Three-dimensional vapor chamber element
By designing three-dimensional vapor cavity components, combining two-phase flow circulation and jet flow heat dissipation, the heat dissipation problem of cold plate liquid-cooled heat dissipation technology in high-computing chips and 3D stacking IC packaging structures is solved, achieving more efficient heat dissipation and temperature uniformity, and extending the service life of the equipment.
Patent Information
- Application Number
- CN202421108281.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-05-21
AI Technical Summary
The existing cold plate liquid-cooled heat dissipation technology faces the problems of low heat dissipation efficiency, high thermal resistance, poor temperature uniformity and insufficient heat dissipation area in high computing power chips and 3D stacking IC packaging structures, especially in the case of high power density, which is difficult to effectively solve.
A three-dimensional vapor cavity element is designed, including an upper cover, a lower plate and a runner fin, combining a porous capillary structure and a support column, and the cooling liquid is directly splashed at the hot spot for forced heat exchange, increasing the heat dissipation surface area and efficiency.
It improves heat dissipation efficiency, solves the heat dissipation bottleneck in high-computing chips and 3D stacking IC packaging structures, enhances temperature uniformity and heat dissipation area, and extends service life.
Smart Images
Figure CN223156025U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a three-dimensional steam chamber element, in particular to a three-dimensional steam chamber element which combines an upper cover with a shovel-tooth micro-channel structure and is arranged in the three-dimensional steam chamber element, thereby increasing the heat dissipation surface area and having a jet flow heat dissipation function. Background Art
[0002] As the thermal design power (TDP) and power density of high-computing chips and communication chips in servers and communication switches gradually increase, the temperature of the chips also gradually increases. The 3D stacked IC packaging also makes it more difficult to dissipate the heat generated by the bottom chip. Traditional air cooling technology has faced bottlenecks, and liquid cooling technology has emerged. Among them, cold plate liquid cooling technology has gradually become the mainstream.
[0003] However, conventional cold plate heat dissipation technologies can be roughly divided into shovel-tooth micro-channel cold plates, jet-flow cold plates, and two-phase flow cold plates. However, as chip power exceeds 1,000W, power density exceeds 100W / cm2, and it is a 3D stacked packaging structure, conventional cold plate heat dissipation technologies are also facing bottlenecks in heat dissipation and heat dissipation. Although a general pure jet-type cold plate can effectively reduce the chip temperature in the coolant impact area, it can also cause the problem of excessive temperature difference across the chip; the shovel-tooth micro-channel cold plate that generally relies on heat dissipation fins to dissipate heat also faces difficulties in reducing thermal resistance and temperature uniformity problems; and the two-phase flow cold plate also faces the problem of complex and expensive two-phase coolant circulation systems and insufficient heat dissipation area.
[0004] Therefore, in order to solve the heat dissipation and heat dissipation challenges brought about by various conventional cold plate liquid cooling radiators as chip power and power density gradually increase, it is necessary to provide a more efficient three-dimensional vapor chamber element to solve the problem of chip heat dissipation and heat distribution. Utility Model Content
[0005] In view of this, the purpose of the utility model is to provide a three-dimensional steam chamber element, which has a simple structure, convenient operation and maintenance, can overcome the defects of the prior art, increase the heat dissipation surface area, effectively improve the heat dissipation efficiency, solve the heat dissipation problem of the chip, and increase the service life.
[0006] To achieve the above object, the utility model discloses a three-dimensional steam chamber element, which is characterized by comprising:
[0007] An upper cover having an upper surface;
[0008] a lower plate, disposed relative to the upper cover, and forming a closed air cavity when the upper cover is coupled to the lower plate; and
[0009] A plurality of flow channel fins are spaced apart on the upper surface of the upper cover to form a plurality of microchannels. At the same time, the plurality of flow channel fins surround an opening on the upper surface of the upper cover, and the opening communicates with the microchannels;
[0010] Wherein the three-dimensional vapor chamber element has an endothermic region and a condensation region. The endothermic region is located on the lower plate, and the condensation region is located on the upper cover.
