Test equipment

Abstract

The embodiment of the utility model relates to the technical field of semiconductor detection, in particular to test equipment, which comprises a test box, a semiconductor chilling plate, a heat dissipation assembly and a mainboard, the test box is provided with a test cavity, the test cavity is used for providing a test environment for a chip to be tested, and the semiconductor chilling plate is provided with a first surface and a second surface which are opposite to each other. The first surface is adjacent to the outer wall of the test cavity, the semiconductor chilling plate is used for heating and cooling the test cavity, the heat dissipation assembly comprises a liquid cooling head and a liquid cooling row, the liquid cooling head abuts against the second surface, the liquid cooling head is used for absorbing heat generated by the semiconductor chilling plate, the liquid cooling row is connected to the liquid cooling head, and the liquid cooling row is used for dissipating the heat absorbed by the liquid cooling head to the environment. The mainboard is used for being in communication connection with a chip to be tested. According to the embodiment of the utility model, the semiconductor chilling plate can be rapidly cooled through the cooperation of the liquid cooling head and the liquid cooling row, so that the test chamber can realize a test environment lower than normal temperature.

Description

Technical Field

[0001] The embodiment of the utility model relates to the technical field of semiconductor detection, and in particular to a testing device. Background Art

[0002] With the rapid development of science and technology, people have higher and higher requirements for chip reliability. As an important part of chip manufacturing, chip testing has played a good role in promoting chip quality. The current equipment for aging test of memory chips (generally called furnace body) places the chip to be tested on the test board, and then inserts the test board into the furnace body. The compressor and evaporator in the furnace body increase and decrease the temperature of the furnace body where the test board is located, so as to simulate the aging process of the memory chip. Most of these equipment are bulky and have high maintenance costs.

[0003] However, most of the small, desktop temperature control test equipment currently available on the market only has the ability to adjust the temperature from normal temperature to high temperature. Since this type of equipment only needs to consider heating issues, its structure is relatively simple and can be designed to be smaller, but this type of equipment cannot meet the test environment below normal temperature. Utility Model Content

[0004] In view of the above problems, an embodiment of the present utility model provides a testing device, which overcomes the above problems or at least partially solves the above problems.

[0005] According to one aspect of an embodiment of the utility model, a test device is provided, including a test box, a semiconductor refrigeration sheet, a heat dissipation component and a main board, the test box is provided with a test cavity, the test cavity is used to provide a test environment for a chip to be tested; the semiconductor refrigeration sheet is provided with a first surface and a second surface relative to each other, the first surface is adjacent to the outer wall of the test cavity, the semiconductor refrigeration sheet is used to heat and cool the test cavity; the heat dissipation component includes a liquid cooling head and a liquid cooling row, the liquid cooling head is abutted against the second surface, the liquid cooling head is used to absorb the heat generated by the semiconductor refrigeration sheet, the liquid cooling row is connected to the liquid cooling head, and the liquid cooling row is used to dissipate the heat absorbed by the liquid cooling head into the environment; the main board is used to communicate with the chip to be tested.

[0006] In some embodiments, the liquid cooling head includes a liquid cooling head body and a heat conducting part which are connected to each other, a contact surface is provided on the side of the heat conducting part which is away from the liquid cooling head body, the contact surface abuts against the second surface, and a pump body and a first flow channel are provided inside the liquid cooling head body, the pump body is used to drive the flow of liquid in the first flow channel.

[0007] In some embodiments, the liquid cooling row includes a liquid cooling row body and a plurality of fins. The plurality of fins are arranged on the surface of the liquid cooling row body, and a second flow channel is arranged inside the liquid cooling row body; the heat dissipation assembly includes a liquid cooling tube, and the first flow channel is communicated with the second flow channel through the liquid cooling tube.

[0008] In some embodiments, the testing device includes a heat sink. One side of the heat sink abuts against the outer wall of the testing cavity, and the other side of the heat sink abuts against the first surface of the semiconductor refrigeration sheet.

[0009] In some embodiments, the testing device includes a drying assembly. The drying assembly includes an air pump and a drying cavity. The air inlet of the air pump is communicated with one side of the testing cavity, the air outlet of the air pump is communicated with one side of the drying cavity, the other side of the drying cavity is communicated with the other side of the testing cavity, and a desiccant is arranged inside the drying cavity.

