Test equipment

Abstract

The embodiment of the utility model relates to the technical field of semiconductor detection, in particular to test equipment, which comprises a test box, an insulation board, a temperature control assembly, a fan and a mainboard, the test box is provided with a test cavity, the test cavity is used for providing a test environment for a chip to be tested, and two sides of the test box are respectively provided with a first opening and a second opening. The first opening and the second opening are respectively communicated with the test cavity; the insulation board is arranged on the outer wall of the test box, the insulation board and the outer wall of the test box jointly define an air duct, and the air duct is communicated with the first opening and the second opening; the temperature control assembly is at least partially located in the air duct. The fan is at least partially arranged in the air duct and is used for guiding air in the air duct into the test cavity from the first opening or the second opening. According to the embodiment of the utility model, the testing cavity, the first opening, the air duct and the second opening jointly form the circulating air duct, and the circulating air flow is formed under the driving of the fan, so that the heat distribution of each area of the testing cavity is more uniform.

Description

Technical Field

[0001] The embodiments of the present utility model relate to the technical field of semiconductor detection, and particularly to a testing device. Background Art

[0002] With the rapid development of technology, people have higher and higher requirements for the reliability of chips. Chip testing, as an important part of the chip manufacturing field, plays a good role in promoting the quality of chips. Currently, the equipment for aging testing of memory chips (generally called a furnace body) places the chips to be tested on a test board, then inserts the test board into the furnace body, and heats and cools the furnace body where the test board is located through a compressor and an evaporator in the furnace body to simulate the aging process of the memory chips. Most of such equipment is large in size and high in maintenance cost.

[0003] However, the existing small-sized and desktop-type temperature control testing equipment on the market mainly heats and cools a test chamber through a temperature control component to provide a test environment for the chips to be tested. The temperature control component cannot cover all areas of the test chamber, which results in uneven heat transfer to different areas of the test chamber, causing differences in the test environments of the chips to be tested at different positions, and thus leading to deviations in the test results. Summary of the Utility Model

[0004] In view of the above problems, the embodiments of the present utility model provide a testing device that overcomes or at least partially solves the above problems.

[0005] According to one aspect of the embodiments of the present utility model, there is provided a testing device, including a test box, a heat insulation board, a temperature control component, a fan, and a main board. The test box is provided with a test chamber for providing a test environment for the chips to be tested. First and second openings are respectively formed on two sides of the test box, and the first and second openings are respectively communicated with the test chamber; the heat insulation board is disposed on the outer wall of the test box, and the heat insulation board and the outer wall of the test box jointly enclose an air duct, and the air duct is respectively communicated with the first and second openings; at least part of the temperature control component is located in the air duct, and the temperature control component is used for heating and cooling the test chamber; at least part of the fan is disposed in the air duct, and the fan is used for introducing the gas in the air duct into the test chamber from the first opening or the second opening; the main board is used for communicating with the chips to be tested; wherein, the test chamber, the first opening, the air duct, and the second opening jointly form a circulating air passage, and when the fan is started, the gas in the circulating air passage will circulate along the circulating air passage to form a circulating air flow.

[0006] In some embodiments, the fan includes an impeller and a motor, the impeller is arranged at one end of the air duct close to the first opening or the second opening, the motor is arranged on a side of the insulation board away from the air duct, and the output end of the motor passes through the insulation board and is connected to the rotating shaft of the impeller.

[0007] In some embodiments, the impeller is a turbine impeller, and the side of the turbine impeller facing away from the motor is toward the first opening or the second opening; wherein, when the motor is started and the impeller rotates, the gas in the air duct is sucked in from the side of the impeller perpendicular to the rotating shaft, and is blown into the test chamber from the side of the impeller facing the first opening or the second opening.

[0008] In some embodiments, the testing equipment includes an air guide plate disposed in the testing chamber, the air guide plate being provided with a plurality of air guide holes, the plurality of air guide holes being evenly arranged in an array on the air guide plate, and the gas in the testing chamber can flow from one side of the air guide plate through the air guide holes to the other side.