[0011] Wherein, the flow channel fins are integrally formed and spaced apart on the upper surface of the upper cover to form the microchannels.
[0012] Wherein, the lower plate has a lower surface of the lower plate, and the lower surface of the lower plate relative to the opening is used to contact a heat source.
[0013] Wherein, the upper surface of the upper cover has an opening surface for receiving splashing of a coolant relative to the opening.
[0014] Wherein, the coolant flows through the opening and splashes on the opening surface and then flows through the microchannels on the upper surface of the upper cover.
[0015] Wherein, the flow channel width of the microchannels is less than or equal to 1 mm.
[0016] Wherein, a plurality of heat dissipation structures are provided on the opening surface, and the opening surface is located at a hot spot of the heat source.
[0017] Wherein, there is also a continuous porous capillary structure, and the porous capillary structure is arranged between the upper cover and the lower plate in the sealed air cavity.
[0018] Wherein, there are also a plurality of support columns with porous capillary structures, which are respectively arranged between the upper cover and the lower plate in the sealed air cavity.
[0019] Wherein, the flow channel fins further surround a microchannel buffer region, which is formed between the upper surface of the upper cover and the microchannels.
[0020] In summary, the three-dimensional vapor chamber component of the present utility model first absorbs the thermal energy of the heat source through the lower surface of the lower plate that is preferentially in close contact with the heat source. The working fluid inside the three-dimensional vapor chamber component can directly absorb the thermal energy through the lower surface of the lower plate and then perform phase change and two-phase flow circulation for heat dissipation in the porous capillary structure and the sealed air chamber. Further, since the upper cover of the three-dimensional vapor chamber component of the present utility model is further provided with flow channel fins, and there is further an opening in the middle of the flow channel fins. When the three-dimensional vapor chamber component of the present utility model is applied to liquid cooling heat dissipation, this opening can be used to accommodate the spray head. By arranging the spray head in the semi-open housing and vertically setting the spray orifice of the spray head at the hottest point with the highest temperature for the heat source (i.e., the wafer), the coolant can directly splash and impact on the opening surface of the upper cover that is in close contact with the hottest point of the heat source to perform forced heat exchange.
[0021] Therefore, in addition to increasing the heat dissipation surface area in the two-phase flow circulation of the three-dimensional vapor chamber component, when the flow channel fins of the three-dimensional vapor chamber component of the present utility model are applied to liquid cooling, the coolant can also directly splash and impact on the opening surface of the upper cover, directly dissipate heat at the place with the highest temperature, and let the coolant take the thermal energy away from the radiator. In summary, the innovative three-dimensional vapor chamber component provided by the present utility model can be further combined with the heat exchange chamber housing of the liquid cooling cycle to form a radiator that simultaneously has a phase change function, a jet flow, and a micro-channel heat dissipation function, so as to solve the deficiencies of various conventional liquid cooling radiators. Brief Description of the Drawings
[0022] Figure 1 Shows a schematic structural diagram of a three-dimensional vapor chamber component according to a specific embodiment of the present utility model.
[0023] Figure 2 Shows according to Figure 1 An exploded schematic diagram of the three-dimensional vapor chamber component.
[0024] Figure 3 Shows according to Figure 1 A schematic diagram of the three-dimensional vapor chamber component applied to liquid cooling heat dissipation.
[0025] Figure 4 Shows a schematic diagram of a three-dimensional vapor chamber component according to another specific embodiment of the present utility model.
[0026] Figure 5 Shows a schematic diagram of a three-dimensional vapor chamber component according to another specific embodiment of the present utility model.
[0027] Figure 6 Shows a schematic diagram of a three-dimensional vapor chamber component according to another specific embodiment of the present utility model.
