Semiconductor wafer bonding chuck assembly

Abstract

The utility model belongs to the technical field of semiconductor wafer processing, and particularly relates to a semiconductor wafer bonding chuck assembly, which comprises two groups of bearing plates, connecting rods are fixedly mounted at opposite ends of the two groups of bearing plates, and supporting plates are fixedly mounted at opposite ends of the two groups of connecting rods. First grooves are formed in the opposite ends of the two sets of supporting plates, and chucks capable of bearing semiconductor wafers of various sizes are arranged in the first grooves. The chuck is formed by sleeving a plurality of circular plates together, the supporting plate is provided with a lifting assembly capable of driving the circular plates to ascend and descend, and the circular plates are provided with adsorption assemblies capable of adsorbing semiconductor wafers. According to the utility model, the chuck composed of a plurality of circular plates is arranged, so that the semiconductor wafers of various sizes can be borne, the semiconductor wafers of various sizes can be further bonded, and the practicability is improved to a certain extent.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, and specifically relates to a semiconductor wafer bonding chuck assembly. Background Art

[0002] In order to further expand the functions on a semiconductor wafer, bonding two or even more wafers together is one of the relatively popular development directions in the industry at present. The conventional method for bonding two wafers is to press one wafer onto the surface of another wafer.

[0003] However, the chucks used in semiconductor wafer bonding at present are difficult to carry semiconductor wafers of various sizes, and thus there will be limitations. Therefore, a semiconductor wafer bonding chuck assembly is invented. Summary of the Utility Model

[0004] In view of the above and / or existing problems in a semiconductor wafer bonding chuck assembly, the present utility model is proposed.

[0005] Therefore, the purpose of the present utility model is to provide a semiconductor wafer bonding chuck assembly that can solve the above-mentioned existing problems.

[0006] To solve the above technical problems, according to one aspect of the present utility model, the following technical solutions are provided:

[0007] A semiconductor wafer bonding chuck assembly includes two groups of carrier plates. Connecting rods are fixedly installed at the opposite ends of the two groups of carrier plates. Support plates are fixedly installed at the opposite ends of the two groups of connecting rods. First grooves are formed at the opposite ends of the two groups of support plates. A chuck capable of carrying semiconductor wafers of various sizes is arranged in the first grooves;

[0008] The chuck is formed by a plurality of circular plates sleeved together. A lifting assembly capable of driving the circular plates to lift is arranged on the support plate, and an adsorption assembly capable of adsorbing the semiconductor wafer is arranged on the circular plate.

[0009] As a preferred scheme of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: the lifting assembly includes:

[0010] A second groove is formed on the support plate on one side of the circular plate;

[0011] Support rods, and support rods are fixedly installed at both ends of the inner cavity of the second groove;

[0012] A support block is fixedly installed between the two groups of support rods.

[0013] As a preferred embodiment of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: the lifting assembly further includes:

[0014] A first box body, which is fixedly installed on one side of the support block;

[0015] A first cylinder, which is fixedly installed in the first box body, and the first cylinder is fixedly installed with a circular plate through a piston rod.

[0016] As a preferred embodiment of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: the adsorption assembly includes:

[0017] A first flow channel, a first flow channel with an annular shape is opened in the middle of the circular plate;

[0018] Adsorption holes, adsorption holes are opened on the opposite sides of the two circular plates, and the adsorption holes are communicated with the first flow channel;

[0019] Hoses, hoses are fixedly installed on the opposite ends of the two circular plates, and one end of the hose is arranged in the first flow channel.

[0020] As a preferred embodiment of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: the adsorption assembly further includes:

[0021] A square plate, a second groove is provided on one side of the square plate;

[0022] A second flow channel, the second flow channel is opened in the square plate, and the other end of the hose is arranged in the second flow channel.

[0023] As a preferred embodiment of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: the adsorption assembly further includes:

[0024] A rigid pipe, one end of the rigid pipe is arranged in the second flow channel;

[0025] A third flow channel, the third flow channel is opened in the carrier plate, and the other end of the rigid pipe is arranged in the third flow channel.

