Anode assembly and vertical electroplating equipment

Abstract

The utility model discloses an anode assembly and vertical electroplating equipment, the anode assembly at least comprises an anode base and an anode piece, the anode base is provided with a liquid passing channel and a mounting groove, the position of the liquid passing channel partially or completely coincides with a processing position, and the mounting groove is configured to be used for mounting the anode piece; the number of the installation grooves is two or more, the multiple installation grooves are distributed in the two sides of the machining position with the machining position as the standard, and the anode pieces are installed in at least part of the installation grooves. By the adoption of the anode assembly, the electroplating liquid can be sprayed below the to-be-electroplated part, it is avoided that spraying devices are arranged on one side or two sides of the to-be-electroplated part, the distance between the anode part and the to-be-electroplated part can be further shortened, and the electroplating effect can be improved.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and particularly relates to an anode assembly and a vertical electroplating device. Background Art

[0002] According to the orientation of the workpiece to be electroplated during electroplating, the electroplating process can be divided into horizontal electroplating and vertical electroplating. In vertical electroplating, the workpiece to be electroplated is immersed in the electroplating solution in a vertical state through a mounting member. The workpiece to be electroplated is electrically connected to the negative electrode of the power supply to form a cathode unit. An anode unit is installed in the electroplating tank and is electrically connected to the positive electrode of the power supply. Under the action of the electric field, the cations in the electroplating solution will migrate to the vicinity of the workpiece to be electroplated and form a coating on the workpiece to be electroplated.

[0003] The anode unit includes an anode assembly, and the anode assembly includes an anode member. The existing anode assembly uses a fixed anode member. The anode member itself is not convenient for installation and disassembly, and the distance between the anode member and the workpiece to be electroplated cannot be adjusted. Furthermore, it is not convenient to adjust the electroplating effect by changing the distance between the anode member and the workpiece to be electroplated. Secondly, during electroplating, in order to improve the electroplating effect, it is necessary to spray the recycled electroplating solution or the newly added electroplating solution into the electroplating solution near the workpiece to be electroplated through a spraying device. The existing spraying devices are generally arranged on one side or both sides of the workpiece to be electroplated, which will prevent the distance between the anode member and the workpiece to be electroplated from being reduced, affecting the electroplating effect. Moreover, how to guide the flow of the electroplating solution and how to reduce the edge effect will also affect the electroplating uniformity and electroplating quality of the workpiece to be electroplated.

[0004] In addition, when performing double-sided electroplating on the workpiece to be electroplated, the distance between the two anode members cannot be adjusted, that is, the distance between the workpiece to be electroplated and the anode member is a constant distance. However, this structure cannot meet the requirements of the workpiece to be electroplated having different electroplating effects on both sides, and cannot electroplate different types of battery wafers or battery wafers with different process requirements.

[0005] Therefore, there is an urgent need to design an anode assembly and a vertical electroplating device to solve one of the above technical problems. Summary of the Utility Model

[0006] The purpose of the present application is to provide an anode assembly and a vertical electroplating device to solve one of the technical problems raised in the background art.

[0007] To achieve the above object, an embodiment of the present application provides an anode assembly, which at least includes an anode base and an anode member. A liquid passing channel and a mounting groove are provided on the anode base. The position of the liquid passing channel partially or entirely coincides with the processing position. The mounting groove is configured to install the anode member.

[0008] The number of the installation grooves is two or more. With the machining position as a reference, a plurality of the installation grooves are distributed on both sides of the machining position, and at least part of the installation grooves are provided with the anode members.

[0009] In some embodiments, the two anode members are respectively installed in the two installation grooves located on both sides of the liquid passing channel;

[0010] If there are a plurality of the installation grooves on the same side of the machining position, the distances between the plurality of the installation grooves on the same side of the machining position and the machining position increase in sequence.

[0011] In some embodiments, the anode member is connected to a conductive copper bar, and the conductive copper bar is connected to the positive electrode of a power supply;

[0012] Wherein, the conductive copper bar is arranged on a fixing rod, and the fixing rod is connected to electroplating equipment.

[0013] In some embodiments, the anode assembly further includes a baffle sub-assembly. The baffle sub-assembly at least includes a first baffle. A baffle groove for installing the first baffle is formed in the anode base, and the baffle groove is located between the liquid passing channel and the adjacent installation groove;

[0014] When the first baffle is installed in the baffle groove, the lower edge position of the first baffle corresponds to that of the anode member.

[0015] In some embodiments, the baffle sub-assembly further includes a second baffle. One end of the second baffle is connected to the conductive copper bar, and the other end extends from the top of the workpiece to be electroplated to its bottom until the upper edge of the anode member is blocked.

[0016] In some embodiments, the baffle sub-assembly further includes a third baffle. One end of the third baffle is arranged on the second baffle and is located between the second baffle and the anode member.

[0017] In some embodiments, the anode assembly further includes an overflow plate. An overflow groove for installing the overflow plate is formed in the anode base, and the overflow groove is located on the side of the installation groove away from the liquid passing channel. The orthographic projection area of the overflow plate on a preset vertical plane is larger than the orthographic projection area of the anode member on the same preset vertical plane.

[0018] In some embodiments, a drainage opening is formed in the second baffle, and the drainage opening is located above the anode member so that the electroplating solution flowing in from the liquid passing channel flows through the workpiece to be electroplated and flows in the direction of the drainage opening.

[0019] In some embodiments, the anode base and the anode member are detachably connected, the second baffle and the fixing rod are detachably connected, and the anode base and the electroplating equipment are detachably connected; wherein, the anode member is inserted into the installation groove, and the anode base is threadedly connected to the anode member.

[0020] It can be seen that the anode assembly provided by the embodiments of the present application includes an anode base and an anode member. By providing a liquid passing channel and an installation groove on the anode base, and the position of the liquid passing channel partially or completely coincides with the processing position, the electroplating solution can be sprayed below the workpiece to be electroplated, so that the distance between the anode member and the workpiece to be electroplated can be further reduced, the electroplating effect can be improved, and more anode members can be arranged on the premise of the same electroplating tank width, realizing the electroplating of more workpieces to be electroplated and improving the electroplating efficiency. In addition, if there are multiple installation grooves on the same side of the processing position, the distances between the multiple installation grooves on the same side of the processing position and the processing position are arranged to increase in sequence, so that the anode member can be installed in the installation groove at the corresponding position according to requirements, thereby adjusting the distance between the processing position and the installation groove. Since the position of the liquid passing channel partially or completely coincides with the processing position, when the workpiece to be electroplated is directly above the liquid passing channel station and the anode member is installed in the installation groove, the distance between the processing position and the installation groove is the distance between the anode member and the workpiece to be electroplated. In this way, the position adjustment efficiency of the anode member can be effectively improved and the electroplating effect of the workpiece to be electroplated can be improved. In addition, by providing shielding members (including the first baffle, the second baffle and the third baffle) at the edge part of the anode member, the influence of the edge effect of the anode member on the uneven plating can be reduced. In addition, the anode base and the anode member are detachably connected, the second baffle and the fixing rod are detachably connected, and the anode base and the electroplating equipment are detachably connected; which facilitates the disassembly and assembly of each component.

[0021] The embodiments of the present application also provide a vertical electroplating equipment, which includes all the technical solutions of the above anode assembly, and therefore also has all the technical advantages of the above anode assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0023] Figure 1 is a schematic structural diagram of an anode assembly in an embodiment provided by the present application;

[0024] Figure 2 is a schematic structural diagram of an anode assembly in an embodiment provided by the present application;

[0025] Figure 3 It is a schematic structural diagram of an anode assembly in an embodiment provided by the present application;

[0026] Figure 4 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0027] Figure 5 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0028] Figure 6 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0029] Figure 7 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0030] Figure 8 It is a schematic structural diagram of an anode assembly in another embodiment provided by the present application;

[0031] Figure 9 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0032] Figure 10 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0033] Figure 11 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0034] Figure 12 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0035] Figure 13 is Figure 12 a partial enlarged view of part A therein;

[0036] Figure 14 is Figure 12 a partial enlarged view of part B therein;

[0037] Figure 15 is Figure 12 a partial enlarged view of part C therein;

[0038] Figure 16 is Figure 12 a partial enlarged view of part D therein;

[0039] Figure 17 It is a schematic structural diagram of a vertical electroplating device in an embodiment provided by the present application;

[0040] Figure 18 isFigure 17 Partial enlarged view of part E;

[0041] Figure 19 is Figure 17 Partial enlarged view of part F;

[0042] Figure 20 is Figure 17 Partial enlarged view of part G;

[0043] Figure 21 Schematic diagram of power connection of vertical electroplating equipment in an embodiment provided by the present application;

[0044] Figure 22 Schematic diagram of the structure of the liquid supply component in an embodiment provided by the present application;

[0045] Figure 23 Schematic diagram of the structure of the liquid supply component in another embodiment provided by the present application;

[0046] Figure 24 Schematic diagram of the flow direction of the electroplating solution in an embodiment provided by the present application;

[0047] Figure 25 Schematic diagram of the control logic diagram of vertical electroplating equipment and the structure of the temperature control component in an embodiment provided by the present application;

[0048] Figure 26 Schematic diagram of the structure of the driving mechanism in an embodiment provided by the present application;

[0049] Figure 27 Schematic diagram of the structure of the cooperation between the driving mechanism and the cathode unit in an embodiment provided by the present application;

[0050] Figure 28 Figure 27 Partial enlarged view of part H;

[0051] Figure 29 Schematic diagram of the structure of the installation component in an embodiment provided by the present application;

[0052] Figure 30 Schematic diagram of the structure of the installation component in an embodiment provided by the present application;

[0053] Figure 31 Schematic diagram of the structure of the installation component in an embodiment provided by the present application.

[0054] Reference numerals:

[0055] 10 - Anode assembly; 101 - Anode base; 1011 - Liquid passing channel; 1012 - Installation groove; 102 - Anode part; 103 - Conductive copper bar; 104 - Fixed rod; 105 - First baffle; 106 - Baffle groove; 107 - Second baffle; 1071 - Drainage port; 108 - Third baffle; 109 - Fourth baffle; 110 - Overflow plate; 111 - Overflow groove; 112 - Anode channel; 113 - Electroplating channel;

[0056] 20 - Workpiece to be electroplated;

[0057] 30 - Electroplating tank; 301 - First partition; 302 - Second partition; 303 - Electroplating sub - tank; 304 - Liquid supply bin; 305 - Liquid storage tank; 306 - Circulation tank; 307 - Circulation partition;

[0058] 40 - Cathode unit; 401 - Conductive assembly; 4011 - Conductive block; 40111 - Conductive fixing seat; 4012 - Conductive bar; 4013 - Substrate; 4014 - Conductive connecting rod; 4015 - Guide roller; 4016 - Roller mounting seat; 4017 - Guide protrusion; 402 - Mounting assembly; 4021 - Cathode support frame; 40211 - Support frame body; 40212 - First support part; 40213 - Second support part; 40214 - Support block; 40215 - Carrying frame body; 40216 - Carrying groove; 40217 - Carrying block; 40218 - Carrying area; 4023 - Fifth baffle; 4024 - Sixth baffle; 4025 - Cathode connecting rod;

[0059] 50 - Driving mechanism; 501 - Driving bracket; 5011 - Slide rail; 502 - Transmission part; 503 - Driving source; 5031 - Transmission wheel; 5032 - Motor; 504 - Pushing part; 5041 - Pushing base; 5042 - Pushing roller; 5043 - Pushing rod; 5044 - Pushing plate;

[0060] 60 - Power supply;

[0061] 70 - Liquid circulation mechanism; 701 - Liquid storage barrel; 702 - Circulation pipeline; 7021 - Circulation inlet pipe; 7022 - Circulation outlet pipe; 703 - Filter; 7031 - Filter holes;

[0062] 80 - Liquid supply assembly; 801 - Shunt pipe; 802 - Liquid supply pipe; 8021 - Liquid supply main pipe; 8022 - Liquid supply branch pipe; 803 - Flow - equalizing pipe; 804 - Jet flow main pipe; 805 - Jet flow branch pipe; 806 - Sprinkler pipe;

[0063] 90 - Controller; 91 - Liquid level sensor; 92 - Flow sensor; 93 - Temperature sensor; 94 - Regulating valve; 95 - Solenoid valve;

[0064] 100 - Temperature control component; 1001 - Heat exchanger; 1002 - Liquid supply tank; 1003 - First heat exchange pipe; 1004 - Second heat exchange pipe; 1005 - Third heat exchange pipe; 1006 - Fourth heat exchange pipe. Detailed implementation mode

[0065] To make the purpose, technical solution and advantages of this application clearer, the following will further describe the implementation mode of this application in detail with reference to the accompanying drawings. Spatially relative position terms used in this application, such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end", etc., are for the purpose of facilitating description to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. Spatially relative position terms can be intended to include different orientations of the device in use or operation other than the orientation shown in the figures. For example, if the device in the figure is flipped, the unit described as being "below" or "beneath" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the upper and lower orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein can be interpreted accordingly.

[0066] In addition, the terms "installed", "set", "provided with", "connected", "slidingly connected", "fixed", "socketed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. When the term "connected" is used for the connection of a pipe to other components, it is judged according to the scenario. The pipe and other components may be in a communicating state. That is, in some scenarios, the connection of the pipe to other components also means the communication between the pipe and other components.

