Chip strengthening structure and electronic equipment

Abstract

The utility model relates to a chip strengthening structure and electronic equipment. The chip strengthening structure comprises a substrate, a strengthening ring and a welding structure. Wherein the substrate comprises a chip mounting part and a first welding part surrounding the circumferential direction of the chip mounting part; the reinforcing ring comprises a second welding part corresponding to the first welding part; and the second welding part and the first welding part are fixedly connected through a welding structure, so that the reinforcing ring is arranged in the circumferential direction of the chip mounting part in a surrounding manner. According to the chip reinforcing structure, the reinforcing ring is welded and fixed in the circumferential direction of the chip mounting part of the substrate, and a support is formed in the circumferential direction of the substrate of the chip mounting part, so that buckling deformation of the chip mounted on the chip mounting part is reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of chip installation, and in particular, to a chip strengthening structure and an electronic device. Background Art

[0002] FCBGA (Flip Chip Ball Grid Array, that is, the packaging format of flip chip ball grid array) is the most main packaging format of current graphics acceleration chips. Among them, since the chip is exposed outside and can be in direct contact with the radiator, the junction-to-case thermal resistance is extremely small. However, in this packaging form, as the computing power of the chip becomes stronger and the chip area becomes larger, the warping problem becomes more and more serious.

[0003] In the related art, in order to avoid the warping of the chip, a circumferential bonding ring is bonded around the chip mounting portion of the substrate. When the warping is relatively large, usually the thickness of the ring is increased to improve the strengthening effect to reduce the warping. However, increasing the thickness of the ring will affect the layout of the chip radiator and reduce the heat dissipation efficiency. Summary of the Utility Model

[0004] The purpose of the present disclosure is to provide a chip strengthening structure and an electronic device. The chip strengthening structure welds and fixes a reinforcing ring around the circumference of the chip mounting portion of the substrate to form a support around the circumference of the substrate of the chip mounting portion, so as to reduce the warping deformation of the chip mounted on the chip mounting portion.

[0005] In order to achieve the above purpose, according to the first aspect of the present disclosure, a chip strengthening structure is provided, including:

[0006] A substrate, including a chip mounting portion and a first welding portion surrounding the circumference of the chip mounting portion;

[0007] A reinforcing ring, including a second welding portion corresponding to the first welding portion; and

[0008] A welding structure, the second welding portion and the first welding portion are fixedly connected through the welding structure, so that the reinforcing ring surrounds the circumference of the chip mounting portion.

[0009] Optionally, the second welding portion is configured as a second annular structure extending along the bottom circumference of the reinforcing ring;

[0010] The first welding portion is configured as a first annular structure extending along the circumference of the chip mounting portion and at least partially corresponding to the second welding portion.

[0011] Optionally, at least part of the welding structure extends from the bottom of the reinforcing ring to the outer side wall of the reinforcing ring.

[0012] Optionally, the first welding portion and the second welding portion are configured as strip structures;

[0013] The welding structure includes a plurality of strip-shaped solder tapes located between the first welding portion and the second welding portion, and the first welding portion and the second welding portion are fixedly connected through the strip-shaped solder tapes.

[0014] Optionally, the reinforcing ring is rectangular, and at least one of the second welding portions is provided on each side of the reinforcing ring.

[0015] Optionally, the ratio of the length of the second welding portion to the length of the side of the reinforcing ring is greater than or equal to 1 / 2.

[0016] Optionally, both the first welding portion and the second welding portion include a plurality of corresponding dot-shaped structures;

[0017] The welding structure includes a plurality of solder balls, and the dot-shaped structure of the first welding portion is connected to the dot-shaped structure of the second welding portion through the solder balls.

[0018] Optionally, the chip strengthening structure further includes a chip connected to the chip mounting portion, and the height of the reinforcing ring is less than or equal to the height of the chip.