[0026] As a preferred embodiment of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: the adsorption assembly further includes:

[0027] Vacuum pumps, vacuum pumps are fixedly installed on the opposite ends of the two carrier plates;

[0028] Pipes, the pipes are fixedly installed on the air inlet ends of the vacuum pumps, and one end of the pipes is arranged in the third flow channel.

[0029] As a preferred embodiment of a semiconductor wafer bonding chuck assembly according to the present utility model, wherein: a plurality of second cylinders are fixedly installed between the two bearing plates to be able to adjust the distance between the two chucks.

[0030] Compared with the prior art:

[0031] By providing a chuck composed of a plurality of circular plates, it is possible to carry semiconductor wafers of various sizes. By carrying semiconductor wafers of various sizes, it is further possible to bond semiconductor wafers of various sizes, which improves the practicality to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a front view schematic diagram of the structure of the present utility model;

[0033] Figure 2 For the present utility model Figure 1 It is an enlarged schematic diagram of the structure at A in the present utility model;

[0034] Figure 3 It is a bottom view schematic diagram of the chuck of the present utility model;

[0035] Figure 4 It is a schematic diagram of the operating state of the chuck of the present utility model.

[0036] In the figure: bearing plate 10, connecting rod 11, support plate 12, first groove 13, chuck 20, support rod 30, support block 31, first box body 32, first cylinder 33, second groove 34, first flow channel 40, adsorption hole 41, hose 42, square plate 43, second flow channel 44, hard pipe 45, third flow channel 46, vacuum pump 47, pipeline 48. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] To make the objectives, technical solutions, and advantages of the present utility model clearer, the embodiments of the present utility model will be further described in detail below in conjunction with the accompanying drawings.

[0038] The present utility model provides a semiconductor wafer bonding chuck assembly. Please refer to Figures 1-4 , which includes two bearing plates 10. Connecting rods 11 are fixedly installed at the opposite ends of the two bearing plates 10. Support plates 12 are fixedly installed at the opposite ends of the two connecting rods 11. First grooves 13 are opened at the opposite ends of the two support plates 12. A chuck capable of carrying semiconductor wafers of various sizes is provided in the first grooves 13. A plurality of second cylinders are fixedly installed between the two bearing plates 10 to be able to adjust the distance between the two chucks. Among them, the surface of the chuck is flush with the surface of the support plate 12.

[0039] The chuck is formed by several circular plates sleeved together. An elevating component capable of driving the circular plates to move up and down is provided on the support plate 12, and an adsorption component capable of adsorbing the semiconductor wafer is provided on the circular plates.

[0040] The elevating component includes: a support rod 30, a support block 31, a first box body 32, a first cylinder 33, and a second groove 34;

[0041] A second groove 34 is formed in the support plate 12 on one side of the circular plate. Support rods 30 are fixedly installed at both ends of the inner cavity of the second groove 34. The support block 31 is fixedly installed between the two groups of support rods 30. The first box body 32 is fixedly installed on one side of the support block 31. The first cylinder 33 is fixedly installed in the first box body 32, and the first cylinder 33 is fixedly installed with the circular plate through a piston rod.

[0042] The adsorption component includes: a first flow channel 40, adsorption holes 41, a hose 42, a square plate 43, a second flow channel 44, a rigid tube 45, a third flow channel 46, a vacuum pump 47, and a pipeline 48;

[0043] A first flow channel 40 with an annular shape is formed in the middle of the circular plate. Adsorption holes 41 are formed on the opposite sides of the two circular plates, and the adsorption holes 41 communicate with the first flow channel 40. Hoses 42 are fixedly installed at the opposite ends of the two circular plates, and one end of the hose 42 is arranged in the first flow channel 40. A second groove 34 is provided on one side of the square plate 43. A second flow channel 44 is formed in the square plate 43, and the other end of the hose 42 is arranged in the second flow channel 44. One end of the rigid tube 45 is arranged in the second flow channel 44. A third flow channel 46 is formed in the carrier plate 10, and the other end of the rigid tube 45 is arranged in the third flow channel 46. Vacuum pumps 47 are fixedly installed at the opposite ends of the two carrier plates 10. A pipeline 48 is fixedly installed at the air inlet end of the vacuum pump 47, and one end of the pipeline 48 is arranged in the third flow channel 46. Among them, an electromagnetic valve is provided on the rigid tube 45.

