Wafer transmission device

Abstract

The utility model provides a wafer transmission device, which comprises a support shaft, a connecting piece, a temperature control manipulator and a temperature control heat insulation plate, and is characterized in that the connecting piece is connected with the support shaft; the temperature control manipulator is connected with the connecting piece and is used for bearing and transferring the wafer, and a first temperature control pipeline is arranged in the manipulator; the temperature control heat insulation plates are connected with the connecting piece and located on the upper side and the lower side of the mechanical arm, and second temperature control pipelines are arranged in the temperature control heat insulation plates. The wafer transmission device provided by the utility model can timely and effectively cool the wafer, and improves the WPH of a machine and the yield of products.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment and relates to a wafer transfer device. Background Art

[0002] In the wafer manufacturing process, it is usually necessary to transfer wafers with the help of a wafer transfer device, such as the transfer of wafers between wafer cassettes, the transfer of wafers between a wafer cassette and a boat, and the transfer of wafers between processing chambers, etc.

[0003] During the wafer manufacturing process, the wafer sometimes needs to be treated at a high temperature, such as during the processes of photoresist coating and development. Since temperature is one of the crucial influencing factors in the wafer process, usually, a manipulator is required to transfer the high-temperature wafer to a designated cooling unit for cooling. However, such an operation will undoubtedly affect the WPH of the machine tool and lead to process instability, such as the risk of fragmentation caused by frequent transfer and the decrease in product yield due to untimely cooling.

[0004] Therefore, it is necessary to provide a wafer transfer device. Summary of the Utility Model

[0005] In view of the above-mentioned disadvantages of the prior art, the purpose of the utility model is to provide a wafer transfer device for solving the problem that it is difficult to cool wafers in a timely manner in the prior art.

[0006] To achieve the above purpose and other related purposes, the utility model provides a wafer transfer device, which includes:

[0007] A support shaft;

[0008] A connecting member, which is connected to the support shaft;

[0009] A temperature-controlled manipulator, which is connected to the connecting member for carrying and transferring wafers, and a first temperature control pipeline is arranged in the temperature-controlled manipulator;

[0010] A temperature-controlled heat insulation plate, which is connected to the connecting member, is located on the upper and lower sides of the temperature-controlled manipulator, and a second temperature control pipeline is arranged in the temperature-controlled heat insulation plate.

[0011] Optionally, it further includes a rotation driving member connected to the support shaft to drive the support shaft to rotate; and / or it further includes a lifting driving member connected to the connecting member to drive the connecting member to lift.

[0012] Optionally, when including the lifting driving member, the lifting operation mode of the connecting member includes slide rail operation, chain operation or cylinder operation.

[0013] Optionally, the projection area of the second temperature control pipeline is larger than the bearing area of the temperature control manipulator when in the initial position.

[0014] Optionally, the distance between the temperature control manipulator and the temperature control heat insulation plate is 2-2.5 mm.

[0015] Optionally, there are M temperature control manipulators on the connecting piece, and M≥2.

[0016] Optionally, the temperature control medium contained in the first temperature control pipeline includes liquid or gas.

[0017] Optionally, the temperature control medium contained in the second temperature control pipeline includes liquid or gas.

[0018] Optionally, it further includes a first detector connected to the first temperature control pipeline, and the first detector includes one or a combination of a flow meter, a thermometer and a pressure gauge; it further includes a second detector connected to the second temperature control pipeline, and the second detector includes one or a combination of a flow meter, a thermometer and a pressure gauge.

[0019] Optionally, it further includes a first controller in communication with the first detector; and / or a second controller in communication with the second detector.

[0020] As described above, the wafer transfer device of the present invention includes the support shaft, the connecting piece, the temperature control manipulator and the temperature control heat insulation plate. Among them, the connecting piece is connected to the support shaft; the temperature control manipulator is connected to the connecting piece for carrying and transferring wafers, and the first temperature control pipeline is arranged in the temperature control manipulator; the temperature control heat insulation plate is connected to the connecting piece, the temperature control heat insulation plate is located on the upper and lower sides of the temperature control manipulator, and the second temperature control pipeline is arranged in the temperature control heat insulation plate.

