Elevated surface mount inductor

Abstract

The utility model discloses an elevated surface mount inductor, which is mainly characterized in that two metal foot stands are welded on two welding plates of the surface mount inductor, and the two metal foot stands are welded on corresponding welding pads of a circuit board; as the two metal foot stands protrude out of the two welding plates on the bottom surface of the surface mount type inductor, the surface mount type inductor is elevated, so that a space is formed between the bottom surface of the surface mount type inductor and the circuit board, and other small surface mount type electronic elements can be placed and welded on the circuit board, so as to improve the layout density of the electronic elements.

Description

Technical Field

[0001] The utility model relates to a surface mount inductor, in particular to a raised surface mount inductor. Background Art

[0002] With the popularization of surface mount technology, most passive components have adopted surface mount packaging. During welding, after the planar solder feet of the surface mount passive component are smeared with solder paste, they are placed on the corresponding solder joints on the circuit board. After the solder paste is melted and then solidified through heating settings such as a reflow oven, it can be adhered to the circuit board.

[0003] Since the solder feet of the surface mount passive component are flat and exposed on the bottom surface of its package body, after being soldered to the circuit board, there is only a narrow gap with a height matching the solidified solder paste between the bottom surface of the surface mount passive component and the circuit board.

[0004] For specific applications, such as AI servers, the doubling of computing power has relatively increased the number and density of electronic components on the circuit board, and more space for setting electronic components must be vacated. Summary of the Utility Model

[0005] In view of the above technical problems of a large number of electronic components being set on a limited circuit board area, the main purpose of the utility model is to propose a raised surface mount inductor, so that relatively small surface mount passive components can be placed below it.

[0006] The main technical means used to achieve the above purpose is to make the raised surface mount inductor include:

[0007] A surface mount inductor, including:

[0008] An inductance package body; and

[0009] Two welding plates, exposed on the bottom surface of the inductance package body; and

[0010] Two metal brackets, respectively abutted against the bottom surface and two opposite side surfaces of the inductance package body, and each metal bracket includes:

[0011] A horizontal plate, abutted against the bottom surface of the inductance package body and welded to the corresponding welding plate exposed on the bottom surface; and

[0012] A vertical plate, integrally connected to the horizontal plate, and including from top to bottom:

[0013] An upper section, abutted against the corresponding side surface of the inductance package body;

[0014] A middle section, integrally connected to the horizontal plate; and

[0015] The following section, the welding plate protruding downward and exposed on the bottom surface of the inductor package.

[0016] As can be seen from the above description, the elevated surface-mounted inductor of the present utility model mainly welds two metal legs to the two welding plates of the surface-mounted inductor, and instead welds the two metal legs to the corresponding pads on the circuit board; since the two metal legs protrude from the two welding plates on the bottom surface of the surface-mounted inductor, the surface-mounted inductor is elevated, forming a space between its bottom surface and the circuit board. There are multiple pads on the circuit board corresponding to this space for electronic components with a height matching the height of this space to be welded to the corresponding pads on the circuit board; thus, on the circuit board welded with the elevated surface-mounted inductor of the present utility model, other small surface-mounted electronic components can be further welded in the space below the elevated surface-mounted inductor of the present utility model to improve the layout density of electronic components. Description of the Drawings

[0017] Figure 1 Is the bottom-up perspective external view of the elevated surface-mounted inductor of the present utility model;

[0018] Figure 2 Is the top-down perspective exploded view of the elevated surface-mounted inductor of the present utility model;

[0019] Figure 3A Is the side view plan of an embodiment of the elevated surface-mounted inductor of the present utility model;

[0020] Figure 3B Is the side view plan of another embodiment of the elevated surface-mounted inductor of the present utility model;

[0021] Figure 4A Is the side view cross-section of an embodiment of the elevated surface-mounted inductor of the present utility model;

[0022] Figure 4B Is the side view cross-section of another embodiment of the elevated surface-mounted inductor of the present utility model;

[0023] Figure 5 Is the three-dimensional external view of the elevated surface-mounted inductor of the present utility model and other small surface-mounted electronic components welded to the circuit board;

[0024] Among them, reference numerals:

[0025] 10: Surface-mounted inductor; 11: Inductor package;

[0026] 111: Bottom surface; 112: Side surface;

[0027] 12: Welding plate; 121: Bottom surface;

[0028] 13: Inner magnetic core base; 131: Base

[0029] 132: Lower surface; 133: Middle column

[0030] 14, 14’: Nickel - tin alloy layer; 15, 15’: Solder layer

[0031] 20: Coil; 21: Terminal segment

[0032] 30: Outer magnet; 31: Bottom surface

[0033] 32: First outer side; 321: Lower part

[0034] 33: Insulating layer; 40: Metal bracket

[0035] 41: Horizontal plate; 42, 42’: Vertical plates

[0036] 420: Opening; 421: Middle section

[0037] 422: Upper section; 423: Lower section

[0038] 50: Circuit board; 51: Solder pad

[0039] 52: Electronic component Detailed implementation mode

[0040] The present utility model is an improvement on surface - mount inductors, and the technical content will be described in detail below in conjunction with multiple embodiments and drawings.