[0009] In some embodiments, there are two air guide plates; one air guide plate is disposed at one end of the test cavity close to the first opening to enclose a first wind zone connected to the first opening; the other air guide plate is disposed at one end of the test cavity close to the second opening to enclose a second wind zone connected to the second opening; the two air guide plates and the inner wall of the test cavity together enclose a test area; wherein the first wind zone, the first opening, the air duct, the second opening, the second wind zone and the test area together form the circulating air duct.

[0010] In some embodiments, a fixing portion is bent and extended from one end of the air guide plate near the top of the test cavity, a fixing groove is provided on the side wall of the top of the test cavity, at least a portion of the fixing portion is accommodated in the fixing groove, and the fixing portion is used to fix the air guide plate to the test cavity.

[0011] In some embodiments, the temperature control component includes a semiconductor refrigeration sheet, which is disposed on the insulation board and is used to increase or decrease the temperature of the air duct.

[0012] In some embodiments, the temperature control component includes a heat sink disposed in the air duct, one side of the heat sink abuts against the outer wall of the test cavity, and the other side of the heat sink abuts against the semiconductor refrigeration sheet.

[0013] In some embodiments, the testing device includes a monitoring board, and the monitoring board is electrically connected to the temperature control component, the fan and the main board respectively.

[0014] In some embodiments, the test device includes a heat dissipation component disposed on a side of the temperature control component facing away from the test box, and the heat dissipation component is used to dissipate heat from the temperature control component.

[0015] The beneficial effects of the embodiments of the present utility model are as follows: Different from the prior art, a test device provided by the embodiments of the present utility model includes a test box, a heat preservation board, a temperature control component, a fan, and a main board. The test box is provided with a test cavity for providing a test environment for a chip to be tested. First openings and second openings are respectively formed on two sides of the test box, and the first openings and the second openings are respectively communicated with the test cavity; the heat preservation board is disposed on the outer wall of the test box, and the heat preservation board and the outer wall of the test box jointly enclose an air duct, and the air duct is respectively communicated with the first opening and the second opening; at least a part of the temperature control component is located in the air duct, and the temperature control component is used to raise and lower the temperature of the test cavity; at least a part of the fan is disposed in the air duct, and the fan is used to introduce the gas in the air duct into the test cavity from the first opening or the second opening; the main board is used for communicating with the chip to be tested. The test device of the present utility model forms a circulating air duct through the test cavity, the first opening, the air duct, and the second opening. Driven by the fan, the gas in the circulating air duct will circulate along the circulating air duct to form a circulating air flow, so that the heat distribution in each area of the test cavity is more uniform, reducing the difference in the test environment of the chip to be tested at different positions, and thus making the test results more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments of the present utility model. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the drawings without creative efforts.

[0017] Figure 1 is a perspective view of the test device provided by the embodiments of the present utility model;

[0018] Figure 2 is an exploded view of the test device provided by the embodiments of the present utility model;

[0019] Figure 3 is a cross-sectional view of the test device provided by the embodiments of the present utility model in the test box area;

[0020] Figure 4 is a structural view of the test box provided by the embodiments of the present utility model after the box cover is opened;

[0021] Figure 5It is a cross-sectional view after the assembly of the test box, heat preservation board, heat sink and circulation component provided by the embodiment of the present utility model;

[0022] Figure 6 It is a schematic structural diagram after the assembly of the heat preservation board and the box body provided by the embodiment of the present utility model;

[0023] Figure 7 It is Figure 3 The enlarged view of part A in

[0024] Figure 8 It is a schematic structural diagram of the heat sink provided by the embodiment of the present utility model;

[0025] Figure 9 It is a schematic structural diagram of the fan provided by the embodiment of the present utility model;

[0026] Figure 10 It is a schematic structural diagram of the air deflector provided by the embodiment of the present utility model.