[0028] Figure 7Shows a schematic diagram of a three-dimensional vapor chamber element according to another specific embodiment of the present utility model. Detailed Description of the Embodiment
[0029] In order to make the advantages, spirit, and features of the present utility model easier and clearer to understand, the following will be described and discussed in detail with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present utility model, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present utility model or the corresponding specific embodiments. Also, the elements in the drawings are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present utility model are only used to distinguish different steps and do not represent the order of the steps. This is hereby stated first.
[0030] Please refer to Figure 1 and Figure 2 , Figure 1 which shows a schematic structural diagram of a three-dimensional vapor chamber element 1 according to a specific embodiment of the present utility model, Figure 2 which shows an exploded schematic diagram of the three-dimensional vapor chamber element 1 according to Figure 1 . As shown in Figure 1 and Figure 2 , the three-dimensional vapor chamber element 1 of this specific embodiment includes an upper cover 10, a lower plate 20, and a plurality of flow channel fins 30. Among them, the upper cover 10 has an upper surface 101, and the lower plate 20 has a lower surface 201 of the lower plate. When the upper cover 10 is coupled to the lower plate 20, a sealed air cavity 204 is formed between the upper cover 10 and the lower plate 20. The plurality of flow channel fins 30 are arranged at intervals on the upper surface 101 of the upper cover 10 to form a plurality of microchannels 31. At the same time, the plurality of flow channel fins 30 surround the upper surface 101 of the upper cover 10 to form an opening 32, and the opening 32 communicates with each microchannel 31. Among them, the three-dimensional vapor chamber element 1 has a heat absorption area 81 and a condensation area 82. The heat absorption area 81 is located on the lower plate 20, and the condensation area 82 is located on the upper cover 10, and the lower surface 201 of the lower plate relative to the opening 32 contacts a heat source 90.
[0031] In this specific embodiment, the three-dimensional vapor chamber element 1 further includes a continuous porous capillary structure (not shown in the figure) and a plurality of support columns 41 with porous capillary structures, and the upper cover 10 is provided with a nozzle sealing structure 103. In practice, the porous capillary structure is disposed on the lower surface of the upper cover 10 and the upper surface of the lower plate 20 of the lower plate, and the support columns 41 are disposed between the upper cover 10 and the lower plate 20. When the upper cover 10 and the lower plate 20 are coupled, a plurality of support columns 41 with porous capillary structures are located between the upper cover 10 and the lower plate 20, and further, a plurality of support columns 41 with porous capillary structures form a continuous capillary structure with the porous capillary structures on the lower surface of the upper cover 10 and the upper surface of the lower plate 20 of the lower plate. Then, the working fluid is injected into the cavity between the upper cover 10 and the lower plate 20 through a pre-set liquid injection port (not shown in the figure) in the lower plate 20, and the cavity is evacuated and the liquid injection port is sealed. The evacuated internal cavity forms a sealed gas cavity 204. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol, or a two-phase coolant, such as R134a.
[0032] Please continue to refer to Figure 1 and Figure 2 , the flow channel fin 30 structure of the three-dimensional vapor chamber element 1 in this specific embodiment is generally quadrilateral. In practice, after the metal material is first milled to form the specific contour of the overall structure and the opening 32 in the middle of the upper cover 10 by the shovel tooth process, the flow channel fins 30 are then sequentially machined by cutting, and the gap between the distances of each flow channel fin 30 forms a microchannel 31 so that the coolant can flow through more evenly. Then, the flow channel fins 30 are coupled to the upper surface 101 of the upper cover 10 through welding. In another embodiment, the metal material can also directly reserve the thickness of the upper cover and directly mill the opening and the structural features of the flow channel fins on the upper surface of the material, so that the flow channel fins are integrally formed on the upper cover. When the integrally formed upper cover is coupled to the lower cover, a three-dimensional vapor chamber element is formed. Due to the integrally formed relationship, the thermal resistance between the flow channel fins and the upper cover can be reduced, thereby improving the heat dissipation efficiency.
