Novel nondestructive testing device for internal structure of silicon wafer

Abstract

The utility model discloses a novel nondestructive testing device for an internal structure of a silicon wafer, and relates to the technical field of testing devices. The device comprises a bottom plate, a placing mechanism is installed above the bottom plate, the placing mechanism comprises a supporting plate, an electric push rod is fixedly connected to the outer wall of the supporting plate, a placing plate is fixedly connected to one end of the electric push rod, a first sliding rod is fixedly connected to the upper portion of the placing plate, and a pressing plate is slidably connected to the outer wall of the first sliding rod; the outer wall of the first sliding rod is in threaded connection with a nut. Through the arrangement of the electric push rod, the placing plate, the first sliding rod, the pressing plate and the nut, the electric push rod pushes the placing plate to move, after the placing plate moves to a proper position, a silicon wafer is placed on the placing plate, then the pressing plate is pushed to move on the first sliding rod, and when the pressing plate makes contact with the silicon wafer, the pressing plate is pushed to move on the first sliding rod. And then the rotating nut rotates on the first sliding rod and is in contact with the pressing plate, so that the silicon wafer is clamped and fixed by the pressing plate, and the interior of the silicon wafer is detected conveniently.

Description

Technical Field

[0001] The utility model belongs to the technical field of detection devices, and particularly relates to a novel non-destructive detection device for the internal structure of silicon wafers. Background Art

[0002] Before the silicon wafers are made into battery wafers, a series of defect detections need to be carried out on the silicon wafers. When the existing internal detection of silicon wafers is carried out, it is usually carried out by hand, and it is very likely to damage the silicon wafers during the detection process, affecting the detection effect.

[0003] Therefore, we provide a novel non-destructive detection device for the internal structure of silicon wafers to solve the above problems. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0005] The utility model is a novel non-destructive detection device for the internal structure of silicon wafers, including a bottom plate; a placing mechanism is installed above the bottom plate, the placing mechanism includes a support plate, an electric push rod is fixedly connected to the outer wall of the support plate, one end of the electric push rod is fixedly connected to a placing plate, a first sliding rod is fixedly connected above the placing plate, a pressing plate is slidably connected to the outer wall of the first sliding rod, a nut is threadedly connected to the outer wall of the first sliding rod, and the end of the support plate is fixedly connected to the top of the bottom plate.

[0006] The utility model is further provided that a detection mechanism is installed above the bottom plate, the detection mechanism includes a motor, a threaded rod is fixedly connected to the power output end of the motor, one end of the threaded rod is rotatably connected to a fixing plate, and the end of the fixing plate is fixedly connected to the top of the bottom plate, a U-shaped moving plate is threadedly connected to the outer wall of the threaded rod, and the end of the U-shaped moving plate is slidably connected to the outer wall of the bottom plate, a camera is installed above the U-shaped moving plate, and one side of the motor is connected to the top of the bottom plate.

[0007] The utility model is further provided that a clamping mechanism is installed above the U-shaped moving plate, the clamping mechanism includes a clamping plate, a screw rod is threadedly connected to the outer wall of the clamping plate, and the end of the screw rod extends into the U-shaped moving plate, and the end of the clamping plate is slidably connected to the outer wall of the U-shaped moving plate.

[0008] The utility model is further provided that a rotating groove adapted to the threaded rod is opened on the outer wall of the fixing plate, and one end of the threaded rod extends into the rotating groove.

[0009] The utility model is further provided that a first sliding groove adapted to the U-shaped moving plate is opened on the outer wall of the bottom plate, and the end of the U-shaped moving plate extends into the first sliding groove.

[0010] The utility model is further arranged such that a second sliding groove adapted to the clamping plate is formed on the outer wall of the U-shaped moving plate, and the end of the U-shaped moving plate extends into the second sliding groove, and threaded grooves adapted to the screw rod are formed on the outer walls of both the clamping plate and the U-shaped moving plate.

[0011] The utility model has the following beneficial effects:

[0012] 1. Through the provided electric push rod, placing plate, first sliding rod, pressing plate and nut, the placing plate is pushed to move by the electric push rod. When the placing plate moves to a proper position, then the silicon wafer is placed on the placing plate. Then, the pressing plate is pushed to move on the first sliding rod. When the pressing plate contacts the silicon wafer, then the nut is rotated to rotate on the first sliding rod and contact the pressing plate, so that the pressing plate clamps and fixes the silicon wafer, facilitating the detection of the inside of the silicon wafer.