[0041] First, please refer to Figure 1 and Figure 2 As shown, the elevated surface - mount inductor of the present utility model includes a surface - mount inductor 10 and two metal brackets 40.

[0042] Please refer to Figure 3A As shown, the above - mentioned surface - mount inductor 10 includes an inductive package 11 and two welding plates 12; among them, as Figure 3AAs shown, the two welding plates 12 are exposed on the bottom surface 111 of the inductor package 11; in this embodiment, the bottom surfaces of the two welding plates 12 are substantially flush with the bottom surface 111 of the inductor package 11. In one embodiment, the inductor package 11 includes an inner magnetic core base 13, a coil 20, and an outer magnet 30; wherein the inner magnetic core base 13 extends upward with a middle column 133 in the middle of a base 131, the coil 20 is sleeved on the middle column 133 of the inner magnetic core base 13 and is located on the base 131, and the two end segments 21 of the coil 20 are bent toward the base 131 and are disposed on the lower surface 132 of the base 131; the outer magnet 30 covers the inner magnetic core base 13 and the coil 20, but the end segments 21 of the coil 20 located on the lower surface 132 of the base 131 are exposed on the bottom surface 31 of the outer magnet 30. In one embodiment, the coil 20 is wound by a flat metal wire, so the two end segments 21 naturally form the two welding plates 12 of the surface mount inductor 10. In one embodiment, since the coil 20 is made of copper, the two exposed end segments 21 are further electroplated with a nickel-tin alloy layer 14.

[0043] In addition, the inductor package 11 may further include an insulating layer 33, the insulating layer 33 covers the outer magnet 30, but does not cover the two exposed end segments 21. In one embodiment, the insulating layer 33 is a black paint. The outer magnet 30 includes four outer side surfaces, wherein two opposite first outer side surfaces 32 are respectively close to the long sides of the two exposed end segments 21, and the insulating layer 33 covering the lower portions 321 of the two first outer side surfaces 32 of the outer magnet 30 is further removed and exposed, that is, the insulating layer 33 does not cover the lower portions 321 of the two first outer side surfaces 32 of the outer magnet 30. In one embodiment, the two exposed lower portions 321 are also further electroplated with a nickel-tin alloy layer 14'.

[0044] The above two metal brackets 40 respectively abut against the bottom surface 111 of the inductor package 11 and its two opposite side surfaces 112. Each of the metal brackets 40 includes a horizontal plate 41 and a vertical plate 42 integrally connected. The horizontal plate 41 is integrally connected to the middle section 421 of the vertical plate 42, abuts against the bottom surface 111 of the inductor package 11, and is welded to the corresponding welding plate 12 exposed on the bottom surface 111 of the inductor package 11. The upper section 422 of the vertical plate 42 abuts against the corresponding side surface 112 of the inductor package 11, and the lower section 423 protrudes downward and is exposed outside the welding plate 12 on the bottom surface 111 of the inductor package 11. Specifically, the two metal brackets 40 respectively abut against the bottom surface 31 of the outer magnet 30 and the two first outer side surfaces 32 for the corresponding welding plate 12 to be provided and welded thereto. That is, as shown in 3A, there is a solder layer 15 between the nickel-tin alloy layer 14 of each welding plate 12 and the horizontal plate 41. The upper section 422 of the vertical plate 42 abuts against the lower part 321 of the corresponding first outer side surface 32 of the outer magnet 30. The lower section 423 of the vertical plate 42 protrudes downward and is exposed outside the welding plate 12 on the bottom surface 111 of the inductor package 11. Again, as Figure 5 shown, the lower section 423 is used for welding to the corresponding pad 51 on the circuit board 50; thus, the lower section 423 of the vertical plate 42 protrudes more outside the welding plate 12 on the bottom surface 111 of the inductor package 11, and the surface-mount inductor 10 can be elevated, forming a space between its bottom surface and the circuit board 50. The circuit board 50 has a plurality of pads 51 corresponding to this space for electronic components 52 with a height matching the height of this space to be welded to the corresponding pads 51 on the circuit board 50.

