Power module and power module assembly

Abstract

The utility model relates to a power module and a power module assembly, and relates to the technical field of semiconductors, in the power module, a connecting terminal is connected with a circuit board, and the connecting terminal comprises a welding part connected with a conducting layer on the circuit board and an extending part extending towards one side far away from the circuit board. The thickness h of the welding part is less than or equal to 2D, and D is the thickness of the conductive layer, so that the circuit board cannot be punctured by laser during welding, and the reliability of the power module is ensured. And the thickness h of the welding part is smaller than the thickness H of the extension part, that is, the thickness of the extension part is relatively large, so that the current-carrying capacity of the power module can be improved while the circuit board is prevented from being broken down.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a power module and a power module assembly. Background Art

[0002] In modern motor control systems, power modules are an essential component. With the development of technology and the growth of market demand, the design and functions of these power modules are continuously optimized to adapt to more demanding application environments and higher performance requirements.

[0003] When setting connection terminals for an existing power module, it is necessary to weld the connection terminals to the circuit board by welding. To ensure the current-carrying capacity of the power module, the thickness of the connection terminals needs to be designed relatively thick. However, if the thickness of the connection terminals is too thick, based on the welding penetration depth of the copper layer on the circuit board, the circuit board may be penetrated during welding, resulting in damage to the power module.

[0004] Based on this, how to enable the power module to ensure that the circuit board is not penetrated and at the same time achieve high current-carrying capacity has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0005] Based on this, it is necessary to provide a power module and a power module assembly to address the problem of the circuit board being penetrated during welding, resulting in damage to the power module.

[0006] To achieve the above object, on the one hand, the present utility model provides a power module, which includes:

[0007] A circuit board and connection terminals; the connection terminals are connected to the circuit board, and the circuit board includes a conductive layer;

[0008] The connection terminals include a welding portion and an extending portion; the welding portion is connected to the conductive layer on the circuit board, and the extending portion extends away from the circuit board;

[0009] In a first direction, the thickness of the welding portion is h, the thickness of the extending portion is H, and the thickness of the conductive layer on the circuit board is D, where h ≤ 2D and h < H; the first direction is perpendicular to the plane of the circuit board.

[0010] In one embodiment, in the first direction, the thickness range of the welding portion is 0.9 mm - 1.1 mm;

[0011] The thickness range of the extending portion is 1.1 mm - 1.3 mm;

[0012] The thickness range of the conductive layer is 0.45 mm - 0.6 mm.

[0013] In one embodiment, the extension portion includes a welding area;

[0014] In a direction perpendicular to the extending direction of the extension portion and parallel to the plane where the circuit board is located, the width of the extension portion is T1, and the width of the welding area is T2, where T2 < T1.

[0015] In one embodiment, the connection terminal includes:

[0016] A DC connection terminal, which includes a positive DC terminal and a negative DC terminal;

[0017] The positive DC terminal includes a positive welding portion and a positive extension portion; the negative DC terminal includes a negative welding portion and a negative extension portion; the plane where the positive extension portion is located is parallel to the plane where the negative extension portion is located, and there is a first interval between the positive extension portion and the negative extension portion;

[0018] In the first direction, the positive projection of the negative extension portion and the positive projection of the positive extension portion at least partially overlap.

[0019] In one embodiment, in a direction perpendicular to the extending direction of the extension portion and parallel to the plane where the circuit board is located, the positive extension portion and the negative extension portion have the same width.

[0020] In one embodiment, in a direction perpendicular to the extending direction of the extension portion and parallel to the plane where the circuit board is located, the positive welding portion and the negative welding portion are arranged at intervals;

[0021] The total width of the positive welding portions is A, the total width of the negative welding portions is a, and the width of the circuit board is B, where 2A < B; 2a < B.

[0022] In one embodiment, the power module further includes:

[0023] An insulating layer, which is located in the first interval; the distance of the first interval is L, where L ≥ 0.8 mm.

[0024] In one embodiment, the power module further includes:

[0025] A capacitor, which is connected to the DC connection terminal.

[0026] In one embodiment, the connection terminal further includes:

[0027] An AC connection terminal, which is oppositely arranged with the DC connection terminal on the circuit board.

[0028] On the other hand, the present utility model also provides a power module assembly, which includes:

[0029] a substrate, a housing, and at least one power module, where the power module is any one of the above-mentioned power modules;

[0030] The substrate is located on the side of the power module away from the connection terminal;

[0031] The housing wraps at least one of the power modules.