[0027] The reference numerals in the specific implementation mode are as follows:

[0028] 100, test equipment;

[0029] 1, box body; 1a, receiving cavity; 1b, first heat dissipation fan;

[0030] 2, test component; 21, test box; 21a, test cavity; 21b, first air zone; 21c, second air zone; 21d, test area; 21e, fixing groove; 211, box body; 211a, open end; 2111, convex part; 211d, first opening; 211e, second opening; 212, box cover; 22, main board; 23, test board; 25, monitoring board;

[0031] 3, temperature control component; 31, semiconductor refrigeration sheet; 31a, first surface; 31b, second surface; 32, heat sink; 321, positioning part;

[0032] 4, heat dissipation component; 44, fan;

[0033] 5, circulation component; 51, fan; 511, impeller; 512, motor; 52, air deflector; 521, air guiding hole; 522, fixing part;

[0034] 9, heat preservation board; 9a, slotted; 9b, air duct;

[0035] 10, temperature sensor. Specific implementation mode

[0036] To facilitate the understanding of the present utility model, the present utility model will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0037] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in this specification in the description of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0038] The current equipment for aging testing of storage chips (generally called the furnace body) places the chips to be tested on the test board, then inserts the test board into the furnace body, and raises and lowers the temperature of the furnace body where the test board is located through the compressor and evaporator in the furnace body to simulate the aging process of the storage chips. Most of such equipment is bulky and has a high maintenance cost.

[0039] The existing small and desktop temperature control test equipment mainly raises and lowers the temperature of the test chamber through the temperature control component to provide a test environment for the chips to be tested. The temperature control component cannot cover all areas of the test chamber, which results in uneven heat transfer to different areas of the test chamber, causing differences in the test environment at different positions of the chips to be tested, and thus leading to deviations in the test results.

[0040] The test equipment of the present utility model forms a circulating air duct through the test chamber, the first opening, the air duct and the second opening. Driven by the fan, the gas in the circulating air duct will circulate along the circulating air duct to form a circulating air flow, so that the heat distribution in each area of the test chamber is more uniform, reducing the difference in the test environment at different positions of the chips to be tested, and thus making the test results more accurate.

[0041] To facilitate the reader's understanding of the inventive concept of the present utility model, the specific structure of the test equipment will be described as follows:

[0042] Please refer to Figures 1-3, the test device 100 of the present utility model includes a box body 1, a test component 2, a temperature control component 3, a heat dissipation component 4 and a circulation component 5. The box body 1 is provided with a receiving cavity 1a, and the test component 2, the temperature control component 3, the heat dissipation component 4 and the circulation component 5 are all arranged in the receiving cavity 1a. The test component 2 is used to test the chip to be tested; the temperature control component 3 is used to raise and lower the temperature of the chip to be tested; the heat dissipation component 4 is used to quickly dissipate heat from the chip to be tested and / or the temperature control component 3; the circulation component 5 is used to form a circulating air flow for the test component 2 to improve the temperature uniformity in the test component 2.

[0043] For the above-mentioned test component 2, the test component 2 includes a test box 21, a main board 22 and a test board 23. The test box 21 is provided with a test cavity 21a, and the test cavity 21a is used to provide a test environment for the chip to be tested; the test board 23 is arranged in the test cavity 21a, and the test board 23 is used to fix and connect the chip to be tested; the main board 22 is electrically connected to the test board 23, and the main board 22 is used to communicate with the chip to be tested to detect the working quality of the chip to be tested in different test environments. The main board 22 is equivalent to the brain of the whole device, and operations such as program reading and writing, signal transmission and reception need to be carried out through the main board 22. Preferably, the size of the test cavity 21a of the present application is designed to be 260*58*53.5mm to meet miniaturization requirements.

[0044] In some embodiments, first heat dissipation fans 1b are arranged on two opposite side walls of the box body 1 to form convection, thereby accelerating the heat dissipation of the test component 2 in the box body 1.

[0045] In some embodiments, please refer to Figure 4 , the test box 21 includes a box body 211 and a box cover 212. The box body 211 is provided with an open mouth 211a, and the box cover 212 is covered on the open mouth 211a. The box body 211 and the box cover 212 jointly enclose the test cavity 21a. Preferably, the test box 21 is made of metal 6061 aluminum alloy. 6061 aluminum alloy is a high-quality aluminum alloy product produced by heat treatment and pre-stretching processes, belonging to a heat-treatable alloy, so that the test box 21 has a good heat preservation effect. First openings 211d and second openings 211e are respectively arranged on two sides of the box body 211 of the test box 21, and the first openings 211d and the second openings 211e are respectively communicated with the test cavity 21a.