[0010] In some embodiments, first air vents and second air vents communicating with the testing cavity are respectively formed on two sides of the testing box. The air inlet of the air pump is connected to the first air vent through a first branch pipe, the air outlet of the air pump is connected to one side of the drying cavity through a second branch pipe, and the other side of the drying cavity is connected to the second air vent through a third branch pipe.

[0011] In some embodiments, the testing device includes a monitoring board, and the monitoring board is electrically connected to the semiconductor refrigeration sheet, the liquid cooling head, the liquid cooling row and the main board respectively.

[0012] In some embodiments, the testing device includes a temperature sensor. The temperature sensor is arranged in the testing cavity and is used for detecting the temperature inside the testing cavity.

[0013] In some embodiments, the testing box includes a box body and a box cover. The box body is provided with an open mouth, the box cover covers the open mouth, and the box body and the box cover jointly enclose the testing cavity.

[0014] In some embodiments, the testing device includes a plurality of heat preservation boards. The plurality of heat preservation boards are arranged on the outer wall of the testing box to wrap the testing box.

[0015] The beneficial effects of the embodiments of the present utility model are as follows: Different from the prior art, a testing device provided by the embodiments of the present utility model includes a testing box, a semiconductor refrigeration sheet, a heat dissipation component, and a main board. The testing box is provided with a testing cavity for providing a testing environment for a chip to be tested. The semiconductor refrigeration sheet has opposite first and second surfaces. The first surface is adjacent to the outer wall of the testing cavity. The semiconductor refrigeration sheet is used to raise and lower the temperature of the testing cavity. The heat dissipation component includes a liquid cold head and a liquid cold row. The liquid cold head abuts against the second surface. The liquid cold head is used to absorb the heat generated by the semiconductor refrigeration sheet. The liquid cold row is connected to the liquid cold head and is used to dissipate the heat absorbed by the liquid cold head into the environment; the main board is used for communication connection with the chip to be tested. The testing device of the embodiments of the present utility model realizes rapid cooling of the second surface of the semiconductor refrigeration sheet by abutting the liquid cold head against the second surface of the semiconductor refrigeration sheet and connecting the liquid cold head to the liquid cold row, so that the first surface of the semiconductor refrigeration sheet is correspondingly cooled rapidly, and further enables the testing cavity adjacent to the first surface to achieve a testing environment below normal temperature. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments of the present utility model will be briefly introduced below. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the drawings without creative efforts.

[0017] Figure 1 is a perspective view of the testing device provided by the embodiments of the present utility model;

[0018] Figure 2 is an exploded schematic view of the testing device provided by the embodiments of the present utility model;

[0019] Figure 3 is a cross-sectional view of the testing device provided by the embodiments of the present utility model in the testing box area;

[0020] Figure 4 is a schematic structural view of the testing box after the box cover is opened provided by the embodiments of the present utility model;

[0021] Figure 5 is a schematic structural view of the heat preservation board and the box body after assembly provided by the embodiments of the present utility model;

[0022] Figure 6 is Figure 3 the enlarged view of part A in

[0023] Figure 7 is a schematic structural view of the heat dissipation fin provided by the embodiments of the present utility model;

[0024] Figure 8 is a schematic structural view of the liquid cooling head provided by an embodiment of the present utility model;

[0025] Figure 9 is a schematic structural view of the liquid cooling radiator provided by an embodiment of the present utility model;

[0026] Figure 10 is a schematic structural view of the drying component connected to the box body provided by an embodiment of the present utility model.

[0027] The reference numerals in the specific embodiments are as follows:

[0028] 100, test equipment; 1, box body; 1a, accommodation cavity; 1b, first heat dissipation fan; 2, test component; 21, test box; 21a, test cavity; 211, box body; 211a, open end; 2111, convex portion; 211b, first air outlet; 211c, second air outlet; 212, box cover; 22, main board; 23, test board; 25, monitoring board; 3, temperature control component; 31, semiconductor refrigeration sheet; 31a, first surface; 31b, second surface; 32, heat sink; 321, positioning portion; 4, heat dissipation component; 41, liquid cooling head; 411, liquid cooling head body; 412, heat conduction portion; 412a, contact surface; 42, liquid cooling radiator; 421, liquid cooling radiator body; 422, second heat dissipation fan; 43, liquid cooling pipe; 6, drying component; 61, air pump; 61a, air inlet; 61b, air outlet; 62, drying cavity; 63, first branch pipe; 64, second branch pipe; 65, third branch pipe; 9, heat preservation board; 9a, slotted opening; 10, temperature sensor. Specific Embodiments