[0019] According to a second aspect of the present disclosure, there is also provided an electronic device, and the electronic device includes the above-mentioned chip strengthening structure.

[0020] Optionally, the electronic device further includes a heat dissipation member, and the heat dissipation member is connected to the side of the chip away from the substrate for dissipating heat of the chip.

[0021] Through the above technical solution, that is, in the chip strengthening structure of the present disclosure, the first welding portion is circumferentially arranged on the chip mounting portion of the substrate, and the reinforcing ring includes a second welding portion corresponding to the first welding portion. The first welding portion and the second welding portion are welded and connected together through the welding structure, so as to fixedly arrange the reinforcing ring circumferentially on the chip mounting portion of the substrate, and form a support on the circumferential direction of the substrate of the chip mounting portion, so as to reduce the warping deformation of the chip mounted on the chip mounting portion.

[0022] Other features and advantages of the present disclosure will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification. They are used together with the following specific implementation to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the drawings:

[0024] Figure 1 is a schematic structural diagram of a chip strengthening structure provided by some embodiments of the present disclosure.

[0025] Figure 2 is an exploded view of a chip strengthening structure provided by some embodiments of the present disclosure.

[0026] Figure 3 is a schematic structural view of a substrate of a chip strengthening structure provided by some embodiments of the present disclosure.

[0027] Figure 4 is a schematic structural view of a reinforcing ring of a chip strengthening structure provided by some embodiments of the present disclosure.

[0028] Figure 5 is a schematic structural view of a substrate of a chip strengthening structure provided by some other embodiments of the present disclosure.

[0029] Figure 6 is a schematic structural view of a reinforcing ring of a chip strengthening structure provided by some other embodiments of the present disclosure.

[0030] Figure 7 is a schematic structural view of a substrate of a chip strengthening structure provided by some further embodiments of the present disclosure.

[0031] Figure 8 is a schematic structural view of a reinforcing ring of a chip strengthening structure provided by some further embodiments of the present disclosure.

[0032] Figure 9 is a cross-sectional view of a chip strengthening structure provided by some embodiments of the present disclosure.

[0033] Figure 10 is a side view of a chip strengthening structure provided by some embodiments of the present disclosure.

[0034] Figure 11 is a partial schematic view of an electronic device provided by some embodiments of the present disclosure.

[0035] Description of Reference Numerals

[0036] 100 - Substrate; 110 - Chip mounting portion; 120 - First welding portion; 121 - First annular structure; 122 - First strip structure; 123 - First dot structure;

[0037] 200 - Reinforcing ring; 210 - Second welding portion; 211 - Second annular structure; 212 - Second strip structure; 213 - Second dot structure;

[0038] 300 - Welding structure; 310 - Strip solder tape; 320 - Solder ball;

[0039] 400 - Chip;

[0040] 500 - Heat sink. Detailed Description of the Embodiments

[0041] The following will describe the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present disclosure, and are not intended to limit the present disclosure.

[0042] In the present disclosure, unless otherwise stated, the orientation terms such as "upper, lower, left, right" generally refer to the upper, lower, left, and right in the accompanying drawings; "inner, outer" refer to the inside and outside of the contour of the corresponding component; "far, near" refer to the corresponding structure or component being far from or close to another structure or component. In addition, the terms "first", "second", etc. used in the present disclosure are used to distinguish one element from another, and do not have an order or importance. Furthermore, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings represent the same or similar elements. The above definitions are only for explaining and illustrating the present disclosure, and should not be construed as a limitation of the present disclosure.

[0043] The object of the present disclosure is to provide a chip strengthening structure and an electronic device. The chip strengthening structure welds and fixes the reinforcing ring 200 to the circumference of the chip mounting portion 110 of the substrate 100, forming support and strengthening in the circumferential direction of the substrate 100 of the chip mounting portion 110 to reduce the warping deformation of the chip 400 mounted on the chip mounting portion 110.

