Optocoupler packaging structure

Abstract

The utility model discloses an optocoupler packaging structure, and relates to the technical field of photoelectric coupling. The optocoupler packaging structure has a first direction and a second direction which are perpendicular to each other, the second direction is a vertically spaced direction, and in the optocoupler packaging structure, a photoelectric coupling region is arranged in a plastic package body; the photoelectric coupling component is arranged in the photoelectric coupling area; the first lead frame comprises a first supporting part, a first bending part and a first pin part which are connected in sequence; the second lead frame comprises a second supporting part, a second bending part and a second pin part which are connected in sequence; the first supporting part and the second supporting part are arranged in the plastic package body, are positioned on two opposite sides of the photoelectric coupling area along the second direction, and are used for supporting the photoelectric coupling assembly; the first bending part and the second bending part are arranged in the plastic package body and are positioned on the peripheral side of the photoelectric coupling region distributed around the second direction; the first pin part and the second pin part are positioned outside the plastic package body; the surface of any one of the first bending part and the second bending part is provided with a coarsening structure. The sealing performance of the plastic package body can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of optoelectronic coupling, and particularly to an optocoupler packaging structure. Background Art

[0002] An optical coupler (optical coupler equipment), also known as an opto-isolator or an optical coupler, simply called an optocoupler, is a device that transmits electrical signals through light. Usually, a light-emitting element (such as a light-emitting diode LED) and a photosensitive element (such as a photosensitive semiconductor tube, a photosensitive resistor) are encapsulated in the same housing. When an electrical signal is applied to the input end, the light-emitting element emits light. After the photosensitive element receives the light, a photocurrent is generated and flows out from the output end, thus realizing "electricity - light - electricity" control. The optical coupler that couples the input end signal to the output end through light has been widely used in digital circuits because of its advantages such as small size, long life, non-contact, strong anti-interference ability, insulation between the output and the input, and unidirectional signal transmission.

[0003] Optical couplers often adopt an up-and-down opposed optocoupler packaging structure. As Figure 1 shown, the up-and-down opposed optocoupler packaging structure 100 has a first direction W1 and a second direction H1 that are perpendicular to each other. The second direction H1 is the up-and-down spacing direction, and the optocoupler packaging structure 100 includes a plastic package 110, an optoelectronic coupling component 120, a first lead frame 130, and a second lead frame 140. There is an optoelectronic coupling area S1 inside the plastic package 110. The optoelectronic coupling component 120 is arranged in the optoelectronic coupling area S1. The first lead frame 130 includes a first support portion 131, a first bending portion 132, and a first pin portion 133 that are sequentially connected. The second lead frame 140 includes a second support portion 141, a second bending portion 142, and a second pin portion 143 that are sequentially connected.

[0004] Among them, the first support portion 131 and the second support portion 141 are arranged inside the plastic package 110 and on opposite sides of the optoelectronic coupling area S1 along the second direction H1 for supporting the optoelectronic coupling component 120. The first bending portion 132 and the second bending portion 142 are arranged inside the plastic package 110 and on the circumferential side of the optoelectronic coupling area S1 around the second direction H1. The first pin portion 133 and the second pin portion 143 are located outside the plastic package 110. In the existing optocoupler packaging structure 100, the sealing performance of the plastic package 110 is poor, so that water vapor easily penetrates into the plastic package 110, and then the optocoupler packaging structure 100 is prone to short circuit or leakage.

[0005] Therefore, there is an urgent need for an optocoupler packaging structure that can improve the sealing performance of the plastic package. Summary of the Utility Model

[0006] In view of this, to solve the above technical problems, the present application provides an optocoupler packaging structure.

