation grooves 1012 are distributed on both sides of the processing position. The distances between the multiple installation grooves 1012 on the same side of the processing position and the processing position increase successively. The distance between any two installation grooves 1012 on both sides of the processing position is greater than the thickness of the workpiece to be electroplated 20. When the number of the installation grooves 1012 is an even multiple of two, multiple installation grooves 1012 are evenly arranged on both sides thereof with the processing position as the center. The distances between the multiple installation grooves 1012 on the same side of the processing position and the processing position increase successively, so that after the anode member 102 is installed in the installation groove 1012, the workpiece to be electroplated 20 can be moved to above the liquid passing channel 1011 or suspended above the liquid passing channel 1011 manually or by an automated method. Thus, when the electroplating solution flows out through the liquid passing channel 1011, it can flow between the surface to be electroplated and the anode member 102. Under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed from the anode member 102 or the cations originally in the electrolyte solution are enriched on the surfaces of both sides of the workpiece to be electroplated 20 and deposited to form a metal coating, so as to complete the double-sided electroplating of the workpiece to be electroplated 20.

[0105] When the number of the installation grooves 1012 is odd, the distribution mode of the even number of installation grooves 1012 among them is the same as that when the number is an even multiple of two. The remaining one installation groove 1012 can be arranged on any side of the liquid passing channel 1011. For example, when the number of the installation grooves 1012 is three, two of the installation grooves 1012 are respectively arranged on both sides of the liquid passing channel 1011, and the remaining one installation groove 1012 is arranged on any side of the liquid passing channel 1011, that is, when only one installation groove 1012 is arranged on one side of the liquid passing channel 1011, two installation grooves 1012 must be arranged on the other side.

[0106] In practical applications, when the number of anode members 102 is one and the number of mounting grooves 1012 is two or more, the anode member 102 is installed in any one of the mounting grooves 1012. Specifically, when the number of anode members 102 is set to one, only one side of the workpiece to be electroplated 20 can be electroplated. At this time, there is no direction limit for the installation of the anode member 102, that is, the anode member 102 can be placed on either side of the liquid passage 1011. The workpiece to be electroplated 20 needs to set its electroplating surface facing the anode member 102. For example, when the workpiece to be electroplated 20 adopts hanging static electroplating and the anode member 102 is installed in the mounting groove 1012 on the left side of the liquid passage 1011, the electroplating surface of the workpiece to be electroplated 20 needs to face the left side of the liquid passage 1011 and be arranged opposite to the anode member 102 (that is, the area of the orthographic projection of the electroplating surface on the preset vertical plane partially or entirely coincides with the area of the orthographic projection of the anode member 102 on the same preset vertical plane). When the number of anode members 102 is two and the number of mounting grooves 1012 is two or more, the two anode members 102 are respectively installed in any two mounting grooves 1012 located on both sides of the liquid passage 1011. Specifically, when the number of anode members 102 is set to two, double-sided electroplating is performed on the workpiece to be electroplated 20. To achieve double-sided electroplating, it is necessary to ensure that the two anode members 102 are respectively installed in the mounting grooves 1012 located on both sides of the liquid passage 1011, so that the two electroplating surfaces of the workpiece to be electroplated 20 respectively correspond to the two anode members 102.

[0107] If the electroplating part 20 is to be electroplated on one side, only one anode part 102 can be selected. With one anode part 102, the electroplating of one side of the electroplating part 20 can be achieved. When more than one anode part 102 is set, multiple anode parts 102 are located on the same side or multiple anode parts 102 are respectively located on both sides of the electroplating part 20, which has little influence on the electroplating effect of the electroplating part 20 compared with only setting one anode part 102, while the electroplating cost and electroplating efficiency will be improved. For example, when multiple anode parts 102 are located on the same side (that is, multiple anode parts 102 are all installed in multiple installation grooves 1012 on one side of the liquid passing channel 1011), the electroplating solution flowing out through the liquid passing channel 1011 only contacts the anode part 102 closest to the electroplating surface, and it is difficult for the cations electrolyzed by the remaining anode parts 102 to migrate to the electroplating surface; when multiple anode parts 102 are respectively located on both sides of the liquid passing channel 1011, the electroplating solution flowing out through the liquid passing channel 1011 will contact two electroplating surfaces and the corresponding anode parts 102 at the same time, so that cations will be deposited on both sides of the electroplating part 20. However, most of the cations deposited on the electroplating surface come from the anode part 102 closest to it, and the cations electrolyzed by the remaining anode parts 102 are free in the electroplating solution or deposited on non-electroplating surfaces. That is to say, when the anode part 102 is connected to the positive pole of the power supply 60, all the anode parts 102 immersed in the electroplating solution will be electrolyzed in the electric field. Even if only one anode part 102 provides metal cations for the electroplating part 20, all the anode parts 102 will be consumed during the electroplating process, thus increasing the electroplating cost and reducing the electroplating efficiency caused by installing redundant anode parts 102.

[0108] Correspondingly, if the electroplating part 20 is to be electroplated on both sides, only two anode parts 102 can be selected. Two anode parts 102 are respectively used for electroplating the two electroplating surfaces of the electroplating part 20. If the number of anode parts 102 exceeds two, the remaining anode parts 102 need to be installed on one side of the above two anode parts 102. During the electroplating process, the electroplating solution flowing out through the liquid passing channel 1011 only contacts the anode part 102 closest to the electroplating surface, and the anode parts 102 far from the electroplating part 20 will increase the electroplating cost.

[0109] It can be seen from this that when the electroplating part 20 is electroplated on one side, the anode base 101 with only a single installation groove 1012 can be selected, or the anode base 101 with multiple installation grooves 1012 can be selected. The anode part 102 can be installed in any one of the installation grooves 1012. When the electroplating part 20 is electroplated on both sides, only the anode base 101 with multiple installation grooves 1012 can be selected, and two anode parts 102 need to be respectively installed in the installation grooves 1012 located on both sides of the liquid passing channel 1011.

[0110] In an implementable embodiment, the distances between multiple mounting grooves 1012 on the same side of the liquid passing channel 1011 and the liquid passing channel 1011 can increase in equal proportion successively. For example, when the number of mounting grooves 1012 is four, two mounting grooves 1012 will be respectively arranged on both sides of the liquid passing channel 1011. Among the four mounting grooves 1012 respectively located on both sides of the liquid passing channel 1011, the distances between the liquid passing channel 1011 and the two mounting grooves 1012 closest to it are both S1, with the unit of cm, and the distances between the liquid passing channel 1011 and the two mounting grooves 1012 far from it are both 2S1, with the unit of cm.

[0111] Correspondingly, the distances between multiple mounting grooves 1012 on the same side of the liquid passing channel 1011 and the liquid passing channel 1011 can increase non-equally in proportion successively. For example, among the four mounting grooves 1012 respectively located on both sides of the liquid passing channel 1011, the distances between the liquid passing channel 1011 and the two mounting grooves 1012 closest to it are both S1, with the unit of cm, the distances between the liquid passing channel 1011 and the two mounting grooves 1012 far from it are both S2, with the unit of cm, and the distance between the two mounting grooves 1012 on the same side is S2 - S1, and S2 - S1 ≠ S1.

[0112] In practical applications, the installation position of the anode member 102 can be determined by the results of pre-tests. Specifically, the anode member 102 can be successively installed in multiple mounting grooves 1012 on the same side of the liquid passing channel 1011, and by comparing the electroplating effects of the workpiece to be electroplated 20 when the anode member 102 is installed at different positions, the optimal installation position of the anode member 102 can be inferred. Among them, when performing single-sided electroplating on the workpiece to be electroplated 20, only the electroplating effect of its surface to be electroplated needs to be considered. If it is selected to install the anode member 102 on the anode base 101 with only a single mounting groove 1012, the electroplating effect when the anode member 102 is installed in the mounting groove 1012 of this anode base 101 can be compared with the electroplating effect when the anode member 102 is installed on the anode base 101 with multiple mounting grooves 1012 (the anode member 102 is installed in the mounting grooves 1012 at multiple different positions for testing respectively, and the electroplating effects are compared one by one). If it is selected to install the anode member 102 on the anode base 101 with multiple mounting grooves 1012, only the electroplating effects when the anode member 102 is installed in different mounting grooves 1012 need to be compared. When performing double-sided electroplating on the workpiece to be electroplated 20, it can be selected according to needs whether the distances between the two anode members 102 and the liquid passing channel 1011 are equal or not. If the distances between the two anode members 102 and the liquid passing channel 1011 are both equal, the same electroplating effect will be produced. If the distances between the two anode members 102 and the liquid passing channel 1011 are not equal, different electroplating effects can be presented on the two sides of the workpiece to be electroplated 20.

[0113] For example, when the number of the mounting grooves 1012 is one, refer to Figure 4 , the anode member 102 is installed in the mounting groove 1012 for testing. If the electroplating effect of the workpiece to be electroplated 20 does not meet the pre-set qualified standard, the anode assembly 10 is replaced. The distance between the mounting groove 1012 and the liquid passing channel 1011 in the replaced anode assembly 10 needs to be different from the distance between the mounting groove 1012 and the liquid passing channel 1011 in the anode assembly 10 before replacement.

[0114] When the number of the mounting grooves 1012 is two, refer to Figure 5 , the two anode members 102 can be respectively installed in the mounting grooves 1012 on both sides of the liquid passing channel 1011 for testing. If the electroplating effect of the workpiece to be electroplated 20 does not meet the pre-set qualified standard, the anode assembly 10 is replaced. The distance between the mounting groove 1012 and the liquid passing channel 1011 in the replaced anode assembly 10 needs to be different from the distance between the mounting groove 1012 and the liquid passing channel 1011 in the anode assembly 10 before replacement.

[0115] When the number of the mounting grooves 1012 is more than two and is an integer multiple of two, for example, when the number of the mounting grooves 1012 is set to four, refer to Figure 6 , the two mounting grooves 1012 close to the liquid passing channel 1011 are respectively a first groove body and a second groove body, and the two mounting grooves 1012 far from the liquid passing channel 1011 are respectively a third groove body and a fourth groove body, wherein the first groove body and the third groove body are on the same side, and the second groove body and the fourth groove body are on the same side. Specifically, the two anode members 102 can be installed in any of the following ways:

[0116] (1) The two anode members 102 are respectively installed in the first groove body and the second groove body;

[0117] (2) The two anode members 102 are respectively installed in the first groove body and the fourth groove body;

[0118] (3) The two anode members 102 are respectively installed in the third groove body and the fourth groove body;

[0119] (4) The two anode members 102 are respectively installed in the third groove body and the second groove body.

[0120] When the two anode members 102 are installed in the first and third ways, the electroplating effects on both sides of the workpiece to be electroplated 20 are the same. When the two anode members 102 are installed in the second and fourth ways, the electroplating effects on both sides of the workpiece to be electroplated 20 are different.

[0121] When the number of the mounting grooves 1012 is more than two and is an odd number, for example, when the number of the mounting grooves 1012 is set to five, refer to Figure 7, there are two mounting grooves 1012 located on one side of the liquid passage 1011, namely the first groove body and the third groove body, and there are three mounting grooves 1012 located on the other side of the liquid passage 1011, namely the second groove body, the fourth groove body and the fifth groove body. Specifically, the two anode members 102 can be installed in any of the following ways:

[0122] (1) The two anode members 102 are respectively installed in the first groove body and the second groove body;

[0123] (2) The two anode members 102 are respectively installed in the first groove body and the fourth groove body;

[0124] (3) The two anode members 102 are respectively installed in the first groove body and the fifth groove body;

[0125] (4) The two anode members 102 are respectively installed in the third groove body and the second groove body;

[0126] (5) The two anode members 102 are respectively installed in the third groove body and the fourth groove body;

[0127] (6) The two anode members 102 are respectively installed in the third groove body and the fifth groove body.

[0128] When the two anode members 102 are installed in the first and fifth ways, the electroplating effects on both sides of the workpiece 20 to be electroplated are the same. When the two anode members 102 are installed in the second, third, fourth and sixth ways, the electroplating effects on both sides of the workpiece 20 to be electroplated are different.