[0021] The wafer transfer device of the present invention utilizes the principle of heat conduction, and can realize direct contact temperature control of the wafer located on the temperature control manipulator through the temperature control manipulator; and further realize indirect temperature control by absorbing the heat of the wafer through the temperature control heat insulation plates located on the upper and lower sides of the temperature control manipulator; furthermore, through the setting of the temperature control heat insulation plate, heat isolation of the adjacent wafers above and below can also be realized, so that the heat between the adjacent wafers will not affect each other.

[0022] Therefore, the wafer transfer device of the present invention can timely and effectively cool the wafers, improving the WPH of the machine and the yield rate of the products. Description of the Drawings

[0023] Figure 1 Shown is a schematic structural diagram of the wafer transfer device in the present utility model.

[0024] Figure 2 Shown as Figure 1 a partial side view structural diagram of area A in

[0025] Description of reference numerals

[0026] 100 Support shaft

[0027] 200 Connecting piece

[0028] 300 Temperature control manipulator

[0029] 400 Temperature control heat insulation plate

[0030] 501 First temperature control pipeline

[0031] 502 Second temperature control pipeline

[0032] 600 Rotation driving part

[0033] 700 Lifting driving part

[0034] 800 Wafer Detailed implementation manners

[0035] The following uses specific specific examples to illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model.

[0036] It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present utility model in a schematic manner. Therefore, only the components related to the present utility model are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components during actual implementation. The types, quantities, and proportions of the components during actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0038] Refer to Figure 1, this embodiment provides a wafer transfer device, which includes a support shaft 100, a connecting member 200, a temperature-controlled manipulator 300, and a temperature-controlled heat insulation plate 400. The connecting member 200 is connected to the support shaft 100; the temperature-controlled manipulator 300 is connected to the connecting member 200 for carrying and transferring the wafer 800, and a first temperature control pipeline 501 is arranged in the temperature-controlled manipulator 300; the temperature-controlled heat insulation plate 400 is connected to the connecting member 200, the temperature-controlled heat insulation plate 400 is located on the upper and lower sides of the temperature-controlled manipulator 300, and a second temperature control pipeline 502 is arranged in the temperature-controlled heat insulation plate 400.

[0039] For the wafer transfer device of this embodiment, using the principle of heat conduction, direct contact temperature control of the wafer 800 located on the temperature-controlled manipulator 300 can be realized through the temperature-controlled manipulator 300; and indirect temperature control can be further realized by absorbing the heat of the wafer 800 through the temperature-controlled heat insulation plates 400 located on the upper and lower sides of the temperature-controlled manipulator 300.

[0040] Furthermore, when the wafer transfer device has multiple temperature-controlled manipulators 300, heat isolation of the adjacent wafers 800 above and below can also be realized through the setting of the temperature-controlled heat insulation plate 400, so that the heat between the adjacent wafers 800 will not affect each other.

[0041] Specifically, the temperature-controlled manipulator 300 may include a manipulator with a vacuum adsorption pipeline arranged inside to realize the carrying of the wafer 800 by means of vacuum adsorption. However, the carrying method of the wafer 800 by the temperature-controlled manipulator 300 is not limited thereto. For example, the vacuum adsorption pipeline may not be provided, and the wafer 800 may be fixed by means of claws, etc., which is not limited here. In this embodiment, the temperature-controlled manipulator 300 preferably has the vacuum adsorption pipeline.

[0042] Among them, to realize timely temperature reduction treatment of the wafer 800, so as to improve the WPH of the machine tool, reduce the turnover of the wafer 800, reduce the risk of fragmentation, and improve process stability and product yield. For example, in the lithography process, after the coating process, the temperature state will determine the stability of the thickness (THK) of the formed photoresist, and after the exposure process, the temperature state will determine the stability of the critical dimension uniformity (CDU), etc. Therefore, by adding the first temperature control pipeline 501 in the manipulator to form the temperature-controlled manipulator 300, timely temperature control of the manipulator can be realized, thereby realizing temperature control of the wafer 800 located on the temperature-controlled manipulator 300. Regarding the distribution of the first temperature control pipeline 501 in the temperature-controlled manipulator 300, it can be set according to needs and is not overly restricted here.