[0046] In some embodiments, please refer to Figures 5-6, the test device 100 includes a plurality of thermal insulation boards 9, and the plurality of thermal insulation boards 9 are arranged on the outer wall of the test box 21 to wrap the test box 21 for heat preservation of the test box 21. Specifically, the outer sides of the peripheral side walls and the bottom wall of the box body 211 of the test box 21 are all wrapped with thermal insulation boards 9, and the thermal insulation boards 9 are preferably XPS foam boards to improve the heat preservation effect. It can be understood that the thermal insulation boards 9 may also include at least one of polystyrene, extruded polystyrene, polyurethane or glass wool. The thermal insulation boards 9 and the outer wall of the test box 21 jointly enclose an air duct 9b, and the air duct 9b is respectively communicated with the first opening 211d and the second opening 211e. At least part of the temperature control component 3 is located in the air duct 9b to raise and lower the temperature of the test chamber 21a. The test chamber 21a, the first opening 211d, the air duct 9b and the second opening 211e jointly form a circulating air duct. When the circulating component 5 is started, the gas in the circulating air duct will circulate along the circulating air duct to form a circulating air flow (as shown by the arrow in Figure 5 ), so that the temperature in each area of the test chamber is more uniform. It can be understood that the flow direction of the circulating air flow is not limited and can be adjusted according to actual needs. For example, it can be clockwise or counterclockwise.

[0047] Preferably, the thermal insulation board 9 arranged on a certain side wall of the box body 211 is provided with a slot 9a, and at least part of the temperature control component 3 is arranged in the slot 9a to position the temperature control component 3 and make the temperature control component 3 close to the side wall of the box body 211, so as to facilitate raising and lowering the temperature of the test chamber 21a.

[0048] For the above temperature control component 3, please refer to Figures 7-8, the temperature control component 3 includes a thermoelectric cooler 31 and a heat sink 32. The thermoelectric cooler 31 is provided with opposite first surface 31a and second surface 31b. The first surface 31a is adjacent to the outer wall of the test chamber 21a. The thermoelectric cooler 31 is used to raise and lower the temperature of the test chamber 21a; one side of the heat sink 32 abuts against the outer wall of the test chamber 21a, and the other side of the heat sink 32 abuts against the first surface 31a of the thermoelectric cooler 31. The heat sink 32 is used to better assist the thermoelectric cooler 31 in raising and lowering the temperature of the test chamber 21a. Specifically, the heat sink 32 is arranged between the heat insulation board 9 and the side wall of the box body 211 so that the heat insulation board 9 can keep the heat sink 32 warm; the side wall of the box body 211 is provided with a plurality of protruding parts 2111, and the heat sink 32 is provided with a plurality of through holes. At least part of the protruding parts 2111 is inserted into the through holes so that the heat sink 32 is positioned on the side wall of the box body 211; further, the temperature control component 3 includes a fixing member. One end of the fixing member abuts against the heat sink 32, and the other end of the fixing member passes through the through hole and is fixed to the protruding part 2111 so that the heat sink 32 is fixed to the side wall of the box body 211. The fixing member can be a screw, a buckle, a rivet, a welding part or an adhesive part. The fixing member can be fixed to the protruding part 2111 by screwing, clamping, bonding or welding, etc.; the surface of the heat sink 32 facing the thermoelectric cooler 31 is provided with a positioning part 321. The positioning part 321 is at least partially arranged in the slot 9a of the heat insulation board 9 so that one side of the heat sink 32 facing the thermoelectric cooler 31 is positioned on the heat insulation board 9; the thermoelectric cooler 31 is arranged in the slot 9a of the heat insulation board 9 so that the thermoelectric cooler 31 is positioned on the heat insulation board 9. The first surface 31a of the thermoelectric cooler 31 abuts against the positioning part 321. The thermoelectric cooler 31 is a prior art. In this application, thermoelectric coolers 31 of models such as TEC1-12706, TEC1-12708 or TEC1-12710 can be used. Through the thermoelectric cooler 31, the temperature of the test chamber 21a can be adjusted from normal temperature to high temperature section, so that the chip to be tested can be tested in a high temperature environment. For example, the temperature of the test chamber 21a can be adjusted between 25°C and 90°C. The heat sink 32 includes copper to have a better heat dissipation effect.