[0032] Compared with the prior art, the above technical solution has the following advantages:

[0033] In this power module, the connection terminal is connected to the circuit board. The connection terminal includes a welding portion connected to the conductive layer on the circuit board and an extension portion extending away from the circuit board. In the first direction, since the thickness h of the welding portion ≤ 2D, where D is the thickness of the conductive layer, it can ensure that the laser will not penetrate the circuit board during welding, thereby ensuring the reliability of the power module. Also, since the thickness h of the welding portion < the thickness H of the extension portion, that is, the thickness of the extension portion is relatively thick, it can improve the current-carrying capacity of the power module while ensuring that the circuit board will not be penetrated. Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0035] Figure 1 Structural schematic diagram of a power module provided by an embodiment of the present application;

[0036] Figure 2 Partial structural schematic diagram of a power module provided by an embodiment of the present application;

[0037] Figure 3 Structural schematic diagram of another power module provided by an embodiment of the present application;

[0038] Figure 4 Top view structural schematic diagram of a power module provided by an embodiment of the present application;

[0039] Figure 5 Partial top view structural schematic diagram of another power module provided by an embodiment of the present application;

[0040] Figure 6Another partial top view structural schematic diagram of the power module provided by the embodiment of the present application;

[0041] Figure 7 Another top view structural schematic diagram of the power module provided by the embodiment of the present application;

[0042] Figure 8 A structural schematic diagram of a power module assembly provided by the embodiment of the present application;

[0043] Figure 9 Another structural schematic diagram of the power module assembly provided by the embodiment of the present application.

[0044] Explanation of reference numerals: 01 - circuit board; 02 - connection terminal; 02a - welding part; 02b - extension part; 02x - DC connection terminal; 021 - positive DC terminal; 022 - negative DC terminal; 021a - positive welding part; 021b - positive extension part; 022a - negative welding part; 022b - negative extension part; 02y - AC connection terminal; 03 - conductive layer; 04 - welding area; 11 - substrate; 12 - housing; 13 - power module; 14 - insulating layer. Detailed implementation manners

[0045] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the specification of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0047] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "including" or "having", etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0048] In order to make the objectives, features and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the drawings and specific implementation manners.

[0049] Please refer to Figure 1 , Figure 1Schematic diagram of the structure of a power module provided by an embodiment of the present application; refer to Figure 2 , Figure 2 Partial schematic diagram of the structure of a power module provided by an embodiment of the present application; the power module includes:

[0050] A circuit board 01 and a connection terminal 02; the connection terminal 02 is connected to the circuit board 01, and the circuit board 01 includes a conductive layer 03.

[0051] The connection terminal 02 includes a welding portion 02a and an extension portion 02b; the welding portion 02a is connected to the conductive layer 03 on the circuit board 01, and the extension portion 02b extends away from the circuit board 01.

[0052] In the first direction M, the thickness of the welding portion 02a is h, the thickness of the extension portion 02b is H, and the thickness of the conductive layer 03 on the circuit board 01 is D, where h ≤ 2D and h < H; the first direction M is perpendicular to the plane where the circuit board 01 is located.

[0053] Specifically, in this embodiment, the circuit board 01 can be a copper-clad ceramic substrate, the conductive layer 03 is a copper layer on the copper-clad ceramic substrate, and the material of the connection terminal 02 can be copper material. It should be noted that the circuit structure of the power module, including electronic components such as power chips and resistors, is also provided on the copper-clad ceramic substrate, which will not be specifically described here and can be set according to specific needs.

[0054] The circuit board 01 is connected to the connection terminal 02. The connection terminal 02 can be a voltage connection terminal, including a DC voltage connection terminal, an AC voltage connection terminal, etc., and is not specifically limited. The connection terminal 02 includes a welding portion 02a and an extension portion 02b. As Figure 2 shown, the welding portion 02a is the part where the connection terminal 02 is welded to the copper-clad ceramic substrate, and the extension portion 02b extends away from the copper-clad ceramic substrate for connecting other components of the power module.