[0043] Among them, the temperature control manipulator 300 includes a robotic arm that can extend and contract in the horizontal direction (X direction). Figure 1 Shown in the figure is an illustration of the temperature control manipulator 300 when it runs to the initial position after adsorbing the wafer 800. One end of the robotic arm in the temperature control manipulator 300 can be connected to the connecting member 200 through, for example, screws, but the connection method is not limited to this.

[0044] As an example, the temperature control medium for realizing temperature control in the first temperature control pipeline 501 can include liquid or gas.

[0045] Specifically, the temperature control medium loaded in the first temperature control pipeline 501 can be, for example, cooling water, cooling oil, etc. provided by a chiller, or the temperature control medium is cooling nitrogen, etc. The type of the temperature control medium is not overly restricted here and can be selected according to needs. In this embodiment, the temperature control medium is preferably cooling water that is relatively easy to control, has low cost, and is environmentally friendly.

[0046] It should be noted that the first temperature control pipeline 501 is configured with components such as a temperature control medium storage tank, a pump body, a chiller, etc. that match it to realize the operation of the temperature control medium in the temperature control manipulator 300. Among them, it is preferred that the temperature control medium can circulate in the first temperature control pipeline 501 to save resources, but it is not limited to this. The setting of the operation system related to the first temperature control pipeline 501 is not overly restricted here.

[0047] As an example, it further includes a first detector connected to the first temperature control pipeline 501. The first detector can include, for example, one or a combination of a flow meter, a thermometer, and a pressure gauge.

[0048] Specifically, to realize the regulation of the temperature control medium in the first temperature control pipeline 501, it is preferred to set components such as a flow meter, a thermometer, and a pressure gauge connected to the first temperature control pipeline 501 to realize the timely regulation of parameters such as the flow rate, temperature, and pressure of the temperature control medium to meet the process requirements. However, the type of the first detector is not limited to this and can be specifically selected according to needs.

[0049] Furthermore, it can further include a first controller communicating with the first detector to realize the automatic control of the first detector through the first controller. Among them, the communication method between the first detector and the first controller is not overly restricted here and can include, for example, wired communication or wireless communication, which can be specifically selected according to needs.

[0050] However, considering the application of the manipulator, the morphology of the manipulator has limitations. For example, most of the existing manipulators adopt a hollow U-shaped morphology. Therefore, the layout of the first temperature control pipeline 501 in the temperature control manipulator 300 also has limitations and it is difficult to fully cover the wafer 800, making it difficult to achieve precise temperature control at every location of the wafer 800. Therefore, in this embodiment, a temperature control and heat insulation plate 400 with the second temperature control pipeline 502 is further provided in the wafer transfer device. One end of the temperature control and heat insulation plate 400 can be connected to the connector 200 through, for example, screws. In the initial position, the temperature control and heat insulation plate 400 is located on the upper and lower sides of the temperature control manipulator 300 to provide non-contact indirect temperature control for the wafer 800 from the upper and lower sides through the temperature control and heat insulation plate 400.

[0051] As an example, the distance D between the temperature control manipulator 300 and the temperature control and heat insulation plate 400 is preferably 2 - 2.5 mm.

[0052] Specifically, based on the principle of heat conduction, the distance D between the temperature control manipulator 300 and the temperature control and heat insulation plate 400 is preferably controlled within 2 - 2.5 mm, such as 2 mm, 2.2 mm, 2.5 mm, etc., so that when the temperature control manipulator 300 adsorbing the wafer 800 returns to the initial position, the wafer 800 can be precisely cooled through the upper temperature control and heat insulation plate 400, the temperature control manipulator 300, and the lower temperature control and heat insulation plate 400.

[0053] Furthermore, when there are multiple temperature control manipulators 300, the temperature control and heat insulation plate 400 can also be used to achieve thermal isolation between the adjacent wafers 800 above and below, so that the heat between the adjacent wafers 800 will not affect each other.

[0054] As an example, the connector 200 can be provided with M temperature control manipulators 300, and M ≥ 2.