[0049] For the principle of temperature rise and fall of semiconductors, after the semiconductor refrigeration chip 31 is powered on, one side cools and the other side heats up, and the temperature difference between the two sides is stable at 60 °C. Therefore, theoretically, the faster the heat on the heating surface is dissipated, the lower the temperature of the cooling surface will be. Based on this, the cold of the cooling surface is then transferred to the small heat preservation cavity through the heat sink 32 to achieve a low-temperature environment. In this application, when the power supply is connected to the positive of the semiconductor refrigeration chip 31, the first surface 31a of the semiconductor refrigeration chip 31 cools, and the second surface 31b of the semiconductor refrigeration chip 31 heats up to cool the test chamber 21a; when the power supply is connected to the negative of the semiconductor refrigeration chip 31, the first surface 31a of the semiconductor refrigeration chip 31 heats up, and the second surface 31b of the semiconductor refrigeration chip 31 cools to heat the test chamber 21a. Since the semiconductor refrigeration chip 31 has the characteristic that the higher the temperature, the lower the working current, through multiple experiments, it is found that when using a semiconductor refrigeration chip 31 with a rated current of 15A at a voltage of 12.8V, the cooling speed is the fastest and the effect is the best.

[0050] For the above heat dissipation component 4, the heat dissipation component 4 is arranged on the side of the temperature control component 3 away from the test box 21, and the heat dissipation component 4 is used to dissipate heat from the temperature control component 3. Specifically, the heat dissipation component 4 includes a fan 44, and the fan 44 is arranged on the second surface 31b of the semiconductor refrigeration chip 31. The fan 44 is used to dissipate the heat generated by the semiconductor refrigeration chip 31 into the environment through air flow.

[0051] In this application, the power supply is connected to the positive of the semiconductor refrigeration chip 31, so that the semiconductor refrigeration chip 31 cools the test chamber 21a. Then, through the fan 44, the second surface 31b of the semiconductor refrigeration chip 31 can be cooled, and correspondingly, the first surface 31a of the semiconductor refrigeration chip 31 will also be cooled, thereby reducing the temperature of the test chamber 21a. For example, the temperature of the test chamber 21a can be reduced to about 25 °C. Preferably, in this application, selecting 2 semiconductor refrigeration chips 31 can achieve temperature rise and fall to the required temperature while taking into account the advantage of small volume.

[0052] In some embodiments, the heat dissipation component 4 includes a liquid cooling head, and the liquid cooling head is arranged on the semiconductor refrigeration chip 31 to cool the semiconductor refrigeration chip 31 through the coolant in the liquid cooling head; further, the heat dissipation component 4 includes a liquid cooling row, and the liquid cooling row is connected to the liquid cooling head, so that the coolant in the liquid cooling head can flow to the liquid cooling row. The liquid cooling row can increase the contact area between the coolant and the air, thereby improving the heat dissipation efficiency of the coolant and further improving the cooling efficiency of the semiconductor refrigeration chip 31.

[0053] For the above circulation component 5, please refer to Figures 9-10The circulation component 5 includes a fan 51 and an air guide plate 52. The fan 51 is at least partially disposed in the air duct 9b. The fan 51 is used to introduce the gas in the air duct 9b into the test chamber 21a from the first opening 211d or the second opening 211e. When the fan 51 is started, the gas in the circulating air duct will circulate along the circulating air duct to form a circulating airflow. The air guide plate 52 is provided with a plurality of air guide holes 521, and the plurality of air guide holes 521 are evenly arranged in an array on the air guide plate 52. The gas in the test chamber 21a can flow from one side of the air guide plate 52 to the other side through the air guide holes 521. After passing through the air guide holes 521, the gas in the test chamber 21a is divided into small air flows to form a relatively uniform air flow, so as to further improve the uniformity of the temperature of each area in the test chamber 21a.