[0067] Based on the technical problems pointed out in the background art of the present application, the present application provides an anode assembly with adjustable anode position, and a vertical electroplating device including the anode assembly. The anode assembly includes an anode base and an anode member. By providing a liquid passing channel and a mounting groove on the anode base, the liquid passing channel is used for spraying electroplating solution, and the mounting groove is used for mounting the anode member. The position of the liquid passing channel partially or completely coincides with the processing position. During operation, the electroplating solution can be sprayed below the workpiece to be electroplated, avoiding the need to set spraying devices on one side or both sides of the workpiece to be electroplated. This allows the distance between the anode member and the workpiece to be electroplated to be further reduced, improving the electroplating effect. On the premise of the same electroplating tank width, more anode members can be arranged to electroplate more workpieces to be electroplated, improving the electroplating efficiency. On the other hand, if there are multiple mounting grooves on the same side of the processing position, the distances between the multiple mounting grooves on the same side of the processing position and the liquid passing channel are sequentially increased. This enables the anode member to be installed in the mounting groove at the corresponding position according to requirements, thereby adjusting the distance between the processing position and the mounting groove. Since the position of the liquid passing channel partially or completely coincides with the processing position, when the workpiece to be electroplated is directly above the liquid passing channel station and the anode member is installed in the mounting groove, the distance between the processing position and the mounting groove is the distance between the anode member and the workpiece to be electroplated, effectively improving the position adjustment efficiency of the anode member and the electroplating effect of the workpiece to be electroplated. Herein, the processing position is the area covered by the orthographic projection of the workpiece to be electroplated on the anode base during electroplating, or the area covered by the orthographic projection on a preset horizontal plane. Its function is to mark a reference position for the installation of other components.

[0068] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments of the present application are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0069] The anode assembly 10 provided in the embodiment of the present application is used to provide electroplating metal for the electroplating device and carry the electroplating metal so that it can be stably installed in the electroplating device. When the electroplating device is in the working state, the electroplating metal will ionize into cations and enter the electroplating solution, and flow to the workpiece to be electroplated 20 to deposit a metal film on all or part of the surface of the workpiece to be electroplated 20. Herein, the workpiece to be electroplated 20 can be a product that needs to be given a certain special physical property or decorative property, such as a PCB board, a solar cell, a silicon wafer, a chip, etc.; for another example, the electroplating metal can be an insoluble anode, which is made by coating a noble metal oxide coating with high electrocatalytic performance on a titanium substrate (mesh, plate, strip, tube, etc.), or the electroplating metal is a soluble anode that can dissolve into cations and enter the solution by itself.

[0070] Please refer to Figures 1 - 8 , an anode assembly 10, at least including an anode base 101 and an anode member 102. A liquid passing channel 1011 and a mounting groove 1012 are provided on the anode base 101. The mounting groove 1012 is configured for mounting the anode member 102. When the workpiece to be electroplated 20 is located on one side of the anode member 102, under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed from the anode member 102 and the cations originally existing in the electroplating solution will be enriched on the surface of the workpiece to be electroplated 20 and deposited to form a metal coating. A liquid passing channel 1011 is opened on the anode base 101, and the liquid passing channel 1011 is configured for the electroplating solution to flow through, wherein part or all of the position of the liquid passing channel coincides with the processing position. Refer to Figure 4 , when performing single-sided electroplating on the workpiece to be electroplated 20, the number of the mounting grooves 1012 can be set to one and located on one side of the processing position. The anode member 102 is mounted in the mounting groove 1012. Specifically, the bottom of the anode member 102 is mounted in the mounting groove 1012, and the electroplating surface of the workpiece to be electroplated 20 is arranged opposite to the mounting of the anode member 102, that is, the orthographic projection area of the workpiece to be electroplated 20 on a preset vertical plane partially or completely coincides with the orthographic projection area of the anode member 102 on the same preset vertical plane. When the workpiece to be electroplated 20 is moved manually or automatically above the liquid passing channel 1011 or suspended above the liquid passing channel 1011, the electroplating solution flows through the liquid passing channel 1011 to between the electroplating surface and the anode member 102. Under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed from the anode member 102 or the cations originally existing in the electroplating solution are enriched on the surface of the workpiece to be electroplated 20 and deposited to form a metal coating, so as to complete the single-sided electroplating of the workpiece to be electroplated 20. Compared with the structure without the liquid passing channel 1011 on the anode base 101, opening the liquid passing channel 1011 enables the electroplating solution to flow through the liquid passing channel 1011 to between the electroplating surface and the anode member 102. In addition, the electroplating solution flowing in through the liquid passing channel 1011 can adopt an electroplating solution with a higher cation concentration. The cation concentration of the electroplating solution may decrease after long-term use, resulting in uneven thickness of the coating deposited on the surface of the workpiece to be electroplated 20. Or, refer to Figures 1 - 3 、 Figures 4 - 8, the number of the installation grooves 1012 is two or more. Taking the processing position as a reference, a plurality of installation grooves 1012 are distributed on both sides of the processing position. The distances between the plurality of installation grooves 1012 on the same side of the processing position and the processing position increase in sequence. The distance between any two installation grooves 1012 located on both sides of the processing position is greater than the thickness of the workpiece to be electroplated 20. When the number of the installation grooves 1012 is an even multiple of two, a plurality of installation grooves 1012 are evenly arranged on both sides thereof with the processing position as the center. The distances between the plurality of installation grooves 1012 on the same side of the processing position and the processing position increase in sequence, so that after the anode member 102 is installed in the installation groove 1012, the workpiece to be electroplated 20 can be moved above the liquid passing channel 1011 manually or automatically, or suspended above the liquid passing channel 1011. Thus, when the electroplating solution flows out through the liquid passing channel 1011, it can flow between the surface to be electroplated and the anode member 102. Under the drive of the potential of the power supply 60 and the flow of the liquid, the cations electrolyzed from the anode member 102 or the cations originally existing in the electrolyte solution are enriched on the surfaces of both sides of the workpiece to be electroplated 20 and deposited to form a metal coating, so as to complete the double-sided electroplating of the workpiece to be electroplated 20.

[0071] When the number of the installation grooves 1012 is odd, the distribution mode of the even number of installation grooves 1012 among them is the same as that when the number is an even multiple of two. The remaining one installation groove 1012 can be arranged on any side of the liquid passing channel 1011. For example, when the number of the installation grooves 1012 is three, two of the installation grooves 1012 are respectively arranged on both sides of the liquid passing channel 1011, and the remaining one installation groove 1012 is arranged on any side of the liquid passing channel 1011, that is, when only one installation groove 1012 is arranged on one side of the liquid passing channel 1011, two installation grooves 1012 must be arranged on the other side.

[0072] In practical applications, when the number of anode members 102 is one and the number of mounting grooves 1012 is two or more, the anode member 102 is installed in any one of the mounting grooves 1012. Specifically, when the number of anode members 102 is set to one, only one side of the workpiece to be electroplated 20 can be electroplated. At this time, there is no direction limit for the installation of the anode member 102, that is, the anode member 102 can be placed on either side of the liquid passage 1011. The workpiece to be electroplated 20 needs to set its electroplating surface facing the anode member 102. For example, when the workpiece to be electroplated 20 uses hanging static electroplating and the anode member 102 is installed in the mounting groove 1012 on the left side of the liquid passage 1011, the electroplating surface of the workpiece to be electroplated 20 needs to face the left side of the liquid passage 1011 and be arranged opposite to the anode member 102 (that is, the orthographic projection area of the electroplating surface on the preset vertical plane partially or completely coincides with the orthographic projection area of the anode member 102 on the same preset vertical plane). When the number of anode members 102 is two and the number of mounting grooves 1012 is two or more, the two anode members 102 are respectively installed in any two mounting grooves 1012 located on both sides of the liquid passage 1011. Specifically, when the number of anode members 102 is set to two, the workpiece to be electroplated 20 is electroplated on both sides. To achieve double-sided electroplating, it is necessary to ensure that the two anode members 102 are respectively installed in the mounting grooves 1012 located on both sides of the liquid passage 1011 so that the two electroplating surfaces of the workpiece to be electroplated 20 respectively correspond to the two anode members 102.

[0073] If single-sided electroplating is performed on the electroplating workpiece 20, only one anode member 102 can be selected. With one anode member 102, single-sided electroplating of the electroplating workpiece 20 can be achieved. When more than one anode member 102 is provided, the multiple anode members 102 are located on the same side or the multiple anode members 102 are respectively located on both sides of the electroplating workpiece 20, and the electroplating effect on the electroplating workpiece 20 is less affected compared to when only one anode member 102 is provided, while the electroplating cost and electroplating efficiency will increase. For example, when the multiple anode members 102 are located on the same side (i.e., the multiple anode members 102 are all installed in the multiple installation grooves 1012 on one side of the liquid passing channel 1011), the electroplating solution flowing out through the liquid passing channel 1011 only contacts the anode member 102 closest to the electroplating surface, and it is difficult for the cations electrolyzed by the remaining anode members 102 to migrate to the electroplating surface; when the multiple anode members 102 are respectively located on both sides of the liquid passing channel 1011, the electroplating solution flowing out through the liquid passing channel 1011 will contact both electroplating surfaces of the electroplating workpiece 20 and the corresponding anode members 102 simultaneously, causing cations to be deposited on both sides of the electroplating workpiece 20. However, most of the cations deposited on the electroplating surface come from the anode member 102 closest to it, and the cations electrolyzed by the remaining anode members 102 are free in the electroplating solution or deposited on non-electroplating surfaces. That is to say, when the anode member 102 is connected to the positive pole of the power supply 60, all the anode members 102 immersed in the electroplating solution will undergo electrolysis in the electric field. Even if only one anode member 102 provides metal cations for the electroplating workpiece 20, all the anode members 102 will be consumed during electroplating, thereby increasing the electroplating cost and reducing the electroplating efficiency caused by installing redundant anode members 102.

[0074] Correspondingly, if double-sided electroplating is performed on the electroplating workpiece 20, only two anode members 102 can be selected, and the two anode members 102 are respectively used for electroplating the two electroplating surfaces of the electroplating workpiece 20. If the number of anode members 102 exceeds two, the remaining anode members 102 need to be installed on one side of the above two anode members 102. During electroplating, the electroplating solution flowing out through the liquid passing channel 1011 only contacts the anode member 102 closest to the electroplating surface, and the anode members 102 far from the electroplating workpiece 20 will increase the electroplating cost.

[0075] It can be seen from this that when single-sided electroplating is performed on the electroplating workpiece 20, the anode base 101 with only a single installation groove 1012 can be selected, or the anode base 101 with multiple installation grooves 1012 can be selected. The anode member 102 can be installed in any one of the installation grooves 1012. When double-sided electroplating is performed on the electroplating workpiece 20, only the anode base 101 with multiple installation grooves 1012 can be selected, and the two anode members 102 need to be respectively installed in the installation grooves 1012 located on both sides of the liquid passing channel 1011.

[0076] In an achievable implementation, the distances between multiple mounting grooves 1012 on the same side of the liquid passing channel 1011 and the liquid passing channel 1011 can increase successively in equal proportion. For example, when the number of mounting grooves 1012 is four, two mounting grooves 1012 will be provided on each side of the liquid passing channel 1011. Among the four mounting grooves 1012 on each side of the liquid passing channel 1011, the distances between the liquid passing channel 1011 and the two mounting grooves 1012 closest to it are both S1, with the unit of cm, and the distances between the liquid passing channel 1011 and the two mounting grooves 1012 far from it are both 2S1, with the unit of cm.

[0077] Correspondingly, the distances between multiple mounting grooves 1012 on the same side of the liquid passing channel 1011 and the liquid passing channel 1011 can increase successively in non-equal proportion. For example, among the four mounting grooves 1012 on each side of the liquid passing channel 1011, the distances between the liquid passing channel 1011 and the two mounting grooves 1012 closest to it are both S1, with the unit of cm, the distances between the liquid passing channel 1011 and the two mounting grooves 1012 far from it are both S2, with the unit of cm, the distance between the two mounting grooves 1012 on the same side is S2 - S1, and S2 - S1 ≠ S1.

[0078] In practical applications, the installation position of the anode member 102 can be determined by the results of pre-tests. Specifically, the anode member 102 can be successively installed in multiple mounting grooves 1012 on the same side of the liquid passing channel 1011, and by comparing the electroplating effects of the workpiece to be electroplated 20 when the anode member 102 is installed at different positions, the optimal installation position of the anode member 102 can be inferred. Among them, when performing single-sided electroplating on the workpiece to be electroplated 20, only the electroplating effect of its surface to be electroplated needs to be considered. If it is selected to install the anode member 102 on the anode base 101 with only a single mounting groove 1012, the electroplating effect when the anode member 102 is installed in the mounting groove 1012 of this anode base 101 can be compared with the electroplating effect when the anode member 102 is installed on the anode base 101 with multiple mounting grooves 1012 (the anode member 102 is installed in the mounting grooves 1012 at multiple different positions for testing respectively, and the electroplating effects are compared one by one). If it is selected to install the anode member 102 on the anode base 101 with multiple mounting grooves 1012, only the electroplating effects when the anode member 102 is installed in different mounting grooves 1012 need to be compared. When performing double-sided electroplating on the workpiece to be electroplated 20, it can be selected according to needs whether the distances between the two anode members 102 and the liquid passing channel 1011 are equal or not. If the distances between the two anode members 102 and the liquid passing channel 1011 are equal, the same electroplating effect will be produced. If the distances between the two anode members 102 and the liquid passing channel 1011 are not equal, different electroplating effects can be presented on the two sides of the workpiece to be electroplated 20.

[0079] For example, when the number of the installation grooves 1012 is one, refer to Figure 4 , the anode member 102 is installed in the installation groove 1012 for testing. If the electroplating effect of the workpiece 20 to be electroplated does not meet the pre-set qualified standard, the anode assembly 10 is replaced. The distance between the installation groove 1012 and the liquid passing channel 1011 in the replaced anode assembly 10 needs to be different from the distance between the installation groove 1012 and the liquid passing channel 1011 in the anode assembly 10 before replacement.