[0029] For ease of understanding the present utility model, the present utility model will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0030] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in this specification in the description of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0031] The current equipment for aging testing of storage chips (generally called a furnace body) places the chips to be tested on a test board, then inserts the test board into the furnace body, and raises and lowers the temperature of the furnace body where the test board is located through the compressor and evaporator in the furnace body to simulate the aging process of the storage chips. Most of such equipment is bulky and has high maintenance costs.

[0032] Existing small and desktop temperature control testing equipment mostly only has the ability to adjust the temperature from normal temperature to high temperature. Since such equipment only needs to consider heating problems, its structure is relatively simple and can be designed to be more compact. However, this type of equipment cannot meet the testing environment below normal temperature.

[0033] The testing equipment in the embodiment of the present utility model realizes quickly reducing the temperature of the second surface of the semiconductor refrigeration chip by abutting a liquid cooling head against the second surface of the semiconductor refrigeration chip and connecting the liquid cooling head to a liquid cooling row, so that the first surface of the semiconductor refrigeration chip correspondingly quickly cools down, and further enables the test cavity adjacent to the first surface to achieve a testing environment below normal temperature.

[0034] For the convenience of readers to understand the inventive concept of the present utility model, the specific structure of the testing equipment is described as follows:

[0035] Please refer to Figures 1-3 , the testing equipment 100 of the present utility model includes a box body 1, a testing component 2, a temperature control component 3 and a heat dissipation component 4. The box body 1 is provided with a receiving cavity 1a. The testing component 2, the temperature control component 3 and the heat dissipation component 4 are all arranged in the receiving cavity 1a. The testing component 2 is used to test the chips to be tested. The temperature control component 3 is used to raise and lower the temperature of the chips to be tested. The heat dissipation component 4 is used to quickly dissipate heat from the chips to be tested and / or the temperature control component 3.

[0036] For the above-mentioned testing component 2, the testing component 2 includes a test box 21, a main board 22 and a test board 23. The test box 21 is provided with a test cavity 21a, and the test cavity 21a is used to provide a testing environment for the chips to be tested; the test board 23 is arranged in the test cavity 21a, and the test board 23 is used to fix and connect the chips to be tested; the main board 22 is electrically connected to the test board 23, and the main board 22 is used to communicate with the chips to be tested to detect the working quality of the chips to be tested under different testing environments. The main board 22 is equivalent to the brain of the whole equipment, and operations such as program reading and writing, signal transmission and reception all need to be carried out through the main board 22. Preferably, the size of the test cavity 21a of the present application is designed to be 260*58*53.5mm to meet miniaturization.

[0037] In some embodiments, first heat dissipation fans 1b are arranged on two opposite side walls of the box body 1 to form convection, thereby accelerating the heat dissipation of the testing component 2 in the box body 1.

[0038] In some embodiments, please refer to Figure 4 , the test box 21 includes a box body 211 and a box cover 212. The box body 211 is provided with an opening 211a, and the box cover 212 is covered on the opening 211a. The box body 211 and the box cover 212 together enclose the test chamber 21a. Preferably, the test box 21 is made of 6061 aluminum alloy. 6061 aluminum alloy is a high-quality aluminum alloy product produced by heat treatment and pre-stretching processes and belongs to a heat-treatable alloy, so that the test box 21 has a good heat preservation effect.

