Workbench for large-size diamond growth equipment

Abstract

The utility model relates to a workbench for large-size diamond growth equipment, and belongs to the related field of diamond preparation. The device comprises a copper carrying table, a top cover plate, fastening screws, a cooling liquid circulation cavity and a vacuumizing cavity, the copper carrying table is arranged on the top cover plate, the cooling liquid circulation cavity comprises a water return cavity, an overflow groove, a sealing groove, a second mounting hole, a cooling liquid temperature equalizing cavity, a flow guide hole and a cooling liquid inlet cavity, and the sealing groove is formed in the upper end face of the cooling liquid circulation cavity. A plurality of uniformly distributed mounting holes II are formed in the periphery and fixed with the top cover plate through fastening screws, a water return cavity is formed in the middle, a plurality of uniformly distributed overflow grooves are formed in the periphery of the lower side of the water return cavity, the water return cavity is connected with a cooling liquid temperature equalizing cavity through the overflow grooves, and the lower part of the cooling liquid temperature equalizing cavity is connected with a cooling liquid inlet cavity through a flow guide hole; the vacuumizing cavity is located in the cooling liquid circulating cavity and located between the cooling liquid temperature equalizing cavity and the cooling liquid inlet cavity. The cooling device is safe and reasonable in structural design, better in cooling effect, more uniform in temperature and capable of meeting use requirements.

Description

Technical Field

[0001] The utility model relates to a workbench, in particular to a workbench for a large-size diamond growth device, and belongs to the related field of diamond preparation. Background Art

[0002] Large-size diamond device: namely, a microwave plasma chemical vapor deposition device, also called MPCVD (Microwave Plasma Chemical Vapor Deposition), is a device used to grow large-size single-crystal and polycrystalline diamonds, and the size of the grown diamonds can reach 4-6 inches.

[0003] Workbench: refers to the workbench used in the microwave plasma chemical vapor deposition device, which is used to carry the diamond substrate, and diamonds grow at the center position of the workbench.

[0004] The main methods for synthesizing artificial diamonds are the high temperature and high pressure method (HTHP), the microwave plasma chemical vapor deposition method (MPCVD), the direct current arc plasma jet method (DCAPJ), the hot filament chemical vapor deposition method (HFCVD), etc. The MPCVD method has the advantages of high plasma energy density, low impurity content, good controllability, etc., and is one of the most potential methods for synthesizing high-quality diamonds. The working principle of the MPCVD device is that the microwave generated by the microwave generator enters the reaction chamber of the reaction device through the waveguide transmission system, and a mixed gas such as methane and hydrogen is introduced into the reaction chamber. Under the excitation of the microwave, glow discharge is generated in the reaction chamber, the molecules of the reaction gas are ionized to generate plasma, and a diamond film is deposited on the diamond growth substrate.

[0005] In the prior art, the deposition workbench of the MPCVD device not only has the functions of carrying the substrate and growing the diamond film, but also has the functions of cooling and gas flow channel. In terms of the deposition workbench of the large-size MPCVD device, the main problem is that the distribution of the cooling liquid is uneven, which easily causes the temperature of the substrate above the workbench to be uneven, resulting in uneven and insufficient heat exchange, that is, uneven hot and cold distribution of the substrate table, thus affecting the quality of crystal growth.

[0006] Currently, in terms of the deposition workbench of the large-size MPCVD device, there is no solution similar to the present invention in the type of downward microwave device. Summary of the Utility Model

[0007] The purpose of the utility model is to overcome the above deficiencies existing in the prior art, and to provide a workbench for a large-size diamond growth device with reasonable structural design, safety and reliability, better cooling effect and more uniform temperature.