[0007] To solve the above technical problems, a technical solution adopted in this application is to provide an optocoupler package structure. The optocoupler package structure has a first direction and a second direction that are perpendicular to each other. The second direction is the vertical spacing direction, and the optocoupler package structure includes:

[0008] A plastic package body with an optoelectronic coupling region inside;

[0009] An optoelectronic coupling component disposed in the optoelectronic coupling region;

[0010] A first lead frame including a first support portion, a first bending portion, and a first pin portion connected in sequence;

[0011] A second lead frame including a second support portion, a second bending portion, and a second pin portion connected in sequence;

[0012] Wherein, the first support portion and the second support portion are disposed inside the plastic package body and on opposite sides of the optoelectronic coupling region along the second direction for supporting the optoelectronic coupling component; the first bending portion and the second bending portion are disposed inside the plastic package body and on the circumferential side of the optoelectronic coupling region around the second direction; the first pin portion and the second pin portion are located outside the plastic package body; a roughened structure is provided on the surface of any one of the first bending portion and the second bending portion.

[0013] Optionally, the first bending portion bends towards the side close to the second support portion relative to the first support portion; the first lead frame includes a third bending portion that penetrates out of the plastic package body from inside the plastic package body to connect the first bending portion and the first pin portion respectively;

[0014] The second bending portion bends towards the side close to the first support portion relative to the second support portion; the second lead frame includes a fourth bending portion that penetrates out of the plastic package body from inside the plastic package body to connect the second bending portion and the second pin portion respectively.

[0015] Optionally, no roughened structure is provided on the surface of any one of the first support portion and the second support portion;

[0016] Or, no roughened structure is provided on the surface of any one of the first support portion, the second support portion, the third bending portion, and the fourth bending portion.

[0017] Optionally, the optoelectronic coupling component includes a light-emitting element and a photosensitive element; the light-emitting element is disposed on the first support portion and electrically connected to the first support portion, and the photosensitive element is disposed on the second support portion and electrically connected to the second support portion;

[0018] Wherein, the light-emitting element is used for emitting light and shooting the emitted light towards the photosensitive element; the photosensitive element is used for receiving the light emitted by the light-emitting element and converting it into a corresponding electrical signal.

[0019] Optionally, the optoelectronic coupling component includes a light-transmitting protection part that wraps the light-emitting element.

[0020] Optionally, a light-condensing curved surface is formed on the surface of the light-transmitting protection part. The light-condensing curved surface covers the light-emitting element, and the light-condensing curved surface is a spherical crown surface; the light-condensing curved surface is used to converge the light emitted by the light-emitting element and emit the converged light toward the photosensitive element.

[0021] Optionally, the preparation material of the light-transmitting protection part includes silicone resin.

[0022] Optionally, the plastic package includes a light-transmitting inner plastic encapsulant and an opaque outer plastic encapsulant; the optoelectronic coupling region is located within the light-transmitting inner plastic encapsulant; the opaque outer plastic encapsulant wraps the light-transmitting inner plastic encapsulant;

[0023] Among them, the first support part, the second support part, the first bending part, and the second bending part are located within the light-transmitting inner plastic encapsulant.

[0024] Optionally, the preparation materials of the first lead frame and the second lead frame include copper.

[0025] Optionally, a roughened structure is provided on the surface of any one of the part of the third bending part embedded in the plastic package and the part of the fourth bending part embedded in the plastic package.

[0026] Beneficial effects: Different from the prior art, the optocoupler package structure of the present application can at least improve the sealing performance of the plastic package from the following first aspect and second aspect. First aspect, the roughened structure can increase the bonding strength between the corresponding lead frame and the plastic package, thereby hindering water vapor from passing through the interface between the lead frame and the plastic package, so the sealing performance of the plastic package can be improved. Second aspect, the roughened structure can make the interface between the lead frame and the plastic package bend and extend, so that the travel of water vapor entering the plastic package through this interface can be extended, so the sealing performance of the plastic package can be improved. Description of the Drawings

[0027] Figure 1 is a schematic cross-sectional view of a conventional optocoupler package structure;

[0028] Figure 2 is Figure 1 a schematic diagram of the marking of the optoelectronic coupling region in

[0029] Figure 3 a schematic cross-sectional view of the optocoupler package structure according to Embodiment 1 of the present application;

[0030] Figure 4 is Figure 3 a schematic diagram of the marking of the optoelectronic coupling region in

[0031] Figure 5 isFigure 3 An enlarged schematic view of the area where the first bent portion is located;

[0032] Figure 6 It is a schematic cross-sectional view of the optocoupler package structure of Embodiment 2 of the present application.