[0080] When the number of the installation grooves 1012 is two, refer to Figure 5 , the two anode members 102 can be respectively installed in the installation grooves 1012 on both sides of the liquid passing channel 1011 for testing. If the electroplating effect of the workpiece 20 to be electroplated does not meet the pre-set qualified standard, the anode assembly 10 is replaced. The distance between the installation groove 1012 and the liquid passing channel 1011 in the replaced anode assembly 10 needs to be different from the distance between the installation groove 1012 and the liquid passing channel 1011 in the anode assembly 10 before replacement.

[0081] When the number of the installation grooves 1012 is more than two and is an integer multiple of two, for example, when the number of the installation grooves 1012 is set to four, refer to Figure 6 , the two installation grooves 1012 close to the liquid passing channel 1011 are respectively a first groove body and a second groove body, and the two installation grooves 1012 far from the liquid passing channel 1011 are respectively a third groove body and a fourth groove body, wherein the first groove body and the third groove body are on the same side, and the second groove body and the fourth groove body are on the same side. Specifically, the two anode members 102 can be installed in any of the following ways:

[0082] (1) The two anode members 102 are respectively installed in the first groove body and the second groove body;

[0083] (2) The two anode members 102 are respectively installed in the first groove body and the fourth groove body;

[0084] (3) The two anode members 102 are respectively installed in the third groove body and the fourth groove body;

[0085] (4) The two anode members 102 are respectively installed in the third groove body and the second groove body.

[0086] When the two anode members 102 are installed in the first and third ways, the electroplating effects on both sides of the workpiece 20 to be electroplated are the same. When the two anode members 102 are installed in the second and fourth ways, the electroplating effects on both sides of the workpiece 20 to be electroplated are different.

[0087] When the number of the installation grooves 1012 is more than two and is an odd number, for example, when the number of the installation grooves 1012 is set to five, refer to Figure 7, there are two mounting grooves 1012 located on one side of the liquid passage 1011, namely the first groove body and the third groove body, and there are three mounting grooves 1012 located on the other side of the liquid passage 1011, namely the second groove body, the fourth groove body and the fifth groove body. Specifically, the two anode members 102 can be installed in any of the following ways:

[0088] (1) The two anode members 102 are respectively installed in the first groove body and the second groove body;

[0089] (2) The two anode members 102 are respectively installed in the first groove body and the fourth groove body;

[0090] (3) The two anode members 102 are respectively installed in the first groove body and the fifth groove body;

[0091] (4) The two anode members 102 are respectively installed in the third groove body and the second groove body;

[0092] (5) The two anode members 102 are respectively installed in the third groove body and the fourth groove body;

[0093] (6) The two anode members 102 are respectively installed in the third groove body and the fifth groove body.

[0094] When the two anode members 102 are installed in the first and fifth ways, the electroplating effects on both sides of the workpiece 20 to be electroplated are the same. When the two anode members 102 are installed in the second, third, fourth and sixth ways, the electroplating effects on both sides of the workpiece 20 to be electroplated are different.

[0095] Preferably, the distances between the mounting grooves 1012 and the liquid passage 1011 (equivalent to the distances between the anode members 102 and the workpiece 20 to be electroplated during electroplating) are 40mm, 70mm and 100mm in sequence from near to far, and the number of the mounting grooves 1012 is six. Refer to Figures 1 - 3 , Figure 8 , that is, the distance between the mounting groove 1012 closest to the liquid passage 1011 and the liquid passage 1011 is 40mm, and the distance between two adjacent mounting grooves 1012 on the same side of the liquid passage 1011 is 30mm. In this embodiment, there are nine installation ways for the two anode members 102. The specific installation ways and test methods can refer to the installation ways and test methods adopted when the number of the mounting grooves 1012 is an integer multiple of two.

[0096] It should be noted that the two anode members 102 are arranged in parallel, the center points are on the same horizontal line, and the projected areas of the two anode members 102 on the same preset vertical plane are the same. In this way, after the anode members 102 are installed in the installation grooves 1012, the projected areas of the two anode members 102 on the same preset vertical plane corresponding to the workpiece 20 to be electroplated are the same, so that all areas or corresponding areas on both sides of the workpiece 20 to be electroplated can be electroplated simultaneously.

[0097] In an implementable embodiment, the anode member 102 is connected to the conductive copper bar 103, and the conductive copper bar 103 is connected to the positive pole of the power supply 60. In this way, the conductive copper bar 103 can deliver the positive current to the anode member 102, so that the anode member 102 can be electrolyzed in the electroplating solution. Among them, the conductive copper bar 103 is arranged on the fixing rod 104, and the fixing rod 104 is connected to the electroplating equipment.

[0098] In an implementable embodiment, referring to Figures 1 - 8 , the anode assembly 10 further includes a baffle sub-assembly. The baffle sub-assembly at least includes a first baffle 105. A baffle groove 106 for installing the first baffle 105 is formed on the anode base 101. The baffle groove 106 is located between the liquid passing channel 1011 and the adjacent installation groove 1012. When the first baffle 105 is installed in the baffle groove 106, the lower edge position of the first baffle 105 corresponds to that of the anode member 102. Specifically, for the anode base 101 with only one installation groove 1012, only one anode member 102 can be installed correspondingly, and only one first baffle 105 for shielding the lower edge of the anode member 102 needs to be provided. For the anode base 101 with two or more installation grooves 1012, the workpiece 20 to be electroplated can be electroplated on one side or both sides, and two baffle grooves 106 need to be provided. When the workpiece 20 to be electroplated is electroplated on both sides, anode members 102 will be installed on both sides of the liquid passing channel 1011. Since the distance between the baffle groove 106 and the liquid passing channel 1011 is less than the distance between the installation groove 1012 and the liquid passing channel 1011, therefore, no matter which installation groove 1012 the anode member 102 is installed in, the first baffle 105 is located between the anode member 102 and the workpiece 20 to be electroplated, so as to shield the lower edge of the anode member 102.

[0099] Further, when the first baffle 105 is installed in the baffle groove 106 and the anode member 102 is installed in the installation groove 1012, the upper surface of the first baffle 105 is higher than the lower surface of the anode member 102, so that the first baffle 105 can block a part of the anode member 102. Specifically, the part of the first baffle 105 located in the baffle groove 106 is blocked by the baffle groove 106 body, and the part of the anode member 102 located in the installation groove 1012 is blocked by the installation groove 1012 body. It is necessary to ensure that the part of the first baffle 105 exposed from the baffle groove 106 can block the edge part of the anode member 102 exposed from the installation groove 1012.

[0100] It should be noted that the lower edge area of the anode member 102 can be preset. Due to the edge effect of the anode member 102 itself (i.e., during electroplating, the power lines tend to concentrate at the sharp corners and edges of the anode member 102, so that the current density at the sharp corners and edges of the anode member 102 is relatively large), in order to prevent the power lines flowing from the anode member 102 to the edge part of the workpiece to be electroplated 20 from being too concentrated, a shielding member can be provided at the edge part of the anode member 102, so that when the power lines located in the lower edge area of the anode member 102 extend to the workpiece to be electroplated 20, they need to bypass the first baffle 105. From this, it can be inferred that the distance that the power lines located in the lower edge area of the anode member 102 extend to the workpiece to be electroplated 20 will be greater than the distance that the power lines located in the central area of the anode member 102 move to the workpiece to be electroplated 20. In this way, the distribution of the power lines on the surface to be electroplated can be made uniform, thereby reducing the influence of the uneven plating layer caused by the edge effect of the anode member 102.

[0101] Assume that the area of the part of the first baffle 105 exposed from the baffle groove 106 is A, in cm 2 , and the preset lower edge area of the anode member 102 is B, in cm 2 , in order to achieve a better shielding effect, it can be ensured that the orthographic projection of the part of the first baffle 105 exposed from the baffle groove 106 on the anode member 102 covers the preset lower edge area of the anode member 102, that is, the orthographic projection area of the part of the first baffle 105 exposed from the baffle groove 106 on the anode member 102 is greater than B, so as to realize the shielding of the lower edge area of the anode member 102. Without limitation, the depth of the baffle groove 106 and the depth of the installation groove 1012 are not limited here as long as the exposed part of the first baffle 105 can block the lower edge area of the anode member 102. When the first baffle 105 and the anode member 102 are parallel and facing each other, it is only necessary that the area of the part of the first baffle 105 exposed from the baffle groove 106 is greater than the preset lower edge area of the anode member 102.

[0102] In an implementable embodiment, the baffle sub-assembly further includes a second baffle 107. One end of the second baffle 107 is connected to the conductive copper bar 103, and the other end extends from the top of the workpiece to be electroplated 20 towards its bottom until the upper edge of the anode 102 is blocked. Specifically, connection holes capable of cooperating with the same bolt are provided on both the second baffle 107 and the conductive copper bar 103 to realize the connection between the second baffle 107 and the conductive copper bar 103. To ensure that the second baffle 107 can block the upper edge of the anode 102, the second baffle 107 needs to be arranged above the anode 102, that is, the conductive copper bar 103 and the fixing rod 104 for installing the conductive copper bar 103 are both located above the anode 102. That is to say, the second baffle 107 can also be connected in cooperation with the fixing rod 104.

[0103] Further, the free end of the second baffle 107 extends downward until it can block the upper edge area of the anode 102. Correspondingly, the upper edge area of the anode 102 can be preset. If the area of the preset upper edge area of the anode 102 is C, with the unit of cm 2 , in order to achieve a better blocking effect, the downward extension area at the bottom of the second baffle 107 can be made to cover the upper edge area of the anode 102 in the orthographic projection on the anode 102, so as to block the upper edge area of the anode 102. When the power lines located in the upper edge area of the anode 102 extend to the workpiece to be electroplated 20, they need to bypass the second baffle 107. From this, it can be inferred that the distance that the power lines located in the upper edge area of the anode 102 extend to the workpiece to be electroplated 20 will be greater than the distance that the power lines located in the central area of the anode 102 extend to the workpiece to be electroplated 20.

[0104] In an implementable embodiment, the baffle sub-assembly further includes a third baffle 108. One end of the third baffle 108 is arranged on the second baffle 107 and is located between the second baffle 107 and the anode 102. If the distance between the upper edge area of the anode 102 and the second baffle 107 is too large, the blocking effect of the second baffle 107 on the edge power lines will be reduced. Further, there is a certain distance between the side of the second baffle 107 close to the anode 102 and the anode 102, and the distance is greater than or equal to the thickness of the third baffle 108.

[0105] In an implementable embodiment, the baffle sub-assembly further includes a fourth baffle 109. One end of the fourth baffle 109 is arranged on the first baffle 105, and the other end extends towards the adjacent anode 102. The principle is the same as that of the above-mentioned third baffle 108. If the distance between the lower edge area of the anode 102 and the first baffle 105 is too large, the blocking effect of the first baffle 105 on the edge power lines will be reduced. Further, there is a certain distance between the side of the first baffle 105 close to the anode 102 and the anode 102, and the distance is greater than or equal to the thickness of the fourth baffle 109.

[0106] Furthermore, the fourth baffle 109 and the first baffle 105 are detachably connected. Specifically, when there are two or more installation grooves 1012, the anode member 102 can be placed in the installation groove 1012 far from the liquid passing channel 1011, and the baffle groove 106 is arranged between the liquid passing channel 1011 and its adjacent installation groove 1012. In this case, the distance between the first baffle 105 and the anode member 102 will change. The maximum value of the distance between the first baffle 105 and the anode member 102 is positively correlated with the number of installation grooves 1012. The more the number of installation grooves 1012 on the same side of the liquid passing channel 1011, the greater the distance between the liquid passing channel 1011 and the farthest installation groove 1012. Therefore, when the installation position of the anode member 102 is uncertain, in order to ensure that the fourth baffle 109 can always fill the distance between the first baffle 105 and the anode member 102, the fourth baffle 109 can adopt a detachable connection method. When the installation position of the anode member 102 changes, different lengths of the fourth baffle 109 can be replaced in time. Among them, the detachable connection method can be threaded connection, snap connection, etc. The present application does not limit the detachable connection method as long as the fourth baffle 109 connected to the first baffle 105 can be replaced repeatedly.

[0107] Different from the above method of using the fourth baffle 109 to fill the distance between the anode member 102 and the first baffle 105, in another implementable embodiment, a plurality of baffle grooves 106 are provided on the anode base 101, and the number of baffle grooves 106 is equal to the number of installation grooves 1012 and they are arranged at intervals. Specifically, one baffle groove 106 and one installation groove 1012 together form a lower shielding group. In one lower shielding group, the baffle groove 106 is located on the side close to the liquid passing channel 1011. For example, the number of installation grooves 1012 is four and they are evenly distributed on both sides of the liquid passing channel 1011, that is, there are two lower shielding groups on both sides of the liquid passing channel 1011. In the lower shielding group on the left side of the liquid passing channel 1011, the baffle groove 106 is located on the side close to the liquid passing channel 1011, which is equivalent to the right side in the lower shielding group, and the installation groove 1012 is located on the side far from the liquid passing channel 1011, which is equivalent to the left side in the lower shielding group. In this embodiment, the distance between the first baffle 105 and the anode member 102 is equal to the distance between the installation groove 1012 and the baffle groove 106. If the installation groove 1012 and the baffle groove 106 are communicated in one lower shielding group, after the anode member 102 and the first baffle 105 are respectively installed in the installation groove 1012 and the baffle groove 106, the anode member 102 and the first baffle 105 are in a fitting state. If the installation groove 1012 and the baffle groove 106 are separated by the anode base 101 in one lower shielding group, the smaller the width of the anode base 101 between the installation groove 1012 and the baffle groove 106, the better the shielding effect of the first baffle 105 on the power lines at the lower edge of the anode member 102.