[0008] The technical solution adopted by the present utility model to solve the above problems is as follows: The workbench for large-size diamond growth equipment includes a copper carrier table, a top cover plate, and fastening screws. The copper carrier table is arranged on the top cover plate, and is characterized in that: it further includes a coolant circulation cavity and a vacuum pumping cavity. The coolant circulation cavity includes a return water cavity, an overflow groove, a sealing groove, mounting hole two, a coolant temperature equalizing cavity, a diversion hole, and a coolant inlet cavity. A sealing groove is arranged on the upper end surface of the coolant circulation cavity, and a number of uniformly distributed mounting holes two are arranged around it. It is fixed to the top cover plate by fastening screws, and a return water cavity is formed in the middle. A number of uniformly distributed overflow grooves are arranged on the outer periphery of the lower side of the return water cavity. The return water cavity is connected to the coolant temperature equalizing cavity through the overflow groove. The lower part of the coolant temperature equalizing cavity is connected to the coolant inlet cavity through the diversion hole; the vacuum pumping cavity is located inside the coolant circulation cavity, between the coolant temperature equalizing cavity and the coolant inlet cavity.

[0009] Preferably, the top cover plate of the present utility model includes a positioning ring, mounting hole one, a positioning step, a coolant sealing surface, and a coolant contact surface. A positioning ring is arranged at the center of the upper end surface of the top cover plate, and the copper carrier table is placed on the positioning ring. A number of uniformly distributed mounting holes one are arranged in the circumferential direction of the top cover plate. A positioning step is arranged on the other side of the top cover plate. A coolant sealing surface is arranged outside the positioning step and is matched with the coolant sealing ring. The inner side of the positioning step is the coolant contact surface.

[0010] Preferably, the present utility model further includes a coolant sealing ring, and the coolant sealing ring is installed in the sealing groove.

[0011] Preferably, the vacuum pumping cavity of the present utility model includes a drainage hole, an upper sealing ring groove, a vacuum cavity, and a lower sealing ring groove. An upper sealing ring groove is arranged on the upper end surface of the large outer circle of the workbench, and a lower sealing ring groove is arranged on the lower end surface. A number of uniformly distributed drainage holes are arranged on the upper surface of the vacuum cavity.

[0012] Preferably, the present utility model further includes a coolant inflow channel and a coolant outflow channel. The coolant inflow channel is connected to the center of the coolant inlet cavity, and the coolant outflow channel is connected to the center of the return water cavity.

[0013] Preferably, the present utility model further includes a vacuum pumping channel. The coolant inflow channel, the coolant outflow channel, and the vacuum pumping channel are designed to be annular. The outermost layer of the pipeline is the coolant inflow channel. The vacuum pumping channel is sleeved inside the coolant inflow channel, and the coolant outflow channel is sleeved inside the vacuum pumping channel.

[0014] Preferably, the present utility model further includes a coolant inlet, a coolant outlet, and a vacuum pumping interface. The lowermost end of the workbench is the coolant outlet, which is connected to the coolant outflow channel and is connected by pipe threads; the bottom of the vacuum pumping channel is connected to the vacuum pumping interface and is connected to the vacuum pumping equipment by a CF flange interface; the coolant inlet is connected to the coolant inflow channel and is connected by pipe threads.

[0015] Preferably, the copper material of the copper carrier table of the present utility model is oxygen-free copper, and the upper end surface is circular with a diameter of not less than 160 mm.

[0016] Preferably, the material of the top cover plate of the present utility model is high-temperature resistant stainless steel.

[0017] Compared with the prior art, the present utility model has the following advantages and effects: The overall structure is reasonably designed, safe and reliable. The copper carrier table is arranged on the top cover plate. A sealing groove is provided on the upper end surface of the coolant circulation cavity. A coolant sealing ring is installed in the sealing groove and fixed to the top cover plate by fastening screws, forming a return water cavity in the middle. The vacuum pumping cavity is located inside the coolant circulation cavity, between the coolant temperature equalizing cavity and the coolant inlet cavity. Through the above structure, the overall cooling effect is better, the temperature is more uniform, and the use requirements are met. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the overall structural schematic diagram of an embodiment of the present utility model.

[0019] Figure 2 is the structural schematic diagram of the top cover plate in an embodiment of the present utility model Figure 1 .