[0033] Description of the reference numerals:

[0034] Optocoupler package structure 100; first direction W1; second direction H1; plastic package 110; optoelectronic coupling component 120; first lead frame 130; first support portion 131; first bent portion 132; first pin portion 133; second lead frame 140; second support portion 141; second bent portion 142; second pin portion 143; optoelectronic coupling region S1;

[0035] Optocoupler package structure 200; first direction W2; second direction H2; plastic package 210; light-transmitting inner plastic encapsulant 211; light-blocking outer plastic encapsulant 212; optoelectronic coupling component 220; light-emitting element 221; photosensitive element 222; light-transmitting protection portion 223; light-condensing curved surface 224; first lead frame 230; first support portion 231; first bent portion 232; first pin portion 233; third bent portion 234; second lead frame 240; second support portion 241; second bent portion 242; second pin portion 243; fourth bent portion 244; roughened structure 20; concave portion 21; convex portion 22; optoelectronic coupling region S2. Detailed implementation manners

[0036] To enable those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners. Obviously, the described implementation manners are only a part of the implementation manners of the present application, rather than all the implementation manners. All other implementation manners obtained by those of ordinary skill in the art based on the implementation manners in the present application without making creative efforts shall fall within the scope of protection of the present application.

[0037] In addition, all directional indications (such as up, down, left, right, front, back, inside, outside...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the accompanying drawings). If this specific posture changes, the directional indications will also change accordingly.

[0038] Please refer to Figure 1 and Figure 2As shown, in the existing optocoupler package structure 100, the surfaces of the first lead frame 130 and the second lead frame 140 are relatively smooth. As a result, in the existing optocoupler package structure 100, the bonding strength between the surface of the first lead frame 130 and the plastic package 110 is insufficient, and the bonding strength between the surface of the second lead frame 140 and the plastic package 110 is also insufficient. Furthermore, moisture is likely to enter the plastic package 110 through the interface between the first lead frame 130 and the plastic package 110, causing the optocoupler package structure 100 to short-circuit or leak electricity.

[0039] Therefore, there is an urgent need for an optocoupler package structure to improve the sealing performance of the plastic package. To this end, the inventors of the present application propose the following embodiments.

[0040] Embodiment 1

[0041] Referring to Figure 3 and Figure 4 As shown, the optocoupler package structure 200 of the present application has a first direction W2 and a second direction H2 that are perpendicular to each other. The second direction H2 is the vertical spacing direction, and the optocoupler package structure 200 includes a plastic package 210, an optoelectronic coupling component 220, a first lead frame 230, and a second lead frame 240.

[0042] The plastic package 210 has an optoelectronic coupling region S2. The optoelectronic coupling component 220 is disposed in the optoelectronic coupling region S2. The first lead frame 230 includes a first support portion 231, a first bending portion 232, and a first pin portion 233 that are sequentially connected. The second lead frame 240 includes a second support portion 241, a second bending portion 242, and a second pin portion 243 that are sequentially connected.

[0043] Among them, the first support portion 231 and the second support portion 241 are disposed in the plastic package 210 and on opposite sides of the optoelectronic coupling region S2 along the second direction H2 for supporting the optoelectronic coupling component 220. The first bending portion 232 and the second bending portion 242 are disposed in the plastic package 210 and on the circumferential side of the optoelectronic coupling region S2 around the second direction H2. The first pin portion 233 and the second pin portion 243 are located outside the plastic package 210. A roughened structure 20 is provided on the surface of any one of the first bending portion 232 and the second bending portion 242.