[0129] Preferably, the distances between the mounting grooves 1012 and the liquid passage 1011 (equivalent to the distances between the anode members 102 and the workpiece 20 to be electroplated during electroplating) are 40mm, 70mm and 100mm in sequence from near to far, and the number of the mounting grooves 1012 is six. Refer to Figures 1 - 3 、 Figure 8 , that is, the distance between the mounting groove 1012 closest to the liquid passage 1011 and the liquid passage 1011 is 40mm, and the distance between two adjacent mounting grooves 1012 on the same side of the liquid passage 1011 is 30mm. In this embodiment, there are nine installation ways for the two anode members 102. The specific installation ways and test methods can refer to the installation ways and test methods adopted when the number of the mounting grooves 1012 is an integer multiple of two.

[0130] It should be noted that the two anode members 102 are arranged in parallel, the center points are on the same horizontal line, and the orthographic projection areas of the two anode members 102 on the same preset vertical plane are the same. In this way, after the anode members 102 are installed in the installation grooves 1012, the projection areas of the two anode members 102 on the same preset vertical plane corresponding to the workpiece 20 to be electroplated are the same, so that all areas or corresponding areas on both sides of the workpiece 20 to be electroplated can be electroplated simultaneously.

[0131] In an implementable embodiment, the anode member 102 is connected to the conductive copper bar 103, and the conductive copper bar 103 is connected to the positive electrode of the power supply 60. In this way, the conductive copper bar 103 can deliver the positive current to the anode member 102, so that the anode member 102 can be electrolyzed in the electroplating solution. Among them, the conductive copper bar 103 is arranged on the fixing rod 104, and the fixing rod 104 is connected to the electroplating equipment.

[0132] In an implementable embodiment, referring to Figures 1 - 8 , the anode assembly 10 further includes a baffle sub-assembly. The baffle sub-assembly at least includes a first baffle 105. A baffle groove 106 for installing the first baffle 105 is formed on the anode base 101. The baffle groove 106 is located between the liquid passing channel 1011 and the adjacent installation groove 1012. When the first baffle 105 is installed in the baffle groove 106, the first baffle 105 corresponds to the lower edge position of the anode member 102. Specifically, for the anode base 101 with only one installation groove 1012, only one anode member 102 can be installed correspondingly, and only one first baffle 105 for blocking the lower edge of the anode member 102 needs to be provided. For the anode base 101 with two or more installation grooves 1012, the workpiece 20 to be electroplated can be electroplated on one side or both sides, and two baffle grooves 106 need to be provided. When electroplating the workpiece 20 to be electroplated on both sides, anode members 102 will be installed on both sides of the liquid passing channel 1011. Since the distance between the baffle groove 106 and the liquid passing channel 1011 is less than the distance between the installation groove 1012 and the liquid passing channel 1011, when the anode member 102 is installed in any one of the installation grooves 1012, the first baffle 105 is located between the anode member 102 and the workpiece 20 to be electroplated, so as to block the lower edge of the anode member 102.

[0133] Further, when the first baffle 105 is installed in the baffle groove 106 and the anode member 102 is installed in the installation groove 1012, the upper surface of the first baffle 105 is higher than the lower surface of the anode member 102, so that the first baffle 105 can block a part of the anode member 102. Specifically, the part of the first baffle 105 located in the baffle groove 106 is blocked by the baffle groove 106 body, and the part of the anode member 102 located in the installation groove 1012 is blocked by the installation groove 1012 body. It is necessary to ensure that the part of the first baffle 105 exposed from the baffle groove 106 can block the edge part of the anode member 102 exposed from the installation groove 1012.

[0134] It should be noted that the lower edge area of the anode member 102 can be preset. Due to the edge effect of the anode member 102 itself (i.e., during electroplating, the power lines are prone to concentrate at the sharp corners and edges of the anode member 102, so that the current density at the sharp corners and edges of the anode member 102 is relatively large), in order to prevent the power lines flowing from the anode member 102 to the edge part of the workpiece to be electroplated 20 from being too concentrated, a shielding member can be provided at the edge part of the anode member 102, so that when the power lines located in the lower edge area of the anode member 102 extend to the workpiece to be electroplated 20, they need to bypass the first baffle 105. From this, it can be inferred that the distance that the power lines located in the lower edge area of the anode member 102 extend to the workpiece to be electroplated 20 will be greater than the distance that the power lines located in the central area of the anode member 102 move to the workpiece to be electroplated 20. In this way, the distribution of the power lines on the surface to be electroplated can be made uniform, thereby reducing the influence of the uneven coating caused by the edge effect of the anode member 102.

[0135] Assume that the area of the part of the first baffle 105 exposed from the baffle groove 106 is A, with the unit of cm 2 , and the preset lower edge area of the anode member 102 is B, with the unit of cm 2 . In order to achieve a better shielding effect, the positive projection of the part of the first baffle 105 exposed from the baffle groove 106 on the anode member 102 can cover the preset lower edge area of the anode member 102, that is, the positive projection area of the part of the first baffle 105 exposed from the baffle groove 106 on the anode member 102 is greater than B, so as to achieve the shielding of the lower edge area of the anode member 102. Without limitation, the depth of the baffle groove 106 and the depth of the installation groove 1012 are not limited here as long as the exposed part of the first baffle 105 can block the lower edge area of the anode member 102. When the first baffle 105 and the anode member 102 are parallel and facing each other, it is only necessary that the area of the part of the first baffle 105 exposed from the baffle groove 106 is greater than the preset lower edge area of the anode member 102.

[0136] In an implementable embodiment, the baffle sub-assembly further includes a second baffle 107. One end of the second baffle 107 is connected to the conductive copper bar 103, and the other end extends from the top of the workpiece to be electroplated 20 towards its bottom until the upper edge of the anode 102 is blocked. Specifically, connection holes capable of cooperating with the same bolt are provided on both the second baffle 107 and the conductive copper bar 103 to realize the connection between the second baffle 107 and the conductive copper bar 103. To ensure that the second baffle 107 can block the upper edge of the anode 102, the second baffle 107 needs to be arranged above the anode 102, that is, the conductive copper bar 103 and the fixing rod 104 for installing the conductive copper bar 103 are both located above the anode 102. That is to say, the second baffle 107 can also be connected in cooperation with the fixing rod 104.

[0137] Further, the free end of the second baffle 107 extends downward until it can block the upper edge area of the anode 102. Correspondingly, the upper edge area of the anode 102 can be preset. If the area of the preset upper edge area of the anode 102 is C, with the unit of cm 2 , in order to achieve a better blocking effect, the downward extension area at the bottom of the second baffle 107 can be made such that its orthographic projection on the anode 102 covers the upper edge area of the anode 102, thereby realizing the blocking of the upper edge area of the anode 102. So that when the power lines located in the upper edge area of the anode 102 extend to the workpiece to be electroplated 20, they need to bypass the second baffle 107. From this, it can be inferred that the distance for the power lines located in the upper edge area of the anode 102 to extend to the workpiece to be electroplated 20 will be greater than the distance for the power lines located in the central area of the anode 102 to extend to the workpiece to be electroplated 20.

[0138] In an implementable embodiment, the baffle sub-assembly further includes a third baffle 108. One end of the third baffle 108 is arranged on the second baffle 107 and is located between the second baffle 107 and the anode 102. If the distance between the upper edge area of the anode 102 and the second baffle 107 is too large, the blocking effect of the second baffle 107 on the edge power lines will be reduced. Further, there is a certain distance between the side of the second baffle 107 close to the anode 102 and the anode 102, and the distance is greater than or equal to the thickness of the third baffle 108.

[0139] In an implementable embodiment, the baffle sub-assembly further includes a fourth baffle 109. One end of the fourth baffle 109 is arranged on the first baffle 105, and the other end extends towards the adjacent anode 102. The principle is the same as that of the above-mentioned third baffle 108. If the distance between the lower edge area of the anode 102 and the first baffle 105 is too large, the blocking effect of the first baffle 105 on the edge power lines will be reduced. Further, there is a certain distance between the side of the first baffle 105 close to the anode 102 and the anode 102, and the distance is greater than or equal to the thickness of the fourth baffle 109.

[0140] Further, the fourth baffle 109 and the first baffle 105 are detachably connected. Specifically, when there are two or more installation grooves 1012, the anode member 102 can be placed in the installation groove 1012 away from the liquid passing channel 1011, and the baffle groove 106 is arranged between the liquid passing channel 1011 and the adjacent installation groove 1012. In this case, the distance between the first baffle 105 and the anode member 102 will change. The maximum value of the distance between the first baffle 105 and the anode member 102 is positively correlated with the number of installation grooves 1012. The more the number of installation grooves 1012 on the same side of the liquid passing channel 1011, the greater the distance between the liquid passing channel 1011 and the farthest installation groove 1012. Therefore, when the installation position of the anode member 102 is uncertain, in order to ensure that the fourth baffle 109 can always fill the distance between the first baffle 105 and the anode member 102, the fourth baffle 109 can adopt a detachable connection method. When the installation position of the anode member 102 changes, the fourth baffle 109 with different lengths can be replaced in time. Among them, the detachable connection method can be threaded connection, snap connection, etc. The application does not limit the detachable connection method as long as the fourth baffle 109 connected to the first baffle 105 can be repeatedly replaced.

[0141] Different from the above method of using the fourth baffle 109 to fill the distance between the anode member 102 and the first baffle 105, in another implementable embodiment, a plurality of baffle grooves 106 are provided on the anode base 101, and the number of baffle grooves 106 is equal to the number of installation grooves 1012 and they are arranged at intervals. Specifically, one baffle groove 106 and one installation groove 1012 jointly form a lower shielding group. In one lower shielding group, the baffle groove 106 is located on the side close to the liquid passing channel 1011. For example, the number of installation grooves 1012 is four and they are evenly distributed on both sides of the liquid passing channel 1011, that is, there are two lower shielding groups on both sides of the liquid passing channel 1011. In the lower shielding group on the left side of the liquid passing channel 1011, the baffle groove 106 is located on the side close to the liquid passing channel 1011, which is equivalent to the right side in the lower shielding group, and the installation groove 1012 is located on the side away from the liquid passing channel 1011, which is equivalent to the left side in the lower shielding group. In this embodiment, the distance between the first baffle 105 and the anode member 102 is equal to the distance between the installation groove 1012 and the baffle groove 106. If the installation groove 1012 and the baffle groove 106 are connected in one lower shielding group, after the anode member 102 and the first baffle 105 are respectively installed in the installation groove 1012 and the baffle groove 106, the anode member 102 and the first baffle 105 are in a fitting state. If the installation groove 1012 and the baffle groove 106 are separated by the anode base 101 in one lower shielding group, the smaller the width of the anode base 101 between the installation groove 1012 and the baffle groove 106, the better the shielding effect of the first baffle 105 on the power lines at the lower edge of the anode member 102.

[0142] In an implementable embodiment, referring to Figures 1 - 8 , the anode assembly 10 further includes an overflow plate 110. An overflow groove 111 for installing the overflow plate 110 is formed in the anode base 101. The overflow groove 111 is located on the side of the installation groove 1012 away from the liquid passing channel 1011. The projected area of the overflow plate 110 on a preset vertical plane is larger than the projected area of the anode member 102 on the same preset vertical plane. Since the titanium substrate of the anode member 102 can be selected to be a mesh or other structure that communicates the spaces on both sides of the anode member 102, in order to prevent the electroplating solution flowing in from the liquid passing channel 1011 from directly flowing away from the workpiece 20 to be electroplated by using the structure of the anode member 102 and no longer flowing through the workpiece 20 to be electroplated, so that the cations are subject to a flow resistance in the direction opposite to the direction close to the workpiece 20 to be electroplated and cannot converge on the surface of the workpiece 20 to be electroplated, the overflow groove 111 for installing the overflow plate 110 is arranged on the side of the installation groove 1012 away from the liquid passing channel 1011, that is, the electroplating solution cannot flow to the side of the anode member 102 away from the liquid passing channel 1011. That is to say, when the electroplating solution flowing out of the liquid passing channel 1011 is blocked by the overflow plate 110 and the workpiece 20 to be electroplated on the left and right sides respectively, it can only flow along the height direction of the workpiece 20 to be electroplated and the overflow plate 110. In this way, the electroplating solution can continuously contact the workpiece 20 to be electroplated during the flowing process, and the cations will also be free to the surface of the workpiece 20 to be electroplated.