[0013] 2. Through the provided motor, threaded rod, U-shaped moving plate and camera, the threaded rod is driven to rotate by the motor, and the threaded rod drives the U-shaped moving plate to move. The moving direction of the U-shaped moving plate is restricted by moving on the first sliding groove. The U-shaped moving plate moves to drive the camera to move, and the camera moves to photograph the silicon wafer, thereby comprehensively detecting the inside of the silicon wafer.

[0014] Certainly, it is not necessary for any product implementing the utility model to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0016] Figure 1 It is a schematic diagram of the overall structure of the present utility model.

[0017] Figure 2 It is a schematic diagram of the structure of the detection mechanism of the present utility model.

[0018] Figure 3 It is a schematic diagram of the threaded rod structure of the present utility model.

[0019] In the drawings, the list of components represented by each reference numeral is as follows:

[0020] 1. Bottom plate; 101. First chute; 2. Placing mechanism; 201. Support plate; 202. Electric push rod; 203. Placing plate; 204. First slide bar; 205. Pressing plate; 206. Nut; 3. Detection mechanism; 301. Motor; 302. Threaded rod; 303. Fixed plate; 304. U-shaped moving plate; 3041. Second chute; 305. Camera; 4. Clamping mechanism; 401. Clamping plate; 402. Screw rod. Detailed implementation manner

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Specific embodiment

[0023] Please refer to Figures 1-3 , the present invention is a new type of non-destructive detection device for the internal structure of silicon wafers, including a bottom plate 1; a placing mechanism 2 is installed above the bottom plate 1. The placing mechanism 2 includes a support plate 201. An electric push rod 202 is fixedly connected to the outer wall of the support plate 201. One end of the electric push rod 202 is fixedly connected to a placing plate 203. A first slide bar 204 is fixedly connected above the placing plate 203. A pressing plate 205 is slidably connected to the outer wall of the first slide bar 204. A nut 206 is threadedly connected to the outer wall of the first slide bar 204, and the end of the support plate 201 is fixedly connected to the upper part of the bottom plate 1; the placing plate 203 is pushed by the electric push rod 202. When the placing plate 203 moves to a suitable position, then the silicon wafer is placed on the placing plate 203, and then the pressing plate 205 is pushed to move on the first slide bar 204. When the pressing plate 205 contacts the silicon wafer, then the nut 206 is rotated to rotate on the first slide bar 204 and contact the pressing plate 205, so that the pressing plate 205 clamps and fixes the silicon wafer for facilitating the detection of the inside of the silicon wafer.

[0024] Such as Figures 1-3As shown in the figure, a detection mechanism 3 is installed above the bottom plate 1. The detection mechanism 3 includes a motor 301. The power output end of the motor 301 is fixedly connected to a threaded rod 302. One end of the threaded rod 302 is rotatably connected to a fixing plate 303, and the end of the fixing plate 303 is fixedly connected to the upper part of the bottom plate 1. A U-shaped moving plate 304 is threadedly connected to the outer wall of the threaded rod 302, and the end of the U-shaped moving plate 304 is slidably connected to the outer wall of the bottom plate 1. A camera 305 is installed above the U-shaped moving plate 304, and one side of the motor 301 is connected to the upper part of the bottom plate 1. By driving the threaded rod 302 to rotate through the motor 301, the threaded rod 302 drives the U-shaped moving plate 304 to move. The U-shaped moving plate 304 restricts the moving direction of the U-shaped moving plate 304 by moving on the first chute 101. The U-shaped moving plate 304 moves to drive the camera 305 to move, and the camera 305 moves to take pictures of the silicon wafer, so as to comprehensively detect the inside of the silicon wafer.

[0025] Among them, a clamping mechanism 4 is installed above the U-shaped moving plate 304. The clamping mechanism 4 includes a clamping plate 401. The outer wall of the clamping plate 401 is threadedly connected to a screw rod 402, and the end of the screw rod 402 extends into the U-shaped moving plate 304, and the end of the clamping plate 401 is slidably connected to the outer wall of the U-shaped moving plate 304. By pushing the clamping plate 401 to move, the clamping plate 401 contacts the camera 305 by moving on the second chute 3041. When the clamping plate 401 contacts the camera 305, rotate the screw rod 402 to rotate on the clamping plate 401 and enter the U-shaped moving plate 304 to fix the clamping plate 401, so that the clamping plate 401 clamps and fixes the camera 305 to install the camera 305 and improve the detection efficiency.