[0044] In the above manner, the optocoupler packaging structure 200 of the present application can at least improve the sealing performance of the plastic package 210 from the following first aspect and second aspect. In the first aspect, the roughened structure 20 can increase the bonding strength between the corresponding lead frames 230 / 240 and the plastic package 210, thereby hindering water vapor from passing through the interface between the lead frames 230 / 240 and the plastic package 210. Therefore, the sealing performance of the plastic package 210 can be improved. In the second aspect, the roughened structure 20 can cause the interface between the lead frames 230 / 240 and the plastic package 210 to bend and extend, so as to extend the travel distance of water vapor entering the plastic package 210 through this interface. Therefore, the sealing performance of the plastic package 210 can be improved.

[0045] By way of example and not limitation, the materials for preparing the first lead frame 230 and the second lead frame 240 include one or more of copper and iron, but are not limited thereto. In other examples, the materials for preparing the first lead frame 230 and the second lead frame 240 can be other conductive materials, whether metallic or non-metallic, other than copper.

[0046] Optionally, as Figure 3 and Figure 4 shown, the first lead frame 230 includes a third bending portion 234, and the second lead frame 240 includes a fourth bending portion 244.

[0047] The first bending portion 232 bends relative to the first supporting portion 231 toward the side close to the second supporting portion 241. The third bending portion 234 penetrates out of the plastic package 210 from inside the plastic package 210 to connect the first bending portion 232 and the first pin portion 233 respectively. The second bending portion 242 bends relative to the second supporting portion 241 toward the side close to the first supporting portion 231. The fourth bending portion 244 penetrates out of the plastic package 210 from inside the plastic package 210 to connect the second bending portion 242 and the second pin portion 243 respectively.

[0048] In the above manner, the bending and extending structures formed by the first supporting portion 231, the first bending portion 232, the third bending portion 234, and the first pin portion 233 and the bending and extending structures formed by the second supporting portion 241, the second bending portion 242, the fourth bending portion 244, and the second pin portion 243 can further increase the travel distance of water vapor entering the plastic package 210 through the interface between the lead frames 230 / 240 and the plastic package 210, so as to achieve the purpose of improving the sealing performance of the plastic package 210.

[0049] Optionally (but not limited thereto), as Figure 3 and Figure 4As shown, no roughened structure 20 is provided on the surface of any one of the first support portion 231, the second support portion 241, the third bending portion 234, and the fourth bending portion 244. Thus, by providing the roughened structure 20 only in the first bending portion 232 and the second bending portion 242, the encapsulant 210 can maintain sufficient sealing performance while reducing costs.

[0050] Optionally (but not limited to), the surface of the corresponding lead frame 230 / 240 can be treated by physical roughening or chemical roughening methods to provide a roughened structure 20 on the surface of the corresponding lead frame 230 / 240. Physical roughening methods include but are not limited to sandblasting, and chemical roughening methods include but are not limited to etching.

[0051] Optionally, in combination with Figure 3 and Figure 4 referring to Figure 5 As shown, the roughened structure 20 includes a plurality of concave portions 21 and a plurality of convex portions 22, and the concave portions 21 and the convex portions 22 are arranged alternately. Among them, the sizes of the plurality of concave portions 21 can be similar or random, and the sizes of the plurality of convex portions 22 can be similar or random.

[0052] Optionally (but not limited to), in combination with Figure 3 and Figure 4 referring to Figure 5 As shown, the cross-section of the roughened structure 20 extending in the first direction W2 and the second direction H2 forms a Polish shape or a zigzag shape at the portion on the surface of the roughened structure 20.

[0053] Optionally, as Figure 3 and Figure 4 shown, the optoelectronic coupling component 220 includes a light-emitting element 221 and a photosensitive element 222. The light-emitting element 221 is disposed on the first support portion 231 and is electrically connected to the first support portion 231, and the photosensitive element 222 is disposed on the second support portion 241 and is electrically connected to the second support portion 241.