[0055] Specifically, as Figure 1 shown, in this embodiment, a wafer transfer device with 2 temperature control manipulators 300 and 3 temperature control and heat insulation plates 400 is illustrated. However, the number of the temperature control manipulators 300 and the temperature control and heat insulation plates 400 connected to the connector 200 is not limited thereto. For example, M can also be 1, 3, 5, etc., and no excessive restrictions are made here.

[0056] As an example, the projection area of the second temperature control pipeline 502 is larger than the bearing area of the temperature control manipulator 300 in the initial position.

[0057] Specifically, as Figure 2, the projection area of the second temperature control pipeline 502 located within the temperature control and heat insulation plate 400 from top to bottom is larger than the bearing area of the temperature control manipulator 300 in the initial position. Here, the bearing area can be understood as the area of the wafer 800 carried by the temperature control manipulator 300, so that the second temperature control pipeline 502 can completely cover the wafer 800, facilitating better temperature control of the wafer 800. For example, when the size of the wafer 800 is 300 mm, it is preferred that the size of the projection area of the second temperature control pipeline 502 is larger than 300 mm, such as 301 mm, 302 mm, 304 mm, etc., so that even if the wafer 800 is deformed by heat, the second temperature control pipeline 502 can completely cover the wafer 800. Of course, the size of the wafer 800 can also be 150 mm, 200 mm, etc.

[0058] As an example, the temperature control medium contained in the second temperature control pipeline 502 may include liquid or gas.

[0059] Specifically, the temperature control medium loaded in the second temperature control pipeline 502 may be cooling water, cooling oil provided by a chiller, or cooling nitrogen, etc. There is no excessive limitation on the type of the temperature control medium here, and it can be selected according to needs. In this embodiment, the temperature control medium is preferably cooling water that is relatively easy to control, low in cost, and environmentally friendly.

[0060] It should be noted that the second temperature control pipeline 502 is configured with components such as a temperature control medium storage tank, a pump body, and a chiller that match it to realize the operation of the temperature control medium in the temperature control manipulator 300. Among them, it is preferred that the temperature control medium circulates in the second temperature control pipeline 502 to save resources, but it is not limited to this. There is no excessive limitation on the setting of the operation system related to the second temperature control pipeline 502 here.

[0061] As an example, it further includes a second detector connected to the second temperature control pipeline 502, and the second detector may include one or a combination of a flow meter, a thermometer, and a pressure gauge.

[0062] Specifically, to realize the regulation of the temperature control medium in the second temperature control pipeline 502, it is preferred to set components such as a flow meter, a thermometer, and a pressure gauge connected to the second temperature control pipeline 502 to realize the timely regulation of parameters such as the flow rate, temperature, and pressure of the temperature control medium to meet the process requirements. However, the type of the second detector is not limited to this, and it can be specifically selected according to needs.

[0063] Further, it may further include a second controller communicatively connected to the second detector to achieve automated control of the second detector through the second controller. Here, the communication method between the second detector and the second controller is not overly limited and may include, for example, wired communication or wireless communication, which can be selected according to needs.

[0064] As an example, it further includes a rotation driving member 600 connected to the support shaft 100 to drive the support shaft 100 to rotate; and / or it further includes a lifting driving member 700 connected to the connecting member 200 to drive the connecting member 200 to move up and down.

[0065] Specifically, to expand the application range of the wafer transfer device, it is preferably that the temperature-controlled manipulator 300 can move up and down in the vertical direction (Z direction) and / or rotate in the direction from the outside to the inside (Y direction) perpendicular to the X direction and the Z direction. Here, Figure 1 a rotation driving member 600 connected to the support shaft 100 can be provided to drive the support shaft 100 to rotate in the Y direction, thereby realizing the rotation operation of the rotation driving member 600, and / or a lifting driving member 700 connected to the connecting member 200 can be provided to drive the connecting member 200 to move up and down along the Z axis, thereby driving the temperature-controlled manipulator 300 to move up and down. The types of the rotation driving member 600 and the lifting driving member 700 are not overly limited here and can be, for example, a motor, a servo motor, etc., which are not overly limited here.

[0066] As an example, when the wafer transfer device includes the lifting driving member 700, the lifting operation mode of the connecting member 200 may include, for example, slide rail operation, chain operation, or cylinder operation.