[0020] Figure 3 is the structural schematic diagram of the top cover plate in an embodiment of the present utility model Figure 2 .

[0021] Figure 4 is the structural schematic diagram of the coolant circulation cavity in an embodiment of the present utility model.

[0022] Figure 5 is the structural schematic diagram of the vacuum pumping cavity in an embodiment of the present utility model.

[0023] In the figure: copper carrier table 1, top cover plate 2, fastening screw 3, coolant sealing ring 4, coolant circulation cavity 5, vacuum pumping cavity 6, coolant inflow channel 7, coolant outflow channel 8, vacuum pumping channel 9, coolant inlet 10, coolant outlet 11, vacuum pumping interface 12;

[0024] Top cover plate 2: positioning ring 2.1, first mounting hole 2.2, positioning step 2.3, coolant sealing surface 2.4, coolant contact surface 2.5;

[0025] Coolant circulation cavity 5: return water cavity 5.1, overflow groove 5.2, sealing groove 5.3, second mounting hole 5.4, coolant temperature equalizing cavity 5.5, diversion hole 5.6, coolant inlet cavity 5.7, outer ring support column 5.8, inner ring support column 5.9;

[0026] Vacuum pumping cavity 6: drainage hole 6.1, upper sealing ring groove 6.2, vacuum cavity 6.3, lower sealing ring groove 6.4. Detailed implementation mode

[0027] The present utility model will be further described in detail below with reference to the accompanying drawings and through embodiments. The following embodiments are explanations of the present utility model, and the present utility model is not limited to the following embodiments.

[0028] Embodiment

[0029] See Figures 1 - 5 , the workbench for large-size diamond growth equipment in this embodiment includes a copper carrier 1, a top cover plate 2, fastening screws 3, a coolant sealing ring 4, a coolant circulation chamber 5, a vacuum pumping chamber 6, a coolant inflow channel 7, a coolant outflow channel 8, a vacuum pumping channel 9, a coolant inlet 10, a coolant outlet 11, and a vacuum pumping interface 12.

[0030] In this embodiment, the copper material of the copper carrier 1 is oxygen-free copper, and the upper end face is set to be circular with a diameter of not less than 160 mm, which is used to carry the diamond substrate.

[0031] In this embodiment, the top cover plate 2 includes a positioning ring 2.1, a first mounting hole 2.2, a positioning step 2.3, a coolant sealing surface 2.4, a coolant contact surface 2.5. The material is made of high-temperature resistant stainless steel. The positioning ring 2.1 is arranged at the center of the upper end face, and the copper carrier 1 is placed on the positioning ring 2.1; a number of uniformly distributed first mounting holes 2.2 are arranged in the circumferential direction of the top cover plate 2 for fastening the installation of the top cover plate and other components; on the other side of the top cover plate 2, a positioning step 2.3 is arranged for installation positioning. The coolant sealing surface 2.4 is arranged outside the positioning step 2.3 and cooperates with the coolant sealing ring 4 to ensure the sealing of the coolant. The inner side of the positioning step 2.3 is the coolant contact surface 2.5, and the continuously flowing coolant takes away the heat transmitted from above the top cover plate 2 through this surface.

[0032] In this embodiment, the coolant circulation chamber 5 includes a return water chamber 5.1, an overflow tank 5.2, a sealing groove 5.3, a second mounting hole 5.4, a coolant temperature equalizing chamber 5.5, a diversion hole 5.6, a coolant inlet chamber 5.7, an outer ring support column 5.8 and an inner ring support column 5.9. The sealing groove 5.3 is arranged on the upper end face of the coolant circulation chamber 5, and the coolant sealing ring 4 is installed in the sealing groove 5.3 for the sealing of the coolant; a number of uniformly distributed second mounting holes 5.4 are arranged around, and are fixed to the top cover plate 2 by the fastening screws 3, and a return water chamber 5.1 is formed in the middle. A number of uniformly distributed overflow tanks 5.2 are arranged on the outer periphery below the return water chamber 5.1, and the coolant rises from the overflow tank 5.2 to the return water chamber 5.1. The center of the return water chamber 5.1 is connected to the coolant outflow channel 8, and the heated coolant flows out of the return water chamber 5.1 from here.