[0039] In some embodiments, please refer to Figure 5 , the test device 100 includes a plurality of heat preservation plates 9. The plurality of heat preservation plates 9 are arranged on the outer wall of the test box 21 to wrap the test box 21 for heat preservation of the test box 21. Specifically, the outer sides of the peripheral side walls and the bottom wall of the box body 211 of the test box 21 are all wrapped with heat preservation plates 9. The heat preservation plates 9 are preferably XPS foam boards to improve the heat preservation effect. It can be understood that the heat preservation plates 9 may also include at least one of polystyrene, extruded polystyrene, polyurethane or glass wool. Preferably, the heat preservation plate 9 arranged on a certain side wall of the box body 211 is provided with a slot 9a, and at least part of the temperature control component 3 is arranged in the slot 9a to position the temperature control component 3 and make the temperature control component 3 close to the side wall of the box body 211, thereby facilitating the temperature rise and fall of the test chamber 21a.

[0040] Regarding the above temperature control component 3, please refer to Figures 6-7, the temperature control component 3 includes a thermoelectric cooler 31 and a heat sink 32. The thermoelectric cooler 31 has opposite first surface 31a and second surface 31b. The first surface 31a is adjacent to the outer wall of the test chamber 21a, and the thermoelectric cooler 31 is used to raise and lower the temperature of the test chamber 21a; one side of the heat sink 32 abuts against the outer wall of the test chamber 21a, and the other side of the heat sink 32 abuts against the first surface 31a of the thermoelectric cooler 31. The heat sink 32 is used to better assist the thermoelectric cooler 31 in raising and lowering the temperature of the test chamber 21a. Specifically, the heat sink 32 is disposed between the heat insulation board 9 and the side wall of the box body 211 so that the heat insulation board 9 can insulate the heat sink 32; the side wall of the box body 211 is provided with a plurality of protrusions 2111, and the heat sink 32 is provided with a plurality of through holes, and at least part of the protrusions 2111 is inserted into the through holes so that the heat sink 32 is positioned on the side wall of the box body 211; further, the temperature control component 3 includes a fixing member, one end of the fixing member abuts against the heat sink 32, and the other end of the fixing member passes through the through hole and is fixed to the protrusion 2111 so that the heat sink 32 is fixed to the side wall of the box body 211. The fixing member can be a screw, a buckle, a rivet, a welding part or an adhesive part, and the fixing member can be fixed to the protrusion 2111 by screwing, clamping, bonding or welding, etc.; the surface of the heat sink 32 facing the thermoelectric cooler 31 is provided with a positioning part 321, and at least part of the positioning part 321 is disposed in the slot 9a of the heat insulation board 9 so that one side of the heat sink 32 facing the thermoelectric cooler 31 is positioned on the heat insulation board 9; the thermoelectric cooler 31 is disposed in the slot 9a of the heat insulation board 9 so that the thermoelectric cooler 31 is positioned on the heat insulation board 9, and the first surface 31a of the thermoelectric cooler 31 abuts against the positioning part 321. The thermoelectric cooler 31 is a prior art. In this application, thermoelectric coolers 31 of models such as TEC1-12706, TEC1-12708 or TEC1-12710 can be used. Through the thermoelectric cooler 31, the temperature of the test chamber 21a can be adjusted from room temperature to high temperature, so that the chip to be tested can be tested in a high temperature environment. For example, the temperature of the test chamber 21a can be adjusted between 25°C and 90°C. The heat sink 32 includes copper to have a better heat dissipation effect.

[0041] Regarding the principle of temperature rise and fall of semiconductors, after the semiconductor refrigeration chip 31 is powered on, one side cools and the other side heats up, and the temperature difference between the two sides is stable at 60 °C. Therefore, theoretically, the faster the heat on the heating surface is dissipated, the lower the temperature of the cooling surface will be. Based on this, the cold of the cooling surface is then transferred to the small heat preservation cavity through the heat sink 32 to achieve a low-temperature environment. In this application, when the power supply is connected to the positive of the semiconductor refrigeration chip 31, the first surface 31a of the semiconductor refrigeration chip 31 cools, and the second surface 31b of the semiconductor refrigeration chip 31 heats up to achieve cooling of the test cavity 21a; when the power supply is connected to the negative of the semiconductor refrigeration chip 31, the first surface 31a of the semiconductor refrigeration chip 31 heats up, and the second surface 31b of the semiconductor refrigeration chip 31 cools to achieve heating of the test cavity 21a. Since the semiconductor refrigeration chip 31 has the characteristic that the higher the temperature, the lower the working current, through multiple experiments, it is obtained that when using a semiconductor refrigeration chip 31 with a rated current of 15A at a voltage of 12.8V, the cooling speed is the fastest and the effect is the best.