[0055] For the laser welding of two metal parts, the upper metal part will be melted instantly at high temperature and conduct to the lower metal part, causing the lower metal part to start melting from the upper surface in contact with the upper metal part, and then forming a weld after cooling. When welding the connection terminal 02 on the copper-clad ceramic substrate, the copper layer on the copper-clad ceramic substrate serves as the lower metal part, and the welding portion 02a of the connection terminal 02 serves as the upper metal part. Considering the characteristics of the laser welding process, the upper metal part needs to consider the welding penetration depth of the lower metal part to ensure that the lower metal part will not be penetrated during welding, thus affecting the ceramic insulation layer of the copper-clad ceramic substrate and further affecting the performance of the power module.

[0056] As Figure 2As shown, only some of the connection terminals 02 are taken as examples for illustration. Since when the connection terminal 02 is soldered to the copper-clad ceramic substrate, in the first direction M, the thickness of the copper layer on the copper-clad ceramic substrate, that is, the thickness D of the conductive layer 03, is preset. In order to avoid the problem of soldering breakdown during soldering, the thickness h of the soldering portion 02a of the connection terminal 02 needs to be set to be less than or equal to 2 times the thickness D of the conductive layer 03, so as to ensure the reliability of the power module. In addition, the extension portion 02b is connected to other components, and better current-carrying capacity needs to be ensured. Therefore, the thickness H of the extension portion 02b is set to be greater than the thickness of the soldering portion 02a, which can improve the current-carrying capacity of the connection terminal 02. In addition, it should be noted that the extension portion 02b is set to be relatively thick. In addition to improving the current-carrying capacity, when other components are soldered on its upper layer, as the lower-layer metal part, the relatively thick thickness of the extension portion 02b can also ensure that breakdown does not occur during soldering, ensuring that the performance of the power module is not affected.

[0057] Optionally, in another embodiment of the present application, in the first direction M, the thickness range of the soldering portion 02a is 0.9 mm - 1.1 mm.

[0058] The thickness range of the extension portion 02b is 1.1 mm - 1.3 mm.

[0059] The thickness range of the conductive layer 03 is 0.45 mm - 0.6 mm.

[0060] Specifically, the conductive layer 03 can be a copper layer, and the thickness range of the conductive layer 03 can be 0.45 mm - 0.6 mm, including the end values. For example, the thickness D of the conductive layer 03 can be 0.9 mm or 1.1 mm or 1.2 mm. The thickness range of the soldering portion 02a can be 0.9 mm - 1.1 mm, including the end values. For example, the thickness h of the soldering portion 02a can be 0.9 mm or 0.95 mm or 1.1 mm, etc. There is no specific limitation on the thickness of the conductive layer 03 and the soldering portion 02a, but in order to avoid the problem of soldering breakdown during soldering, it is necessary to ensure that the thickness h of the soldering portion 02a ≤ 2 times the thickness D of the conductive layer 03.

[0061] The thickness range of the extension portion 02b can be 1.1 mm - 1.3 mm, excluding the end values. For example, the thickness H of the extension portion 02b can be 1.2 mm or 1.25 mm or 1.28 mm, etc. There is no specific limitation, as long as it is ensured that the thickness h of the soldering portion 02a < the thickness H of the extension portion 02b. The relatively thick thickness of the extension portion 02b can improve the current-carrying capacity of the connection terminal 02.

[0062] Optionally, in another embodiment of the present application, refer to Figure 3 , Figure 3Another structural schematic diagram of the power module provided by the embodiment of the present application; refer to Figure 4 , Figure 4 Another top view structural schematic diagram of the power module provided by the embodiment of the present application; the connection terminal 02 includes:

[0063] A DC connection terminal 02x, and the DC connection terminal 02x includes a positive DC terminal 021 and a negative DC terminal 022.

[0064] The positive DC terminal 021 includes a positive welding portion 021a and a positive extension portion 021b; the negative DC terminal 022 includes a negative welding portion 022a and a negative extension portion 022b; the plane where the positive extension portion 021b is located is parallel to the plane where the negative extension portion 022b is located, and there is a first interval between the positive extension portion 021b and the negative extension portion 022b.

[0065] In the first direction M, the positive projection of the negative extension portion 022b and the positive projection of the positive extension portion 021b at least partially overlap.

[0066] Specifically, in this embodiment, the DC connection terminal can be a DC voltage connection terminal, which includes a negative extension portion 022b and a positive extension portion 021b. The negative extension portion 022b is located above the positive extension portion 021b, and the negative extension portion 022b and the positive extension portion 021b are arranged in parallel, which can reduce the stray inductance of the power module and improve the performance of the power module.