[0044] During specific use, the specific steps are as follows:

[0045] Step 1: Start the corresponding first cylinder 33 according to the diameter of the semiconductor wafer, so that the circular plate adjacent to the semiconductor wafer extends out of the surface of the support plate 12, and the extended part thereof shall not exceed the thickness of the semiconductor wafer;

[0046] Step 2: Place the semiconductor wafer on the chuck, and make the semiconductor wafer located in the inner cavity of the circular plate in Step 1;

[0047] Step 3: Start the corresponding electromagnetic valve to be able to extract the air in the adsorption holes 41 covered by the semiconductor wafer through the vacuum pump 47. Thus, the adsorption and fixation of the semiconductor crystal can be realized;

[0048] Step 4: Move the upper semiconductor wafer towards the lower semiconductor wafer through the second cylinder. Thus, the two groups of semiconductor wafers can be bonded.

[0049] Although the present utility model has been described with reference to the embodiments above, various improvements can be made thereto and components thereof can be replaced with equivalents without departing from the scope of the present utility model. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in the present utility model can be combined with each other in any manner. The exhaustive description of these combinations is not given in this specification only for the consideration of saving space and resources. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A semiconductor wafer bonding chuck assembly, comprising two groups of carrier plates (10). The opposite ends of the two groups of carrier plates (10) are fixedly installed with connecting rods (11). The opposite ends of the two groups of connecting rods (11) are fixedly installed with support plates (12). The opposite ends of the two groups of support plates (12) are each provided with a first groove (13), characterized in that, A chuck capable of carrying semiconductor wafers of various sizes is provided in the first groove (13). The chuck is formed by sleeving a plurality of circular plates together. An elevating assembly capable of driving the circular plates to move up and down is provided on the support plate (12), and an adsorption assembly capable of adsorbing semiconductor wafers is provided on the circular plates.

2. The semiconductor wafer bonding chuck assembly according to claim 1, wherein The elevating assembly includes: A second groove (34) is formed in the support plate (12) on one side of the circular plate. Support rods (30) are fixedly installed at both ends of the inner cavity of the second groove (34). A support block (31) is fixedly installed between the two groups of support rods (30).

3. The semiconductor wafer bonding chuck assembly according to claim 2, wherein, The elevating assembly further includes: A first box body (32) is fixedly installed on one side of the support block (31). A first cylinder (33) is fixedly installed in the first box body (32), and the first cylinder (33) is fixedly installed on the circular plate through a piston rod.

4. A semiconductor wafer bonding chuck assembly according to claim 1, wherein The adsorption assembly includes: A first flow channel (40) is formed in the middle of the circular plate, and the shape of the first flow channel (40) is annular. Adsorption holes (41) are formed on the opposite sides of the two circular plates, and the adsorption holes (41) communicate with the first flow channel (40). Hoses (42) are fixedly installed on the opposite ends of the two circular plates, and one end of each hose (42) is arranged in the first flow channel (40).

5. The semiconductor wafer bonding chuck assembly according to claim 4, wherein The adsorption assembly further includes: A square plate (43) has a second groove (34) on one side. A second flow channel (44) is formed in the square plate (43), and the other end of the hose (42) is arranged in the second flow channel (44).

6. The semiconductor wafer bonding chuck assembly according to claim 5, wherein The adsorption assembly further includes: A rigid pipe (45) has one end arranged in the second flow channel (44). A third flow channel (46) is formed in the carrier plate (10), and the other end of the rigid pipe (45) is arranged in the third flow channel (46).

7. The semiconductor wafer bonding chuck assembly according to claim 6, wherein The adsorption assembly further includes: Vacuum pumps (47) are fixedly installed on the opposite ends of the two carrier plates (10). Pipes (48) are fixedly installed on the air inlet ends of the vacuum pumps (47), and one end of each pipe (48) is arranged in the third flow channel (46).

8. The semiconductor wafer bonding chuck assembly according to claim 1, characterized in that A number of second cylinders are fixedly installed between the two carrier plates (10) to be able to adjust the distance between the two chucks.

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