[0067] Specifically, Figure 1 in this embodiment, the wafer transfer device includes the lifting driving member 700, and the way the lifting driving member 700 drives the connecting member 200 to move up and down is slide rail operation, but it is not limited thereto. It can also be chain operation or cylinder operation, etc. Here, since the temperature-controlled manipulator 300 and the temperature-controlled heat insulation plate 400 are both connected to the connecting member 200 respectively, the lifting operation of the lifting driving member 700 can drive the temperature-controlled manipulator 300 and the temperature-controlled heat insulation plate 400 to move up and down synchronously, so that the distance D between the temperature-controlled manipulator 300 and the temperature-controlled heat insulation plate 400 remains constant.

[0068] In summary, the wafer transfer device of the present utility model includes the support shaft, the connecting member, the temperature-controlled manipulator, and the temperature-controlled heat insulation plate. Among them, the connecting member is connected to the support shaft; the temperature-controlled manipulator is connected to the connecting member for carrying and transferring wafers, and a first temperature control pipeline is arranged in the temperature-controlled manipulator; the temperature-controlled heat insulation plate is connected to the connecting member, the temperature-controlled heat insulation plate is located on the upper and lower sides of the temperature-controlled manipulator, and a second temperature control pipeline is arranged in the temperature-controlled heat insulation plate.

[0069] The wafer transfer device of the present utility model utilizes the principle of heat conduction. Through the temperature-controlled manipulator, direct contact temperature control of the wafer located on the temperature-controlled manipulator can be achieved; and through the temperature-controlled heat insulation plates located on the upper and lower sides of the temperature-controlled manipulator, indirect temperature control can be further achieved by absorbing the heat of the wafer; furthermore, through the setting of the temperature-controlled heat insulation plates, thermal isolation of the adjacent wafers above and below can also be achieved, so that the heat between the adjacent wafers will not affect each other.

[0070] Therefore, the wafer transfer device of the present utility model can timely and effectively cool the wafers, improve the WPH of the machine tool and the yield rate of the products. Therefore, the present utility model effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0071] The above embodiments are only illustrative of the principles and effects of the present utility model, and are not used to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. A wafer transfer device, characterized in that, The wafer transfer device includes: A support shaft; A connecting piece, which is connected to the support shaft; A temperature-controlled manipulator, which is connected to the connecting piece for carrying and transferring wafers, and a first temperature control pipeline is arranged in the temperature-controlled manipulator; A temperature-controlled heat insulation plate, which is connected to the connecting piece, is located on the upper and lower sides of the temperature-controlled manipulator, and a second temperature control pipeline is arranged in the temperature-controlled heat insulation plate.

2. The wafer transfer device according to claim 1, wherein: It further includes a rotation driving part connected to the support shaft to drive the support shaft to rotate; and / or it further includes a lifting driving part connected to the connecting piece to drive the connecting piece to move up and down.

3. The wafer transfer device according to claim 2, wherein: When the lifting driving part is included, the lifting movement mode of the connecting piece includes slide rail movement, chain movement or cylinder movement.

4. The wafer transfer device according to claim 1, wherein: The projection area of the second temperature control pipeline is larger than the loading area of the temperature-controlled manipulator in the initial position.

5. The wafer transfer device according to claim 1, wherein: The distance between the temperature-controlled manipulator and the temperature-controlled heat insulation plate is 2 - 2.5 mm.

6. The wafer transfer device according to claim 1, wherein: There are M temperature-controlled manipulators on the connecting piece, and M≥2.

7. The wafer transfer device according to claim 1, wherein: The temperature control medium contained in the first temperature control pipeline includes liquid or gas.

8. The wafer transfer device according to claim 1, wherein: The temperature control medium contained in the second temperature control pipeline includes liquid or gas.

9. The wafer transfer device according to claim 1, wherein: It further includes a first detector connected to the first temperature control pipeline, and the first detector includes one or a combination of a flow meter, a thermometer and a pressure gauge; it further includes a second detector connected to the second temperature control pipeline, and the second detector includes one or a combination of a flow meter, a thermometer and a pressure gauge.

10. The wafer transfer device according to claim 9, wherein: It further includes a first controller in communication with the first detector; and / or a second controller in communication with the second detector.

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