Framework structure for transversely placing chip

By designing a skeleton structure connected by a multi-tree structure and magnetic steel, the wire damage caused by a single outgoing probe skeleton is solved, and the wire protection and adjustment are achieved, which is practical and economical.

CN223154288UActive Publication Date: 2025-07-25HUANGSHAN XINXIAN AUTOMOTIVE ELECTRONICS CO LTD +1
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Patent Information

Application Number
CN202422525546.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-07-25
Estimated Expiration
2034-10-18

AI Technical Summary

Technical Problem

The single outgoing direction of the existing probe skeleton structure leads to the problem that the wire is prone to impact, deformation or damage during injection molding.

Method used

A skeleton structure for chip horizontal layout is designed, including a first wire groove, a second wire groove and a third wire groove, allowing the wire to adjust the wiring direction in different grooves, and electrically connect and position through magnetic steel and connecting sheets.

Benefits of technology

Effectively protect the wire from being flushed randomly during the injection molding process, avoid deformation and damage, the structure is simple and low-priced, and has practical value.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a skeleton structure for horizontally placing a chip, which belongs to the technical field of appearance direction of a sensor probe, and comprises a skeleton body and a lead body in the skeleton body, one end of the skeleton body is provided with a first lead groove, and two sides of the first lead groove are respectively provided with a second lead groove and a third lead groove. The lead body can penetrate through the first lead groove, the second lead groove and the third lead groove, the lead can be placed in different lead grooves according to actual conditions before injection molding of the probe, and the purpose of adjusting the wiring direction of the probe is achieved, so that the lead can be effectively protected from being rushed disorderly during injection molding, the service life of the probe is prolonged, and the service life of the probe is prolonged. And the lead is prevented from being pressed, deformed and damaged.
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Description

Technical Field

[0001] The utility model mainly relates to the technical field of the emergence direction of sensor probes, and specifically relates to a skeleton structure for horizontally placing chips. Background Technique

[0002] A sensor probe is a detection device that can sense the information to be measured and transform the sensed information into an electrical signal or other required form of information output according to a certain rule to meet the requirements of information transmission, processing, storage, display, recording, and control, etc. It is the core part of the sensor and is usually installed in a device or environment to detect the changes of one or more physical quantities (such as temperature, pressure, humidity, light intensity, etc.).

[0003] Currently, the skeleton structure in the probe leads out wires from a traditional single direction without another wire emergence direction guide (for example, attached Figure 5 ), so it cannot be adjusted according to the actual situation. During injection molding, the presence of the wire may hinder the normal flow of the plastic melt. If no suitable opening is set for the wire, the resistance of the melt flow may cause a local pressure increase, thereby impacting the wire and causing problems such as wire punching and wire leakage, resulting in the wire being pressed, deformed, or damaged. Content of the Utility Model

[0004] The technical solution of the utility model aims at the technical problem that the existing technical solution is too single, and provides a solution significantly different from the prior art. Specifically, the utility model mainly provides a skeleton structure for horizontally placing chips to solve the technical problem that the skeleton structure in the current probe leads out wires from a traditional single direction without another wire emergence direction guide, thus prone to wire punching during injection molding.

[0005] The technical solution adopted by the utility model to solve the above technical problems is as follows:

[0006] A skeleton structure for horizontally placing chips, including a skeleton body and a wire body inside the skeleton body. A first wire groove is provided at one end of the skeleton body, and a second wire groove and a third wire groove are respectively provided on both sides of the first wire groove, and the wire body can pass through the first wire groove, the second wire groove, and the third wire groove.

[0007] Further, an installation groove is provided inside the skeleton body, and a magnetic steel is embedded in the installation groove.

[0008] Further, a connecting piece is provided on the magnetic steel, and the connecting piece passes through a through hole on the skeleton body and is connected to one end of the wire body.

[0009] Further, positioning blocks are provided on both sides of the outer wall of the skeleton body.

[0010] Furthermore, the structures of the second wire groove and the third wire groove are both narrow outside and wide inside.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] By providing the skeleton body, the first wire groove, the second wire groove and the third wire groove, the present utility model realizes that before injecting plastic into the probe, the wires can be placed in different wire grooves according to actual situations to adjust the wire routing direction of the probe, thereby ensuring that the wires can be effectively protected from chaotic wire punching during injection molding, avoiding the wires from being pressed, deformed and damaged. Moreover, the structures of the second wire groove and the third wire groove are both narrow outside and wide inside, which is convenient for limiting the bending amplitude of the wires after bending the wires. The structure is simple, the operation is convenient, the price is low, and it has certain practical value and application prospects.