[0108] In an achievable implementation, referring to Figures 1 - 8 , the anode assembly 10 further includes an overflow plate 110. An overflow groove 111 for installing the overflow plate 110 is formed on the anode base 101. The overflow groove 111 is located on the side of the installation groove 1012 away from the liquid passing channel 1011. The projected area of the overflow plate 110 on a preset vertical plane is larger than the projected area of the anode member 102 on the same preset vertical plane. Since the titanium substrate of the anode member 102 can be selected as a mesh or other structure that connects the spaces on both sides of the anode member 102, in order to prevent the electroplating solution flowing in from the liquid passing channel 1011 from directly flowing away from the workpiece to be electroplated 20 by using the structure of the anode member 102 and no longer flowing through the workpiece to be electroplated 20, causing the cations to be subjected to a flow resistance in the direction opposite to the direction close to the workpiece to be electroplated 20 and unable to converge on the surface of the workpiece to be electroplated 20, the overflow groove 111 for installing the overflow plate 110 is arranged on the side of the installation groove 1012 away from the liquid passing channel 1011, that is, the electroplating solution cannot flow to the side of the anode member 102 away from the liquid passing channel 1011. That is to say, when the electroplating solution flowing out of the liquid passing channel 1011 is blocked by the overflow plate 110 and the workpiece to be electroplated 20 on the left and right sides respectively, it can only flow along the height direction of the workpiece to be electroplated 20 and the overflow plate 110. In this way, the electroplating solution can continuously contact the workpiece to be electroplated 20 during the flowing process, and the cations will also be free to the surface of the workpiece to be electroplated 20.

[0109] In an achievable implementation, a drainage opening 1071 is formed on the second baffle 107. The drainage opening 1071 is located above the anode member 102 so that the electroplating solution flowing in from the liquid passing channel 1011 flows through the workpiece to be electroplated 20 and flows in the direction of the drainage opening 1071. If there is no drainage opening 1071 on the second baffle 107, when the second baffle 107 blocks the upper edge of the anode member 102, after the electroplating solution flows in from the liquid passing channel 1011, it will flow along the height of the workpiece to be electroplated 20 to the top of the second baffle 107 and then diffuse. However, when the upper surface of the electroplating tank 30 is flush with the upper surface of the anode assembly 10, after the electroplating solution flows to the top of the second baffle 107, because it is too close to the side wall of the electroplating tank 30, the electroplating solution will flow out of the electroplating tank 30. When the flow rate of the electroplating solution flowing in from the liquid passing channel 1011 is too fast, when the electroplating solution cannot diffuse to both sides, the liquid level height when flowing above the anode assembly 10 will be greater than the anode assembly 10, and there is a possibility of generating water splashes or flowing out of the electroplating tank 30 when falling.

[0110] Accordingly, to ensure that the flow area of the electroplating solution can completely cover the surface to be electroplated of the workpiece 20 to be electroplated, so that cations can be ionized to the surface of the surface to be electroplated, thereby achieving the effect of uniform electroplating, the drainage port 1071 should also be located above the workpiece 20 to be electroplated. Since the specific position of the workpiece 20 to be electroplated cannot be determined during moving electroplating (i.e., non-hanging electroplating), therefore, the top position of the workpiece 20 to be electroplated during movement can be pre-tested, and by adjusting its height, the drainage port 1071 is always located above it, thereby avoiding uneven electroplating.

[0111] In this embodiment, there should be enough space above the anode member 102 for the electroplating solution to flow out from the drainage port 1071. Specifically, since the bottom of the second baffle 107 is a free end and the top is a fixed end, and the fixed end is connected to the conductive copper bar 103 and / or the fixing rod 104, that is to say, both the conductive copper bar 103 and the fixing rod 104 are located above the anode member 102, so that the second baffle 107 can block the upper edge of the anode member 102 when extending downward. When the conductive copper bar 103, the fixing rod 104 and the anode member 102 are all on the same side of the second baffle 107, both the conductive copper bar 103 and the fixing rod 104 are located above the anode member 102 and have a certain distance from the anode member 102, forming a drainage channel, and the drainage channel is connected to the drainage port 1071. Thus, after the electroplating solution flows in through the liquid channel 1011, it moves along the height direction between the anode member 102 and the workpiece 20 to be electroplated, and flows to the drainage port 1071 and then enters the drainage channel through the drainage port 1071.

[0112] In practical applications, to ensure the stability of the anode assembly 10 during electroplating, after the anode member 102 is inserted into the installation groove 1011, the anode base 101 and the anode member 102 can be further threadedly connected by bolts to further improve the installation stability of the anode plate 102. At the same time, both between the second baffle 107 and the fixing rod 104 and between the anode base 101 and the electroplating equipment are threadedly connected. In this way, the influence of the water flow impact force and the like on the anode assembly 10 and its components during electroplating can be reduced, thereby ensuring the stable progress of the electroplating work. When ensuring stable connection between the anode base 101 and the electroplating equipment and between the components of the anode assembly 10 and being convenient for replacement, other detachable connection methods can also be adopted, and the present application does not limit this here.

[0113] One embodiment disclosed in the present application also provides a vertical electroplating device, please refer to Figures 9 - 30 This vertical electroplating device includes the anode assembly 10 in the foregoing embodiment. The vertical electroplating device is used for electroplating the workpiece 20 to be electroplated so that a metal film is attached to all or part of the surface of the workpiece 20 to be electroplated.

[0114] In this embodiment, refer to Figures 9 - 21, the vertical electroplating equipment further includes an anode unit, an electroplating tank 30, a cathode unit 40, a driving mechanism 50, a power supply 60, and a liquid circulation mechanism 70. Specifically, the anode assembly 10 is disposed in the electroplating tank 30, and a plurality of anode assemblies 10 together form the anode unit; in the working state, the electroplating tank 30 is further filled with electroplating solution, and the anode member 102 is immersed in the electroplating solution to ensure the normal flow of cations during the electroplating process; the cathode unit 40 is configured to mount the workpiece to be electroplated 20; the driving mechanism 50 is configured to push the cathode unit 40 to move in the anode unit. If the anode assembly 10 includes only one anode member 102, when the cathode unit 40 moves in the anode unit, the workpiece to be electroplated 20 is located on one side of the anode member 102, and the cations ionized from the anode member 102 will be free and deposited on the surface of the workpiece to be electroplated 20, so that the workpiece to be electroplated 20 can be electroplated on one side. If the anode assembly 10 includes two anode members 102, when the cathode unit 40 moves in the anode unit, the workpiece to be electroplated 20 is located between the two anode members 102, and the cations ionized from the anode members 102 will be free and deposited on the surface of the workpiece to be electroplated 20, so that the workpiece to be electroplated 20 can be electroplated on both sides; the positive pole of the power supply 60 is connected to the anode assembly 10, and the negative pole of the power supply 60 is connected to the cathode unit 40, thereby forming an electric field circuit; the liquid circulation mechanism 70 is connected to the electroplating tank 30 and is configured to drive the electroplating solution to circulate, so as to form a liquid loop. In practical applications, refer to Figures 9 - 11 , to ensure the overall stability of the vertical electroplating equipment, the electroplating tank 30, the driving mechanism 50, and the liquid circulation mechanism 70 are all connected to the frame. Above, by pushing the cathode unit 40 to move in the anode unit through the driving mechanism 50, driving the workpiece to be electroplated 20 installed in the cathode unit 40 to move in the anode unit, the workpiece to be electroplated 20 can move in the electroplating solution, improving the electroplating efficiency. In addition, the liquid circulation mechanism 70 can drive the electroplating solution to circulate, which can supplement the concentration loss of the electroplating solution around the workpiece to be electroplated 20, further improving the electroplating efficiency and being beneficial to electroplating uniformity.

[0115] In an implementable embodiment, refer to Figures 9 - 11, a plurality of anode assemblies 10 are arranged in the electroplating tank 30. The plurality of anode assemblies 10 are spaced or continuously distributed along a preset direction to form an anode unit. The anode members 102 on the plurality of anode assemblies 10 in the anode unit all extend along the preset direction. Preferably, among the plurality of anode assemblies 10 belonging to the same anode unit, the anode members 102 on the same side are arranged coplanarly. Wherein, the preset direction is the moving direction of the workpiece to be electroplated 20 in the electroplating tank 30. Thus, when each anode assembly 10 belonging to the same anode unit includes two anode members 102, there is a certain distance between the two anode members 102, forming an anode channel 112. The plurality of anode channels 112 are connected to form an electroplating channel 113. Since in the anode assembly 10, the width of the liquid passing channel 1011 is greater than the thickness of the workpiece to be electroplated 20, and the two anode members 102 are located on both sides of the liquid passing channel 1011, the width of the formed anode channel 112 must be greater than the thickness of the workpiece to be electroplated 20 to allow the workpiece to be electroplated 20 to move in the anode channel 112. When the workpiece to be electroplated 20 moves along its length in the electroplating channel 113, the cations ionized by the two anode members 102 will respectively migrate to the electroplating surface close to them. Since the workpiece to be electroplated 20 in this embodiment is continuously electroplated in a vertical state, this electroplating method belongs to vertical continuous electroplating. Vertical continuous electroplating can ensure that the workpiece to be electroplated 20 can be evenly electroplated throughout the electroplating tank 30, thereby obtaining a uniform coating thickness.

[0116] In practical applications, a plurality of plating channels 113 are arranged in parallel in the plating tank 30, so that a plurality of workpieces to be plated 20 can be plated in the plating tank 30 simultaneously, thereby achieving continuous and efficient production. If only one plating channel 113 is provided, a sequential continuous plating method can be adopted. Specifically, after the workpiece to be plated 20 moves into the anode channel 112, the two anode members 102 will respectively plate the two sides of the workpiece to be plated 20. That is to say, even if the distance between the two anode members 102 is large enough, in the case of double-sided plating of the workpiece to be plated 20, the anode channel 112 can only allow one workpiece to be plated 20 to pass through at a time. Therefore, a plurality of workpieces to be plated 20 need to enter the plating channel 113 sequentially and intermittently. Without mutual influence between the workpieces to be plated 20, the smaller the interval time between adjacent workpieces to be plated 20 entering the plating channel 113, the higher the plating efficiency. If a plurality of plating channels 113 are provided simultaneously, a method of parallel and continuous plating of a plurality of workpieces to be plated 20 can be adopted. Specifically, a plurality of workpieces to be plated 20 can be installed on the cathode unit 40 at the same time. The installed plurality of workpieces to be plated 20 are parallel to each other and the number is equal to the number of plating channels 113, so that a plurality of workpieces to be plated 20 can enter the plating channel 113 for plating at the same time. In this method, only the cathode unit 40 needs to install multiple groups of workpieces to be plated 20 at the same time. The plurality of workpieces to be plated 20 located in the same cathode unit 40 are taken as a group, and multiple groups of workpieces to be plated 20 enter the plating channel 113 sequentially and intermittently. Since the plurality of plating channels 113 are independent of each other, when a plurality of plating channels 113 are provided, for a single plating channel 113, the way the workpiece to be plated 20 enters is the same as when only one plating channel 113 is provided. The method of parallel installation of a plurality of workpieces to be plated 20 can reduce the space occupied by the installation components compared with single installation, and the plurality of workpieces to be plated 20 move in parallel, which is convenient for management and adjustment of the interval time. It can be seen that setting a plurality of plating channels 113 in the plating tank 30 can effectively improve the plating efficiency of the vertical plating equipment.

[0117] In an implementable embodiment, referring to Figure 12 、 Figure 17 、 Figure 24 , a first partition 301 is horizontally arranged in the plating tank 30, and the plating tank 30 is divided into a plating sub-tank 303 and a liquid supply chamber 304 by the first partition 301. The plating sub-tank 303 is located above the liquid supply chamber 304. Among them, the anode assembly 10 is arranged in the plating sub-tank 303, a liquid supply assembly 80 is arranged in the liquid supply chamber 304, and the plating liquid is conveyed to the plating sub-tank 303 through the liquid supply assembly 80. Specifically, by horizontally arranging the first partition 301, the plating tank 30 is divided into upper and lower parts, and the liquid supply chamber 304 located below can accurately supply liquid to the anode assembly 10 in the plating sub-tank 303 through the liquid supply assembly 80.

[0118] If the first partition 301 is vertically arranged, the range of the electroplating sub-tank 303 in the horizontal direction will be reduced. Since the workpiece to be electroplated 20 needs to be moved by the driving mechanism 50, the anode assembly 10 cannot be arranged in a multi-layer structure in the vertical direction. Therefore, reducing the range of the electroplating sub-tank 303 in the horizontal direction will decrease the number of the anode assemblies 10 arranged, thereby changing the length or the number of the anode channels 112, affecting the electroplating quality and reducing the electroplating efficiency. If the number of the anode assemblies 10 arranged is not to be changed, the space of the electroplating tank 30 in the horizontal direction needs to be enlarged, thus resulting in an increase in the volume and the occupied space of the vertical electroplating equipment and increasing the production cost of the vertical electroplating equipment.

[0119] In addition, when the first partition 301 is vertically arranged, the electroplating tank 30 will be divided into two parts, the liquid supply chamber 304 and the electroplating sub-tank 303 are arranged adjacent to each other in the horizontal direction. When the liquid supply chamber 304 conveys the electroplating solution to the electroplating sub-tank 303 through the liquid supply assembly 80, the electroplating solution can only enter the electroplating sub-tank 303 in the horizontal direction. However, the liquid passing channel 1011 is opened on the anode base 101, which is equivalent to restricting the conveying direction of the electroplating solution and making the electroplating solution need to enter from the vertical direction of the electroplating sub-tank 303. Therefore, when the first partition 301 is vertically arranged, the liquid supply chamber 304 cannot accurately supply the electroplating solution to the anode assembly 10 in the electroplating sub-tank 303.