[0054] The fan 51 includes an impeller 511 and a motor 512. The impeller 511 is arranged at one end of the air duct 9b close to the first opening 211d or the second opening 211e, and the motor 512 is arranged at the side of the heat preservation plate 9 away from the air duct 9b. The output end of the motor 512 passes through the heat preservation plate 9 and is connected to the rotating shaft of the impeller 511, so as to reduce the space required for the fan 51 to occupy the air duct 9b. Preferably, the impeller 511 is a turbine impeller, and the side of the turbine impeller away from the motor 512 faces the first opening 211d or the second opening 211e; wherein, when the motor 512 is started and the impeller 511 rotates, the gas in the air duct 9b is sucked in from the side of the impeller 511 perpendicular to the rotating shaft, and blown into the test chamber 21a from the side of the impeller 511 facing the first opening 211d or the second opening 211e, so as to improve the gas circulation efficiency in the test chamber 21a.

[0055] In some embodiments, there are two air guide plates 52; one air guide plate 52 is disposed at one end of the test cavity 21a close to the first opening 211d to enclose a first wind zone 21b connected to the first opening 211d; the other air guide plate 52 is disposed at one end of the test cavity 21a close to the second opening 211e to enclose a second wind zone 21c connected to the second opening 211e; the two air guide plates 52 and the inner wall of the test cavity 21a together enclose a test area 21d; wherein the first wind zone 21b, the first opening 211d, the air duct 9b, the second opening 211e, the second wind zone 21c and the test area 21d together form the circulating air duct.

[0056] In some embodiments, one end of the air deflector 52 near the top of the test chamber 21a is bent and extended with a fixing portion 522. A fixing groove 21e is formed in the side wall of the top of the test chamber 21a. At least a part of the fixing portion 522 is received in the fixing groove 21e. The fixing portion 522 is used to fix the air deflector 52 to the test chamber 21a, so that the air deflector 52 can be better fixed to the test chamber 21a without occupying too much space of the test chamber 21a.

[0057] In some embodiments, the above-mentioned test assembly 2 includes a monitoring board 25. The monitoring board 25 is electrically connected to the semiconductor refrigeration chip 31, the blower 51, the main board 22, the first cooling fan 1b and the heat dissipation assembly 4 respectively. The monitoring board 25 is used to monitor and control the semiconductor refrigeration chip 31, the blower 51, the main board 22, the first cooling fan 1b and the heat dissipation assembly 4.

[0058] In some embodiments, the test device 100 includes a temperature sensor 10. The temperature sensor 10 is disposed in the test chamber 21a. The temperature sensor 10 is electrically connected to the main board 22 and the monitoring board 25 respectively. The temperature sensor 10 is used to detect the temperature in the test chamber 21a.

[0059] In some embodiments, the test device 100 includes a whole machine power on / off device, such as a switching power supply, a contactor, and a smoke detector, etc., to realize the on / off control of the power supply of the test device 100.

[0060] For the convenience of readers to understand the inventive concept of the present invention, the working process of the test device 100 is described as follows:

[0061] When the test device 100 works, open the lid 212 of the test box 21, install the chip to be tested on the test board 23, then put the test board 23 with the chip to be tested into the test chamber 21a in the test box 21, and then electrically connect the test board 23 to the main board 22. After closing the lid 212, start the semiconductor refrigeration chip 31, the heat dissipation assembly 4, the blower 51 and the first cooling fan 1b through the monitoring board 25, so that the temperature of the test chamber 21a rises and falls, thereby simulating the process of chip aging. After the main board 22 sends a signal to the test board 23, according to the return situation of the signal, the quality of the chip to be tested is judged.

[0062] In the embodiment of the present utility model, the test device 100 raises and lowers the temperature of the test chamber 21a through the semiconductor refrigeration chip 31. Compared with the prior art that uses a compressor for refrigeration, the volume of the test device 100 is greatly saved, enabling it to be placed on a desktop; a circulating air duct is jointly formed by the test chamber 21a, the first opening 211d, the air duct 9b and the second opening 211e. Driven by the fan 51, the gas in the circulating air duct will circulate along the circulating air duct to form a circulating air flow, so that the heat distribution in each area of the test chamber 21a is more uniform, reducing the difference in the test environment of the chip under test at different positions, thereby making the test results more accurate; by abutting the second surface 31b of the semiconductor refrigeration chip 31 against the fan 44, the temperature of the second surface 31b of the semiconductor refrigeration chip 31 is reduced, so that the first surface 31a of the semiconductor refrigeration chip 31 is correspondingly cooled, and further the test chamber 21a adjacent to the first surface 31a realizes a low-temperature test environment; in addition, the test device 100 does not require a dedicated line and only needs 220V of daily electricity to start, without an additional water supply system.