[0033] The return water cavity 5.1 is connected to the coolant temperature equalizing cavity 5.5 through the overflow groove 5.2. The lower part of the temperature equalizing cavity is connected to the coolant inlet cavity 5.7 through the diversion hole 5.6. The center of the coolant inlet cavity 5.7 is connected to the coolant inflow channel 7. The coolant rises from the coolant inflow channel 7 to the coolant inlet cavity 5.7. After the coolant is filled, it rises from the diversion hole 5.6 to the coolant temperature equalizing cavity 5.5, then rises to the coolant circulation cavity 5 through the overflow groove 5.2, and finally flows out through the central hole of the coolant circulation cavity 5. Each cavity is separated by a thin-walled part. A number of outer ring support columns 5.8 and inner ring support columns 5.9 are evenly arranged between layers of the thin-walled part to prevent the cavity wall from deforming due to water pressure.

[0034] In this embodiment, the vacuum chamber 6 includes a drainage hole 6.1, an upper sealing ring groove 6.2, a vacuum chamber 6.3, and a lower sealing ring groove 6.4. The vacuum chamber 6 is located inside the coolant circulation cavity, between the coolant temperature equalizing cavity 5.5 and the coolant inlet cavity 5.7. Process exhaust gas generated during operation is extracted from the vacuum chamber channel. The upper end face of the large outer circle of the workbench is provided with an upper sealing ring groove 6.2, and the lower end face is provided with a lower sealing ring groove 6.4 for placing sealing rings to isolate different chambers. A number of evenly distributed drainage holes 6.1 are provided on the upper surface of the vacuum chamber 6.3, which are directly connected to the reaction chamber above the workbench to facilitate the extraction of process exhaust gas.

[0035] In this embodiment, the coolant inflow channel 7, the coolant outflow channel 8, and the vacuum extraction channel 9 are designed in a ring shape. The outermost layer of the pipeline is the coolant inflow channel 7. The vacuum extraction channel 9 is sleeved inside the coolant inflow channel 7, and the coolant outflow channel 8 is sleeved inside the vacuum extraction channel 9. The total length of the channels is not less than 990 mm. The coolant outlet 11 is located at the lowermost end of the workbench and is connected to the coolant outflow channel 8, using a pipe thread connection; the bottom of the vacuum extraction channel 9 is connected to the vacuum extraction interface 12, using a CF flange interface to connect to the vacuum extraction equipment; the coolant inlet 10 is connected to the coolant inflow channel 7, using a pipe thread connection.

[0036] In this embodiment, when the large-size diamond growth equipment adopts the lower-inlet microwave form, the workbench used to carry diamond growth solves problems such as poor cooling effect and uneven temperature.

[0037] Through the above description, those skilled in the art can already implement it.

[0038] In addition, it should be noted that for the specific embodiments described in this specification, the shapes and names of the components can be different. The above content described in this specification is only an illustrative example of the structure of the present utility model. Any equivalent changes or simple changes made according to the structure, features, and principles conceived in the patent of the present utility model are included within the protection scope of the patent of the present utility model. Those skilled in the art of the present utility model can make various modifications, supplements, or use similar ways of substitution to the specific embodiments described, as long as they do not deviate from the structure of the present utility model or exceed the scope defined by this claims, they should all fall within the protection of the present utility model.