[0033] In practical applications, the lower plate 20 of the three-dimensional vapor chamber element 1 preferentially absorbs the heat energy of the heat source 90 as the heat absorption area 81. At this time, the working fluid in the sealed gas cavity 204 of the three-dimensional vapor chamber element 1 absorbs the heat energy, and undergoes a phase change from the liquid working fluid to the gaseous working fluid. Then, the gaseous working fluid drifts to the condensation area 82. Due to the temperature reduction, the cooled working fluid will undergo a phase change back to the liquid working fluid, and finally flow back to the heat absorption area 81 along the porous capillary structure and the support columns 41, thereby repeating the two-phase flow cycle inside the three-dimensional vapor chamber element 1.
[0034] In practical applications, the three-dimensional vapor chamber element 1 of the present invention can be installed in a semi-open shell and filled with cooling liquid to simultaneously perform two-phase flow heat dissipation and liquid cooling heat dissipation inside the three-dimensional vapor chamber element. Figure 1 , Figure 2 as well as Figure 3 , Figure 3 Shows the Figure 1 Schematic diagram of a three-dimensional vapor chamber element 1 applied to liquid cooling. Figure 3 As shown, the three-dimensional vapor chamber element 1 is installed in a semi-open housing 70. When the three-dimensional vapor chamber element 1 of the utility model is actually used for heat dissipation, Figure 3 The arrow direction shown in the figure is the flow direction of the coolant. The coolant flows in from the input port of the semi-open shell 70. At this time, the coolant can directly flow downward from the input port above the three-dimensional vapor chamber element 1 and pass through the opening surface 102 of the upper cover 10. Then, the coolant flows along the flow direction of the microchannel 31 and further performs forced heat exchange with the large-area channel fins 30. Finally, the coolant is discharged from the output port of the semi-open shell 70, completing a heat exchange liquid cooling cycle.
[0035] Please continue reading Figure 3 It is worth noting that the position of the opening of the three-dimensional vapor chamber element 1 of this specific embodiment corresponds to the position of the heat source 90. In other words, the position of the opening and the heat source 90 is the shortest vertical distance. Therefore, after the coolant flows in from the input port of the semi-open shell 70, the coolant can flow out directly from the spray port above the three-dimensional vapor chamber element 1 and directly splash onto the upper surface area of the upper cover that is the shortest distance from the heat source 90, so that the coolant can directly perform forced heat exchange and heat dissipation at the place with the highest temperature, thereby greatly increasing the overall heat dissipation efficiency.
[0036] Therefore, in addition to the heat dissipation by the two-phase flow circulation inside the three-dimensional vapor chamber element 1 mentioned above, the coolant can be further sprayed directly onto the upper surface of the upper cover from the sprinkler head above the three-dimensional vapor chamber element, so that the low-temperature coolant can further take away the heat energy of the upper cover area, and then the coolant flows through the heat exchange cavity and finally flows out from the output port. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants, but is not limited to this. The coolant can also be other fluids that absorb heat and take away heat energy. Please note that considering the heat exchange area of the microchannel and the flow rate of the coolant, Figure 2 The flow channel width d of the microchannel shown in the figure is less than or equal to 1 mm, and a microchannel buffer area 33 is further provided between the upper surface of the upper cover and the microchannel, so that the flow rate of the coolant can be adjusted when flowing through the microchannel buffer area 33. In practical applications, the flow channel width of the microchannel, the thickness of the flow channel fins, the drainage structure and the microchannel buffer area are not limited to this and can be adjusted according to the design.
[0037] In another embodiment, a plurality of heat dissipation structures (not shown in the figure) are further provided on the opening surface of the upper cover of the three-dimensional vapor chamber element. The heat dissipation structures can be small cylinders that extend upward or recess downward from the opening surface, thereby increasing the heat dissipation efficiency of the three-dimensional vapor chamber element. However, the shape, quantity, and arrangement of the heat dissipation structures can all be optimized according to actual requirements.