[0054] Among them, the light-emitting element 221 is used for emitting light and emitting the emitted light to the photosensitive element 222. The photosensitive element 222 is used for receiving the light emitted by the light-emitting element 221 and converting it into a corresponding electrical signal.

[0055] By the above method, the first lead frame 230 is used for receiving an electrical signal input from outside the optocoupler package structure 200 and delivering it to the light-emitting element 221. The light-emitting element 221 converts the electrical signal delivered by the first lead frame 230 into an optical signal and delivers it to the photosensitive element 222. The photosensitive element 222 is used for converting the optical signal delivered by the light-emitting element 221 into a corresponding electrical signal and delivering it to the second lead frame 240. The second lead frame 240 is used for receiving the electrical signal converted by the photosensitive element 222 and delivering it to the outside of the optocoupler package structure 200.

[0056] The photosensitive element 222 includes, but is not limited to, a phototransistor (PT for short), and the light-emitting element 221 includes, but is not limited to, an LED chip for emitting infrared light.

[0057] Optionally, as Figure 3 and Figure 4 shown, the optocoupler component 220 includes a light-transmitting protection part 223, and the light-transmitting protection part 223 wraps the light-emitting element 221. In this way, the direct contact between the light-emitting element 221 and the plastic package 210 can be avoided through the light-transmitting protection part 223, playing a role in protecting the light-emitting element 221. By way of example and not limitation, the preparation material of the light-transmitting protection part 223 includes silicone resin, but is not limited thereto.

[0058] By way of example and not limitation, a light-concentrating curved surface 224 can be formed on the surface of the light-transmitting protection part 223. The light-concentrating curved surface 224 covers the light-emitting element 221, and the light-concentrating curved surface 224 is a spherical crown surface. The light-concentrating curved surface 224 is used to converge the light emitted by the light-emitting element 221 and shoot the converged light towards the photosensitive element 222. In this way, the light emitted by the light-emitting element 221 can be more accurately and intensively aligned with the photosensitive element 222. It should be understood that in other examples, the light-concentrating curved surface 224 may not be a spherical crown surface either.

[0059] Optionally, as Figure 3 and Figure 4 shown, the plastic package 210 includes a light-transmitting inner plastic encapsulant 211 and a light-blocking outer plastic encapsulant 212. The optocoupling region S2 is located within the light-transmitting inner plastic encapsulant 211. The light-blocking outer plastic encapsulant 212 wraps the light-transmitting inner plastic encapsulant 211. Among them, the first support part 231, the second support part 241, the first bending part 232, and the second bending part 242 are located within the light-transmitting inner plastic encapsulant 211. In this way, the light-blocking outer plastic encapsulant 212 can isolate the interference of the light outside the optocoupler package structure 200 on the optocoupling in the optocoupling region S2.

[0060] Optionally, the preparation materials of both the light-transmitting inner plastic encapsulant 211 and the light-blocking outer plastic encapsulant 212 can include epoxy resin, but are not limited thereto. The light-blocking outer plastic encapsulant 212 can be mixed with a black substance to form an opaque state, but is not limited thereto.

[0061] Embodiment 2

[0062] Comparison Figure 3 and Figure 4 Referring to Figure 6 , the same parts in the optocoupler package structure 200 of Embodiment 2 and the optocoupler package structure 200 of Embodiment 1 will not be described in detail. The differences between the optocoupler package structure 200 of Embodiment 2 and the optocoupler package structure 200 of Embodiment 1 are as follows.

[0063] AsFigure 6 As shown, in addition to the roughened structure 20 being provided on the surfaces of the first bent portion 232 and the second bent portion 242, the roughened structure 20 is provided on the surface of either the portion of the third bent portion 234 embedded in the plastic package 210 or the portion of the fourth bent portion 244 embedded in the plastic package 210. In this way, the sealing performance of the plastic package 210 can be further enhanced.