[0044] To achieve the above object, as Figures 1 to 10 shown, according to the first aspect of the present disclosure, a chip strengthening structure is provided. The chip strengthening structure includes a substrate 100, a reinforcing ring 200, and a welding structure 300. Among them, the substrate 100 includes a chip mounting portion 110 and a first welding portion 120 disposed around the circumference of the chip mounting portion 110; the reinforcing ring 200 includes a second welding portion 210 corresponding to the first welding portion 120; the second welding portion 210 and the first welding portion 120 are fixedly connected by the welding structure 300, so that the reinforcing ring 200 is disposed around the circumference of the chip mounting portion 110.

[0045] Through the above technical solution, that is, in the chip strengthening structure of the present disclosure, the first welding portion 120 is arranged in the circumferential direction of the chip mounting portion 110 of the substrate 100, and the reinforcing ring 200 includes a second welding portion 210 corresponding to the first welding portion 120. The first welding portion 120 and the second welding portion 210 are welded and connected together by the welding structure 300, thereby fixedly arranging the reinforcing ring 200 in the circumferential direction of the chip mounting portion 110 of the substrate 100, forming support and strengthening in the circumferential direction of the substrate 100 of the chip mounting portion 110 to reduce the warping deformation of the chip 400 mounted on the chip mounting portion 110.

[0046] It should be noted that the chip 400 mounted on the substrate 100 includes, but is not limited to, a graphics processing chip, and can also be other chips 400 that generate a large amount of heat or are prone to warping. The substrate 100 includes, but is not limited to, a PCB board, and can also be other types of boards (circuit boards).

[0047] It is worth noting that there is a gap between the chip mounting portion 110 and the second welding portion 210. When the reinforcing ring 200 is welded to the substrate 100 and the chip 400 is mounted on the chip mounting portion 110, there is an annular gap between the reinforcing ring 200 and the chip 400. On the one hand, it is convenient for the installation of the chip 400 (i.e., providing sufficient space for the installation of the chip 400), and on the other hand, it is beneficial to the heat dissipation of the chip 400.

[0048] In order to further improve the welding reliability between the reinforcing ring 200 and the substrate 100, as Figure 9 shown, in some embodiments, at least part of the welding structure 300 extends from the bottom of the reinforcing ring 200 to the outer side wall of the reinforcing ring 200, that is, at least part of the second welding portion 210 extends from the bottom of the reinforcing ring 200 to the outer side wall of the reinforcing ring 200. When welding and connecting, the welding structure 300 between the reinforcing ring 200 and the substrate 100 can extend to the outer side wall of the reinforcing ring 200. Among them, the second welding portion 210 can include a portion located at the bottom of the reinforcing ring 200, and also includes a portion of the surface extending from the bottom to the outer side wall of the reinforcing ring 200. The first welding portion 120 can correspond to the second welding portion 210 at the bottom of the reinforcing ring 200. When connecting through the welding structure 300, the welding structure 300 can weld the bottom of the reinforcing ring 200 to the first welding portion 120 of the substrate 100. In addition, part of the outer side wall of the reinforcing ring 200 can also be welded to the first welding portion 120, so as to further improve the welding effect, ensure the strengthening effect of the reinforcing ring 200 on the substrate 100, and further reduce the warping of the chip 400 in the chip mounting portion 110 inside the reinforcing ring 200.

[0049] The first welding portion 120 and the second welding portion 210 can be constructed with any suitable structure, such as Figure 3 and Figure 4As shown, in some embodiments, the second welding portion 210 is configured as a second annular structure 211 extending circumferentially along the bottom of the reinforcing ring 200; the first welding portion 120 is configured as a first annular structure extending circumferentially along the chip mounting portion 110 and at least partially corresponding to the second welding portion 210. For example, the first welding portion 120 and the second welding portion 210 may be a complete annular structure. Among them, the bottom surface of the entire reinforcing ring 200 forms the second annular structure 211, and a first annular structure 121 corresponding to the second annular structure 211 is also formed circumferentially on the corresponding chip mounting portion 110. The welding structure 300 may also be an annular welding structure 300 corresponding to between the second annular structure 211 and the first annular structure 121. Therefore, the annular welding structure 300 can completely weld between the first welding portion 120 and the second welding portion 210, thereby connecting the reinforcing ring 200 to the circumferential direction of the chip mounting portion 110 of the substrate 100 and reducing the deformation and warping at the chip mounting portion 110.