[0045] To increase the support strength of the two metal brackets 40, as Figure 3B shown, the vertical plate 42 of each metal bracket 40 is further welded to the lower part 321 of the corresponding first outer side surface 32, that is, there is a solder layer 15' between the nickel-tin alloy layer 14' of each lower part 321 and the upper section 422 of the vertical plate 42. In addition, the length of each metal bracket 40 can also be increased.

[0046] Please refer to Figure 4A shown. For the convenience of manufacturing the metal bracket 40, in an embodiment, a square horizontal plate 41 and a U-shaped vertical plate 42 are directly formed by stamping one side of a metal plate, that is, the square horizontal plate 41 corresponds to the opening 420 of the U-shaped vertical plate 42. Another example is as Figure 4B shown. In another embodiment, the metal bracket 40 can be formed by other manufacturing methods, and its vertical plate 42' is also a square.

[0047] In summary, when the present utility model is a raised surface-mount inductor, two metal legs are mainly welded to the two welding plates of the surface-mount inductor, and instead, the two metal legs are welded to the corresponding pads on the circuit board; since the two metal legs protrude from the two welding plates on the bottom surface of the surface-mount inductor, the surface-mount inductor is raised, forming a space between its bottom surface and the circuit board. There are multiple pads on the circuit board corresponding to this space for electronic components with a height matching the height of this space to be welded to the corresponding pads on the circuit board; thus, on the circuit board welded with the raised surface-mount inductor of the present utility model, other small surface-mount electronic components can be further welded in the space below the raised surface-mount inductor of the present utility model to increase the layout density of electronic components.

[0048] The above description is only an embodiment of the present utility model and does not impose any form of limitation on the present utility model. Although the present utility model has been disclosed above with embodiments, it is not intended to limit the present utility model. Any person with ordinary knowledge in the technical field can make some changes or modifications to the equivalent embodiments of equivalent changes within the scope of the technical solution of the present utility model by using the above-disclosed technical content. However, as long as it does not depart from the content of the technical solution of the present utility model, any simple modification, equivalent change, and modification made to the above embodiments according to the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A raised surface-mount inductor, characterized in that, Comprising: A surface-mount inductor, comprising: An inductance package; and Two welding plates, exposed on the bottom surface of the inductance package; and Two metal brackets, respectively abutting against the bottom surface and two opposite side surfaces of the inductance package, each metal bracket comprising: A horizontal plate, abutting against the bottom surface of the inductance package and welded to the corresponding welding plate exposed on the bottom surface; and A vertical plate, integrally connected to the horizontal plate and comprising, from top to bottom: An upper section, abutting against the corresponding side surface of the inductance package; A middle section, integrally connected to the horizontal plate; and A lower section, protruding downward and exposed outside the welding plate on the bottom surface of the inductance package.

2. The elevated surface-mount inductor according to claim 1, wherein: The horizontal plate is square; and The vertical plate is U-shaped, and the U-shaped vertical plate comprises an opening that matches the square horizontal plate.

3. The elevated surface-mounted inductor according to claim 1, wherein Both the horizontal plate and the vertical plate are square.

4. The elevated surface mount inductor according to any one of claims 1 to 3, characterized in that, The inductance package comprises: An inner magnetic core seat, comprising a base and a middle column extending upward from the base; A coil, sleeved on the middle column of the inner magnetic core seat and located on the base, and the two end segments of the coil are bent toward the base and arranged on the lower surface of the base; wherein the two end segments located on the lower surface of the base are the two welding plates; and An outer magnet, covering the inner magnetic core seat and the coil, but not covering the end segments on the lower surface of the base.

5. The elevated surface-mount inductor according to claim 4, wherein The inductance package further comprises an insulating layer that covers the outer magnet but does not cover the exposed two end segments.

6. The elevated surface-mount inductor according to claim 5, wherein, The exposed two end segments are further electroplated with a nickel-tin alloy layer, and there is a solder layer between the nickel-tin alloy layer and the horizontal plate.

7. The elevated surface-mount inductor according to claim 5, wherein: The insulating layer further does not cover the lower parts of two opposite first outer side surfaces of the outer magnet; wherein the two opposite first outer side surfaces correspond to the two opposite side surfaces of the inductance package and are close to the long sides of the two end segments; and The lower parts of the two opposite first outer side surfaces of the outer magnet are further electroplated with a nickel-tin alloy layer, and there is a solder layer between the nickel-tin alloy layer and the upper section of the vertical plate.

8. The elevated surface mount inductor according to claim 1, wherein The bottom surfaces of the two welding plates are flush with the bottom surface of the inductance package.

9. The elevated surface mount inductor according to claim 4, wherein The coil is a flat copper wire.

10. The elevated surface mount inductor according to claim 5, wherein, The insulating layer is black paint.

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