[0064] The above is only the implementation mode of this application, and does not limit the patent scope of this application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.

Claims

1. An optocoupler package structure, characterized in that, The optocoupler package structure has a first direction and a second direction that are perpendicular to each other. The second direction is the vertical spacing direction, and the optocoupler package structure includes: A plastic package body, which has an optoelectronic coupling region therein; An optoelectronic coupling component, disposed in the optoelectronic coupling region; A first lead frame, including a first support portion, a first bending portion, and a first lead portion connected in sequence; A second lead frame, including a second support portion, a second bending portion, and a second lead portion connected in sequence; Wherein, the first support portion and the second support portion are disposed in the plastic package body and on opposite sides of the optoelectronic coupling region along the second direction for supporting the optoelectronic coupling component; the first bending portion and the second bending portion are disposed in the plastic package body and on the circumferential side of the optoelectronic coupling region around the second direction; the first lead portion and the second lead portion are located outside the plastic package body; and a roughened structure is provided on the surface of any one of the first bending portion and the second bending portion.

2. The optocoupler package structure according to claim 1, wherein The first bending portion is bent toward the side close to the second support portion relative to the first support portion; the first lead frame includes a third bending portion, and the third bending portion penetrates out of the plastic package body from inside the plastic package body to connect the first bending portion and the first lead portion respectively; The second bending portion is bent toward the side close to the first support portion relative to the second support portion; the second lead frame includes a fourth bending portion, and the fourth bending portion penetrates out of the plastic package body from inside the plastic package body to connect the second bending portion and the second lead portion respectively.

3. The optocoupler package structure according to claim 2, wherein The roughened structure is not provided on the surface of any one of the first support portion and the second support portion; Or, the roughened structure is not provided on the surface of any one of the first support portion, the second support portion, the third bending portion, and the fourth bending portion.

4. The optocoupler package structure according to claim 1, characterized in that The optoelectronic coupling component includes a light-emitting element and a photosensitive element; the light-emitting element is disposed on the first support portion and electrically connected to the first support portion, and the photosensitive element is disposed on the second support portion and electrically connected to the second support portion; Wherein, the light-emitting element is used for emitting light and shooting the emitted light toward the photosensitive element; the photosensitive element is used for receiving the light emitted by the light-emitting element and converting it into a corresponding electrical signal.

5. The optocoupler package structure according to claim 4, wherein, The optoelectronic coupling component includes a light-transmitting protection portion, and the light-transmitting protection portion wraps the light-emitting element.

6. The optocoupler package structure according to claim 5, wherein A light-concentrating curved surface is formed on the surface of the light-transmitting protection portion. The light-concentrating curved surface covers the light-emitting element, and the light-concentrating curved surface is a spherical crown surface; the light-concentrating curved surface is used for concentrating the light emitted by the light-emitting element and shooting the concentrated light toward the photosensitive element.

7. The optocoupler package structure according to claim 5, characterized in that, The preparation material of the light-transmitting protection portion includes silicone resin.

8. The optocoupler package structure according to claim 1, wherein, The plastic package body includes a light-transmitting inner plastic encapsulant and an opaque outer plastic encapsulant; the optoelectronic coupling region is located in the light-transmitting inner plastic encapsulant; the opaque outer plastic encapsulant wraps the light-transmitting inner plastic encapsulant; Among them, the first support portion, the second support portion, the first bending portion, and the second bending portion are located within the light-transmitting inner plastic encapsulant.

9. The optocoupler package structure according to claim 1, wherein, The preparation materials of the first lead frame and the second lead frame include copper.

10. The optocoupler package structure according to claim 2, wherein, The roughened structure is provided on the surface of any one of the portions of the third bending portion embedded in the plastic package and the portions of the fourth bending portion embedded in the plastic package.

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