[0067] In addition, the positive projections of the negative extension portion 022b and the positive extension portion 021b in the first direction M at least partially overlap, which can include that the positive projections of the negative extension portion 022b and the positive extension portion 021b completely overlap. At this time, the stray inductance can be minimized. Or the positive projections of the negative extension portion 022b and the positive extension portion 021b only partially overlap. For example Figure 3 and Figure 4 as shown, it is set that the positive projection of the negative extension portion 022b in the first direction M is smaller than the positive projection of the positive extension portion 021b in the first direction M. Some process holes can also be opened in the upper negative extension portion 022b. Such a setting can ensure that when the insulating layer is formed between the negative extension portion 022b and the positive extension portion 021b, the voids and bubbles remaining in the process of forming the insulating layer are reduced, and the forming yield of the power module is improved. A first interval is provided between the positive extension portion 021b and the negative extension portion 022b, which can ensure the insulation between the positive extension portion 021b and the negative extension portion 022b.

[0068] Optionally, in another embodiment of the present application, the power module further includes:

[0069] An insulating layer, and the insulating layer is located in the first interval; the spacing of the first interval is L, and L≥0.8mm.

[0070] Specifically, the material of the insulating layer can be a plastic material. The insulating layer is located in the first gap between the positive electrode extension 021b and the negative electrode extension 022b and fills the first gap. The distance between the two ends of the first gap is L, where L≥0.8mm. It should be noted that the distance between the two ends of the first gap is the thickness of the insulating layer. Setting the distance between the two ends of the first gap ≥0.8mm can ensure that the insulating layer of the power module will not fail under long-term working conditions.

[0071] The positive DC terminal 021 and the negative DC terminal 022 in the DC connection terminal 02x are stacked, and at least partial overlap can reduce the stray inductance of the power module and improve the performance of the power module.

[0072] Optionally, in another embodiment of the present application, in a direction perpendicular to the extending direction of the extension 02b and parallel to the plane of the circuit board 01, the widths of the positive electrode extension 021b and the negative electrode extension 022b are the same.

[0073] Specifically, as Figure 4 shown, in a direction perpendicular to the extending direction of the extension 02b and parallel to the plane of the circuit board 01, the widths of both the positive electrode extension 021b and the negative electrode extension 022b can be set to Z. Setting the widths of the positive electrode extension 021b and the negative electrode extension 022b to be the same can effectively reduce the stray inductance of the positive electrode extension 021b and the negative electrode extension 022b, while reducing the utilization of the vertical space of the power module, making the package of the present application have a smaller space layout design than the traditional one.

[0074] Optionally, in another embodiment of the present application, referring to Figure 5 , Figure 5 which is a partial top view structural schematic diagram of another power module provided by an embodiment of the present application; referring to Figure 6 , Figure 6 which is a partial top view structural schematic diagram of yet another power module provided by an embodiment of the present application; in a direction perpendicular to the extending direction of the extension 02b and parallel to the plane of the circuit board 01, the positive electrode welding part 021a and the negative electrode welding part 022a are arranged at intervals.

[0075] The total width of the positive electrode welding parts 021a is A, the total width of the negative electrode welding parts 022a is a, and the width of the circuit board 01 is B, where 2A<B; 2a<B.

[0076] Specifically, the direction perpendicular to the extending direction of the extension 02b and parallel to the plane of the circuit board 01 is the second direction F, as Figure 5As shown, in this embodiment, the positive electrode welding part 021a includes two parts, A1 and A2. Of course, there is no specific limitation, and it can also include more parts, which are set according to specific needs. The total width of the positive electrode welding part 021a in the second direction F is A, where 2 times the total width A of the positive electrode welding part 021a < the width B of the circuit board 01. In this embodiment, the negative electrode welding part 022a is one part, but there is no specific limitation, and it can also be multiple parts, which are set according to specific needs. The total width of the negative electrode welding part 022a in the second direction F is a, where 2 times the total width a of the negative electrode welding part 022a < the width B of the circuit board 01. Such a setting can make the positive electrode welding part 021a and the negative electrode welding part 022a arranged on the same straight line, as Figure 4 shown in, the positive electrode welding part 021a and the negative electrode welding part 022a are arranged at intervals on the same straight line, which can reduce the design space in the length direction of the circuit board 01, making the package of the present application have a smaller space layout design than the traditional one.