[0143] In an implementable embodiment, a drainage port 1071 is formed in the second baffle 107. The drainage port 1071 is located above the anode member 102 so that the electroplating solution flowing in from the liquid passing channel 1011 flows through the workpiece 20 to be electroplated and flows in the direction of the drainage port 1071. If there is no drainage port 1071 on the second baffle 107, when the second baffle 107 blocks the upper edge of the anode member 102, after the electroplating solution flows in from the liquid passing channel 1011, it will flow along the height of the workpiece 20 to be electroplated to the top of the second baffle 107 and then diffuse. However, when the upper surface of the electroplating tank 30 is flush with the upper surface of the anode assembly 10, after the electroplating solution flows to the top of the second baffle 107, since it is too close to the side wall of the electroplating tank 30, the electroplating solution will flow out of the electroplating tank 30. When the flow rate of the electroplating solution flowing in from the liquid passing channel 1011 is too fast, when the electroplating solution cannot diffuse to both sides, the liquid level height when flowing above the anode assembly 10 will be higher than the anode assembly 10, and there is a possibility of generating water splashes or flowing out of the electroplating tank 30 when falling.

[0144] Accordingly, to ensure that the flow area of the electroplating solution can completely cover the surface to be electroplated of the workpiece 20 to be electroplated, so that cations can migrate to the surface of the surface to be electroplated, thereby achieving the effect of uniform electroplating, the drainage port 1071 should also be located above the workpiece 20 to be electroplated. Since the specific position of the workpiece 20 to be electroplated cannot be determined during moving electroplating (i.e., non-hanging electroplating), therefore, the top position of the workpiece 20 to be electroplated during movement can be pre-tested, and by adjusting its height, the drainage port 1071 is always located above it, thereby avoiding uneven electroplating.

[0145] In this embodiment, there should be enough space above the anode member 102 for the electroplating solution to flow out from the drainage port 1071. Specifically, since the bottom of the second baffle 107 is a free end and the top is a fixed end, and the fixed end is connected to the conductive copper bar 103 and / or the fixing rod 104, that is to say, both the conductive copper bar 103 and the fixing rod 104 are located above the anode member 102, so that the second baffle 107 can block the upper edge of the anode member 102 when extending downward. When the conductive copper bar 103, the fixing rod 104 and the anode member 102 are all on the same side of the second baffle 107, both the conductive copper bar 103 and the fixing rod 104 are located above the anode member 102 and have a certain distance from the anode member 102, forming a drainage channel, and the drainage channel is connected to the drainage port 1071. Thus, after the electroplating solution flows in through the liquid channel 1011, it moves along the height direction between the anode member 102 and the workpiece 20 to be electroplated, and flows to the drainage port 1071 and then enters the drainage channel through the drainage port 1071.

[0146] In practical applications, to ensure the stability of the anode assembly 10 during electroplating, after the anode member 102 is inserted into the installation groove 1011, the anode base 101 and the anode member 102 can be further threadedly connected by bolts to further improve the installation stability of the anode plate 102. At the same time, both the connection between the second baffle 107 and the fixing rod 104 and the connection between the anode base 101 and the electroplating equipment are threaded connections. In this way, the influence of the water flow impact force and the like on the anode assembly 10 and its components during electroplating can be reduced, thereby ensuring the stable progress of the electroplating work. When ensuring the stable connection between the anode base 101 and the electroplating equipment and between the components of the anode assembly 10 and being convenient for replacement, other detachable connection methods can also be adopted, and the present application does not limit this here.

[0147] An embodiment disclosed in the present application also provides a vertical electroplating device. Please refer to Figures 9 - 30 This vertical electroplating device includes the anode assembly 10 in the foregoing embodiment. The vertical electroplating device is used to electroplate the workpiece 20 to be electroplated so that a metal film is attached to all or part of the surface of the workpiece 20 to be electroplated.

[0148] In this embodiment, refer to Figures 9 - 21, the vertical electroplating equipment further includes an anode unit, an electroplating tank 30, a cathode unit 40, a driving mechanism 50, a power supply 60, and a liquid circulation mechanism 70. Specifically, the anode assembly 10 is disposed in the electroplating tank 30, and multiple anode assemblies 10 together form the anode unit; in the working state, the electroplating tank 30 is also filled with electroplating solution, and the anode piece 102 in the anode assembly 10 is immersed in the electroplating solution to ensure the normal flow of cations during the electroplating process; the cathode unit 40 is configured to mount the workpiece to be electroplated 20; the driving mechanism 50 is configured to push the cathode unit 40 to move in the anode unit. If the anode assembly 10 includes only one anode piece 102, when the cathode unit 40 moves in the anode unit, the workpiece to be electroplated 20 is located on one side of the anode piece 102, and the cations ionized from the anode piece 102 will be free and deposited on the surface of the workpiece to be electroplated 20, so that the workpiece to be electroplated 20 can be electroplated on one side. If the anode assembly 10 includes two anode pieces 102, when the cathode unit 40 moves in the anode unit, the workpiece to be electroplated 20 is located between the two anode pieces 102, and the cations ionized from the anode pieces 102 will be free and deposited on the surface of the workpiece to be electroplated 20, so that the workpiece to be electroplated 20 can be electroplated on both sides; the positive pole of the power supply 60 is connected to the anode assembly 10, and the negative pole of the power supply 60 is connected to the cathode unit 40, thus forming an electric field loop; the liquid circulation mechanism 70 is connected to the electroplating tank 30 and is configured to drive the electroplating solution to circulate, so as to form a liquid loop. In practical applications, refer to Figures 9 - 11 , to ensure the overall stability of the vertical electroplating equipment, the electroplating tank 30, the driving mechanism 50, and the liquid circulation mechanism 70 are all connected to the frame. Above, by the driving mechanism 50 pushing the cathode unit 40 to move in the anode unit, driving the workpiece to be electroplated 20 installed in the cathode unit 40 to move in the anode unit, the workpiece to be electroplated 20 can move in the electroplating solution, improving the electroplating efficiency. In addition, the liquid circulation mechanism 70 can drive the electroplating solution to circulate, which can supplement the concentration loss of the electroplating solution around the workpiece to be electroplated 20, further improving the electroplating efficiency and being beneficial to electroplating uniformity.

[0149] In an implementable embodiment, refer to Figures 9 - 11, a plurality of anode assemblies 10 are arranged in the electroplating tank 30. The plurality of anode assemblies 10 are spaced or continuously distributed along a preset direction to form an anode unit. The anode parts 102 on the plurality of anode assemblies 10 in the anode unit all extend along the preset direction. Or rather, each anode assembly 10 includes an anode part 102 extending along the preset direction. Preferably, among the plurality of anode assemblies 10 belonging to the same anode unit, the anode parts 102 located on the same side are arranged coplanarly. Wherein, the preset direction is the moving direction of the workpiece to be electroplated 20 in the electroplating tank 30. Thus, when each anode assembly 10 belonging to the same anode unit includes two anode parts 102, there is a certain distance between the two anode parts 102, and an anode channel 112 is formed. A plurality of anode channels 112 are connected to form an electroplating channel 113. Since in the anode assembly 10, the width of the liquid passing channel 1011 is greater than the thickness of the workpiece to be electroplated 20, and the two anode parts 102 are located on both sides of the liquid passing channel 1011, the width of the formed anode channel 112 must be greater than the thickness of the workpiece to be electroplated 20 to allow the workpiece to be electroplated 20 to move in the anode channel 112. When the workpiece to be electroplated 20 moves along its length in the electroplating channel 113, the cations ionized by the two anode parts 102 will respectively migrate to the electroplating surfaces close to them. Since the workpiece to be electroplated 20 in this embodiment is continuously electroplated in a vertical state, this electroplating method belongs to vertical continuous electroplating. Vertical continuous electroplating can ensure that the workpiece to be electroplated 20 can be evenly electroplated throughout the electroplating tank 30, thereby obtaining a uniform coating thickness.

[0150] In practical applications, a plurality of plating channels 113 are arranged in parallel in the plating tank 30, so that a plurality of workpieces to be plated 20 can be plated simultaneously in the plating tank 30 to achieve continuous and efficient production. If only one plating channel 113 is provided, the sequential continuous plating method can be adopted. Specifically, after the workpiece to be plated 20 moves into the anode channel 112, the two anode members 102 will respectively plate the two sides of the workpiece to be plated 20. That is to say, even if the distance between the two anode members 102 is large enough, in the case of double-sided plating of the workpiece to be plated 20, the anode channel 112 can only supply one workpiece to be plated 20 at a time. Therefore, a plurality of workpieces to be plated 20 need to enter the plating channel 113 sequentially and intermittently. Without affecting each other, the smaller the interval time between two adjacent workpieces to be plated 20 entering the plating channel 113, the higher the plating efficiency. If a plurality of plating channels 113 are provided simultaneously, the parallel and continuous plating method of a plurality of workpieces to be plated 20 can be adopted. Specifically, a plurality of workpieces to be plated 20 can be installed on the cathode unit 40 at the same time. The installed plurality of workpieces to be plated 20 are parallel to each other and the number is equal to the number of plating channels 113, so that a plurality of workpieces to be plated 20 can enter the plating channel 113 for plating at the same time. In this way, only the cathode unit 40 needs to install multiple groups of workpieces to be plated 20 at the same time. The plurality of workpieces to be plated 20 located on the same cathode unit 40 are taken as a group, and multiple groups of workpieces to be plated 20 enter the plating channel 113 sequentially and intermittently. Since the plurality of plating channels 113 are independent of each other, when a plurality of plating channels 113 are provided, for a single plating channel 113, the way the workpiece to be plated 20 enters is the same as when only one plating channel 113 is provided. The method of parallel installation of a plurality of workpieces to be plated 20 can reduce the space occupied by the installation components compared with single installation, and the parallel movement of a plurality of workpieces to be plated 20 is convenient for management and adjustment of the interval time. It can be seen that setting a plurality of plating channels 113 in the plating tank 30 can effectively improve the plating efficiency of the vertical plating equipment.

[0151] In an implementable embodiment, referring to Figure 12 , Figure 17 , Figure 24 , a first partition 301 is horizontally arranged in the plating tank 30, and the plating tank 30 is divided into a plating sub-tank 303 and a liquid supply chamber 304 by the first partition 301. The plating sub-tank 303 is located above the liquid supply chamber 304. Among them, the anode assembly 10 is arranged in the plating sub-tank 303, a liquid supply assembly 80 is arranged in the liquid supply chamber 304, and the plating liquid is supplied to the plating sub-tank 303 through the liquid supply assembly 80. Specifically, by horizontally arranging the first partition 301, the plating tank 30 is divided into upper and lower parts, and the liquid supply chamber 304 located below can accurately supply the anode assembly 10 in the plating sub-tank 303 through the liquid supply assembly 80.

[0152] If the first partition 301 is vertically arranged, the range of the electroplating sub-tank 303 in the horizontal direction will be reduced. Since the workpiece to be electroplated 20 needs to be moved by the driving mechanism 50, the anode assembly 10 cannot be arranged in a multi-layer structure in the vertical direction. Therefore, reducing the range of the electroplating sub-tank 303 in the horizontal direction will decrease the number of the anode assemblies 10 arranged, thus changing the length or number of the anode channels 112, affecting the electroplating quality and reducing the electroplating efficiency. If the number of the anode assemblies 10 arranged is not to be changed, the space of the electroplating tank 30 in the horizontal direction needs to be enlarged, resulting in an increase in the volume and occupied space of the vertical electroplating equipment and an increase in the production cost of the vertical electroplating equipment.

[0153] In addition, when the first partition 301 is vertically arranged, the electroplating tank 30 will be divided into two parts on the left and right. The liquid supply chamber 304 and the electroplating sub-tank 303 are arranged adjacent to each other in the horizontal direction. When the liquid supply chamber 304 conveys the electroplating solution to the electroplating sub-tank 303 through the liquid supply assembly 80, the electroplating solution can only enter the electroplating sub-tank 303 in the horizontal direction. However, the liquid passing channel 1011 is opened on the anode base 101, which is equivalent to restricting the conveying direction of the electroplating solution, making the electroplating solution need to enter from the vertical direction of the electroplating sub-tank 303. Therefore, when the first partition 301 is vertically arranged, the liquid supply chamber 304 cannot accurately supply the electroplating solution to the anode assembly 10 in the electroplating sub-tank 303.

