Centralized heat dissipation circuit board

Abstract

The utility model discloses a centralized heat dissipation circuit board, and particularly relates to the technical field of circuit boards, the centralized heat dissipation circuit board comprises a circuit board main body, the circuit board main body is provided with a heat dissipation assembly, the heat dissipation assembly comprises a support frame body arranged at the bottom of the circuit board main body, and the outer side of the circuit board main body is provided with external fins. According to the utility model, through the arrangement of the heat dissipation assembly, the reinforced conduction aluminum columns can be in contact with the circuit board main body, and heat generated during the operation of the circuit board main body is conducted through the reinforced conduction aluminum columns and the heat dissipation arc fins, so that the heat can be quickly dispersed; and airflow can conveniently enter the supporting frame body through the reinforced flow guide frame body and the reinforced airflow carding fin plates, and the reinforced flow guide frame body and the reinforced airflow carding fin plates can transfer heat transferred to the supporting frame body by the circuit board main body, so that the heat dissipation efficiency of the device in use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically, to a circuit board with centralized heat dissipation. Background Art

[0002] A circuit board, also known as a printed circuit board, is a carrier for arranging and connecting electronic components. It is made of conductive materials and covered with a protective layer on the surface for fixing and connecting electronic components. The circuit board is not only the skeleton of an electronic device but also bears multiple functions such as signal transmission and power consumption control.

[0003] Among them, through retrieval, it is found that the patent with the patent application number CN202322229506.7 discloses a circuit board with centralized heat dissipation, which includes a circuit board main body and a heat collecting plate. There is a connecting rod above the circuit board main body, a heat conducting sheet on the side of the connecting rod, a heat dissipation aluminum plate on the side of the heat conducting sheet, aluminum plate legs below the heat dissipation aluminum plate, leg clamping blocks on the aluminum plate legs, a leg clamping seat above the circuit board main body, a clamping seat groove on the leg clamping seat, a heat collecting plate connected above the connecting rod, a servo motor above the heat collecting plate, and a heat dissipation fan blade at the output end of the servo motor;

[0004] When this structure is in use, by setting the cooperation among components such as the circuit board main body, heat dissipation aluminum strips, ventilation square holes, servo motor, heat dissipation fan blades, heat conducting sheets, and heat dissipation aluminum plates, the device can conduct centralized heat dissipation on the circuit board main body. However, when this structure is in use, it is not easy for air to circulate during heat dissipation, and it is not easy for heat conduction either, resulting in low heat dissipation efficiency. Summary of the Utility Model

[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a circuit board with centralized heat dissipation, aiming to solve the problems raised in the above background art.

[0006] The utility model is implemented as follows. The utility model provides the following technical solution: A circuit board with centralized heat dissipation, including a circuit board main body, and a heat dissipation component is arranged on the circuit board main body;

[0007] The heat dissipation component includes a support frame body arranged at the bottom of the circuit board main body, external fins are arranged on the outer side of the circuit board main body, two strengthened flow guiding frame bodies are arranged on the outer side of the support frame body, and a number of strengthened air flow combing fins are arranged in each of the strengthened flow guiding frame bodies;

[0008] The strengthened flow guiding frame body is communicated with the support frame body. A number of mounting blocks are arranged on the outer side of the circuit board main body, and each mounting block is fixedly connected to the circuit board main body. The mounting block and the support frame body are detachably connected by bolts;

[0009] It can be seen that in the above technical solution, through the setting of the enhanced flow guiding frame, it is convenient for the air flow to enter the support frame through the enhanced flow guiding frame and the enhanced air flow combing fins, and the enhanced flow guiding frame and the enhanced air flow combing fins can transfer the heat transferred from the main circuit board to the support frame, improving the heat dissipation efficiency of the device during use;

[0010] Optionally, in a possible implementation manner, a tray is arranged at the bottom of the inner cavity of the support frame, an enhanced conduction aluminum column is arranged on the tray, the top of the enhanced conduction aluminum column extends to the bottom of the main circuit board, a number of heat dissipation arc fins are distributed on the outer side of the enhanced conduction aluminum column, and a card slot is opened on each of the heat dissipation arc fins. A number of support bars are arranged on the outer side of the tray, and each of the support bars is clamped with the card slot. A dislocation opening is penetrated through the support frame, and a heat dissipation aluminum strip is arranged in the dislocation opening;

[0011] It can be seen that in the above technical solution, the enhanced conduction aluminum column can be in contact with the main circuit board, and the heat generated during the operation of the main circuit board is thermally conducted through the enhanced conduction aluminum column and the heat dissipation arc fins, so that the heat can be quickly dispersed. Through the external fins on the main circuit board, it is easy for the main circuit board to release the heat, and through the setting of the heat dissipation aluminum strip, it is convenient for the heat on the support frame to be released through the heat dissipation aluminum strip, thereby improving the heat dissipation efficiency and effect of the device during use.