[0077] Optionally, in another embodiment of the present application, as Figure 3 shown, the connection terminal 02 further includes:

[0078] an AC connection terminal 02y, and the AC connection terminal 02y and the DC connection terminal 02x are oppositely arranged on the circuit board 01.

[0079] Specifically, the AC connection terminal 02y and the DC connection terminal 02x are respectively connected to other components in the power module to ensure the normal operation of the power module. The AC connection terminal 02y and the DC connection terminal 02x are oppositely arranged on the circuit board 01. The welding part in the AC connection terminal 02y is the AC welding part 023a, and the extension part in the AC connection terminal 02y is the AC extension part 023b. The extension direction of the AC extension part 023b is opposite to the extension directions of the negative electrode extension part 022b and the positive electrode extension part 021b.

[0080] Optionally, in another embodiment of the present application, referring to Figure 7 , Figure 7 is a schematic top view structure diagram of another power module provided by the embodiment of the present application; the extension part 02b includes a welding area 04.

[0081] In the direction perpendicular to the extension direction of the extension part 02b and parallel to the plane where the circuit board 01 is located, the width of the extension part 02b is T1, and the width of the welding area 04 is T2, and T2 < T1.

[0082] Specifically, the extension portion 02b includes a welding area 04, which is the area where the extension portion 02b is welded with other components. The direction perpendicular to the extension direction of the extension portion 02b and parallel to the plane where the circuit board 01 is located is the second direction F. In the second direction F, the width T1 of the extension portion 02b is greater than the width T2 of the welding area 04. This arrangement allows part of the connecting terminal 02 to be wrapped with a plastic shell during subsequent packaging, thereby reducing the risk of warping of the connecting terminal after molding due to lack of wrapping.

[0083] It should be noted that the extended portions of the DC connection terminal 02x and the AC connection terminal 02y are both provided with a welding area 04 , and the width of the welding area 04 in the second direction F is not specifically limited, and only needs to be smaller than the extended portion of the connection terminal 02 where it is located.

[0084] Optionally, in another embodiment of the present application, the power module further includes:

[0085] A capacitor is connected to the DC connection terminal 02x.

[0086] Specifically, a capacitor (not shown in the figure) is provided in the power module, and the capacitor is welded to the welding area 04 of the extension portion of the DC connection terminal 02x.

[0087] In the above-mentioned power module, since the thickness h of the welding part of the connection terminal 02 is ≤ 2 times the thickness D of the conductive layer 03 on the circuit board 01, it can be ensured that the laser will not break through the circuit board 01 during welding, thereby ensuring the reliability of the power module. In addition, since the thickness h of the welding part 02a is less than the thickness H of the extension part 02b, that is, the thickness of the extension part 02b is thicker, it is possible to ensure that the circuit board 01 will not be broken through while improving the current carrying capacity of the power module.

[0088] Based on the above power module, the present application also provides a power module assembly, referring to Figure 8 , Figure 8 A schematic diagram of the structure of a power module assembly provided in an embodiment of the present application; the power module assembly comprises:

[0089] A substrate 11, a housing 12 and at least one power module 13, wherein the power module 13 is any of the power modules described above.

[0090] The base plate 11 is located on the side of the power module 13 facing away from the connecting terminals 02 .

[0091] The housing 12 encloses at least one power module 13 .

[0092] Specifically, the substrate 11 can be a heat-dissipating copper bottom plate, the housing 12 can be a plastic housing, and the power module 13 includes all the components in the above-mentioned power module 13. Among them, the AC connection terminal 02y and the DC connection terminal 02x are arranged opposite to each other. An insulating layer 14 is provided between the positive DC terminal 021 and the negative DC terminal 022, and the negative extension 022b and the positive extension 021b are stacked, which can reduce the stray inductance of the power module and improve the performance of the power module.

[0093] The housing 12 covers at least one power module 13. Refer to Figure 9 , Figure 9 FIG. 7 is a schematic structural diagram of another power module assembly provided by an embodiment of the present application; the housing 12 can cover three power modules 13. At this time, the negative extension 022b and the positive extension 021b are stacked. Moreover, the positive extension 021b is welded to the positive electrode of the capacitor, and the negative extension 022b is welded to the negative electrode of the capacitor. The positive welding part 021a and the negative welding part 022a are spaced apart on the same straight line and are welded to the conductive layer 03 on the circuit board 01. The AC welding part 023a is welded to the conductive layer 03 on the circuit board 01, and the AC extension 023b is welded to the three-phase copper bus. The thickness settings of the negative extension 022b, the positive extension 021b, the positive welding part 021a, and the negative welding part 022a are the same as the thickness settings in the above-mentioned power module, and the thicknesses of the AC welding part 023a and the AC extension 023b are the same as the thickness settings in the above-mentioned power module, which will not be elaborated here. In addition, the housing 12 can cover a part of the structure of the extension 02b of the connection terminal 02, which can reduce the risk of warping of the extension 02b of the connection terminal 02 without wrapping after the power module assembly is formed.