[0120] In an implementable embodiment, refer to Figure 12 、 Figure 15 、 Figure 16, the liquid supply assembly 80 at least includes a flow dividing pipe 801. One end of the flow dividing pipe 801 is connected to the liquid circulation mechanism 70, and the other end passes through the first partition 301 and is connected to the electroplating sub-tank 303 to convey electroplating solution into the electroplating channel 113. Among them, the number of flow dividing pipes 801 will be equal to the number of electroplating channels 113 or equal to the number of anode assemblies 10. If the number of flow dividing pipes 801 is equal to the number of electroplating channels 113, the flow dividing pipe 801 is connected to the liquid passing channel 1011 of any one anode assembly 10 in the electroplating channel 113, and conveys the electroplating solution into the anode channel 112 of the anode assembly 10. After the electroplating solution flows out through the liquid passing channel 1011, it will first flow towards the drainage port 1071. When there is enough electroplating solution, part of the electroplating solution will diffuse to the other anode channels 112. In this way, an electroplating channel 113 can convey electroplating solution through only one flow dividing pipe 801. If the number of flow dividing pipes 801 is equal to the number of anode assemblies 10, the flow dividing pipes 801 correspond to the liquid passing channels 1011 one by one, and the flow dividing pipes 801 convey the electroplating solution obtained from the liquid circulation mechanism 70 into the corresponding anode assemblies 10. The method of supplying liquid to the electroplating channel 113 through only one flow dividing pipe 801 is convenient for controlling the flow dividing pipe 801 when there are multiple electroplating channels 113 in the electroplating tank 30, simplifies the pipeline structure, and reduces the occupied space of the liquid supply assembly 80. The method of supplying liquid to the electroplating channel 113 through multiple flow dividing pipes 801 simultaneously can supply liquid to multiple anode assemblies 10 evenly at the same time.

[0121] Further, referring to Figure 22 , the flow dividing pipe 801 and the liquid circulation mechanism 70 are connected through a flow equalizing assembly. The flow equalizing assembly includes a liquid supply pipe 802 and a flow equalizing pipe 803. Both ends of the liquid supply pipe 802 are respectively connected to the flow equalizing pipe 803 and the liquid circulation mechanism 70. The liquid supply pipe 802 is connected to the middle position of the length direction of the flow equalizing pipe 803 and extends equidistantly in the direction away from the center point. Among them, one end of the flow dividing pipe 801 is arranged on the flow equalizing pipe 803 and is connected to the flow equalizing pipe 803, and the other end is connected to the electroplating channel 113. Specifically, when the liquid supply pipe 802 conveys electroplating solution into the flow equalizing pipe 803, the electroplating solution enters the flow equalizing pipe 803 from the middle of the flow equalizing pipe 803 and first diffuses towards both ends of the flow equalizing pipe 803. Since the ends of the flow equalizing pipe 803 are in a closed state, the liquid level of the electroplating solution will rise evenly after flowing to the ends of the flow equalizing pipe 803. That is to say, when there are multiple flow dividing pipes 801, the electroplating solution will enter multiple flow dividing pipes 801 through the flow equalizing pipe 803 at the same time.

[0122] Different from the above method of supplying liquid to the flow dividing pipe 801 through the flow equalizing assembly, in an implementable embodiment, referring to Figure 23, the shunt pipe 801 is communicated with the liquid circulation mechanism 70 through a liquid supply pipe 802. The liquid supply pipe 802 includes a main liquid supply pipe 8021 and a branch liquid supply pipe 8022. Both ends of the main liquid supply pipe 8021 are respectively communicated with the liquid circulation mechanism 70 and the branch liquid supply pipe 8022. One end of the shunt pipe 801 is arranged on the branch liquid supply pipe 8022 and is communicated with the branch liquid supply pipe 8022, and the other end is communicated with the electroplating channel 113. In this way, the electroplating solution flowing out of the liquid circulation mechanism 70 will flow through the main liquid supply pipe 8021, the branch liquid supply pipe 8022, and the shunt pipe 801 in sequence until it flows into the electroplating channel 113. In this embodiment, the multiple shunt pipes 801 can be distributed based on the distance between the electroplating channel 113 and the branch liquid supply pipe 8022. Specifically, taking the connection point of the branch liquid supply pipe 8022 and the main liquid supply pipe 8021 as the starting point, the shunt pipes 801 with gradually decreasing lengths are connected in sequence. The length of the shunt pipe 801 is positively correlated with the distance between the electroplating channel 113 and the branch liquid supply pipe 8022, that is, the farther the distance between the electroplating channel 113 and the branch liquid supply pipe 8022, the longer the shunt pipe 801 is required to connect it with the branch liquid supply pipe 8022. That is to say, the electroplating solution flowing into the branch liquid supply pipe 8022 through the main liquid supply pipe 8021 will enter the shunt pipes 801 with increasing distances from it in sequence, and the lengths of these shunt pipes 801 gradually decrease so that the time point differences of the electroplating solution flowing into the multiple electroplating channels 113 are smaller.

[0123] In an implementable embodiment, refer to Figure 15 , Figure 16 , the liquid supply assembly 80 further includes a jet pipe 806. The jet pipe 806 includes a main jet pipe 804 and a branch jet pipe 805. One end of the main jet pipe 804 is communicated with the liquid circulation mechanism 70, and the other end extends below the electroplating channel 113 and is connected to the branch jet pipe 805; both ends of the branch jet pipe 805 extend away from the main jet pipe 804 until the length of the branch jet pipe 805 is equal to that of the electroplating channel 113. A plurality of nozzles are arranged on the branch jet pipe 805, and the nozzles are communicated with the electroplating sub-tank 303. Specifically, when there are multiple electroplating channels 113, the jet pipe 806 is communicated with the liquid circulation mechanism 70 through a liquid replenishing pipe. Among them, the function and structure of the liquid replenishing pipe are the same as those of the above-mentioned liquid supply pipe 802, that is, the electroplating solution in the liquid circulation mechanism 70 is simultaneously transported to a plurality of jet pipes 806 by using the liquid replenishing pipe.

[0124] In this embodiment, one spray branch pipe 805 corresponds to one electroplating channel 113, and the electroplating channel 113 is supplied with liquid through a plurality of spray heads arranged thereon. Among them, the number of spray heads is equal to the number of anode assemblies 10, and they are in one-to-one correspondence with the liquid passing channels 1011 of the anode assemblies 10 up and down. In order to enable the plurality of anode assemblies 10 in the same electroplating channel 113 to be evenly supplied with liquid, the spray main pipe 804 is connected to the middle position in the length direction of the spray branch pipe 805, so that the liquid level of the electroplating solution in the spray branch pipe 805 can evenly rise and enter the spray heads.

[0125] Furthermore, a plurality of liquid supply ports are provided on the first partition plate 301, and the liquid passing channels 1011 correspond to the positions of at least one liquid supply port. Specifically, the number of liquid supply ports is greater than or equal to the number of liquid passing channels 1011. When the number of liquid supply ports is equal to the number of liquid passing channels 1011, the anode base 101 can be installed according to the positions of the liquid supply ports to ensure that the liquid passing channels 1011 correspond to the positions of the liquid supply ports after installation. When the number of liquid supply ports is greater than the number of liquid passing channels 1011, each anode base 101 can adjust its installation position as needed, as long as it is ensured that the liquid passing channels 1011 correspond to the positions of at least one liquid supply port, or the liquid passing channels 1011 of each anode base 101 can correspond to the positions of more than one liquid supply port to increase the amount of electroplating solution entering the anode channel 112.

[0126] Among them, the number of liquid supply ports and spray heads below the same electroplating channel 113 is equal, and their positions correspond up and down. The spray heads pass through the liquid supply ports and are connected to the electroplating channel 113, so that the electroplating solution flows into the liquid passing channels 1011 through the spray pipe 806. When the number of liquid supply ports below one liquid passing channel 1011 is greater than the number of spray heads, it can be selectively blocked. If the electroplating sub-tank 303 and the liquid supply chamber 304 are connected through the liquid supply ports or other openings, the consumption of the electroplating solution during electroplating of the vertical electroplating equipment will increase, while blocking the liquid supply ports will increase the cost of blocking components and labor costs, reducing the electroplating efficiency.

[0127] In an implementable embodiment, refer to Figure 11 、 Figure 12 、 Figure 25, the liquid circulation mechanism 70 at least includes a liquid storage barrel 701, a circulation pump, and a circulation pipeline 702. Specifically, the circulation pipeline 702 includes a circulation inlet pipe 7021 and a circulation outlet pipe 7022. The liquid supply pipe 802 and the jet pipe 806 are both connected to the circulation inlet pipe 7021; one end of the circulation inlet pipe 7021 is connected to the circulation pump, and the other end is connected to the electroplating tank 30. The circulation pump is connected to the liquid storage barrel 701; a second partition plate 302 is further provided in the electroplating tank 30. The second partition plate 302 is horizontally arranged in the liquid supply chamber 304 to partition the lower part of the liquid supply chamber 304 to form a liquid storage tank 305. The liquid storage tank 305 is located below the liquid supply chamber 304 and is independent of the liquid supply chamber 304. The circulation outlet pipe 7022 is connected to the liquid storage tank 305, and the circulation outlet pipe 7022 is connected to the inlet of the liquid storage barrel 701; the electroplating sub-tank 303 has a circulation tank 306 communicating with the liquid storage tank 305, and the circulation tank 306 is independent of the liquid supply chamber 304. Preferably, the liquid storage barrel 701 has a filtering function and can filter impurities in the electroplating solution.

[0128] See Figure 12 , Figure 17 , Figure 24 , by horizontally arranging the first partition plate 301 and the second partition plate 302, the electroplating tank 30 is sequentially partitioned from top to bottom into an electroplating sub-tank 303, a liquid supply chamber 304, and a liquid storage tank 305, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved. In addition, when the existing electroplating equipment circulates the electroplating solution, it directly sucks the electroplating solution in the electroplating sub-tank 303. This method is prone to insufficient liquid volume in the electroplating sub-tank 303 due to reasons such as too fast rotation speed of the circulation pump. However, in this application, the circulation pump is used to suck the electroplating solution in the liquid storage tank 305. The electroplating solution in the liquid storage tank 305 is the electroplating solution that overflows from the electroplating sub-tank 303, that is, the overflowing electroplating solution is the excess electroplating solution in the electroplating sub-tank 303. The remaining electroplating solution in the electroplating sub-tank 303 can still complete the electroplating of the workpiece to be electroplated 20. In this way, using the liquid storage tank 305 for electroplating solution circulation can reduce the impact of the circulating electroplating solution on electroplating work.

[0129] Among them, see Figure 24 , both sides of the first partition plate 301 and the second partition plate 302 are connected to the inner wall of the electroplating tank 30. At least one end of the first partition plate 301 is provided with a circulation partition plate 307, and there is a certain distance between the circulation partition plate 307 and the inner wall of the electroplating tank 30. The bottom of the circulation partition plate 307 extends downward until it is connected to the end of the second partition plate 302, thereby forming a circulation tank 306. That is, when the liquid level in the electroplating sub-tank 303 exceeds the height of the circulation partition plate 307, it will enter the circulation tank 306 and flow to the liquid storage tank 305.

[0130] In practical applications, the electroplating solution flows into the electroplating sub-tank 303 through the circulating inlet pipe 7021. When the electroplating solution in the electroplating tank 30 is excessive, it will overflow into the circulating tank 306 and flow into the liquid storage tank 305 through the circulating tank 306. The electroplating solution in the liquid storage tank 305 enters the liquid storage barrel 701 through the circulating outlet pipe 7022 under the suction of the circulating pump. In this way, one cycle of the electroplating solution can be completed.

[0131] In this embodiment, the electroplating solution can enter the electroplating sub-tank 303 through the shunt pipe 801 and / or the jet pipe 806. The flow direction of the electroplating solution can be controlled by setting a three-way valve or an adjusting valve 94. When a three-way valve is set, the water inlet of the three-way valve is connected to the circulating liquid inlet pipe 7021, the first water outlet of the three-way valve is connected to the shunt pipe 801, and the second water outlet is connected to the jet pipe 806. Since the shunt pipe 801 transports a large amount of electroplating solution into the electroplating channel 113 through a pipeline and then distributes it, when a large amount of liquid needs to be replenished in the electroplating sub-tank 303 during the start-up or operation of the vertical electroplating equipment, the first water outlet can be opened and the second water outlet can be closed to connect the circulating liquid inlet pipe 7021 with the shunt pipe 801, and the electroplating solution flows into the electroplating channel 113 through the shunt pipe 801. The jet pipe 806 replenishes the anode assembly 10 separately through multiple nozzles. When the electroplating solution in the electroplating sub-tank 303 is sufficient and in a stable operation state, the second water outlet can be opened and the first water outlet can be closed to connect the circulating liquid inlet pipe 7021 with the jet pipe 806, and the electroplating solution flows into the corresponding liquid passing channel 1011 through the nozzles. Since the three-way valve can only keep one of its two water outlets open, in order to enable the electroplating solution to flow into the electroplating sub-tank 303 through both the shunt pipe 801 and the jet pipe 806 at the same time, adjusting valves 94 can also be set on the shunt pipe 801 and the jet pipe 806. Specifically, one end of the circulating liquid inlet pipe 7021 is connected to the liquid outlet of the liquid storage tank 701, and the other end is provided with a three-way joint. The other two interfaces of the three-way joint are respectively connected to the shunt pipe 801 and the jet pipe 806. When the amount of electroplating solution in the electroplating sub-tank 303 is sufficient, one of the adjusting valves 94 can be selected to open, so that the electroplating solution in the liquid storage tank 701 flows into the electroplating sub-tank 303 through the shunt pipe 801 or the jet pipe 806. When the amount of electroplating solution in the electroplating tank 30 is insufficient, both of the adjusting valves 94 can be selected to open to replenish a large amount of liquid to the electroplating sub-tank 303. Among them, when the shunt pipe 801 and the jet pipe 806 transport electroplating solution to the electroplating tank 30 at the same time, since the nozzles directly replenish the liquid passing channel 1011, the shunt pipe 801 is connected to other parts of the electroplating sub-tank 303. For example, when there are multiple mounting grooves 1012 on the anode base 101 of the anode assembly 10, multiple mounting grooves 1012 that are far from the liquid passing channel 1011 and do not have anode parts 102 installed in one anode assembly 10 will form an electroplating solution flow area, and the electroplating solution flow areas of two adjacent anode assemblies 10 will be connected. At this time, the shunt pipe 801 can replenish the electroplating solution flow area, thereby increasing the amount of electroplating solution in the electroplating tank 30.