[0038] The above-mentioned three-dimensional vapor chamber element 1 can be applied to electronic components with relatively large sizes near the heat source, but the three-dimensional vapor chamber element can also be in other forms. Please refer to Figure 4 , Figure 4 which shows a schematic diagram of the three-dimensional vapor chamber element 2 according to another specific embodiment of the present invention. As Figure 4 shown, the lower surface 201 of the lower plate 21 of the three-dimensional vapor chamber element 2 in this specific embodiment contacts the heat source 90. At this time, the size specification of the heat source 90 is relatively large, and the three-dimensional vapor chamber element 2 can be applicable to heat sources 90 of any specification. The other devices in this specific embodiment are substantially the same as the corresponding devices in the foregoing specific embodiment, so they will not be described in detail here. Moreover, the three-dimensional vapor chamber element 2 in this specific embodiment can also be installed in the above-mentioned semi-open housing to allow the three-dimensional vapor chamber element 2 to perform liquid cooling heat dissipation.
[0039] Please refer to Figure 5 , Figure 5 which shows a schematic diagram of the three-dimensional vapor chamber element 3 according to another specific embodiment of the present invention. As Figure 5 shown, a recessed opening 1101 is provided on the upper cover 11 of the three-dimensional vapor chamber element 3 of the composite liquid cooling radiator 3 in this specific embodiment. The recessed opening 1101 can be milled or processed by a mold to form the feature of the recessed opening during pre-operation processing. When the coolant flows out from the spray opening, the coolant can directly splash on the opening surface of the recessed opening 1101, thereby increasing the heat dissipation efficiency. The other devices in this specific embodiment are substantially the same as the corresponding devices in the foregoing specific embodiment, so they will not be described in detail here.
[0040] Please refer to Figure 6 , Figure 6 which shows a schematic diagram of the three-dimensional vapor chamber element 4 according to another specific embodiment of the present invention. As Figure 6 shown, the three-dimensional vapor chamber element 4 in this specific embodiment includes an upper cover 11 and a lower plate 21. The coolant can directly splash on the opening surface of the recessed opening 1101 of the upper cover 11, thereby increasing the heat dissipation efficiency. The lower plate 21 can also avoid interference for electronic components with relatively high heights. The other devices in this specific embodiment are substantially the same as the corresponding devices in the foregoing specific embodiment, so they will not be described in detail here.
[0041] Furthermore, the three-dimensional vapor chamber element of the present utility model can also be installed on electronic products with multiple heat sources simultaneously. Please refer to Figure 7 , Figure 7 which shows a schematic diagram of the three-dimensional vapor chamber element 5 of another specific embodiment of the present utility model. As shown in Figure 7 , the three-dimensional vapor chamber element 5 of this specific embodiment simultaneously includes three sets of upper covers 10. At this time, the three sets of upper covers 10 can be coupled with one set of lower plates 20 to form the three-dimensional vapor chamber element 5, and can be simultaneously joined to three heat sources 90. In practice, the number and arrangement of the three-dimensional vapor chamber elements can be optimized according to actual requirements. The other devices of this specific embodiment are substantially the same as the corresponding devices of the previous specific embodiment, so they will not be elaborated here. Further, the three-dimensional vapor chamber element 5 of this specific embodiment can also be installed in a semi-open housing, and is provided with three sets of coolant openings corresponding to the heat sources 90, so that the three-dimensional vapor chamber element 5 can perform liquid-cooled heat dissipation.