[0042] For the above heat dissipation component 4, please refer to Figures 8-9The heat dissipation component 4 includes a liquid cooling head 41 and a liquid cooling row 42. The liquid cooling head 41 abuts against the second surface 31b. The liquid cooling head 41 is used to absorb the heat generated by the semiconductor cooling plate 31. The liquid cooling row 42 is connected to the liquid cooling head 41. The liquid cooling row 42 is used to dissipate the heat absorbed by the liquid cooling head 41 to the environment. Specifically, the liquid cooling head 41 includes a liquid cooling head body 411 and a heat conducting part 412 connected to each other. The heat conducting part 412 is provided with a contact surface 412a on the side away from the liquid cooling head body 411. The contact surface 412a abuts against the second surface 31b. The heat conducting part 412 is preferably a copper sheet so that the heat conducting part 412 has good thermal conductivity. The liquid cooling head body 411 is provided with a pump body and a first flow channel inside. The pump body is used to drive the liquid flow in the first flow channel. The liquid cooling row 42 includes a liquid cooling row body 421 and a plurality of fins, wherein the plurality of fins are arranged on the surface of the liquid cooling row body 421 to increase the contact surface 412a between the liquid cooling row body 421 and the air, so that the heat of the liquid cooling row body 421 can be timely discharged; a second flow channel is arranged inside the liquid cooling row body 421; the heat dissipation component 4 also includes a liquid cooling pipe 43, and the first flow channel is connected with the second flow channel through the liquid cooling pipe 43. After the liquid cooling head 41 and the liquid cooling row 42 are energized, the heat of the second surface 31b of the semiconductor refrigeration plate 31 is transferred to the refrigerant in the first flow channel inside the liquid cooling head 41 through the heat conducting part 412, and the refrigerant then flows to the liquid cooling row 42 located above the box body 1 through the liquid cooling pipe 43, so that the heat of the second surface 31b can be timely discharged. Preferably, the liquid cooling radiator 42 further includes a second cooling fan 422 , which is disposed below the liquid cooling radiator body 421 , and is used to blow external air toward the liquid cooling radiator body 421 to accelerate heat dissipation of the liquid cooling radiator body 421 .

[0043] The present application connects the power supply to the semiconductor refrigeration sheet 31, so that the semiconductor refrigeration sheet 31 cools the test cavity 21a, and then the second surface 31b of the semiconductor refrigeration sheet 31 can be quickly cooled to below room temperature through the cooperation of the liquid cooling head 41 and the liquid cooling row 42, and the corresponding first surface 31a of the semiconductor refrigeration sheet 31 will also be quickly cooled to below room temperature, so that the temperature of the test cavity 21a is quickly reduced to below room temperature, for example, the temperature of the test cavity 21a can be reduced to about -10°C, that is, the temperature of the test cavity 21a can be adjusted between -10°C and 90°C. Preferably, the present application uses two semiconductor refrigeration sheets 31 to achieve cooling to the required temperature (-10°C) while taking into account the advantage of small size.

[0044] Preferably, the number of the liquid cooling heads 41 and the liquid cooling radiators 42 in the present application is both 2, so as to reduce the volume of the test device 100 on the basis of meeting rapid cooling. Of course, the numbers of the semiconductor refrigeration chips 31, the liquid cooling heads 41 and the liquid cooling radiators 42 are not limited and can be adjusted according to actual needs.

[0045] In some embodiments, the above-mentioned test assembly 2 includes a monitoring board 25, and the monitoring board 25 is electrically connected to the semiconductor refrigeration chip 31, the liquid cooling head 41, the liquid cooling radiator 42 and the main board 22 respectively. The monitoring board 25 is used to monitor and control the semiconductor refrigeration chip 31, the liquid cooling head 41, the liquid cooling radiator 42 and the first cooling fan 1b.