[0050] As Figure 5 and Figure 6 shown, in other embodiments, the first welding portion 120 and the second welding portion 210 may also be configured as a plurality of strip structures; the welding structure 300 includes a plurality of strip welding tapes 310 located between the first welding portion 120 and the second welding portion 210, and the first welding portion 120 and the second welding portion 210 are fixedly connected by the strip welding tapes 310. The first welding portion 120 is configured as a plurality of first strip structures 122 arranged at intervals circumferentially along the mounting position, and the second welding portion 210 is configured as a plurality of second strip structures 212 arranged at intervals along the bottom of the reinforcing ring 200, and the welding structure 300 includes a plurality of strip welding tapes 310 for connecting the first strip structures 122 and the second strip structures 212. Therefore, the reinforcing ring 200 and the substrate 100 are welded and connected through a plurality of strip welding tapes 310 arranged at intervals, thereby fixing the reinforcing ring 200 to the circumferential direction of the chip mounting portion 110 of the substrate 100.

[0051] The reinforcing ring 200 can be designed according to the specific shapes of the chip mounting portion 110 and the chip 400. For example, the reinforcing ring 200 can be a polygonal structure such as a rectangle or a pentagon, or can be a circular or oval structure, etc.

[0052] In some embodiments, the reinforcing ring 200 may be rectangular, and at least one second welding portion 210 is provided on each side of the reinforcing ring 200. Among them, the reinforcing ring 200 includes four sequentially connected sides, and at least one second welding portion 210 is provided at the bottom of each side. On the corresponding substrate 100, a first welding portion 120 is also provided corresponding to the second welding portion 210 in the circumferential direction of the chip mounting portion 110. The first welding portion 120 and the second welding portion 210 are welded and connected by welding to form a welding structure 300, and the rectangular reinforcing ring 200 is connected to the substrate 100 to support and strengthen the internal space surrounded by the reinforcing ring 200 and reduce warping.

[0053] In order to improve the welding reliability between the reinforcing ring 200 and the substrate 100, in some embodiments, the ratio of the length of the second welding portion 210 to the length of the side of the reinforcing ring 200 is greater than or equal to 1 / 2. Among them, the welding length between the reinforcing ring 200 and the substrate 100 is limited by limiting the set length of the second welding portion 210 on the reinforcing ring 200. When the reinforcing ring 200 is rectangular, the welding strength between the two can also be ensured by limiting the welding length between each side and the substrate 100. For example, when the second welding portion 210 is a strip structure, the length of the strip structure on each side can be equal to or more than half of the length of that side. By limiting the actual welding length between each side and the substrate 100, the reliability of the welding connection is ensured.

[0054] It should be noted that when one strip structure is provided on each side, the length of the strip structure can be greater than or equal to half or more of the length of that side, and when multiple strip structures are provided on each side, the total length of the multiple strip structures on the multiple sides is greater than or equal to half or more than half of the length of the entire side (the circumferential length of the reinforcing ring 200).

[0055] As Figure 7 and Figure 8 shown, in some other embodiments, both the first welding portion 120 and the second welding portion 210 include a plurality of corresponding dot structures; the welding structure 300 includes a plurality of solder balls 320, and the dot structures of the first welding portion 120 are connected to the dot structures of the second welding portion 210 through the solder balls 320.