[0154] In an implementable embodiment, refer to Figure 12 、 Figure 15 、 Figure 16, the liquid supply assembly 80 includes at least a flow dividing pipe 801. One end of the flow dividing pipe 801 is communicated with the liquid circulation mechanism 70, and the other end passes through the first partition 301 and is communicated with the electroplating sub-tank 303 to convey electroplating solution into the electroplating channel 113. Among them, the number of the flow dividing pipes 801 will be equal to the number of the electroplating channels 113 or the number of the anode assemblies 10. If the number of the flow dividing pipes 801 is equal to the number of the electroplating channels 113, the flow dividing pipe 801 is communicated with the liquid passing channel 1011 of any one anode assembly 10 in the electroplating channel 113, and conveys the electroplating solution into the anode channel 112 of the anode assembly 10. After the electroplating solution flows out through the liquid passing channel 1011, it will first flow towards the drainage port 1071. When there is enough electroplating solution, part of the electroplating solution will diffuse towards the remaining anode channels 112. In this way, one electroplating channel 113 can convey the electroplating solution through only one flow dividing pipe 801. If the number of the flow dividing pipes 801 is equal to the number of the anode assemblies 10, the flow dividing pipes 801 and the liquid passing channels 1011 are in one-to-one correspondence, and the flow dividing pipes 801 convey the electroplating solution obtained from the liquid circulation mechanism 70 into the corresponding anode assemblies 10. The method of supplying liquid to the electroplating channel 113 through only one flow dividing pipe 801 is convenient for controlling the flow dividing pipes 801 when there are multiple electroplating channels 113 in the electroplating tank 30, simplifies the pipeline structure, and reduces the occupied space of the liquid supply assembly 80. The method of supplying liquid to the electroplating channel 113 through multiple flow dividing pipes 801 simultaneously can supply liquid to multiple anode assemblies 10 evenly at the same time.

[0155] Further, referring to Figure 22 , the flow dividing pipe 801 and the liquid circulation mechanism 70 are communicated through a flow equalizing assembly. The flow equalizing assembly includes a liquid supply pipe 802 and a flow equalizing pipe 803. Two ends of the liquid supply pipe 802 are respectively communicated with the flow equalizing pipe 803 and the liquid circulation mechanism 70. The liquid supply pipe 802 is connected to the middle position in the length direction of the flow equalizing pipe 803 and extends equidistantly away from the center point. Among them, one end of the flow dividing pipe 801 is arranged on the flow equalizing pipe 803 and is communicated with the flow equalizing pipe 803, and the other end is communicated with the electroplating channel 113. Specifically, when the liquid supply pipe 802 conveys the electroplating solution into the flow equalizing pipe 803, the electroplating solution enters the flow equalizing pipe 803 from the middle of the flow equalizing pipe 803 and first diffuses towards both ends of the flow equalizing pipe 803. Since the ends of the flow equalizing pipe 803 are in a closed state, the liquid level of the electroplating solution will rise evenly after flowing to the ends of the flow equalizing pipe 803. That is to say, when there are multiple flow dividing pipes 801, the electroplating solution will enter multiple flow dividing pipes 801 through the flow equalizing pipe 803 at the same time.

[0156] Different from the above method of supplying liquid to the flow dividing pipe 801 through the flow equalizing assembly, in an implementable embodiment, referring to Figure 23, the shunt pipe 801 is communicated with the liquid circulation mechanism 70 through a liquid supply pipe 802. The liquid supply pipe 802 includes a main liquid supply pipe 8021 and a liquid supply branch pipe 8022. Both ends of the main liquid supply pipe 8021 are communicated with the liquid circulation mechanism 70 and the liquid supply branch pipe 8022 respectively. One end of the shunt pipe 801 is arranged on the liquid supply branch pipe 8022 and communicated with the liquid supply branch pipe 8022, and the other end is communicated with the electroplating channel 113. In this way, the electroplating solution flowing out of the liquid circulation mechanism 70 will flow through the main liquid supply pipe 8021, the liquid supply branch pipe 8022, and the shunt pipe 801 in sequence until it flows into the electroplating channel 113. In this embodiment, the multiple shunt pipes 801 can be distributed based on the distance between the electroplating channel 113 and the liquid supply branch pipe 8022. Specifically, taking the connection point between the liquid supply branch pipe 8022 and the main liquid supply pipe 8021 as the starting point, the shunt pipes 801 with gradually decreasing lengths are connected in sequence. The length of the shunt pipe 801 is positively correlated with the distance between the electroplating channel 113 and the liquid supply branch pipe 8022, that is, the farther the distance between the electroplating channel 113 and the liquid supply branch pipe 8022, the longer the shunt pipe 801 is required to connect it with the liquid supply branch pipe 8022. That is to say, the electroplating solution flowing into the liquid supply branch pipe 8022 through the main liquid supply pipe 8021 will enter the shunt pipes 801 with increasing distances from it in sequence, and the lengths of these shunt pipes 801 gradually decrease so that the time difference of the electroplating solution flowing into the multiple electroplating channels 113 is smaller.

[0157] In an implementable embodiment, refer to Figure 15 , Figure 16 , the liquid supply assembly 80 further includes a jet pipe 806. The jet pipe 806 includes a main jet pipe 804 and jet branch pipes 805. One end of the main jet pipe 804 is communicated with the liquid circulation mechanism 70, and the other end extends to the lower part of the electroplating channel 113 and is connected with the jet branch pipes 805; both ends of the jet branch pipes 805 extend away from the main jet pipe 804 until the lengths of the jet branch pipes 805 are equal to the length of the electroplating channel 113. A plurality of nozzles are arranged on the jet branch pipes 805, and the nozzles are communicated with the electroplating sub-tank 303. Specifically, when there are multiple electroplating channels 113, the jet pipe 806 is communicated with the liquid circulation mechanism 70 through a liquid replenishing pipe. Among them, the function and structure of the liquid replenishing pipe are the same as those of the above-mentioned liquid supply pipe 802, that is, the electroplating solution in the liquid circulation mechanism 70 is simultaneously transported to a plurality of jet pipes 806 by using the liquid replenishing pipe.

[0158] In this embodiment, one jet branch pipe 805 corresponds to one electroplating channel 113, and the electroplating channel 113 is supplied with liquid through a plurality of spray heads arranged thereon. Among them, the number of spray heads is equal to the number of anode assemblies 10, and they are in one-to-one correspondence with the liquid passing channels 1011 of the anode assemblies 10 up and down. In order to enable the plurality of anode assemblies 10 in the same electroplating channel 113 to be evenly supplied with liquid, the jet main pipe 804 is connected to the middle position in the length direction of the jet branch pipe 805, so that the liquid level of the electroplating solution in the jet branch pipe 805 can evenly rise and enter the spray heads.

[0159] Furthermore, a plurality of liquid supply ports are provided on the first partition plate 301, and the liquid passing channels 1011 correspond to the positions of at least one liquid supply port. Specifically, the number of liquid supply ports is greater than or equal to the number of liquid passing channels 1011. When the number of liquid supply ports is equal to the number of liquid passing channels 1011, the anode base 101 can be installed according to the positions of the liquid supply ports to ensure that the liquid passing channels 1011 correspond to the positions of the liquid supply ports after installation. When the number of liquid supply ports is greater than the number of liquid passing channels 1011, each anode base 101 can adjust its installation position as needed, as long as it is ensured that the liquid passing channels 1011 correspond to the positions of at least one liquid supply port, or the liquid passing channels 1011 of each anode base 101 can correspond to the positions of more than one liquid supply port to increase the amount of electroplating solution entering the anode channel 112.

[0160] Among them, the number of liquid supply ports and spray heads below the same electroplating channel 113 is equal, and their positions correspond to each other up and down. The spray heads pass through the liquid supply ports and are connected to the electroplating channel 113, so that the electroplating solution flows through the jet pipe 806 into the liquid passing channel 1011. When the number of liquid supply ports below one liquid passing channel 1011 is greater than the number of spray heads, it can be selectively blocked. If the electroplating sub-tank 303 and the liquid supply chamber 304 are connected through the liquid supply port or other openings, it will increase the consumption of the electroplating solution during electroplating of the vertical electroplating equipment, while blocking the liquid supply port will increase the cost of the blocking component and the labor cost, reducing the electroplating efficiency.

[0161] In an implementable embodiment, refer to Figure 11 、 Figure 12 、 Figure 25, the liquid circulation mechanism 70 at least includes a liquid storage barrel 701, a circulation pump, and a circulation pipeline 702. Specifically, the circulation pipeline 702 includes a circulation inlet pipe 7021 and a circulation outlet pipe 7022. The liquid supply pipe 802 and the jet pipe 806 are both communicated with the circulation inlet pipe 7021. One end of the circulation inlet pipe 7021 is connected to the circulation pump, and the other end is connected to the electroplating tank 30 (such as the liquid storage tank 305 below). The circulation pump is connected to the liquid storage barrel 701. A second partition plate 302 is further arranged in the electroplating tank 30. By horizontally arranging the first partition plate 301 and the second partition plate 302, the electroplating tank 30 is sequentially partitioned into an electroplating sub-tank 303, a liquid supply chamber 304, and a liquid storage tank 305 from top to bottom. The liquid storage tank 305 is located below the liquid supply chamber 304 and is independent of the liquid supply chamber 304. The circulation outlet pipe 7022 is communicated with the liquid storage tank 305, and the circulation outlet pipe 7022 is connected to the liquid inlet of the liquid storage barrel 701. The electroplating sub-tank 303 has a circulation tank 306 communicated with the liquid storage tank 305, and the circulation tank 306 is independent of the liquid supply chamber 304. Preferably, the liquid storage barrel 701 has a filtering function and can filter impurities in the electroplating solution.

[0162] See Figure 12 , Figure 17 , Figure 24 , by horizontally arranging the first partition plate 301 and the second partition plate 302, the electroplating tank 30 is sequentially partitioned into an electroplating sub-tank 303, a liquid supply chamber 304, and a liquid storage tank 305 from top to bottom, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved. In addition, when the existing electroplating equipment circulates the electroplating solution, it directly sucks the electroplating solution in the electroplating sub-tank 303. This method is prone to insufficient liquid volume in the electroplating sub-tank 303 due to reasons such as too fast rotation speed of the circulation pump. However, in this application, the circulation pump is used to suck the electroplating solution in the liquid storage tank 305. The electroplating solution in the liquid storage tank 305 is the electroplating solution that overflows from the electroplating sub-tank 303, that is, the overflowed electroplating solution is the excess electroplating solution in the electroplating sub-tank 303. The remaining electroplating solution in the electroplating sub-tank 303 can still complete the electroplating of the workpiece to be electroplated 20. In this way, using the liquid storage tank 305 for electroplating solution circulation can reduce the impact of the circulating electroplating solution on the electroplating work.

[0163] Among them, see Figure 24 , both sides of the first partition plate 301 and the second partition plate 302 are connected to the inner wall of the electroplating tank 30. At least one end of the first partition plate 301 is provided with a circulation partition plate 307, and there is a certain distance between the circulation partition plate 307 and the inner wall of the electroplating tank 30. The bottom of the circulation partition plate 307 extends downward until it is connected to the end of the second partition plate 302, thereby forming a circulation tank 306. That is, when the liquid level in the electroplating sub-tank 303 exceeds the height of the circulation partition plate 307, it will enter the circulation tank 306 and flow to the liquid storage tank 305.

[0164] In practical applications, the electroplating solution flows into the electroplating sub-tank 303 through the circulating inlet pipe 7021. When the electroplating solution in the electroplating tank 30 is excessive, it will overflow into the circulating tank 306 and flow into the liquid storage tank 305 through the circulating tank 306. The electroplating solution in the liquid storage tank 305 enters the liquid storage barrel 701 through the circulating outlet pipe 7022 under the suction force of the circulating pump. In this way, one cycle of the electroplating solution can be completed.