[0132] In an implementable embodiment, refer to Figure 25, a liquid level sensor 91 is provided in the electroplating tank 30, and the liquid level sensor 91 is located in the electroplating sub-tank 303 to monitor the amount of electroplating solution in the electroplating sub-tank 303. Specifically, the vertical electroplating equipment further includes a controller 90. There is a communication line (wired or wireless communication line) between the liquid level sensor 91 and the controller 90. The controller 90 can receive the signal sent by the liquid level sensor 91, and then obtain the real-time liquid level in the electroplating sub-tank 303. Before the vertical electroplating equipment is used, the liquid level threshold range of the liquid level sensor 91 can be preset to control the amount of electroplating solution in the electroplating sub-tank 303. When the electroplating liquid level in the electroplating sub-tank 303 is not within the set liquid level threshold range, the liquid level sensor 91 can be fed back to the controller 90 via the above communication line, and then the controller 90 issues a reminder in the form of sound, light and electricity. In addition, the controller 90 is also electrically connected to the circulation pump and the regulating valve 94, so that the controller 90 can control the opening of the outlet valve of the circulation pump and the opening and closing of the regulating valve 94 when the electroplating liquid level in the electroplating sub-tank 303 is not within the set liquid level threshold range.

[0133] For example, assume that the liquid level threshold range of the liquid level sensor 91 is H1, and the electroplating liquid level of the electroplating sub-tank 303 is H2. When H2 < H1, it indicates that the amount of electroplating solution in the electroplating sub-tank 303 is too small. The reason for this situation may be that the supply amount of the electroplating solution transported to the electroplating sub-tank 303 by the liquid supply assembly 80 is too small. After the controller 90 receives the signal from the liquid level sensor 91 that the liquid level is lower than the liquid level threshold range, it first determines the opening and closing states of the two regulating valves 94 at this time. If both of the two regulating valves 94 are in the open state, the electroplating solution in the electroplating sub-tank 303 can be directly increased manually or by an automated device. If only one regulating valve 94 is in the open state, the other regulating valve 94 can be opened. At this time, the amount of electroplating solution transported to the electroplating sub-tank 303 by the liquid supply assembly 80 increases, and the amount of electroplating solution pumped out of the electroplating sub-tank 303 by the circulation pump decreases, so that the liquid level in the electroplating sub-tank 303 shows a stable growth state.

[0134] Furthermore, referring to Figure 25 , flow sensors 92 are provided on both the shunt pipe 801 and the spray pipe 806 to monitor the flow rate of the electroplating solution flowing into the electroplating sub-tank 303 in real time. Specifically, the flow sensor 92 is electrically connected to the controller 90. The controller 90 can receive the signal sent by the flow sensor 92, and then obtain the real-time flow rate in the shunt pipe 801 and the spray pipe 806. Among them, before the vertical electroplating equipment is used, the flow rate threshold range of the flow sensor 92 can be preset to monitor the amount of electroplating solution flowing into the electroplating sub-tank 303 through the shunt pipe 801 and the spray pipe 806 in real time. The controller 90 can control the opening of the regulating valve 94 according to the signal obtained from the flow sensor 92 to control the flow rate of the electroplating solution in the shunt pipe 801 and the spray pipe 806.

[0135] In an achievable implementation, the liquid storage barrel 701 contains the original electroplating solution. Since the concentration of cations in the electroplating solution in the electroplating sub-tank 303 will decrease compared to the original solution after long-term use, returning it to the liquid storage barrel 701 for mixing and precipitation with the original solution can increase the concentration of cations in the electroplating solution that returns to the electroplating sub-tank 303 via the liquid storage barrel 701. To ensure an increase in the concentration of cations in the electroplating solution that reflows into the electroplating sub-tank 303, the maintenance personnel need to regularly supplement the original electroplating solution into the liquid storage barrel 701. If the electroplating solution flowing out through the liquid passage 1011 to the surface of the workpiece to be electroplated 20 is not mixed with the original solution but the electroplating solution in the electroplating sub-tank 303 is recycled, after a certain period of time, the concentration of cations reaching the surface of the workpiece to be electroplated 20 may gradually decrease, resulting in an insufficient thickness of the coating being formed on the surface of the workpiece to be electroplated 20.

[0136] In an achievable implementation, referring to Figure 25 , a temperature sensor 93 is provided in the electroplating tank 30, and the temperature sensor 93 is located in the electroplating sub-tank 303. Among them, the temperature sensor 93 is electrically connected to the controller 90, and the controller 90 can receive the signal sent by the temperature sensor 93 to obtain the real-time temperature of the electroplating sub-tank 303. During the electroplating production process, the temperature of the electroplating solution will change due to the heat generated during processing or the change in room temperature. However, when the temperature of the electroplating solution does not meet the process requirements, it will have a greater impact on the firmness, uniformity, flatness, and surface finish of the coating on the surface of the electroplated product produced.

[0137] Therefore, in an implemented embodiment, a temperature control component 100 is further included in the vertical electroplating equipment. Specifically, the temperature control component 100 includes a heat exchanger 1001, a liquid supply barrel 1002, a temperature control pump, and heat exchange pipes. The liquid outlet of the liquid supply barrel 1002 is connected to the first heat exchange pipe 1003 and communicates with the first liquid inlet of the heat exchanger 1001 through the first heat exchange pipe 1003. The first liquid outlet of the heat exchanger 1001 is connected to the second heat exchange pipe 1004 and communicates with the liquid inlet of the liquid supply barrel 1002 through the second heat exchange pipe 1004, so as to form a first loop composed of the first heat exchange pipe 1003, the second heat exchange pipe 1004, the liquid supply barrel 1002, and the heat exchanger 1001, and the heat exchange liquid flows within the first loop; the heat exchange outlet of the liquid storage barrel 701 is connected to the third heat exchange pipe 1005 and communicates with the second liquid inlet of the heat exchanger 1001 through the third heat exchange pipe 1005. The second liquid outlet of the heat exchanger 1001 is connected to the fourth heat exchange pipe 1006 and communicates with the heat exchange inlet of the liquid storage barrel 701 through the fourth heat exchange pipe 1006, so as to form a second loop composed of the third heat exchange pipe 1005, the fourth heat exchange pipe 1006, the liquid storage barrel 701, and the heat exchanger 1001, and the electroplating solution flows within the second loop. Among them, there are two temperature control pumps, which are respectively arranged on the first loop and the second loop, so that the heat exchange liquid flowing out of the liquid supply barrel 1002 circulates within the first loop, and the electroplating solution circulates within the second loop. The electroplating solution in circulation exchanges heat with the heat exchange liquid through the heat exchanger 1001. The electroplating solution after heat exchange flows into the liquid storage barrel 701, and then enters the electroplating sub-tank 303 through the circulating liquid inlet pipe 7021, so as to complete the regulation of the temperature of the electroplating solution in the electroplating sub-tank 303.

[0138] In practical applications, the above solution uses a plate heat exchanger to exchange the heat of liquids. Specifically, the electroplating solution enters the flow channel of the plate heat exchanger through the second loop, and the heat exchange liquid enters another flow channel of the plate heat exchanger through the first loop. Heat transfer is carried out through the temperature difference existing between the two liquids. The electroplating solution and the heat exchange liquid after heat exchange then enter the second loop and the first loop respectively, so that the temperature of the electroplating solution flowing into the liquid storage barrel 701 through the plate heat exchanger is lower than the temperature of the electroplating solution flowing out of the liquid storage barrel 701, or the temperature of the electroplating solution flowing into the liquid storage barrel 701 through the plate heat exchanger is higher than the temperature of the electroplating solution flowing out of the liquid storage barrel 701.

[0139] In this embodiment, refer to Figure 25, a solenoid valve 95 is provided on the third heat exchange pipe 1005. The controller 90 is electrically connected to both the solenoid valve 95 and the temperature control pump, and controls the opening and closing of the solenoid valve 95 and the temperature control pump according to the real-time temperature of the electroplating sub-tank 303 obtained, so as to adjust the temperature of the electroplating solution in the electroplating sub-tank 303. For example, assume that the preset temperature range of the electroplating solution in the electroplating sub-tank 303 is T2 - T1. When the heat generated during electroplating is too high, or the temperature in the electroplating workshop is too high, the actual temperature of the current electroplating solution obtained by the temperature sensor 93 is T3, and T3 is greater than the highest value T1 in the working temperature range. In order to keep the temperature of the electroplating solution in the electroplating sub-tank 303 within the preset temperature range, after receiving the signal from the temperature sensor 93, the controller 90 controls the solenoid valve 95 and the temperature control pump to open, so that the electroplating solution in the liquid storage bucket 701 enters the second loop, exchanges heat with the heat exchange liquid, and then flows back to the liquid storage bucket 701. In order to cool down the electroplating solution in the electroplating sub-tank 303, the liquid contained in the supply bucket 1002 at this time is a coolant. In this way, after the electroplating solution exchanges heat with the coolant, the temperature of the electroplating solution flowing into the liquid storage bucket 701 will be lower than the temperature of the electroplating solution flowing out of the liquid storage bucket 701. After the cooled electroplating solution is continuously transported into the electroplating sub-tank 303, the temperature of the electroplating solution in the electroplating sub-tank 303 can be reduced to T4, and T2 < T4 ≤ T1 < T3, until T2 < T4 < T1, and then the controller 90 can control the solenoid valve 95 and the temperature control pump to close; correspondingly, when the temperature in the electroplating workshop is too low, the actual temperature of the current electroplating solution obtained by the temperature sensor 93 is T5, and T5 is less than the lowest value T2 in the working temperature range. In order to keep the temperature of the electroplating solution in the electroplating sub-tank 303 within the preset temperature range, after receiving the signal from the temperature sensor 93, the controller 90 controls the solenoid valve 95 and the temperature control pump to open, so that the electroplating solution in the liquid storage bucket 701 enters the second loop, exchanges heat with the heat exchange liquid, and then flows back to the liquid storage bucket 701. In order to heat up the electroplating solution in the electroplating sub-tank 303, the liquid contained in the supply bucket 1002 at this time is hot water with a temperature higher than that of the electroplating solution. In this way, after the electroplating solution exchanges heat with the hot water, the temperature of the electroplating solution flowing into the liquid storage bucket 701 will be higher than the temperature of the electroplating solution flowing out of the liquid storage bucket 701. After the heated electroplating solution is continuously transported into the electroplating sub-tank 303, the temperature of the electroplating solution in the electroplating sub-tank 303 can be increased to T6, and T5 < T2 ≤ T6 < T1, until T2 < T6 < T1, and then the controller 90 can control the solenoid valve 95 and the temperature control pump to close.

[0140] In order to avoid the impurities generated during electroplating from affecting the electroplating quality of the workpiece to be electroplated 20, in an achievable implementation, see Figure 11 , Figure 12 , Figure 15, the vertical electroplating equipment further includes a filter 703. By arranging the filter 703 on the electroplating solution circulation loop, the recycled electroplating solution is filtered. Specifically, a filter 703 is provided at one end of the circulating liquid outlet pipe 7022 communicating with the liquid storage tank 305. The filter 703 is located in the liquid storage tank 305. A plurality of filter holes 7031 are formed in the filter 703. The electroplating solution in the electroplating sub-tank 303 flows through the circulation tank 306, the liquid storage tank 305, the filter 703 and the circulating liquid outlet pipe 7022 in sequence, and enters the liquid storage barrel 701. Since the liquid storage tank 305 is independently arranged, impurities will be filtered and retained in the liquid storage tank 305 without backflow of the electroplating solution, so that the electroplating solution transported from the liquid storage barrel 701 to the electroplating sub-tank 303 is free of impurities.

[0141] Furthermore, a plurality of filter holes 7031 are uniformly arranged on the side wall of the filter 703. If the filter holes 7031 are arranged on the upper surface of the filter 703, under the suction force of the circulation pump, the electroplating solution on the surface layer of the liquid storage tank 305 is less resistant and will flow to the filter 703 faster. Since the amount of electroplating solution overflowing from the electroplating sub-tank 303 is limited, the electroplating solution in the liquid storage tank 305 cannot be replenished in time, resulting in a negative pressure area above the filter holes 7031 in the liquid storage tank 305. The negative pressure area will drive the surrounding electroplating solution to flow faster, and the electroplating solution near the edge of the liquid storage tank 305 will move towards the negative pressure area and rotate to form a vortex. Therefore, to avoid the above phenomenon, the filter 703 arranges a plurality of filter holes 7031 uniformly on its side wall, so that the electroplating solution in the liquid storage tank 305 can continuously and stably flow into the circulating liquid outlet pipe 7022.

[0142] Even further, a filter 703 is provided on the circulating liquid inlet pipe 7021 to prevent impurities from being contained in the electroplating solution flowing into the electroplating sub-tank 303, thereby affecting the electroplating effect. It should be noted that to prevent the filter holes 7031 from being blocked by impurities after long-term use, the maintenance personnel can regularly remove the filter 703 for cleaning or replacement.