[0042] In summary, the three-dimensional vapor chamber element provided by the present utility model first absorbs the heat energy of the heat source through the lower surface of the lower plate that is preferentially close to the heat source. The working fluid inside the three-dimensional vapor chamber element can directly absorb the heat energy through the lower surface of the lower plate and then perform phase change and two-phase flow circulation heat dissipation in the porous capillary structure and the sealed gas chamber. Further, since the upper cover of the three-dimensional vapor chamber element of the present utility model is further provided with flow channel fins, and there is further an opening in the middle of the flow channel fins. When the three-dimensional vapor chamber element of the present utility model is applied to liquid-cooled heat dissipation, this opening can be used to accommodate the spray head. By arranging the spray head in the semi-open housing, and the spray orifice of the spray head is vertically arranged at the hottest spot where the temperature of the heat source (i.e., the chip) is the highest, the coolant can be directly sprayed and impinged on the opening surface of the upper cover that is close to the heat source hot spot for forced heat exchange.
[0043] Therefore, in addition to increasing the heat dissipation surface area in the two-phase flow circulation heat dissipation of the three-dimensional vapor chamber element, when the flow channel fins of the three-dimensional vapor chamber element of the present utility model are applied to liquid cooling, the coolant can also be directly sprayed and impinged on the opening surface of the upper cover, directly dissipating heat from the place where the temperature is the highest, and allowing the coolant to take away the heat energy from the radiator. In summary, the innovative three-dimensional vapor chamber element provided by the present utility model can be further combined with the heat exchange chamber housing of the liquid-cooled cycle to form a radiator that simultaneously has a phase change function, a jet flow, and a micro-channel heat dissipation function, so as to solve the deficiencies of various conventional liquid-cooled radiators.
[0044] From the detailed description of the above preferred specific embodiments, it is hoped that the features and spirit of the present invention can be more clearly described, rather than limiting the scope of the present invention by the above-disclosed preferred specific embodiments. On the contrary, the purpose is to hope to cover various changes and equivalent arrangements within the scope of the patent scope to which the present invention desires to apply. Therefore, the scope of the patent scope applied for by the present invention should be interpreted as broadly as possible according to the above description, so as to cover all possible changes and equivalent arrangements.
Claims
1. A three-dimensional vapor chamber component, characterized in that Comprising: An upper cover having an upper surface; A lower plate disposed relative to the upper cover, forming a sealed air cavity when the upper cover is coupled to the lower plate; And A plurality of flow channel fins spaced apart on the upper surface of the upper cover to form a plurality of microchannels. At the same time, the plurality of flow channel fins surround an opening on the upper surface of the upper cover, and the opening communicates with the microchannels; Wherein the three-dimensional vapor chamber element has a heat absorption area and a condensation area, the heat absorption area is located on the lower plate, and the condensation area is located on the upper cover.
2. The three-dimensional vapor chamber element according to claim 1, wherein The flow channel fins are integrally formed and spaced apart on the upper surface of the upper cover to form the microchannels.
3. The three-dimensional vapor chamber element according to claim 2, wherein, The lower plate has a lower surface of the lower plate, and the lower surface of the lower plate relative to the opening is used to contact a heat source.
4. The three-dimensional vapor chamber element according to claim 3, characterized in that, The upper surface of the upper cover has an opening surface for receiving a coolant splash relative to the opening.
5. The three-dimensional vapor chamber element according to claim 4, wherein, The coolant flows through the opening and splashes on the opening surface and then flows through the microchannels on the upper surface of the upper cover.
6. The three-dimensional vapor chamber element according to claim 1, wherein, The flow channel width of the microchannels is less than or equal to 1 mm.
7. The three-dimensional vapor chamber element according to claim 4, wherein A plurality of heat dissipation structures are provided on the opening surface, and the opening surface is located at a hot spot of the heat source.
8. The three-dimensional vapor chamber element according to claim 1, wherein, Further comprising a continuous porous capillary structure, the porous capillary structure is disposed between the upper cover and the lower plate in the sealed air cavity.
9. The three-dimensional vapor chamber element according to claim 1, wherein, Further comprising a plurality of support columns with porous capillary structures, respectively disposed between the upper cover and the lower plate in the sealed air cavity.
10. The three-dimensional vapor chamber element according to claim 1, wherein, The flow channel fins further surround a microchannel buffer region formed between the upper surface of the upper cover and the microchannels.