[0165] In this embodiment, the electroplating solution can enter the electroplating sub-tank 303 through the shunt pipe 801 and / or the spray pipe 806. The flow direction of the electroplating solution can be controlled by setting a three-way valve or an adjustment valve 94. When a three-way valve is set, the water inlet of the three-way valve is connected to the circulating liquid inlet pipe 7021, the first water outlet of the three-way valve is connected to the shunt pipe 801, and the second water outlet is connected to the spray pipe 806. Since the shunt pipe 801 transports a large amount of electroplating solution into the electroplating channel 113 through a pipeline and then distributes it, when a large amount of replenishment is required in the electroplating sub-tank 303 during the start-up or operation of the vertical electroplating equipment, the first water outlet can be opened and the second water outlet can be closed to connect the circulating liquid inlet pipe 7021 with the shunt pipe 801, and the electroplating solution flows into the electroplating channel 113 through the shunt pipe 801. The spray pipe 806 replenishes the anode assembly 10 individually through multiple nozzles. When the electroplating solution in the electroplating sub-tank 303 is sufficient and in a stable operation state, the second water outlet can be opened and the first water outlet can be closed to connect the circulating liquid inlet pipe 7021 with the spray pipe 806, and the electroplating solution flows into the corresponding liquid passing channel 1011 through the nozzles. Since the three-way valve can only keep one of its two water outlets open, in order to enable the electroplating solution to flow into the electroplating sub-tank 303 through both the shunt pipe 801 and the spray pipe 806 simultaneously, adjustment valves 94 can also be set on the shunt pipe 801 and the spray pipe 806. Specifically, one end of the circulating liquid inlet pipe 7021 is connected to the liquid outlet of the liquid storage barrel 701, and the other end is provided with a three-way joint. The other two interfaces of the three-way joint are respectively connected to the shunt pipe 801 and the spray pipe 806. When the amount of electroplating solution in the electroplating sub-tank 303 is sufficient, one of the adjustment valves 94 can be selected to open, so that the electroplating solution in the liquid storage barrel 701 flows into the electroplating sub-tank 303 through the shunt pipe 801 or the spray pipe 806. When the amount of electroplating solution in the electroplating tank 30 is insufficient, both adjustment valves 94 can be selected to open to replenish a large amount of electroplating solution to the electroplating sub-tank 303. Among them, when the shunt pipe 801 and the spray pipe 806 simultaneously transport the electroplating solution to the electroplating tank 30, since the nozzles directly replenish the liquid passing channel 1011, the shunt pipe 801 is connected to other parts of the electroplating sub-tank 303. For example, when there are multiple mounting grooves 1012 on the anode base 101 of the anode assembly 10, multiple mounting grooves 1012 that are far from the liquid passing channel 1011 and do not install the anode part 102 in one anode assembly 10 will form an electroplating solution flow area, and the electroplating solution flow areas of two adjacent anode assemblies 10 will be connected. At this time, the shunt pipe 801 can replenish the electroplating solution flow area, thereby increasing the amount of electroplating solution in the electroplating tank 30.

[0166] In an implementable embodiment, refer to Figure 25, a liquid level sensor 91 is provided in the electroplating tank 30, and the liquid level sensor 91 is located in the electroplating sub-tank 303 to monitor the amount of electroplating solution in the electroplating sub-tank 303. Specifically, the vertical electroplating equipment further includes a controller 90. There is a communication line (wired or wireless communication line) between the liquid level sensor 91 and the controller 90. The controller 90 can receive the signal sent by the liquid level sensor 91, and then obtain the real-time liquid level in the electroplating sub-tank 303. Before the vertical electroplating equipment is used, the liquid level threshold range of the liquid level sensor 91 can be preset to control the amount of electroplating solution in the electroplating sub-tank 303. When the electroplating liquid level in the electroplating sub-tank 303 is not within the set liquid level threshold range, the liquid level sensor 91 can be fed back to the controller 90 via the above communication line, and then the controller 90 issues a reminder in the form of sound, light and electricity. In addition, the controller 90 is also electrically connected to the circulation pump and the regulating valve 94, so that the controller 90 can control the opening of the outlet valve of the circulation pump and the opening and closing of the regulating valve 94 when the electroplating liquid level in the electroplating sub-tank 303 is not within the set liquid level threshold range.

[0167] For example, assume that the liquid level threshold range of the liquid level sensor 91 is H1, and the electroplating liquid level of the electroplating sub-tank 303 is H2. When H2 < H1, it indicates that the amount of electroplating solution in the electroplating sub-tank 303 is too small. The reason for this situation may be that the supply amount of the electroplating solution transported to the electroplating sub-tank 303 by the liquid supply assembly 80 is too small. After the controller 90 receives the signal from the liquid level sensor 91 that the liquid level is lower than the liquid level threshold range, it first determines the opening and closing states of the two regulating valves 94 at this time. If both of the two regulating valves 94 are in the open state, the electroplating solution in the electroplating sub-tank 303 can be directly increased by manual or automated equipment. If only one regulating valve 94 is in the open state, the other regulating valve 94 can be opened. At this time, the amount of electroplating solution transported to the electroplating sub-tank 303 by the liquid supply assembly 80 increases, and the amount of electroplating solution pumped out of the electroplating sub-tank 303 by the circulation pump decreases, so that the liquid level in the electroplating sub-tank 303 shows a stable growth state.

[0168] Furthermore, referring to Figure 25 , flow sensors 92 are provided on both the shunt pipe 801 and the spray pipe 806 to monitor the flow rate of the electroplating solution flowing into the electroplating sub-tank 303 in real time. Specifically, the flow sensor 92 is electrically connected to the controller 90. The controller 90 can receive the signal sent by the flow sensor 92, and then obtain the real-time flow rate in the shunt pipe 801 and the spray pipe 806. Among them, before the vertical electroplating equipment is used, the flow rate threshold range of the flow sensor 92 can be preset to monitor the amount of electroplating solution flowing into the electroplating sub-tank 303 through the shunt pipe 801 and the spray pipe 806 in real time. The controller 90 can control the opening of the regulating valve 94 according to the signal obtained from the flow sensor 92 to control the flow rate of the electroplating solution in the shunt pipe 801 and the spray pipe 806.

[0169] In an achievable implementation, the liquid storage barrel 701 contains the original electroplating solution. Since the concentration of cations in the electroplating solution in the electroplating sub-tank 303 will decrease compared to the original solution after long-term use, returning it to the liquid storage barrel 701 for mixing and precipitation with the original solution can increase the concentration of cations in the electroplating solution that returns to the electroplating sub-tank 303 via the liquid storage barrel 701. To ensure an increase in the concentration of cations in the electroplating solution that reflows into the electroplating sub-tank 303, the maintenance personnel need to regularly supplement the original electroplating solution into the liquid storage barrel 701. If the electroplating solution flowing out through the liquid passage 1011 onto the surface of the workpiece to be electroplated 20 is not mixed with the original solution but the electroplating solution in the electroplating sub-tank 303 is recycled, after a certain period of time, the concentration of cations reaching the surface of the workpiece to be electroplated 20 may gradually decrease, resulting in an insufficient thickness of the coating being formed on the surface of the workpiece to be electroplated 20.

[0170] In an achievable implementation, refer to Figure 25 , a temperature sensor 93 is provided in the electroplating tank 30, and the temperature sensor 93 is located in the electroplating sub-tank 303. Among them, the temperature sensor 93 is electrically connected to the controller 90, and the controller 90 can receive the signal sent by the temperature sensor 93 to obtain the real-time temperature of the electroplating sub-tank 303. During the electroplating production process, the temperature of the electroplating solution will change due to the heat generated during processing or the change in room temperature. However, when the temperature of the electroplating solution does not meet the process requirements, it will have a greater impact on the firmness, uniformity, flatness, and surface finish of the coating on the surface of the electroplated product produced.

[0171] Therefore, in an implemented embodiment, a temperature control component 100 is further included in the vertical electroplating equipment. Specifically, the temperature control component 100 includes a heat exchanger 1001, a liquid supply bucket 1002, a temperature control pump, and a heat exchange pipeline. The liquid outlet of the liquid supply bucket 1002 is connected to the first heat exchange pipeline 1003 and communicates with the first liquid inlet of the heat exchanger 1001 through the first heat exchange pipeline 1003. The first liquid outlet of the heat exchanger 1001 is connected to the second heat exchange pipeline 1004 and communicates with the liquid inlet of the liquid supply bucket 1002 through the second heat exchange pipeline 1004, so as to form a first loop composed of the first heat exchange pipeline 1003, the second heat exchange pipeline 1004, the liquid supply bucket 1002, and the heat exchanger 1001, and the heat exchange liquid flows within the first loop; the heat exchange outlet of the liquid storage bucket 701 is connected to the third heat exchange pipeline 1005 and communicates with the second liquid inlet of the heat exchanger 1001 through the third heat exchange pipeline 1005. The second liquid outlet of the heat exchanger 1001 is connected to the fourth heat exchange pipeline 1006 and communicates with the heat exchange inlet of the liquid storage bucket 701 through the fourth heat exchange pipeline 1006, so as to form a second loop composed of the third heat exchange pipeline 1005, the fourth heat exchange pipeline 1006, the liquid storage bucket 701, and the heat exchanger 1001, and the electroplating solution flows within the second loop. Among them, there are two temperature control pumps, which are respectively arranged on the first loop and the second loop, so that the heat exchange liquid flowing out of the liquid supply bucket 1002 circulates within the first loop, and the electroplating solution circulates within the second loop. The electroplating solution in circulation exchanges heat with the heat exchange liquid through the heat exchanger 1001. The electroplating solution after heat exchange flows into the liquid storage bucket 701 and then enters the electroplating sub-tank 303 through the circulating liquid inlet pipe 7021, so as to complete the regulation of the temperature of the electroplating solution in the electroplating sub-tank 303.

[0172] In practical applications, the above solution uses a plate heat exchanger to exchange the heat of the liquid. Specifically, the electroplating solution enters the flow channel of the plate heat exchanger through the second loop, and the heat exchange liquid enters another flow channel of the plate heat exchanger through the first loop. Heat is transferred through the temperature difference between the two liquids. The electroplating solution and the heat exchange liquid after heat exchange then enter the second loop and the first loop respectively, so that the temperature of the electroplating solution flowing into the liquid storage bucket 701 through the plate heat exchanger is lower than the temperature of the electroplating solution flowing out of the liquid storage bucket 701, or the temperature of the electroplating solution flowing into the liquid storage bucket 701 through the plate heat exchanger is higher than the temperature of the electroplating solution flowing out of the liquid storage bucket 701.

[0173] In this embodiment, refer to Figure 25, a solenoid valve 95 is provided on the third heat exchange pipe 1005. The controller 90 is electrically connected to both the solenoid valve 95 and the temperature control pump, and controls the opening and closing of the solenoid valve 95 and the temperature control pump according to the real-time temperature of the electroplating sub-tank 303 obtained, so as to adjust the temperature of the electroplating solution in the electroplating sub-tank 303. For example, assume that the preset temperature range of the electroplating solution in the electroplating sub-tank 303 is T2 - T1. When the heat generated during electroplating is too high, or the temperature in the electroplating workshop is too high, the actual temperature of the current electroplating solution obtained by the temperature sensor 93 is T3, and T3 is greater than the highest value T1 in the working temperature range. In order to keep the temperature of the electroplating solution in the electroplating sub-tank 303 within the preset temperature range, after receiving the signal from the temperature sensor 93, the controller 90 controls the solenoid valve 95 and the temperature control pump to open, so that the electroplating solution in the liquid storage bucket 701 enters the second loop, exchanges heat with the heat exchange liquid, and then flows back to the liquid storage bucket 701. In order to cool the electroplating solution in the electroplating sub-tank 303, the liquid contained in the supply bucket 1002 at this time is a coolant. In this way, after the electroplating solution exchanges heat with the coolant, the temperature of the electroplating solution flowing into the liquid storage bucket 701 will be lower than the temperature of the electroplating solution flowing out of the liquid storage bucket 701. After the cooled electroplating solution is continuously transported into the electroplating sub-tank 303, the temperature of the electroplating solution in the electroplating sub-tank 303 can be reduced to T4, and T2 < T4 ≤ T1 < T3, until T2 < T4 < T1, then the controller 90 can control the solenoid valve 95 and the temperature control pump to close; correspondingly, when the temperature in the electroplating workshop is too low, the actual temperature of the current electroplating solution obtained by the temperature sensor 93 is T5, and T5 is less than the lowest value T2 in the working temperature range. In order to keep the temperature of the electroplating solution in the electroplating sub-tank 303 within the preset temperature range, after receiving the signal from the temperature sensor 93, the controller 90 controls the solenoid valve 95 and the temperature control pump to open, so that the electroplating solution in the liquid storage bucket 701 enters the second loop, exchanges heat with the heat exchange liquid, and then flows back to the liquid storage bucket 701. In order to heat the electroplating solution in the electroplating sub-tank 303, the liquid contained in the supply bucket 1002 at this time is hot water with a temperature higher than that of the electroplating solution. In this way, after the electroplating solution exchanges heat with the hot water, the temperature of the electroplating solution flowing into the liquid storage bucket 701 will be higher than the temperature of the electroplating solution flowing out of the liquid storage bucket 701. After the heated electroplating solution is continuously transported into the electroplating sub-tank 303, the temperature of the electroplating solution in the electroplating sub-tank 303 can be increased to T6, and T5 < T2 ≤ T6 < T1, until T2 < T6 < T1, then the controller 90 can control the solenoid valve 95 and the temperature control pump to close.