[0046] In some embodiments, please refer to Figure 10 simultaneously, the test device 100 includes a drying assembly 6, and the drying assembly 6 includes an air pump 61 and a drying chamber 62. An air inlet 61a of the air pump 61 communicates with one side of the test chamber 21a, and an air outlet 61b of the air pump 61 communicates with one side of the drying chamber 62. The other side of the drying chamber 62 communicates with the other side of the test chamber 21a. A desiccant is arranged in the drying chamber 62, and the drying assembly 6 is used to dry the gas in the test chamber 21a. Further, first air vents 211b and second air vents 211c communicating with the test chamber 21a are respectively formed on two sides of the test box 21. The air inlet 61a of the air pump 61 is connected to the first air vent 211b through a first branch pipe 63, the air outlet 61b of the air pump 61 is connected to one side of the drying chamber 62 through a second branch pipe 64, and the other side of the drying chamber 62 is connected to the second air vent 211c through a third branch pipe 65. When the drying assembly 6 operates, the air pump 61 sucks the gas in the test chamber 21a into the air pump 61 through the first air vent 211b, the first branch pipe 63 and the air inlet 61a in sequence, and then blows the gas into the drying chamber 62 through the air outlet 61b and the second branch pipe 64 in sequence to contact with the desiccant, so as to dry the gas. The dried gas then returns to the test chamber 21a through the third branch pipe 65 and the second air vent 211c in sequence (as Figure 10 shown by the arrow), thus forming a circulating drying loop.

[0047] In practical applications, when the test chamber 21a is in the heating process, since the hotter air will come into contact with the inner wall of the relatively cooler test chamber 21a and the object to be tested, the water vapor in the air will cool and condense on the inner wall of the test chamber 21a and the object to be tested. The object to be tested generally includes a chip to be tested and an electrical connector. The liquid formed by the condensation on the object to be tested is likely to adhere to the electrical connection part. The condensed liquid may cause a short circuit in the circuit, damage the equipment, and even cause a fire, thus bringing potential safety hazards. In addition, the long-term existence of condensation will accelerate the corrosion of metal components and affect the performance and lifespan of the equipment. By starting the air pump 61 of the drying component 6, a part of the air in the test chamber 21a will be sucked into the air pump 61 in the direction of the arrow, pumped into the drying chamber 62 along the second branch pipe 64. A desiccant is placed in the drying chamber 62. The air pumped into the drying chamber 62 is dried and then pumped back into the test chamber 21a along the third branch pipe 65 in the direction of the arrow. In this way, the air in the test chamber 21a is dried to reduce the water vapor in the air and lower the possibility of condensation on the inner wall of the test chamber 21a and the object to be tested. Specifically, since the test chamber 21a is a sealed environment, the limited air in the test chamber 21a has little water content, and there is only a risk of condensation when the temperature in the test chamber 21a rises from the test target temperature below 0°C to the room temperature. Therefore, the drying component 6 does not need to use a large air pump, and the working time of the drying component 6 is short, and the influence of the noise generated by it can be ignored. In addition, the volume of the air that needs to be dried is limited, and not much desiccant is required in the drying chamber 62, and it does not need to be replaced frequently.

[0048] In some embodiments, the test device 100 includes a temperature sensor 10. The temperature sensor 10 is disposed in the test chamber 21a. The temperature sensor 10 is electrically connected to the main board 22 and the monitoring board 25 respectively. The temperature sensor 10 is used to detect the temperature in the test chamber 21a.

[0049] In some embodiments, the test device 100 includes a whole-machine power on / off device, such as a switching power supply, a contactor, and a smoke detector, etc., to realize the control of the power switch of the test device 100.

[0050] To facilitate the reader's understanding of the inventive concept of the present utility model, the working process of the test device 100 is described as follows:

[0051] When the test device 100 is working, open the lid 212 of the test box 21, install the chip to be tested on the test board 23, then place the test board 23 with the chip to be tested into the test chamber 21a in the test box 21, and then electrically connect the test board 23 to the main board 22. After closing the lid 212, start the semiconductor refrigeration chip 31, the liquid cooling head 41, the liquid cooling row 42 and the first cooling fan 1b through the monitoring board 25, so that the temperature of the test chamber 21a can be raised and lowered to simulate the process of chip aging. After the main board 22 sends a signal to the test board 23, judge the quality of the chip to be tested according to the return situation of the signal.