Claims

1. A workbench for a large-size diamond growth device, comprising a copper carrier (1), a top cover plate (2) and fastening screws (3), wherein the copper carrier (1) is arranged on the top cover plate (2), and is characterized in that: It further includes a coolant circulation chamber (5) and a vacuum pumping chamber (6). The coolant circulation chamber (5) includes a return water chamber (5.1), an overflow groove (5.2), a sealing groove (5.3), a second mounting hole (5.4), a coolant temperature equalizing chamber (5.5), a diversion hole (5.6), and a coolant inlet chamber (5.7). A sealing groove (5.3) is provided on the upper end surface of the coolant circulation chamber (5), and a number of evenly distributed second mounting holes (5.4) are provided around it. It is fixed to the top cover plate (2) by fastening screws (3), and a return water chamber (5.1) is formed in the middle. A number of evenly distributed overflow grooves (5.2) are provided on the outer periphery of the lower side of the return water chamber (5.1). The return water chamber (5.1) is connected to the coolant temperature equalizing chamber (5.5) through the overflow groove (5.2). The lower part of the coolant temperature equalizing chamber (5.5) is connected to the coolant inlet chamber (5.7) through the diversion hole (5.6). The vacuum pumping chamber (6) is located inside the coolant circulation chamber (5), between the coolant temperature equalizing chamber (5.5) and the coolant inlet chamber (5.7).

2. The workbench for large-size diamond growth equipment according to claim 1, wherein: The top cover plate (2) includes a positioning ring (2.1), a first mounting hole (2.2), a positioning step (2.3), a coolant sealing surface (2.4), and a coolant contact surface (2.5). A positioning ring (2.1) is provided at the center of the upper end surface of the top cover plate (2), and the copper carrier (1) is placed on the positioning ring (2.1). A number of evenly distributed first mounting holes (2.2) are provided in the circumferential direction of the top cover plate (2). A positioning step (2.3) is provided on the other side of the top cover plate. A coolant sealing surface (2.4) is provided outside the positioning step (2.3) and is matched with the coolant sealing ring (4). The inner side of the positioning step (2.3) is the coolant contact surface (2.5).

3. The workbench for large-size diamond growth equipment according to claim 1, characterized in that: It further includes a coolant sealing ring (4), and the coolant sealing ring (4) is installed in the sealing groove (5.3).

4. The workbench for large-size diamond growth equipment according to claim 1, characterized in that: The vacuum pumping chamber (6) includes a drainage hole (6.1), an upper sealing ring groove (6.2), a vacuum chamber (6.3), and a lower sealing ring groove (6.4). An upper sealing ring groove (6.2) is provided on the upper end surface of the large outer circle of the workbench, and a lower sealing ring groove (6.4) is provided on the lower end surface. A number of evenly distributed drainage holes (6.1) are provided on the upper surface of the vacuum chamber (6.3).

5. The workbench for large-size diamond growth equipment according to claim 1, characterized in that: It further includes a coolant inflow channel (7) and a coolant outflow channel (8). The coolant inflow channel (7) is connected to the center of the coolant inlet chamber (5.7), and the coolant outflow channel (8) is connected to the center of the return water chamber (5.1).

6. The workbench for large-size diamond growth equipment according to claim 5, characterized in that: It further includes a vacuum pumping channel (9). The coolant inflow channel (7), the coolant outflow channel (8), and the vacuum pumping channel (9) are designed to be annular. The outermost layer of the pipeline is the coolant inflow channel (7). The vacuum pumping channel (9) is sleeved inside the coolant inflow channel (7), and the coolant outflow channel (8) is sleeved inside the vacuum pumping channel (9).

7. The workbench for large-size diamond growth equipment according to claim 1, wherein: It also includes a coolant inlet (10), a coolant outlet (11) and a vacuum pumping interface (12). The lowermost end of the workbench is the coolant outlet (11), which is connected to the coolant outflow channel (8) and uses a pipe thread connection. The bottom of the vacuum pumping channel (9) is connected to the vacuum pumping interface (12), and a CF flange interface is used to connect to the vacuum pumping equipment. The coolant inlet (10) is connected to the coolant inflow channel (7) and uses a pipe thread connection.

8. The workbench for large-size diamond growth equipment according to claim 1, characterized in that: The copper material of the copper carrier table (1) is selected as oxygen-free copper, and the upper end face is set as a circle with a diameter of not less than 160 mm.

9. The workbench for large-size diamond growth equipment according to claim 1, wherein: The material of the top cover plate (2) is selected as high-temperature resistant stainless steel.

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