[0174] In order to avoid impurities generated during electroplating from affecting the electroplating quality of the workpiece to be electroplated 20, in an implementable embodiment, refer to Figure 11 , Figure 12 , Figure 15, the vertical electroplating equipment further includes a filter 703. By arranging the filter 703 on the electroplating solution circulation loop, the recycled electroplating solution is filtered. Specifically, a filter 703 is provided at one end of the circulating outlet pipe 7022 communicating with the liquid storage tank 305. The filter 703 is located inside the liquid storage tank 305. A plurality of filter holes 7031 are formed on the filter 703. The electroplating solution in the electroplating sub-tank 303 flows through the circulation tank 306, the liquid storage tank 305, the filter 703, and the circulating outlet pipe 7022 in sequence and enters the liquid storage barrel 701. Since the liquid storage tank 305 is independently arranged, without the backflow of the electroplating solution, impurities will be filtered and retained in the liquid storage tank 305, so that the electroplating solution transported from the liquid storage barrel 701 to the electroplating sub-tank 303 is free of impurities.

[0175] Furthermore, a plurality of filter holes 7031 are evenly distributed on the side wall of the filter 703. If the filter holes 7031 are arranged on the upper surface of the filter 703, under the suction force of the circulating pump, the electroplating solution on the surface layer of the liquid storage tank 305 is less resistant and will flow to the filter 703 faster. Since the amount of electroplating solution overflowing from the electroplating sub-tank 303 is limited, the electroplating solution in the liquid storage tank 305 cannot be replenished in time, resulting in a negative pressure area above the filter holes 7031 in the liquid storage tank 305. The negative pressure area will drive the electroplating solution around it to flow faster, and the electroplating solution near the edge of the liquid storage tank 305 will move towards the negative pressure area and rotate to form a vortex. Therefore, to avoid the above phenomenon, the filter 703 evenly distributes a plurality of filter holes 7031 on its side wall, so that the electroplating solution in the liquid storage tank 305 can continuously and stably flow into the circulating outlet pipe 7022.

[0176] Even further, a filter 703 is provided on the circulating inlet pipe 7021 to prevent impurities from being contained in the electroplating solution flowing into the electroplating sub-tank 303, thereby affecting the electroplating effect. It should be noted that to prevent the filter holes 7031 from being blocked by impurities after long-term use, the maintenance personnel can regularly remove the filter 703 for cleaning or replacement.

[0177] In an implementable embodiment, to prevent the electroplating solution in the electroplating tank 30 from leaking, sealing rings are provided at the parts where the circulating inlet pipe 7021, the shunt pipe 801, and the jet pipe 806 are connected to the electroplating tank 30. The sealing rings can be made of rubber material, and the gaps between the pipes and the electroplating tank 30 are sealed by using the elasticity of the rubber material itself.

[0178] In an implementable embodiment, refer to Figures 12 - 14 、 Figures 17 - 19 、 Figures 27 - 31, the cathode unit 40 includes a conductive component 401 and a mounting component 402. Specifically, the mounting component 402 at least includes a cathode support frame 4021 and a cathode connecting rod 4025. The workpiece to be electroplated 20 is installed inside the cathode support frame 4021, and the cathode support frame 4021 is installed on the cathode connecting rod 4025; the conductive component 401 at least includes a conductive block 4011. A substrate 4013 is arranged along the length of the electroplating tank 30, and a conductive strip 4012 is arranged on the substrate 4013. The conductive strip 4012 extends along the length direction of the electroplating tank 30. The conductive block 4011 is connected to the end of the cathode connecting rod 4025 (directly or indirectly), and the conductive block 4011 is in contact with the conductive strip 4012; wherein, both the substrate 4013 and the mounting component 402 are insulators, the conductive block 4011, the conductive strip 4012 and the conductive wire are all conductors. The workpiece to be electroplated 20 is electrically connected to the conductive block 4011 through the conductive wire, and the conductive strip 4012 is electrically connected to the negative electrode of the power supply 60. When the driving mechanism 50 pushes the cathode unit 40 and the cathode unit 40 moves along the length of the electroplating tank 30, the conductive block 4011 transmits the current obtained from its contact with the conductive strip 4012 to the workpiece to be electroplated 20.

[0179] In this embodiment, referring to Figures 27 - 31 , the cathode support frame 4021 includes a support frame body 40211 and a carrier frame body 40215. The support frame body 40211 is connected to the carrier frame body 40215. The carrier frame body 40215 has a carrier groove 40216, and the carrier groove 40216 can accommodate the workpiece to be electroplated 20 for installation. Among them, the support frame body 40211 has a first support portion 40212 and a second support portion 40213. The two ends of the first support portion 40212 are respectively connected to the two second support portions 40213. The ends of the second support portion 40213 away from the first support portion 40212 extend towards both sides respectively and are connected to the carrier frame body 40215. Preferably, when the distance between the ends of the two second support portions 40213 away from each other is greater than the width of the carrier frame body 40215, the inner wall of the second support portion 40213 is connected to the outer wall of the carrier frame body 40215; when the distance between the ends of the two second support portions 40213 away from each other is equal to the width of the carrier frame body 40215, the bottom of the second support portion 40213 is connected to the top of the carrier frame body 40215; when the distance between the ends of the two second support portions 40213 away from each other is less than the width of the carrier frame body 40215, the outer wall of the second support portion 40213 is connected to the inner wall of the carrier frame body 40215.

[0180] Further, a connecting rod support groove for installing the first support portion 40212 is formed on the cathode connecting rod 4025. The number of the connecting rod support grooves is less than or equal to the number of the electroplating channels 113, and the distance between two adjacent connecting rod support grooves is equal to the distance between the liquid passing channels 1011 in two adjacent electroplating channels 113, so that a plurality of workpieces to be electroplated 20 can enter the corresponding electroplating channels 113 at the same time and move above the liquid passing channels 1011 of the anode assembly 10. To ensure that the support frame body 40211 will not shake due to inertia or other reasons during the movement, resulting in uneven plating layers of the workpieces to be electroplated 20, threaded holes are provided on both the first support portion 40212 and the connecting rod support groove, and the two threaded holes are both matched with the same bolt, so that a threaded connection can be achieved between the cathode support frame 4021 and the cathode connecting rod 4025.

[0181] Furthermore, referring to Figures 27 - 31 , a support block 40214 is further provided on the first support portion 40212. One end of the support block 40214 is arranged on the first support portion 40212, and the other end extends towards the bearing frame body 40215. When the first support portion 40212 is installed in the connecting rod support groove, the support block 40214 contacts the cathode connecting rod 4025. If only one support block 40214 is provided, to avoid shaking of the support frame body 40211 due to inertia during the movement, the support block 40214 is located on the same side of the moving direction. For example, when the moving direction is to the right, the support block 40214 is arranged on the right side of the first support portion 40212. When the cathode connecting rod 4025 moves to the right, the cathode support frame 4021 can limit the moving range on its right side through the support block 40214, thereby reducing the probability and amplitude of shaking of the support block 40214. If two support blocks 40214 are provided, the distance between the two support blocks 40214 is slightly greater than or equal to the width of the cathode connecting rod 4025, so that when the first support portion 40212 is installed in the connecting rod support groove, the two support blocks 40214 are respectively located on both sides of the cathode connecting rod 4025, that is, the distance between the two support blocks 40214 is adapted to the width of the cathode connecting rod 4025, so that the cathode connecting rod 4025 can be clamped between the two support blocks 40214. When the cathode connecting rod 4025 moves, the cathode support frame 4021 can limit its moving range through the support blocks 40214, thereby reducing the probability and amplitude of shaking of the support block 40214.

[0182] It should be noted that the orthographic projection area of the bearing groove 40216 on a preset vertical plane is greater than or equal to the orthographic projection area of the workpiece to be electroplated 20 on the same preset vertical plane, so that the workpiece to be electroplated 20 can be installed in the bearing groove 40216. When the orthographic projection area of the bearing groove 40216 on the preset vertical plane is equal to the orthographic projection area of the workpiece to be electroplated 20 on the same preset vertical plane, the inner wall of the bearing groove 40216 will wear the outer edge of the workpiece to be electroplated 20. When the orthographic projection area of the bearing groove 40216 on the preset vertical plane is greater than the orthographic projection area of the workpiece to be electroplated 20 on the same preset vertical plane, the workpiece to be electroplated 20 may fall or shift in position due to unstable installation.

[0183] To solve the problem of unstable installation of the workpiece to be electroplated 20, in an implementable embodiment, refer to Figures 27 - 31 , a plurality of bearing blocks 40217 are arranged in the bearing groove 40216, and the bearing blocks 40217 are used to reduce the distance between the inner wall of the bearing groove 40216 and the workpiece to be electroplated 20, so as to support the workpiece to be electroplated 20. Specifically, the plurality of bearing blocks 40217 are arranged along the inner wall of the bearing groove 40216 to achieve multi-directional support for the workpiece to be electroplated 20. Further, an opening is provided on the bearing block 40217, so that when the edge of the workpiece to be electroplated 20 is installed in the opening, the movement range of the workpiece to be electroplated 20 can be restricted by the side wall of the opening, avoiding large-amplitude shaking and dropping of the workpiece to be electroplated 20 during the movement process. Furthermore, the opening can be set to a structure with a gradually decreasing width from top to bottom, so as to guide the workpiece to be electroplated 20 during the process of installing it in the bearing groove 40216, and can reduce the gap between the workpiece to be electroplated 20 and the side wall of the opening. It should be noted that when ensuring that the workpiece to be electroplated 20 can be stably installed in the bearing groove 40216, the opening of the bearing block 40217 can adopt any shape, such as V-shaped or X-shaped, etc., and the present application does not limit this.

[0184] Different from the above method of setting an opening on the bearing block 40217, in another implementable embodiment, a plurality of bearing block groups are arranged in the bearing groove 40216, and each bearing block group includes two bearing blocks 40217, and the plurality of bearing block groups are arranged along the inner wall of the bearing groove 40216. Specifically, there is a certain gap between the two bearing blocks 40217 to form a bearing area 40218 for installing the workpiece to be electroplated 20. Among them, the width of the bearing area 40218 is greater than the thickness of the workpiece to be electroplated 20. If the mutually approaching sides of the two bearing blocks 40217 are inclined in opposite directions, the bearing area 40218 has a V-shaped structure, achieving the same effect as the above V-shaped opening.

[0185] In an implementable embodiment, refer to Figures 27 - 31, a fifth baffle 4023 and a sixth baffle 4024 are provided on the cathode support frame 4021. When the workpiece to be electroplated 20 is installed in the loading groove 40216, the fifth baffle 4023 corresponds to the lower edge position of the workpiece to be electroplated 20, and the sixth baffle 4024 corresponds to the upper edge position of the workpiece to be electroplated 20. Specifically, the fifth baffle 4023 and the sixth baffle 4024 are provided on the loading frame body 40215. When performing single-sided electroplating on the workpiece to be electroplated 20, the fifth baffle 4023 and the sixth baffle 4024 can be provided only on one side of the loading frame body 40215, so that the fifth baffle 4023 and the sixth baffle 4024 block the lower edge and the upper edge of the same side of the workpiece to be electroplated 20. When performing double-sided electroplating on the workpiece to be electroplated 20, the fifth baffle 4023 and the sixth baffle 4024 are provided on both sides of the loading frame body 40215. The two fifth baffles 4023 located on both sides of the loading frame body 40215 correspond to each other, and the two sixth baffles 4024 located on both sides of the loading frame body 40215 correspond to each other, so that the two fifth baffles 4023 can simultaneously block the lower edges of both sides of the workpiece to be electroplated 20, and the two sixth baffles 4024 can simultaneously block the upper edges of both sides of the workpiece to be electroplated 20. Among them, both the fifth baffle 4023 and the sixth baffle 4024 are detachably connected to the loading frame body 40215. When the sixth baffle 4024 is provided on both sides of the loading frame body 40215, since the first support portion 40212 is located directly above the loading groove 40216, the workpiece to be electroplated 20 cannot be placed into the loading groove 40216 from directly above. One side of the sixth baffle 4024 can be detached, and the workpiece to be electroplated 20 can be placed into the loading groove 40216 from this notch.