[0094] The AC extension 023b extends in a direction opposite to the positive extension 021b and the negative extension 022b. This power module assembly has a smaller space layout design than the traditional HPD package and has the structural characteristics of a laminated structure with low stray inductance. This power module assembly is suitable for the structural design of a high-integration laser welding process.

[0095] It should be noted that taking the circuit board 01 as a copper-clad ceramic substrate, the substrate 11 as a heat-dissipating copper bottom plate, and the housing 12 as a plastic housing as an example, when preparing this power module assembly, first fix the circuit board without the welded connection terminal 02 on the heat-dissipating copper bottom plate through the solder paste reflow soldering process or the sintering process, then assemble the plastic housing and the heat-dissipating copper bottom plate, and then connect the connection terminal 02 to the copper layer on the copper-clad ceramic substrate through the laser welding process. This is only for illustrative purposes and is not specifically limited.

[0096] In the description of this specification, the descriptions referring to terms such as "some embodiments", "another embodiment", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0097] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0098] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A power module, characterized in that, The power module comprises: A circuit board and a connecting terminal; the connecting terminal is connected to the circuit board, and the circuit board includes a conductive layer; The connecting terminal includes a welding portion and an extending portion; the welding portion is connected to the conductive layer on the circuit board, and the extending portion extends to a side away from the circuit board; In the first direction, the thickness of the welding portion is h, the thickness of the extension portion is H, and the thickness of the conductive layer on the circuit board is D, wherein h≤2D and h<H; the first direction is perpendicular to the plane where the circuit board is located.

2. The power module according to claim 1, wherein In the first direction, the thickness of the welding portion ranges from 0.9 mm to 1.1 mm; The thickness of the extension portion ranges from 1.1 mm to 1.3 mm; The thickness of the conductive layer is in the range of 0.45 mm to 0.6 mm.

3. The power module according to claim 1, characterized in that The extension includes a welding area; In a direction perpendicular to the extending direction of the extending portion and parallel to the plane where the circuit board is located, the width of the extending portion is T1, the width of the welding area is T2, and T2<T1.

4. The power module according to claim 1, wherein The connecting terminal comprises: A DC connection terminal, wherein the DC connection terminal comprises a positive DC terminal and a negative DC terminal; The positive DC terminal includes a positive welding portion and a positive extension portion; the negative DC terminal includes a negative welding portion and a negative extension portion; the plane where the positive extension portion is located is parallel to the plane where the negative extension portion is located, and there is a first interval between the positive extension portion and the negative extension portion; In the first direction, an orthographic projection of the negative extension portion at least partially overlaps with an orthographic projection of the positive extension portion.

5. The power module according to claim 4, characterized in that, In a direction perpendicular to the extension direction of the extension portion and parallel to the plane where the circuit board is located, the width of the positive extension portion is the same as that of the negative extension portion.

6. The power module according to claim 4, wherein The positive electrode welding portion and the negative electrode welding portion are arranged at intervals in a direction perpendicular to the extending direction of the extending portion and parallel to the plane where the circuit board is located; The total width of the positive electrode welding part is A, the total width of the negative electrode welding part is a, the width of the circuit board is B, 2A<B; 2a<B.

7. The power module according to claim 4, characterized in that, The power module further comprises: An insulating layer is located in the first interval; a spacing of the first interval is L, L≥0.8mm.

8. The power module according to claim 4, characterized in that, The power module further comprises: A capacitor is connected to the DC connection terminal.

9. The power module according to claim 4, wherein, The connecting terminal further comprises: An AC connection terminal is disposed opposite to the DC connection terminal on the circuit board.

10. A power module assembly, characterized in that, The power module assembly comprises: A substrate, a housing, and at least one power module, wherein the power module is the power module according to any one of claims 1 to 9; The substrate is located on a side of the power module away from the connection terminal; The housing covers at least one of the power modules.

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