[0143] In an implementable embodiment, in order to prevent the electroplating solution in the electroplating tank 30 from leaking, sealing rings are provided at the parts where the circulating liquid inlet pipe 7021, the shunt pipe 801 and the jet pipe 806 are connected to the electroplating tank 30. The sealing rings can be made of rubber material, and the gaps between the pipes and the electroplating tank 30 are sealed by using the elasticity of the rubber material itself.

[0144] In an implementable embodiment, refer to Figures 12 - 14 , Figures 17 - 19 , Figures 27 - 31, the cathode unit 40 includes a conductive component 401 and a mounting component 402. Specifically, the mounting component 402 at least includes a cathode support frame 4021 and a cathode connecting rod 4025. The workpiece to be electroplated 20 is installed inside the cathode support frame 4021, and the cathode support frame 4021 is installed on the cathode connecting rod 4025; the conductive component 401 at least includes a conductive block 4011. A substrate 4013 is arranged along the length of the electroplating tank 30, and a conductive bar 4012 is arranged on the substrate 4013. The conductive bar 4012 extends along the length direction of the electroplating tank 30. The conductive block 4011 is connected to the end of the cathode connecting rod 4025 (directly or indirectly), and the conductive block 4011 is in contact with the conductive bar 4012; wherein, both the substrate 4013 and the mounting component 402 are insulators, the conductive block 4011, the conductive bar 4012 and the conductive wire are all conductors. The workpiece to be electroplated 20 is electrically connected to the conductive block 4011 through the conductive wire, and the conductive bar 4012 is electrically connected to the negative electrode of the power supply 60. When the driving mechanism 50 pushes the cathode unit 40 and the cathode unit 40 moves along the length of the electroplating tank 30, the conductive block 4011 transmits the current obtained from its contact with the conductive bar 4012 to the workpiece to be electroplated 20.

[0145] In this embodiment, referring to Figures 27 - 31 , the cathode support frame 4021 includes a support frame body 40211 and a bearing frame body 40215. The support frame body 40211 is connected to the bearing frame body 40215. The bearing frame body 40215 has a bearing groove 40216, and the bearing groove 40216 can accommodate the workpiece to be electroplated 20 for installation. Among them, the support frame body 40211 has a first support portion 40212 and a second support portion 40213. The two ends of the first support portion 40212 are respectively connected to the two second support portions 40213. The ends of the second support portion 40213 away from the first support portion 40212 extend towards both sides respectively and are connected to the bearing frame body 40215. Preferably, when the distance between the ends of the two second support portions 40213 away from each other is greater than the width of the bearing frame body 40215, the inner wall of the second support portion 40213 is connected to the outer wall of the bearing frame body 40215; when the distance between the ends of the two second support portions 40213 away from each other is equal to the width of the bearing frame body 40215, the bottom of the second support portion 40213 is connected to the top of the bearing frame body 40215; when the distance between the ends of the two second support portions 40213 away from each other is less than the width of the bearing frame body 40215, the outer wall of the second support portion 40213 is connected to the inner wall of the bearing frame body 40215.

[0146] Further, a connecting rod support groove for installing the first support portion 40212 is formed on the cathode connecting rod 4025. The number of the connecting rod support grooves is less than or equal to the number of the electroplating channels 113, and the distance between two adjacent connecting rod support grooves is equal to the distance between the liquid passing channels 1011 in two adjacent electroplating channels 113, so that a plurality of workpieces to be electroplated 20 can enter the electroplating channels 113 corresponding to their positions simultaneously and move above the liquid passing channels 1011 of the anode assembly 10. To ensure that the support frame body 40211 will not shake due to inertia or other reasons during movement, resulting in uneven plating layers on the workpieces to be electroplated 20, threaded holes are provided on both the first support portion 40212 and the connecting rod support groove, and the two threaded holes are both matched with the same bolt, so that a threaded connection can be achieved between the cathode support frame 4021 and the cathode connecting rod 4025.

[0147] Furthermore, referring to Figures 27 - 31 , a support block 40214 is further provided on the first support portion 40212. One end of the support block 40214 is arranged on the first support portion 40212, and the other end extends towards the bearing frame body 40215. When the first support portion 40212 is installed in the connecting rod support groove, the support block 40214 contacts the cathode connecting rod 4025. If only one support block 40214 is provided, to avoid the support frame body 40211 shaking due to inertia during movement, the support block 40214 is located on the same side of the moving direction. For example, when the moving direction is to the right, the support block 40214 is arranged on the right side of the first support portion 40212. When the cathode connecting rod 4025 moves to the right, the cathode support frame 4021 can limit the moving range on its right side through the support block 40214, thereby reducing the shaking probability and shaking amplitude of the support block 40214. If two support blocks 40214 are provided, the distance between the two support blocks 40214 is greater than or equal to the width of the cathode connecting rod 4025, so that when the first support portion 40212 is installed in the connecting rod support groove, the two support blocks 40214 are respectively located on both sides of the cathode connecting rod 4025. When the cathode connecting rod 4025 moves, the cathode support frame 4021 can limit its moving range through the support blocks 40214, thereby reducing the shaking probability and shaking amplitude of the support block 40214.

[0148] It should be noted that the orthographic projection area of the bearing groove 40216 on a preset vertical plane is greater than or equal to the orthographic projection area of the workpiece to be electroplated 20 on the same preset vertical plane, so that the workpiece to be electroplated 20 can be installed in the bearing groove 40216. When the orthographic projection area of the bearing groove 40216 on the preset vertical plane is equal to the orthographic projection area of the workpiece to be electroplated 20 on the same preset vertical plane, the inner wall of the bearing groove 40216 will wear the outer edge of the workpiece to be electroplated 20. When the orthographic projection area of the bearing groove 40216 on the preset vertical plane is greater than the orthographic projection area of the workpiece to be electroplated 20 on the same preset vertical plane, the workpiece to be electroplated 20 may fall or shift in position due to unstable installation.

[0149] To solve the problem of unstable installation of the workpiece to be electroplated 20 described above, in a feasible implementation, refer to Figures 27 - 31 , a plurality of bearing blocks 40217 are arranged in the bearing groove 40216. The bearing blocks 40217 are used to reduce the distance between the inner wall of the bearing groove 40216 and the workpiece to be electroplated 20, so as to support the workpiece to be electroplated 20. Specifically, the plurality of bearing blocks 40217 are arranged along the inner wall of the bearing groove 40216 to achieve multi-directional support for the workpiece to be electroplated 20. Further, an opening is provided on the bearing block 40217. When the edge of the workpiece to be electroplated 20 is installed in the opening, the movement range of the workpiece to be electroplated 20 can be restricted by the side wall of the opening, avoiding large-amplitude shaking and falling of the workpiece to be electroplated 20 during the movement process. Furthermore, the opening can be set to a structure with a gradually decreasing width from top to bottom, so as to guide the workpiece to be electroplated 20 during the process of installing it in the bearing groove 40216 and reduce the gap between the workpiece to be electroplated 20 and the side wall of the opening. It should be noted that when ensuring that the workpiece to be electroplated 20 can be stably installed in the bearing groove 40216, the opening of the bearing block 40217 can adopt any shape, such as V-shaped or X-shaped, etc., and the present application does not limit this.

[0150] Different from the above method of setting an opening on the bearing block 40217, in another feasible implementation, a plurality of bearing block groups are arranged in the bearing groove 40216, and each bearing block group includes two bearing blocks 40217. The plurality of bearing block groups are arranged along the inner wall of the bearing groove 40216. Specifically, there is a certain gap between the two bearing blocks 40217 to form a bearing area 40218 for installing the workpiece to be electroplated 20. Among them, the width of the bearing area 40218 is greater than the thickness of the workpiece to be electroplated 20. If the mutually approaching sides of the two bearing blocks 40217 are inclined in opposite directions, the bearing area 40218 has a V-shaped structure, achieving the same effect as the above V-shaped opening.

[0151] In a feasible implementation, refer to Figures 27 - 31, a fifth baffle 4023 and a sixth baffle 4024 are provided on the cathode support frame 4021. When the workpiece to be electroplated 20 is installed in the carrier groove 40216, the fifth baffle 4023 corresponds to the lower edge position of the workpiece to be electroplated 20, and the sixth baffle 4024 corresponds to the upper edge position of the workpiece to be electroplated 20. Specifically, the fifth baffle 4023 and the sixth baffle 4024 are provided on the carrier frame body 40215. When performing single-sided electroplating on the workpiece to be electroplated 20, the fifth baffle 4023 and the sixth baffle 4024 can be provided only on one side of the carrier frame body 40215, so that the fifth baffle 4023 and the sixth baffle 4024 block the lower edge and the upper edge of the same side of the workpiece to be electroplated 20. When performing double-sided electroplating on the workpiece to be electroplated 20, the fifth baffle 4023 and the sixth baffle 4024 are provided on both sides of the carrier frame body 40215. The two fifth baffles 4023 located on both sides of the carrier frame body 40215 correspond to each other, and the two sixth baffles 4024 located on both sides of the carrier frame body 40215 correspond to each other, so that the two fifth baffles 4023 can block the lower edges of both sides of the workpiece to be electroplated 20 at the same time, and the two sixth baffles 4024 can block the upper edges of both sides of the workpiece to be electroplated 20 at the same time. Among them, both the fifth baffle 4023 and the sixth baffle 4024 are detachably connected to the carrier frame body 40215. When the sixth baffle 4024 is provided on both sides of the carrier frame body 40215, since the first support portion 40212 is located directly above the carrier groove 40216, the workpiece to be electroplated 20 cannot be placed into the carrier groove 40216 from directly above. One side of the sixth baffle 4024 can be detached, and the workpiece to be electroplated 20 can be placed into the carrier groove 40216 from this notch.

[0152] Due to the edge effect of the workpiece to be electroplated 20 itself, the power lines are likely to concentrate on the sharp corners and edges of the workpiece to be electroplated 20, so that the current density on the sharp corners and edges of the workpiece to be electroplated 20 is relatively large. When the lower edge and the upper edge of the workpiece to be electroplated 20 are respectively covered by the fifth baffle 4023 and the sixth baffle 4024, the electroplating solution needs to first flow to the central part of the electroplating surface and then diffuse from the central part to the edge part, so that the distance that the power lines extend to the edge position of the workpiece to be electroplated 20 is greater than the distance that the power lines extend to the central position of the workpiece to be electroplated 20. In this way, the distribution of the power lines on the electroplating surface can be made uniform, thereby reducing the influence of the uneven coating caused by the edge effect of the workpiece to be electroplated 20. When the electroplating solution flows from the anode member 102 to the workpiece to be electroplated 20, it can first weaken the edge effect of the anode member 102 through the first baffle 105 and the second baffle 107, and then weaken the edge effect of the workpiece to be electroplated 20 through the fifth baffle 4023 and the sixth baffle 4024. In this way, the power lines distributed on the workpiece to be electroplated 20 can be made uniform, so as to achieve the purpose of uniform coating thickness of the workpiece to be electroplated 20.

[0153] Among them, the edge area of the workpiece 20 to be electroplated can be determined in advance. In the case where the fifth baffle 4023 and the sixth baffle 4024 are not provided, the workpiece 20 to be electroplated is directly electroplated, and the electroplated workpiece 20 after electroplating is evenly divided into N electroplating areas, and the thickness of the electroplating layer of each electroplating area is measured, so as to inversely deduce the power line distribution of the workpiece 20 to be electroplated, thereby determining the upper and lower edge areas of the workpiece 20 to be electroplated, balancing the power line distribution of the workpiece 20 to be electroplated, and further effectively improving the electroplating uniformity.

[0154] In practical applications, referring to Figure 21 , a conductive wire is connected to the workpiece 20 to be electroplated, and the other end of the conductive wire is connected to the conductive block 4011, so as to transmit the negative current obtained by the conductive block 4011 to the workpiece 20 to be electroplated. Specifically, the number of conductive wires is at least one, and the end away from the workpiece 20 to be electroplated extends along the cathode connecting rod 4025 to the conductive block 4011. Further, the conductive wire can be a flexible material or a rigid material. The flexible conductive wire can be a copper foil tape, a metal foil tape or other components with good electrical conductivity, and the present application does not limit this.

[0155] Furthermore, an installation rod is provided on the carrier frame 40215, and a wire clamping jaw is provided on the support frame 40211. The wire clamping jaw can jointly install the conductive wire and the installation rod. When the cathode connecting rod 4025 moves, the conductive wire is prone to shaking under the influence of air flow. Fixing the position of part of the conductive wire by using the wire clamping jaw can reduce the shaking range and amplitude of the conductive wire, thereby improving the connection stability of the conductive wire.

[0156] In an implementable embodiment, referring to Figures 12 - 14 , Figures 17 - 19 , Figure 27 , Figure 28 , the conductive assembly 401 further includes a conductive connecting rod 4014. One end of the conductive connecting rod 4014 is connected to the end of the cathode connecting rod 4025, and the other end extends in a direction away from the cathode connecting rod 4025. The conductive block 4011 is disposed on the conductive connecting rod 4014. Specifically, the conductive block 4011 is connected to the conductive connecting rod 4014 through a conductive fixing seat 40111. To ensure stable transmission of the negative current, after the conductive fixing seat 40111 is connected to the conductive connecting rod 4014, it should be ensured that the conductive block 4011 is in contact with the conductive bar 4012.