[0186] Due to the edge effect of the workpiece to be electroplated 20 itself, the power lines tend to concentrate on the sharp corners and edges of the workpiece to be electroplated 20, so that the current density on the sharp corners and edges of the workpiece to be electroplated 20 is relatively large. When the lower edge and the upper edge of the workpiece to be electroplated 20 are respectively covered by the fifth baffle 4023 and the sixth baffle 4024, the electroplating solution needs to first flow to the central part of the electroplating surface and then diffuse from the central part to the edge part, so that the distance that the power line extends to the edge position of the workpiece to be electroplated 20 is greater than the distance that the power line extends to the central position of the workpiece to be electroplated 20. In this way, the distribution of the power lines on the electroplating surface can be made uniform, thereby reducing the influence of the uneven plating layer caused by the edge effect of the workpiece to be electroplated 20. When the electroplating solution flows from the anode member 102 to the workpiece to be electroplated 20, it can first weaken the edge effect of the anode member 102 through the first baffle 105 and the second baffle 107, and then weaken the edge effect of the workpiece to be electroplated 20 through the fifth baffle 4023 and the sixth baffle 4024. In this way, the power lines distributed on the workpiece to be electroplated 20 can be made uniform, so as to achieve the purpose of uniform plating layer thickness of the workpiece to be electroplated 20.

[0187] Among them, the edge area of the workpiece 20 to be electroplated can be predetermined. Without setting the fifth baffle 4023 and the sixth baffle 4024, the workpiece 20 to be electroplated is directly electroplated. The electroplated workpiece 20 after electroplating is evenly divided into N electroplating areas, and the electroplating layer thickness of each electroplating area is measured, so as to inversely infer the power line distribution of the workpiece 20 to be electroplated, thereby determining the upper edge and lower edge areas of the workpiece 20 to be electroplated, balancing the power line distribution of the workpiece 20 to be electroplated, and further effectively improving the electroplating uniformity.

[0188] In practical applications, referring to Figure 21 , a conducting wire is connected to the workpiece 20 to be electroplated, and the other end of the conducting wire is connected to the conducting block 4011, so as to transmit the negative current obtained by the conducting block 4011 to the workpiece 20 to be electroplated. Specifically, the number of conducting wires is at least one, and the end far away from the workpiece 20 to be electroplated extends along the cathode connecting rod 4025 to the conducting block 4011. Further, the conducting wire can be a flexible material or a hard material. The flexible conducting wire can adopt copper foil tape, metal foil tape or other components with good conductivity. This application does not limit this.

[0189] Furthermore, an installation rod is arranged on the carrier frame 40215, and a wire clamping jaw is arranged on the support frame 40211. The wire clamping jaw can jointly install the conducting wire and the installation rod. When the cathode connecting rod 4025 moves, the conducting wire is prone to shake under the influence of air flow. Fixing the position of part of the conducting wire by using the wire clamping jaw can reduce the shaking range and amplitude of the conducting wire, thereby improving the connection stability of the conducting wire.

[0190] In a feasible implementation manner, referring to Figures 12 - 14 , Figures 17 - 19 , Figure 27 , Figure 28 , the conducting component 401 further includes a conducting connecting rod 4014. One end of the conducting connecting rod 4014 is connected to the end of the cathode connecting rod 4025, and the other end extends in a direction away from the cathode connecting rod 4025. The conducting block 4011 is arranged on the conducting connecting rod 4014. Specifically, the conducting block 4011 is connected to the conducting connecting rod 4014 through a conducting fixing seat 40111. To ensure stable transmission of the negative current, after the conducting fixing seat 40111 is connected to the conducting connecting rod 4014, it should be ensured that the conducting block 4011 is in contact with the conducting bar 4012.

[0191] In a feasible implementation manner, referring to Figures 12 - 14 , Figures 17 - 19 , Figure 27 , Figure 28, the conductive component 401 further includes a guiding roller 4015 which is rotatably arranged on a roller mounting seat 4016, and the roller mounting seat 4016 is connected to the cathode connecting rod 4025. A roller moving groove is arranged along the length direction on the substrate 4013, and the guiding roller 4015 is located in the roller moving groove and moves along the roller moving groove. By providing the roller moving groove and the guiding roller 4015, the frictional resistance between the conductive connecting rod 4014 and the substrate 4013 is reduced, which is more convenient for the movement of the cathode connecting rod 4025. In a modified embodiment, the number of guiding rollers 4015 is two, and the two guiding rollers 4015 are arranged on the same rotating shaft. The rotating shaft is rotatably connected to the roller mounting seat 4016. The central axes of the two guiding rollers 4015 coincide with the rotating shaft, and there is a certain distance between the two guiding rollers 4015. In this structure, the substrate 4013 has a guiding protrusion 4017 which extends along the movement direction of the driving mechanism 50, and the guiding protrusion 4017 is located between the two guiding rollers 4015 to guide the movement of the cathode connecting rod 4025. In a modified embodiment, when a guiding groove is formed on the guiding roller 4015, the guiding protrusion 4017 is engaged in the guiding groove, so that the guiding roller 4015 can move along the guiding protrusion 4017. Further, the two coaxially arranged guiding rollers 4015 are a group, and a group of guiding rollers 4015 are arranged on both sides of the roller mounting seat 4016. Further still, guiding rollers 4015 are arranged at both ends of the cathode connecting rod 4025. By guiding both ends of the cathode connecting rod 4025 simultaneously, the stable movement of the cathode connecting rod 4025 is achieved.

[0192] In an implementable embodiment, referring to Figures 9 - 12 , Figure 17 , Figure 20 , Figure 26 , Figure 27, the driving mechanism 50 at least includes a driving bracket 501, a transmission member 502, a driving source 503 and a pushing member 504. Specifically, the transmission member 502 is rotatably arranged on the driving bracket 501, the pushing member 504 is connected to the transmission member 502, and the driving source 503 is arranged on the driving bracket 501 and connected to the transmission member 502 to drive the transmission member 502 to drive the pushing member 504 to rotate in a cycle; when the pushing member 504 rotates above the electroplating tank 30, it contacts the cathode connecting rod 4025 and pushes it to move along the length direction of the electroplating tank 30. The cyclic rotation of the pushing member 504 can cyclically push a plurality of cathode units 40 for continuous feeding, realizing the continuous production of the workpiece 20 to be electroplated, thereby improving the production efficiency. Among them, the transmission member 502 adopts a mechanical transmission structure capable of realizing rotation, such as a belt, a chain, etc. The transmission member 502 rotates in a cycle on the driving bracket 501 along an elliptical trajectory. The driving source 503 includes a transmission wheel 5031 and a motor 5032. The motor 5032 and the transmission wheel 5031 are respectively arranged on two sides of the driving bracket 501. The transmission member 502 is sleeved on the transmission wheel 5031, and the output shaft of the motor 5032 passes through the driving bracket 501 and is connected to the transmission wheel 5031 to drive the transmission wheel 5031 to drive the transmission member 502 to rotate. It should be noted that the transmission member 502 and the transmission wheel 5031 should adopt components with matching structures. For example, when the transmission member 502 adopts a belt, the transmission wheel 5031 adopts a pulley that can cooperate with the belt; when the transmission member 502 adopts a chain, the transmission wheel 5031 adopts a sprocket that can cooperate with the chain.

[0193] In this embodiment, the driving bracket 501 adopts a vertically arranged structure. The transmission member 502 provided on the driving bracket 501 rotates cyclically in the vertical direction. When the transmission member 502 rotates cyclically, it has two horizontal movement regions and two rotation regions. When rotating in the vertical direction, the two horizontal movement regions are at different heights, that is, the transmission positions are divided into a first height and a second height. The distance between the first height and the electroplating tank 30 is L1, and the distance between the second height and the electroplating tank 30 is L2, and L1 < L2. When the pushing member 504 is at the first height, the pushing member 504 is located above the electroplating tank 30, and the end far from the transmission member 502 can contact the cathode connecting rod 4025. Driven by the transmission member 502, the pushing member 504 applies a thrust to the cathode connecting rod 4025, causing the cathode connecting rod 4025 to move with the pushing member 504 until the pushing member 504 leaves the first height and turns to the second height. When the pushing member 504 is at the second height, the pushing member 504 is located above the cathode connecting rod 4025, and the end of the pushing member 504 far from the transmission member 502 is disengaged from the cathode connecting rod 4025. At this time, the pushing member 504 originally at the second height rotates to the first height and contacts the cathode connecting rod 4025. In this way, under the cyclic rotation of the transmission member 502, multiple pushing members 504 connected thereto can repeatedly reach the position at the first height, pushing the cathode connecting rod 4025, thereby realizing the sequential driving of multiple cathode units 40 for continuous feeding. The pushing member 504 and the cathode connecting rod 4025 are in contact connection, enabling the pushing member 504 to rotate cyclically following the transmission member 502.

[0194] Different from the structure where the driving bracket 501 is vertically arranged, in an implementable embodiment, the driving bracket 501 adopts a horizontally arranged structure. The transmission member 502 arranged on the driving bracket 501 rotates cyclically in the horizontal direction. When the transmission member 502 rotates cyclically, it has two horizontal movement regions and two rotation regions. When rotating in the horizontal direction, the two horizontal movement regions have different distances from the electroplating tank 30, that is, the transmission positions are divided into a first width and a second width. The distance between the first width and the electroplating tank 30 is L3, and the distance between the second width and the electroplating tank 30 is L4, and L3 < L4. When the pushing member 504 rotates to be at the first width, the pushing member 504 is located on one side of the electroplating tank 30, and the end far from the transmission member 502 can contact the cathode connecting rod 4025. Driven by the transmission member 502, the pushing member 504 applies a thrust to the cathode connecting rod 4025, causing the cathode connecting rod 4025 to move following the pushing member 504 until the pushing member 504 leaves the first width and turns to the second width. When the pushing member 504 is at the second width, the pushing member 504 is located on the side away from the electroplating tank 30 of the first width. At this time, the original pushing member 504 at the second width rotates to the first width and contacts the cathode connecting rod 4025. Thus, under the cyclic rotation of the transmission member 502, multiple pushing members 504 connected thereto can repeatedly cycle to the position of the first width, pushing the cathode connecting rod 4025, thereby realizing the continuous driving of the cathode unit 40.

[0195] The structure with the vertically arranged driving bracket 501 can reduce the floor area of the vertical electroplating equipment compared to the structure with the horizontally arranged driving bracket 501; while the structure with the horizontally arranged driving bracket 501 can improve the stability of the transmission member 502 during rotation compared to the structure with the vertically arranged driving bracket 501.

[0196] In an implementable embodiment, refer to Figures 12 - 14 、 Figures 17 - 19 、 Figure 27 、 Figure 28, the pusher 504 includes a pusher base 5041 and a pusher rod 5043. The pusher base 5041 is connected to the transmission member 502. One end of the pusher rod 5043 is disposed on the pusher base 5041, and the other end extends away from the pusher base 5041. In order to enable the cathode connecting rod 4025 to move smoothly, the end away from the pusher base 5041 can extend to the middle of the cathode connecting rod 4025, so as to make the force on the cathode connecting rod 4025 balanced. Among them, the pusher rod 5043 and the pusher base 5041 can adopt a rotational connection in the vertical direction, so that when the position of the transmission member 502 is fixed, by adjusting the height of the pusher rod 5043, it can cooperate with various types of cathode units 40. In practical applications, it is necessary to limit the rotation amplitude of the pusher rod 5043 in advance. If the rotation amplitude of the pusher rod 5043 is too large, it will cause interference between pusher rods 5043 at different heights and affect the movement of the cathode connecting rod 4025. Therefore, preferably, the rotation angle of the pusher rod 5042 is less than 30°.