[0063] It should be noted that the description and drawings of the present utility model give preferred embodiments of the present utility model. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations to the content of the present utility model. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Moreover, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, all of which are regarded as within the scope described in the description of the present utility model; further, for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present utility model.

Claims

1. A test device, characterized in that, include: A test box is provided with a test cavity, the test cavity is used to provide a test environment for the chip to be tested, and a first opening and a second opening are respectively opened on two sides of the test box, and the first opening and the second opening are respectively connected to the test cavity; A heat preservation plate, arranged on the outer wall of the test box, wherein the heat preservation plate and the outer wall of the test box together enclose an air duct, and the air duct is respectively connected to the first opening and the second opening; A temperature control component, at least part of which is located in the air duct, and is used to raise and lower the temperature of the test chamber; a fan, at least partially disposed in the air duct, and configured to guide the gas in the air duct into the test chamber from the first opening or the second opening; A mainboard, used for communicating with the chip to be tested; The test cavity, the first opening, the air duct and the second opening together form a circulating air duct. When the fan is started, the gas in the circulating air duct circulates along the circulating air duct to form a circulating airflow.

2. The test device according to claim 1, characterized in that The fan includes an impeller and a motor. The impeller is arranged at one end of the air duct close to the first opening or the second opening. The motor is arranged on a side of the insulation board away from the air duct. The output end of the motor passes through the insulation board and is connected to the rotating shaft of the impeller.

3. The testing device according to claim 2, characterized in that The impeller is a turbine impeller, and the side of the turbine impeller facing away from the motor faces the first opening or the second opening; When the motor is started and the impeller rotates, the gas in the air duct is sucked in from a side of the impeller perpendicular to the rotating shaft, and is blown into the test chamber from a side of the impeller facing the first opening or the second opening.

4. The testing device according to claim 1, characterized in that The testing equipment includes an air guide plate arranged in the testing chamber, the air guide plate is provided with a plurality of air guide holes, the plurality of air guide holes are evenly arranged in an array on the air guide plate, and the gas in the testing chamber can flow from one side of the air guide plate through the air guide holes to the other side.

5. The testing device according to claim 4, characterized in that There are two wind deflectors; A wind guide plate is disposed at one end of the test cavity close to the first opening to enclose a first wind zone communicating with the first opening; Another wind guide plate is disposed at one end of the test cavity close to the second opening to enclose and form a second wind zone communicating with the second opening; The two air guide plates and the inner wall of the test chamber together enclose a test area; The first wind area, the first opening, the air duct, the second opening, the second wind area and the test area together form the circulation air duct.

6. The testing device according to claim 4, characterized in that A fixing portion is bent and extended from one end of the air guide plate close to the top of the test cavity, a fixing groove is opened on the side wall of the top of the test cavity, at least part of the fixing portion is accommodated in the fixing groove, and the fixing portion is used to fix the air guide plate to the test cavity.

7. The testing device according to claim 1, characterized in that The temperature control component includes a semiconductor refrigeration sheet, which is arranged on the insulation board and is used to increase or decrease the temperature of the air duct.

8. The testing device according to claim 7, characterized in that The temperature control component includes a heat sink disposed on the air duct, one side of the heat sink abuts against the outer wall of the test cavity, and the other side of the heat sink abuts against the semiconductor refrigeration sheet.

9. The testing device according to any one of claims 1 to 8, characterized in that: The testing device comprises a monitoring board, and the monitoring board is electrically connected to the temperature control component, the fan and the main board respectively.

10. The testing device according to any one of claims 1 to 8, characterized in that: The testing device comprises a heat dissipation component, which is arranged on a side of the temperature control component away from the testing box, and is used for dissipating heat for the temperature control component.

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