[0026] A rotating groove adapted to the threaded rod 302 is formed on the outer wall of the fixing plate 303, and one end of the threaded rod 302 extends into the rotating groove. By forming a rotating groove adapted to the threaded rod 302 on the outer wall of the fixing plate 303, it is convenient for the threaded rod 302 to rotate on the fixing plate 303.

[0027] A first chute 101 adapted to the U-shaped moving plate 304 is formed on the outer wall of the bottom plate 1, and the end of the U-shaped moving plate 304 extends into the first chute 101. By forming a first chute 101 adapted to the U-shaped moving plate 304 on the outer wall of the bottom plate 1, it is convenient for the U-shaped moving plate 304 to move on the bottom plate 1.

[0028] A second chute 3041 adapted to the clamping plate 401 is formed on the outer wall of the U-shaped moving plate 304, and the end of the U-shaped moving plate 304 extends into the second chute 3041. Thread grooves adapted to the screw 402 are formed on the outer walls of both the clamping plate 401 and the U-shaped moving plate 304. By providing the second chute 3041 on the outer wall of the U-shaped moving plate 304 and adapting it to the clamping plate 401, it is convenient for the clamping plate 401 to move on the U-shaped moving plate 304. Thread grooves adapted to the screw 402 are formed on the outer walls of both the clamping plate 401 and the U-shaped moving plate 304, which facilitates the rotation of the screw 402 on the clamping plate 401 and its entry into the U-shaped moving plate 304 to fix the clamping plate 401.

[0029] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0030] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A non-destructive testing device for the internal structure of a new type of silicon wafer, comprising a bottom plate (1); characterized in that: Above the bottom plate (1), a placing mechanism (2) is installed. The placing mechanism (2) includes a support plate (201). An electric push rod (202) is fixedly connected to the outer wall of the support plate (201). One end of the electric push rod (202) is fixedly connected to a placing plate (203). Above the placing plate (203), a first sliding rod (204) is fixedly connected. A pressing plate (205) is slidably connected to the outer wall of the first sliding rod (204). A nut (206) is threadedly connected to the outer wall of the first sliding rod (204). And the end of the support plate (201) is fixedly connected above the bottom plate (1).

2. The non-destructive testing device for the internal structure of a novel silicon wafer according to claim 1, characterized in that, Above the bottom plate (1), a detection mechanism (3) is installed. The detection mechanism (3) includes a motor (301). The power output end of the motor (301) is fixedly connected to a threaded rod (302). One end of the threaded rod (302) is rotatably connected to a fixing plate (303). And the end of the fixing plate (303) is fixedly connected above the bottom plate (1). A U-shaped moving plate (304) is threadedly connected to the outer wall of the threaded rod (302). And the end of the U-shaped moving plate (304) is slidably connected to the outer wall of the bottom plate (1). Above the U-shaped moving plate (304), a camera (305) is installed. And one side of the motor (301) is connected above the bottom plate (1).

3. A non-destructive detection device for the internal structure of a novel silicon wafer according to claim 2, characterized in that, Above the U-shaped moving plate (304), a clamping mechanism (4) is installed. The clamping mechanism (4) includes a clamping plate (401). A screw rod (402) is threadedly connected to the outer wall of the clamping plate (401). And the end of the screw rod (402) extends into the U-shaped moving plate (304). And the end of the clamping plate (401) is slidably connected to the outer wall of the U-shaped moving plate (304).

4. A non-destructive testing device for the internal structure of a new type of silicon wafer according to claim 2, characterized in that, A rotation groove adapted to the threaded rod (302) is formed in the outer wall of the fixing plate (303). And one end of the threaded rod (302) extends into the rotation groove.

5. A non-destructive detection device for the internal structure of a novel silicon wafer according to claim 2, characterized in that, A first sliding groove (101) adapted to the U-shaped moving plate (304) is formed in the outer wall of the bottom plate (1). And the end of the U-shaped moving plate (304) extends into the first sliding groove (101).

6. The non-destructive testing device for the internal structure of a novel silicon wafer according to claim 3, characterized in that A second sliding groove (3041) adapted to the clamping plate (401) is formed in the outer wall of the U-shaped moving plate (304). And the end of the U-shaped moving plate (304) extends into the second sliding groove (3041). Threaded grooves adapted to the screw rod (402) are formed in the outer walls of both the clamping plate (401) and the U-shaped moving plate (304).

Images