[0013] The following will combine the drawings with specific embodiments to explain the present utility model in detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 is an exploded schematic diagram of the overall structure of the present utility model;

[0016] Figure 3 is a schematic diagram of the structure of the skeleton body of the present utility model;

[0017] Figure 4 is a schematic diagram of the structure of different wire outlet directions of the wires of the present utility model on the skeleton body;

[0018] Figure 5 is a schematic diagram of the wire lead-out direction structure in the inner skeleton of the existing probe.

[0019] In the figure: 1, skeleton body; 11, first wire groove; 12, second wire groove; 13, third wire groove; 14, installation groove; 15, positioning block; 2, wire body; 3, magnet; 4, connecting piece. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present utility model are given in the drawings, but the present utility model can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used in the specification of this utility model herein are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0023] Please refer specifically to the attached Figures 1-5 , a skeleton structure for horizontally placing a chip, comprising a skeleton body 1 and a wire body 2 inside the skeleton body 1. One end of the skeleton body 1 is provided with a first wire groove 11, and a second wire groove 12 and a third wire groove 13 are respectively arranged on both sides of the first wire groove 11, and the wire body 2 can pass through the first wire groove 11, the second wire groove 12 and the third wire groove 13.

[0024] Through the above structure, before injection molding of the probe, the wires can be placed in different wire grooves according to the actual situation to achieve the purpose of adjusting the wire routing direction of the probe, thereby ensuring that the wires can be effectively protected from disorderly wire flushing during injection molding, avoiding the wires being pressed, deformed and damaged, and having a simple structure, convenient operation, low price, and certain practical value and application prospects.

[0025] The specific operation is as follows. First, according to the injection molding situation, select to lead out the wire body 2 from the first wire groove 11, the second wire groove 12 or the third wire groove 13. If directly leading out, select the first wire groove 11. If leading out from the side, select the second wire groove 12 and the third wire groove 13, bend the wire body 2, and then snap it into the second wire groove 12 or the third wire groove 13.

[0026] Please refer specifically to the attached Figure 2 、attached Figure 3 and attached Figure 4, an installation groove 14 is provided in the skeleton body 1, and a permanent magnet 3 is embedded in the installation groove 14. The permanent magnet 3 generates a constant magnetic field, which interacts with the magnetoresistive element or Hall element in the sensor. When the external magnetic field changes, this interaction will cause a change in the output signal of the sensor, thereby detecting the change in the magnetic field. A connecting piece 4 is provided on the permanent magnet 3. The connecting piece 4 passes through the through hole on the skeleton body 1 and is connected to one end of the wire body 2. The connecting piece 4 is an electrical connector. Positioning blocks 15 are provided on both sides of the outer wall of the skeleton body 1. Through the positioning blocks 15, the positioning of the skeleton body 1 is realized, which is convenient for the subsequent encapsulation of the probe housing. The structures of the second wire groove 12 and the third wire groove 13 are both narrow outside and wide inside. Due to this structure design of narrow outside and wide inside, it is convenient to perform amplitude positioning after bending the wire body 2.

[0027] The above exemplary description of the present invention is made in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited by the above methods. As long as such non-substantial improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A skeleton structure for horizontally placing a chip, comprising a skeleton body (1) and a wire body (2) inside the skeleton body (1), characterized in that, One end of the skeleton body (1) is provided with a first wire groove (11), and a second wire groove (12) and a third wire groove (13) are respectively arranged on both sides of the first wire groove (11), and the wire body (2) can pass through the first wire groove (11), the second wire groove (12) and the third wire groove (13).

2. The skeleton structure for horizontally placing a chip according to claim 1, characterized in that An installation groove (14) is arranged in the skeleton body (1), and a magnet (3) is embedded in the installation groove (14).

3. The skeleton structure for horizontally placing a chip according to claim 2, characterized in that, A connecting piece (4) is arranged on the magnet (3), and the connecting piece (4) passes through a through hole in the skeleton body (1) and is connected to one end of the wire body (2).

4. A skeleton structure for horizontally placing a chip according to claim 3, characterized in that, Positioning blocks (15) are arranged on both sides of the outer wall of the skeleton body (1).

5. A skeleton structure for horizontally placing a chip according to claim 1, characterized in that, The structures of the second wire groove (12) and the third wire groove (13) are both narrow outside and wide inside.