[0052] In the embodiment of the present invention, the test device 100 raises and lowers the temperature of the test chamber 21a through the semiconductor refrigeration chip 31. Compared with the prior art that uses a compressor for refrigeration, the volume of the test device 100 is greatly saved, so that it can be placed on the desktop; by abutting the second surface 31b of the semiconductor refrigeration chip 31 against the liquid cooling head 41 and connecting the liquid cooling head 41 to the liquid cooling row 42, the temperature of the second surface 31b of the semiconductor refrigeration chip 31 can be quickly reduced, so that the first surface 31a of the semiconductor refrigeration chip 31 is correspondingly quickly cooled, and then the test chamber 21a adjacent to the first surface 31a can achieve a test environment below normal temperature; in addition, the test device 100 does not require a dedicated line and only needs 220V of daily electricity to start, and does not require an additional water supply system.

[0053] It should be noted that the description and drawings of the present invention give preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not additional limitations to the content of the present invention. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Moreover, the above technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope described in the description of the present invention; further, for those of ordinary skill in the art, modifications or changes can be made according to the above description, and all these modifications and changes should fall within the protection scope of the appended claims of the present invention.

Claims

1. A test device, characterized in that, include: A test box is provided with a test cavity, and the test cavity is used to provide a test environment for the chip to be tested; A semiconductor refrigeration sheet is provided with a first surface and a second surface opposite to each other, wherein the first surface is adjacent to an outer wall of the test cavity, and the semiconductor refrigeration sheet is used to increase or decrease the temperature of the test cavity; A heat dissipation component, comprising a liquid cooling head and a liquid cooling row, wherein the liquid cooling head abuts against the second surface, the liquid cooling head is used to absorb the heat generated by the semiconductor cooling sheet, the liquid cooling row is connected to the liquid cooling head, and the liquid cooling row is used to dissipate the heat absorbed by the liquid cooling head into the environment; A mainboard is used to communicate with the chip to be tested.

2. The test device according to claim 1, characterized in that The liquid cooling head comprises a liquid cooling head body and a heat conducting part which are connected to each other. A contact surface is arranged on the side of the heat conducting part which is away from the liquid cooling head body. The contact surface abuts against the second surface. A pump body and a first flow channel are arranged inside the liquid cooling head body. The pump body is used to drive the flow of liquid in the first flow channel.

3. The testing device according to claim 2, characterized in that The liquid cooling row comprises a liquid cooling row body and a plurality of fins, wherein the plurality of fins are arranged on the surface of the liquid cooling row body, and a second flow channel is arranged inside the liquid cooling row body; The heat dissipation component includes a liquid cooling pipe, and the first flow channel is connected with the second flow channel through the liquid cooling pipe.

4. The testing device according to claim 1, characterized in that The testing device comprises a heat sink, one side of which abuts against the outer wall of the testing cavity, and the other side of which abuts against the first surface of the semiconductor cooling plate.

5. The testing device according to claim 1, characterized in that The test equipment includes a drying component, which includes an air pump and a drying chamber. The air inlet of the air pump is connected to one side of the test chamber, the air outlet of the air pump is connected to one side of the drying chamber, and the other side of the drying chamber is connected to the other side of the test chamber. A desiccant is arranged in the drying chamber.

6. The testing device according to claim 5, characterized in that A first air vent and a second air vent connected to the test cavity are respectively provided on both sides of the test box, an air inlet of the air pump is connected to the first air vent through a first branch pipe, an air outlet of the air pump is connected to one side of the drying cavity through a second branch pipe, and the other side of the drying cavity is connected to the second air vent through a third branch pipe.

7. The testing device according to claim 1, characterized in that The testing device comprises a monitoring board, and the monitoring board is electrically connected to the semiconductor cooling plate, the liquid cooling head, the liquid cooling row and the main board respectively.

8. The testing device according to any one of claims 1 to 7, characterized in that: The testing device comprises a temperature sensor, which is arranged in the testing cavity and is used to detect the temperature in the testing cavity.

9. The testing device according to any one of claims 1 to 7, characterized in that: The test box includes a box body and a box cover. The box body is provided with an opening, and the box cover is covered on the opening. The box body and the box cover jointly enclose to form the test cavity.

10. The test device according to any one of claims 1-7, characterized in that the test device includes a plurality of heat preservation plates, and the plurality of heat preservation plates are arranged on the outer wall of the test box to wrap the test box.

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