[0157] In an implementable embodiment, referring to Figures 12 - 14 , Figures 17 - 19 , Figure 27 , Figure 28, the conductive component 401 further includes a guiding roller 4015 rotatably disposed on a roller mounting seat 4016, and the roller mounting seat 4016 is connected to the cathode connecting rod 4025. A roller moving groove is provided on the substrate 4013 along the length direction, and the guiding roller 4015 is located in the roller moving groove and moves along the roller moving groove. By providing the roller moving groove and the guiding roller 4015, the frictional resistance between the conductive connecting rod 4014 and the substrate 4013 is reduced, which is more convenient for the movement of the cathode connecting rod 4025. In a modified embodiment, the number of the guiding rollers 4015 is two, and the two guiding rollers 4015 are disposed on the same rotating shaft. The rotating shaft is rotatably connected to the roller mounting seat 4016. The central axes of the two guiding rollers 4015 coincide with the rotating shaft, and there is a certain distance between the two guiding rollers 4015. In this structure, a guiding protrusion 4017 is provided on the substrate 4013, and the guiding protrusion extends along the moving direction of the driving mechanism 50. The guiding protrusion 4017 is located between the two guiding rollers 4015 to guide the movement of the cathode connecting rod 4025. In a modified embodiment, when a guiding groove is provided on the guiding roller 4015, the guiding protrusion 4017 is engaged in the guiding groove, so that the guiding roller 4015 can move along the guiding protrusion 4017. Further, the two coaxial guiding rollers 4015 are a group, and a group of guiding rollers 4015 are provided on both sides of the roller mounting seat 4016. Further still, guiding rollers 4015 are provided at both ends of the cathode connecting rod 4025. By guiding both ends of the cathode connecting rod 4025 simultaneously, the stable movement of the cathode connecting rod 4025 is realized.

[0158] In an implementable embodiment, referring to Figures 9 - 12 , Figure 17 , Figure 20 , Figure 26 , Figure 27, the driving mechanism 50 at least includes a driving bracket 501, a transmission member 502, a driving source 503, and a pushing member 504. Specifically, the transmission member 502 is rotatably arranged on the driving bracket 501, the pushing member 504 is connected to the transmission member 502, and the driving source 503 is arranged on the driving bracket 501 and connected to the transmission member 502 to drive the transmission member 502 to drive the pushing member 504 to rotate in a cycle; when the pushing member 504 rotates above the electroplating tank 30, it contacts the cathode connecting rod 4025 and pushes it to move along the length direction of the electroplating tank 30. The cyclic rotation of the pushing member 504 can cyclically push a plurality of continuously loaded cathode units 40, realizing the continuous production of the workpieces to be electroplated 20, thereby improving the production efficiency. Among them, the transmission member 502 adopts a mechanical transmission structure capable of realizing rotation, such as a belt, a chain, etc. The transmission member 502 rotates in a cycle on the driving bracket 501 along an elliptical trajectory. The driving source 503 includes a transmission wheel 5031 and a motor 5032. The motor 5032 and the transmission wheel 5031 are respectively arranged on both sides of the driving bracket 501. The transmission member 502 is sleeved on the transmission wheel 5031, and the output shaft of the motor 5032 passes through the driving bracket 501 and is connected to the transmission wheel 5031 to drive the transmission wheel 5031 to drive the transmission member 502 to rotate. It should be noted that the transmission member 502 and the transmission wheel 5031 should adopt components with matching structures. For example, when the transmission member 502 adopts a belt, the transmission wheel 5031 adopts a pulley that can cooperate with the belt; when the transmission member 502 adopts a chain, the transmission wheel 5031 adopts a sprocket that can cooperate with the chain.

[0159] In this embodiment, the driving bracket 501 is vertically arranged. The transmission member 502 arranged on the driving bracket 501 rotates cyclically in the vertical direction. When the transmission member 502 rotates cyclically, it has two horizontal movement areas and two rotation areas. When rotating in the vertical direction, the two horizontal movement areas are at different heights, that is, the transmission positions are divided into a first height and a second height. The distance between the first height and the electroplating tank 30 is L1, and the distance between the second height and the electroplating tank 30 is L2, and L1 < L2. When the pushing member 504 is at the first height, the pushing member 504 is located above the electroplating tank 30, and the end far from the transmission member 502 can contact the cathode connecting rod 4025. The pushing member 504 applies a thrust to the cathode connecting rod 4025 under the drive of the transmission member 502, so that the cathode connecting rod 4025 moves following the pushing member 504 until the pushing member 504 leaves the first height and turns to the second height. When the pushing member 504 is at the second height, the pushing member 504 is located above the cathode connecting rod 4025, and the end of the pushing member 504 far from the transmission member 502 is disengaged from the cathode connecting rod 4025. At this time, the pushing member 504 originally at the second height rotates to the first height and contacts the cathode connecting rod 4025. In this way, under the cyclic rotation of the transmission member 502, multiple pushing members 504 connected thereto can repeatedly reach the position of the first height, pushing the cathode connecting rod 4025, thereby realizing the continuous drive of the cathode unit 40.

[0160] Different from the vertically arranged structure of the above driving bracket 501, in an implementable embodiment, the driving bracket 501 is horizontally arranged. The transmission member 502 arranged on the driving bracket 501 rotates cyclically in the horizontal direction. When the transmission member 502 rotates cyclically, it has two horizontal movement areas and two rotation areas. When rotating in the horizontal direction, the two horizontal movement areas have different distances from the electroplating tank 30, that is, the transmission positions are divided into a first width and a second width. The distance between the first width and the electroplating tank 30 is L3, and the distance between the second width and the electroplating tank 30 is L4, and L3 < L4. When the pushing member 504 rotates to the first width, the pushing member 504 is located on one side of the electroplating tank 30, and the end far from the transmission member 502 can contact the cathode connecting rod 4025. The pushing member 504 applies a thrust to the cathode connecting rod 4025 under the drive of the transmission member 502, so that the cathode connecting rod 4025 moves following the pushing member 504 until the pushing member 504 leaves the first width and turns to the second width. When the pushing member 504 is at the second width, the pushing member 504 is located on the side of the first width far from the electroplating tank 30. At this time, the pushing member 504 originally at the second width rotates to the first width and contacts the cathode connecting rod 4025. In this way, under the cyclic rotation of the transmission member 502, multiple pushing members 504 connected thereto can repeatedly cycle to the position of the first width, pushing the cathode connecting rod 4025, thereby realizing the continuous drive of the cathode unit 40.

[0161] The structure with the driving bracket 501 vertically arranged can reduce the floor area of the vertical electroplating equipment compared to the structure with the driving bracket 501 horizontally arranged; while the structure with the driving bracket 501 horizontally arranged can improve the stability of the transmission part 502 during rotation compared to the structure with the driving bracket 501 vertically arranged.

[0162] In an implementable embodiment, referring to Figures 12 - 14 、 Figures 17 - 19 、 Figure 27 、 Figure 28 ,the pusher 504 includes a pusher base 5041 and a pusher rod 5043. The pusher base 5041 is connected to the transmission part 502. One end of the pusher rod 5043 is arranged on the pusher base 5041, and the other end extends in a direction away from the pusher base 5041. In order to enable the cathode connecting rod 4025 to move smoothly, the end away from the pusher base 5041 can extend to the middle of the cathode connecting rod 4025, so as to make the force on the cathode connecting rod 4025 balanced. Among them, a rotational connection in the vertical direction can be adopted between the pusher rod 5043 and the pusher base 5041, so that when the position of the transmission part 502 is fixed, by adjusting the height of the pusher rod 5043, it can cooperate with various types of cathode units 40. In practical applications, it is necessary to limit the rotation amplitude of the pusher rod 5043 in advance. If the rotation amplitude of the pusher rod 5043 is too large, it will cause interference between pusher rods 5043 at different heights and affect the movement of the cathode connecting rod 4025. Therefore, preferably, the rotation angle of the pusher rod 5042 is less than 30°.

[0163] Furthermore, a pusher plate 5044 is arranged on the pusher rod 5043, and the pusher plate 5044 is used to increase the contact area between the pusher 504 and the cathode connecting rod 4025, thereby increasing the force application area of the pusher 504 and enabling the cathode connecting rod 4025 to move smoothly. Even further, in order to ensure that the contact position between the pusher plate 5044 and the cathode connecting rod 4025 is accurate and does not shift, a magnetic attraction structure or an adhesive structure that can cooperate with each other can be arranged on the pusher plate 5044 and the cathode connecting rod 4025. For example, if a first magnetic attraction part and a second magnetic attraction part are respectively arranged on the pusher plate 5044 and the cathode connecting rod 4025, and the first magnetic attraction part and the second magnetic attraction part have opposite magnetic polarities, when the pusher plate 5044 contacts the cathode connecting rod 4025, the two can be magnetically connected through the cooperation of the first magnetic attraction part and the second magnetic attraction part to improve the stability during the movement. When the pusher plate 5044 rotates away from the cathode connecting rod 4025, the first magnetic attraction part and the second magnetic attraction part separate due to the excessive distance, and the pusher plate 5044 rotates to the other end of the electroplating tank 30 to contact the unplated cathode unit 40.

[0164] In an implementable embodiment, referring to Figures 12 - 14 、Figures 17 - 19 , Figure 27 , Figure 28 , a slide rail 5011 is further arranged on the driving bracket 501. The slide rail 5011 is an elliptical orbit and is located outside the transmission part 502. Since the transmission part 502 rotates along an elliptical track, that is, the orthographic projection area of the elliptical area with the slide rail 5011 as the circumference on a preset vertical plane is larger than the orthographic projection area of the elliptical area with the transmission part 502 as the circumference on the same preset vertical plane. A plurality of pushing rollers 5042 are arranged on the pushing base 5041, and all the plurality of pushing rollers 5042 are in contact with the slide rail 5011. When the driving source 503 drives the transmission part 502 to rotate, the transmission part 502 drives the pushing base 5041 to perform a cyclic rotation on the driving bracket 501. When the pushing base 5041 rotates, it will drive the pushing rollers 5042 to perform a cyclic motion. Since the pushing rollers 5042 are in contact with the slide rail 5011, that is, the pushing base 5041 rotates along an elliptical track of the transmission part 502, and the pushing rollers 5042 rotate along the elliptical orbit of the slide rail 5011. Among them, the pushing rollers 5042 can rotate along the inner circumference of the slide rail 5011 or along the outer circumference of the slide rail 5011.

[0165] It should be noted that when the vertical electroplating equipment includes the driving mechanism 50, the vertical electroplating equipment uses the dynamic electroplating method to electroplate the workpiece to be electroplated 20. When the vertical electroplating equipment uses the static electroplating method to electroplate the workpiece to be electroplated 20, the vertical electroplating equipment can only use a fixed bracket to install the workpiece to be electroplated 20, and there is no need to set the driving mechanism 50 and the cathode unit 40, so that the workpiece to be electroplated 20 can be statically placed in the electroplating tank 30 for electroplating.

[0166] In the vertical electroplating equipment provided in the embodiment of the present application, the driving mechanism 50 is used to push the cathode unit 40 to pass through the anode assembly 10, so as to realize the vertical continuous electroplating of the workpiece to be electroplated 20. When the workpiece to be electroplated 20 has different distances from the anode parts 102 on both sides, different electroplating effects can be formed on different surfaces to be electroplated; in addition, in the vertical electroplating equipment, the electroplating tank 30 is sequentially divided into an electroplating sub-tank 303, a liquid supply bin 304 and a liquid storage tank 305 from top to bottom, so that the internal structure of the vertical electroplating equipment is compact, the overall floor space is reduced, and the convenience of equipment operation and maintenance is improved.

[0167] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An anode assembly, characterized in that, It includes at least an anode base and an anode member. A liquid passing channel and a mounting groove are provided on the anode base. The position of the liquid passing channel partially or completely coincides with the processing position. The mounting groove is configured to mount the anode member; The number of the mounting grooves is two or more. With the processing position as a reference, multiple mounting grooves are distributed on both sides of the processing position, and at least part of the mounting grooves are provided with the anode members.

2. The anode assembly according to claim 1, characterized in that, Two anode members are respectively mounted in two mounting grooves located on both sides of the liquid passing channel; If there are multiple mounting grooves on the same side of the processing position, the distances between the multiple mounting grooves on the same side of the processing position and the processing position increase in sequence.

3. The anode assembly according to claim 1, wherein, The anode member is connected to a conductive copper bar, and the conductive copper bar is connected to the positive electrode of the power supply; Wherein, the conductive copper bar is arranged on a fixing rod, and the fixing rod is connected to the electroplating equipment.

4. The anode assembly according to claim 3, characterized in that, The anode assembly further includes a baffle sub-assembly. The baffle sub-assembly at least includes a first baffle. A baffle groove for mounting the first baffle is formed on the anode base. The baffle groove is located between the liquid passing channel and the adjacent mounting groove; When the first baffle is mounted in the baffle groove, the lower edge position of the first baffle corresponds to that of the anode member.

5. The anode assembly according to claim 4, characterized in that, The baffle sub-assembly further includes a second baffle. One end of the second baffle is connected to the conductive copper bar, and the other end extends from the top of the workpiece to be electroplated to its bottom until the upper edge of the anode member is blocked.

6. The anode assembly according to claim 5, wherein The baffle sub-assembly further includes a third baffle. One end of the third baffle is arranged on the second baffle and is located between the second baffle and the anode member.

7. The anode assembly according to claim 6, wherein, The anode assembly further includes an overflow plate. An overflow groove for mounting the overflow plate is formed on the anode base. The overflow groove is located on the side of the mounting groove away from the liquid passing channel. The orthographic projection area of the overflow plate on a preset vertical plane is larger than the orthographic projection area of the anode member on the same preset vertical plane.

8. The anode assembly according to claim 7, wherein A drainage opening is formed on the second baffle. The drainage opening is located above the anode member so that the electroplating solution flowing in from the liquid passing channel flows through the workpiece to be electroplated and flows in the direction of the drainage opening.

9. The anode assembly according to claim 8, wherein, The connection between the anode base and the anode member is detachable. The connection between the second baffle and the fixing rod is detachable. The connection between the anode base and the electroplating equipment is detachable; wherein, the anode member is inserted into the mounting groove, and the anode base is threadedly connected to the anode member.

10. A vertical electroplating device, characterized in that, It includes the anode assembly according to any one of claims 1-9.

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