[0056] Among them, a plurality of first dot-like structures 123 are formed at the bottom of the reinforcing ring 200, and second dot-like structures 213 corresponding to the plurality of first dot-like structures 123 at the bottom of the reinforcing ring 200 are formed in the circumferential direction of the chip mounting portion 110 on the substrate 100. The first dot-like structures 123 and the second dot-like structures 213 are welded together by solder balls 320 to realize the connection between the reinforcing ring 200 and the substrate 100. Among them, the plurality of first dot-like structures 123 form a first welding portion 120; the plurality of second dot-like structures 213 form a second welding portion 210, and the plurality of solder balls 320 connecting the first dot-like structures 123 and the second dot-like structures 213 form a welding structure 300. Through this welding method, the reinforcing ring 200 can also be fixedly connected to the circumferential direction of the chip mounting portion 110 of the substrate 100.

[0057] It can be understood that the plurality of solder balls 320 are arranged at intervals. For example, a plurality of solder balls 320 connected to the substrate 100 can be evenly distributed along the circumferential direction of the reinforcing ring 200. Of course, it can also be based on the side of the reinforcing ring 200, and by limiting that the actual welding area of each side with the substrate 100 is greater than half of the projected area of the side and above, the connection strength between the two is ensured to reduce warping.

[0058] As Figure 9 As shown, in some embodiments, the chip strengthening structure further includes a chip 400 connected to the chip mounting portion 110, and the height of the reinforcing ring 200 is less than or equal to the height of the chip 400. Among them, the chip 400 is connected to the chip mounting portion 110 on the substrate 100. Since the above-mentioned reinforcing ring 200 is arranged in its circumferential direction, the warping of the chip 400 is reduced through the welded connection between the reinforcing ring 200 and the substrate 100. Considering the heat dissipation problem of the chip 400, that is, a heat dissipation member 500 needs to be arranged on the side of the chip 400 away from the substrate 100. In order for the heat dissipation member 500 to directly contact the chip 400 to improve the heat dissipation efficiency, therefore, the height of the reinforcing ring 200 is arranged to be lower than the height of the chip 400, so that the heat dissipation member 500 can directly contact the chip 400, and there is no need to arrange a sinking boss to contact the chip 400, reducing the heat transfer path and being more conducive to heat dissipation. It should be noted that the above-mentioned height of the reinforcing ring 200 being less than or equal to the height of the chip 400 means that the upper surface (the surface away from the substrate 100) of the reinforcing ring 200 is flush with the upper surface of the chip 400, or the upper surface of the reinforcing ring 200 is below the upper surface of the chip 400. When the heat dissipation member 500 is arranged, the surface of the heat dissipation member 500 can directly contact the upper surface of the chip 400.

[0059] According to the second aspect of the present disclosure, an electronic device is further provided. The electronic device includes the above-mentioned chip strengthening structure. Therefore, the electronic device also has all the advantages of the above-mentioned chip strengthening structure, which will not be elaborated here one by one.

[0060] It should be noted that the electronic device includes, but is not limited to, a computer, a laptop computer, a tablet computer, a server, or a single-chip microcomputer, etc., and can also be other electronic devices that need to use the substrate 100 and arrange the chip 400 on the substrate 100.

[0061] As Figure 11 shown, in some embodiments, the electronic device further includes a heat dissipation member 500, and the heat dissipation member 500 is connected to the side of the chip 400 away from the substrate 100 for dissipating heat from the chip 400. Among them, the heat dissipation member 500 can be a radiator in any suitable form, for example, a water-cooled radiator, an air-cooled radiator, or a heat pipe radiator, etc. The heat dissipation member 500 can be directly connected to the upper surface of the chip 400. For example, it can be bonded to the surface of the chip 400 through a thermal conductive adhesive. When the chip 400 works, the heat generated by it can be directly dissipated through the radiator, so that the chip 400 can work within a normal temperature range.