[0197] Further, a pusher plate 5044 is provided on the pusher rod 5043. The pusher plate 5044 is used to increase the contact area between the pusher 504 and the cathode connecting rod 4025, thereby increasing the force application area of the pusher 504 and enabling the cathode connecting rod 4025 to move smoothly. Even further, in order to ensure that the contact position between the pusher plate 5044 and the cathode connecting rod 4025 is accurate and does not shift, a magnetic attraction structure or an adhesive structure that can cooperate with each other can be provided on the pusher plate 5044 and the cathode connecting rod 4025. For example, if a first magnetic attraction member and a second magnetic attraction member are respectively provided on the pusher plate 5044 and the cathode connecting rod 4025, and the magnetic properties of the first magnetic attraction member and the second magnetic attraction member are opposite, when the pusher plate 5044 contacts the cathode connecting rod 4025, the two can be magnetically connected through the cooperation of the first magnetic attraction member and the second magnetic attraction member to improve the stability during the movement. When the pusher plate 5044 rotates away from the cathode connecting rod 4025, the first magnetic attraction member and the second magnetic attraction member are separated due to the excessive distance, and the pusher plate 5044 rotates to the other end of the electroplating tank 30 to contact the unplated cathode unit 40.

[0198] In an implementable embodiment, refer to Figures 12 - 14 , Figures 17 - 19 , Figure 27 , Figure 28, a slide rail 5011 is further provided on the driving bracket 501. The slide rail 5011 is an elliptical orbit and is located outside the transmission member 502. Since the transmission member 502 rotates along an elliptical trajectory, that is, the orthographic projection area of the elliptical area with the slide rail 5011 as the circumference on a preset vertical plane is larger than the orthographic projection area of the elliptical area with the transmission member 502 as the circumference on the same preset vertical plane. A plurality of pushing rollers 5042 are provided on the pushing base 5041, and the plurality of pushing rollers 5042 are all in contact with the slide rail 5011. When the driving source 503 drives the transmission member 502 to rotate, the transmission member 502 drives the pushing base 5041 to rotate in a cycle on the driving bracket 501. When the pushing base 5041 rotates, it will drive the pushing rollers 5042 to move in a cycle. Since the pushing rollers 5042 are in contact with the slide rail 5011, that is, the pushing base 5041 rotates along the elliptical trajectory of the transmission member 502, and the pushing rollers 5042 rotate along the elliptical orbit of the slide rail 5011. Among them, the pushing rollers 5042 can rotate along the inner circumference of the slide rail 5011 or along the outer circumference of the slide rail 5011.

[0199] It should be noted that when the vertical electroplating equipment includes the driving mechanism 50, the vertical electroplating equipment uses the dynamic electroplating method to electroplate the workpiece to be electroplated 20. When the vertical electroplating equipment uses the static electroplating method to electroplate the workpiece to be electroplated 20, the vertical electroplating equipment can only use a fixed bracket to install the workpiece to be electroplated 20, and there is no need to set the driving mechanism 50 and the cathode unit 40, so that the workpiece to be electroplated 20 can be statically placed in the electroplating tank 30 for electroplating.

[0200] In the vertical electroplating equipment provided in the embodiment of the present application, the driving mechanism 50 is used to push the cathode unit 40 to pass through the anode assembly 10 to realize the vertical continuous electroplating of the workpiece to be electroplated 20. When the workpiece to be electroplated 20 has different distances from the anode members 102 on both sides, different electroplating effects can be formed on different surfaces to be electroplated; in addition, in the vertical electroplating equipment, the electroplating tank 30 is sequentially divided into an electroplating sub-tank 303, a liquid supply chamber 304 and a liquid storage tank 305 from top to bottom, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved.

[0201] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A vertical electroplating device, characterized in that, Comprising: An anode unit, which is jointly composed of a plurality of anode components, and the plurality of anode components are distributed at intervals or continuously along a preset direction to form the anode unit; each anode component includes an anode member extending along the preset direction; A plating bath, in which the anode unit is arranged, and the plating bath is also filled with a plating solution; A cathode unit, which is configured to mount a workpiece to be plated; A driving mechanism, which is configured to push the cathode unit to move in the anode unit; A power supply, the positive pole of which is connected to the anode unit, and the negative pole of which is connected to the cathode unit.

2. The vertical electroplating equipment according to claim 1, wherein When each anode component contains two anode members, there is a certain distance between the two anode members to form an anode channel, and the plurality of anode channels are connected to form a plating channel.

3. The vertical electroplating equipment according to claim 2, characterized in that, It further comprises: An anode base, on which a liquid passing channel and a mounting groove are arranged, the mounting groove is arranged on both sides of the liquid passing channel, and the anode member is mounted in the mounting groove; A liquid circulation mechanism, which is connected to the plating bath and is configured to drive the plating solution to circulate to form a liquid loop; A liquid supply component, which is used to convey the plating solution into the plating channel; The liquid circulation mechanism is communicated with the liquid supply component, and the liquid supply component is communicated with the liquid passing channel to convey the plating solution into the plating channel.

4. The vertical electroplating equipment according to claim 3, characterized in that, A first partition plate is horizontally arranged in the plating bath, and the plating bath is divided into a plating sub-tank and a liquid supply chamber by the first partition plate, and the plating sub-tank is located above the liquid supply chamber; The anode unit is arranged in the plating sub-tank, and a liquid supply component is arranged in the liquid supply chamber, and the plating solution is conveyed to the plating sub-tank through the liquid supply component.

5. The vertical plating equipment according to claim 4, wherein The liquid supply component at least includes a shunt pipe; The shunt pipe is communicated with the liquid circulation mechanism through a flow equalizing component, and the flow equalizing component includes a liquid supply pipe and a flow equalizing pipe. The two ends of the liquid supply pipe are respectively communicated with the flow equalizing pipe and the liquid circulation mechanism. The liquid supply pipe is connected to the middle position in the length direction of the flow equalizing pipe. The two ends of the flow equalizing pipe extend equidistantly away from the connection point of the liquid supply pipe with the center point as the center point; One end of the shunt pipe is arranged on the flow equalizing pipe and is communicated with the flow equalizing pipe, and the other end is communicated with the plating channel to convey the plating solution into the plating channel.

6. The vertical electroplating equipment according to claim 5, characterized in that, The liquid supply component further includes a jet pipe, and the jet pipe includes a jet main pipe and jet branch pipes. One end of the jet main pipe is communicated with the liquid circulation mechanism, and the other end is connected to the jet branch pipes; Nozzles are arranged on the jet branch pipes, and the nozzles are communicated with the plating sub-tank; A plurality of liquid supply ports are arranged on the first partition plate, and the liquid passing channel corresponds to at least one of the liquid supply ports in position; The number of the liquid supply ports and the nozzles located below the same plating channel is equal, and their positions correspond up and down. The nozzles pass through the liquid supply ports and are communicated with the plating channel, so that the plating solution flows into the liquid passing channel through the jet pipe.

7. The vertical electroplating apparatus according to claim 6, wherein The liquid circulation mechanism at least includes a liquid storage bucket, a circulation pump and a circulation pipeline; The circulating pipeline includes a circulating liquid inlet pipe and a circulating liquid outlet pipe. The liquid supply pipe and the jet pipe are both communicated with the circulating liquid outlet pipe, and the circulating liquid outlet pipe is connected to the liquid outlet of the liquid storage barrel. A second partition is further arranged in the electroplating tank. Through the horizontally arranged first partition and the second partition, the electroplating tank is sequentially divided into an electroplating sub-tank, a liquid supply chamber and a liquid storage tank from top to bottom. The liquid storage tank is located below the liquid supply chamber and is independent of the liquid supply chamber. The electroplating sub-tank has a circulating tank communicated with the liquid storage tank, and the circulating tank is independent of the liquid supply chamber. One end of the circulating liquid inlet pipe is connected to the circulating pump, and the other end is connected to the liquid storage tank. The circulating pump is connected to the liquid storage barrel. A filter is arranged at one end of the circulating liquid inlet pipe connected to the liquid storage tank. The filter is located in the liquid storage tank. A plurality of filter holes are formed in the filter. The electroplating solution in the electroplating sub-tank sequentially flows through the circulating tank, the liquid storage tank, the filter and the circulating liquid inlet pipe and enters the liquid storage barrel.

8. The vertical electroplating equipment according to any one of claims 1-7, characterized in that, The cathode unit includes a conductive component and a mounting component. The mounting component at least includes a cathode support frame and a cathode connecting rod. The cathode support frame is used for mounting the workpiece to be electroplated, and the cathode support frame is mounted on the cathode connecting rod. The conductive component at least includes a conductive block. A substrate is arranged along the length of the electroplating tank. A conductive strip is arranged on the substrate. The conductive block is connected to the end of the cathode connecting rod and contacts the conductive strip. Among them, the workpiece to be electroplated is electrically connected to the conductive block through a conducting wire, and the negative electrode of the power supply is electrically connected to the conductive strip. When the driving mechanism pushes the cathode unit and the cathode unit moves along the length of the electroplating tank, the conductive block transmits the electric energy obtained by its contact with the conductive strip to the workpiece to be electroplated.

9. The vertical electroplating apparatus according to claim 8, wherein, The cathode support frame includes a support frame body and a bearing frame body. The support frame body is connected to the bearing frame body. The bearing frame body has a bearing groove, and the bearing groove can be used for mounting the workpiece to be electroplated. The orthographic projection area of the bearing groove on a preset vertical plane is larger than the orthographic projection area of the workpiece to be electroplated on the same preset vertical plane. A plurality of bearing blocks are arranged in the bearing groove. The plurality of bearing blocks are arranged along the inner wall of the bearing groove. When the workpiece to be electroplated is mounted in the bearing groove, the bearing blocks contact the edge of the workpiece to be electroplated to support the workpiece to be electroplated. A fifth baffle and a sixth baffle are arranged on the cathode support frame. When the workpiece to be electroplated is mounted in the bearing groove, the fifth baffle corresponds to the lower edge position of the workpiece to be electroplated, and the sixth baffle corresponds to the upper edge position of the workpiece to be electroplated.

10. The vertical electroplating equipment according to claim 9, wherein The support frame body has a first support portion and a second support portion. The two ends of the first support portion are respectively connected to the two second support portions. The ends of the second support portion far from the first support portion extend to both sides respectively and are connected to the bearing frame body. A connecting rod support groove for mounting the first support portion is formed in the cathode connecting rod. There are two support blocks arranged on the first support part, and the distance between the two support blocks is adapted to the width of the cathode connecting rod, so that the cathode connecting rod can be clamped between the two support blocks to limit the moving range of the cathode support frame.

11. The vertical electroplating equipment according to claim 8, characterized in that, The driving mechanism at least includes a driving bracket, a transmission member, a driving source and a pushing member; The transmission member is rotatably arranged on the driving bracket, the pushing member is connected to the transmission member, and the driving source is arranged on the driving bracket and connected to the transmission member to drive the transmission member to drive the pushing member to rotate in a cycle; When the pushing member rotates above the electroplating tank, it contacts the cathode connecting rod and pushes it to move along the length of the electroplating tank.

12. The vertical electroplating equipment according to claim 11, wherein The transmission member rotates in a cycle on the driving bracket along an elliptical trajectory. The driving source includes a transmission wheel and a motor. The motor and the transmission wheel are respectively arranged on two sides of the driving bracket. The transmission member is sleeved on the transmission wheel, and the output shaft of the motor passes through the driving bracket and is connected to the transmission wheel to drive the transmission wheel to drive the transmission member to rotate.

13. The vertical electroplating equipment according to claim 11, wherein, The transmission member arranged on the driving bracket rotates in a cycle in the vertical direction. When the transmission member rotates in a cycle, it has two horizontal moving areas and two rotating areas. The two horizontal moving areas are respectively at a first height and a second height. The distance between the first height and the electroplating tank is L1, and the distance between the second height and the electroplating tank is L2, and L1 < L2; when the pushing member is at the first height, the end of the pushing member away from the transmission member can contact the cathode connecting rod, and the pushing member applies a thrust to the cathode connecting rod under the drive of the transmission member, so that the cathode connecting rod moves following the pushing member; when the pushing member is at the second height, the end of the pushing member away from the transmission member can be separated from the cathode connecting rod; The pushing member includes a pushing base and a pushing rod. The pushing base is connected to the transmission member, and one end of the pushing rod is arranged on the pushing base, and the other end extends in a direction away from the pushing base to the middle of the cathode connecting rod; The pushing rod and the pushing base are rotatably connected in the vertical direction to adjust the height of the pushing rod; A pushing plate is arranged on the pushing rod; Mutually matching magnetic attraction structures are arranged on the pushing plate and the cathode connecting rod.

Images