[0062] In the chip strengthening structure and the electronic device of the present disclosure, a first welding portion 120 is circumferentially arranged around the chip mounting portion 110 of the substrate 100, and the reinforcing ring 200 includes a second welding portion 210 corresponding to the first welding portion 120. The first welding portion 120 and the second welding portion 210 are welded and connected together through a welding structure 300, so as to fixedly arrange the reinforcing ring 200 circumferentially on the chip mounting portion 110 of the substrate 100, forming support and strengthening in the circumferential direction of the substrate 100 of the chip mounting portion 110, so as to reduce the warping deformation of the chip 400 mounted on the chip mounting portion 110.

[0063] Compared with the related art, in the chip strengthening structure of the present disclosure, the reinforcing ring 200 is fixed on the substrate 100 of the chip 400 by welding, and its strength is greatly increased compared with the bonding form, and the structural requirements can be met with a smaller height of the reinforcing ring 200. At the same time, the height of the reinforcing ring 200 is arranged to be the same as or shorter than the height of the chip 400, and there is a gap between the chip 400 and the reinforcing ring 200, so that the chip 400 can be directly in contact with the heat dissipation member 500 (radiator), the heat dissipation efficiency of the heat dissipation member 500 is greatly enhanced, the thermal resistance is reduced, and the total thermal resistance of the chip 400 is greatly reduced, which is beneficial to the heat dissipation design.

[0064] The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

[0065] In addition, it should be noted that, in the above specific embodiments, the various specific technical features described can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination manners.

[0066] Furthermore, any combinations can be made among the various different embodiments of the present disclosure, as long as they do not violate the idea of the present disclosure, and they should also be regarded as the content disclosed by the present disclosure.

Claims

1. A chip strengthening structure, characterized in that, Comprising: A substrate, including a chip mounting portion and a first welding portion surrounding the circumferential direction of the chip mounting portion; A reinforcing ring, including a second welding portion corresponding to the first welding portion; And A welding structure, the second welding portion and the first welding portion are fixedly connected through the welding structure, so that the reinforcing ring surrounds the circumferential direction of the chip mounting portion.

2. The chip strengthening structure according to claim 1, wherein The second welding portion is configured as a second annular structure extending along the circumferential direction of the bottom of the reinforcing ring; The first welding portion is configured as a first annular structure extending along the circumferential direction of the chip mounting portion and at least partially corresponding to the second welding portion.

3. The chip strengthening structure according to claim 1, wherein At least a part of the welding structure extends from the bottom of the reinforcing ring to the outer side wall of the reinforcing ring.

4. The chip strengthening structure according to claim 1, wherein The first welding portion and the second welding portion are configured as a plurality of strip-shaped structures; The welding structure includes a plurality of strip-shaped solder tapes located between the first welding portion and the second welding portion, and the first welding portion and the second welding portion are fixedly connected through the strip-shaped solder tapes.

5. The chip strengthening structure according to claim 4, wherein, The reinforcing ring is rectangular, and at least one of the second welding portions is provided on each side of the reinforcing ring.

6. The chip strengthening structure according to claim 5, wherein, The ratio of the length of the second welding portion to the length of the side of the reinforcing ring is greater than or equal to 1 / 2.

7. The chip strengthening structure according to claim 1, wherein, Both the first welding portion and the second welding portion include a plurality of corresponding dot-shaped structures; The welding structure includes a plurality of solder balls, and the dot-shaped structure of the first welding portion is connected to the dot-shaped structure of the second welding portion through the solder balls.

8. The chip strengthening structure according to any one of claims 1-7, characterized in that, The chip strengthening structure further includes a chip connected to the chip mounting portion, and the height of the reinforcing ring is less than or equal to the height of the chip.

9. An electronic device, characterized in that, The electronic device includes the chip strengthening structure according to any one of claims 1-8.

10. The electronic device according to claim 9, wherein The electronic device further includes a heat dissipating member, and the heat dissipating member is connected to the side of the chip away from the substrate for dissipating heat of the chip.

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