[0012] The technical effects and advantages of the present utility model:

[0013] By setting the heat dissipation component, compared with the prior art, the overall design is simple and the structure is reasonable. Through the corresponding cooperation of each structure, the enhanced conduction aluminum column can be in contact with the main circuit board, and the heat generated during the operation of the main circuit board is thermally conducted through the enhanced conduction aluminum column and the heat dissipation arc fins, so that the heat can be quickly dispersed;

[0014] Through the setting of the enhanced flow guiding frame, it is convenient for the air flow to enter the support frame through the enhanced flow guiding frame and the enhanced air flow combing fins, and the enhanced flow guiding frame and the enhanced air flow combing fins can transfer the heat transferred from the main circuit board to the support frame, improving the heat dissipation efficiency of the device during use;

[0015] Through the external fins on the main circuit board, it is easy for the main circuit board to release the heat, and through the setting of the heat dissipation aluminum strip, it is convenient for the heat on the support frame to be released through the heat dissipation aluminum strip, thereby improving the heat dissipation efficiency and effect of the device during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not limitations on the actual dimensions of the products involved in the embodiments of the present disclosure, the actual processes of the methods, the actual timings of the signals, etc.

[0017] Figure 1 This is the front view of the overall structure of the present utility model.

[0018] Figure 2 This is the top view of the overall structure of the present utility model.

[0019] Figure 3 This is the three-dimensional view of the support frame body, the circuit board main body and the enhanced flow guiding frame body of the present utility model.

[0020] Figure 4 This is the three-dimensional view of the heat dissipation arc fins, the enhanced conduction aluminum columns and the heat dissipation aluminum strips of the present utility model.

[0021] Figure 5 This is the Figure 3 exploded view of the present utility model.

[0022] The reference numerals are: 1, support frame body; 2, circuit board main body; 3, mounting block; 4, external fins; 5, enhanced flow guiding frame body; 6, enhanced air flow combing fin plate; 7, tray; 8, enhanced conduction aluminum column; 9, heat dissipation arc fin; 10, card slot; 11, misalignment port; 12, heat dissipation aluminum strip; 13, support bar. Detailed implementation manners

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0024] As shown in the Figures 1-5A circuit board with centralized heat dissipation as shown. Through the heat dissipation components provided on the circuit board main body 2, the enhanced conduction aluminum columns 8 can be in contact with the circuit board main body 2. When the circuit board main body 2 operates, the heat generated is thermally conducted through the enhanced conduction aluminum columns 8 and the heat dissipation arc fins 9, enabling the heat to be quickly dispersed. At the same time, through the setting of the enhanced flow guiding frame 5, it is convenient for air to enter the support frame 1 through the enhanced flow guiding frame 5 and the enhanced air flow combing fins 6, and the enhanced flow guiding frame 5 and the enhanced air flow combing fins 6 can transfer the heat transferred from the circuit board main body 2 to the support frame 1, improving the heat dissipation efficiency of the device during use. The specific structure of the components is as follows;

[0025] The heat dissipation components include a support frame 1 provided at the bottom of the circuit board main body 2. External fins 4 are provided on the outer side of the circuit board main body 2. Two enhanced flow guiding frames 5 are provided on the outer side of the support frame 1, and several enhanced air flow combing fins 6 are provided in each enhanced flow guiding frame 5;

[0026] The enhanced flow guiding frame 5 is communicated with the support frame 1. Several mounting blocks 3 are provided on the outer side of the circuit board main body 2, and each mounting block 3 is fixedly connected to the circuit board main body 2. The mounting block 3 and the support frame 1 are detachably connected by bolts;

[0027] A tray 7 is provided at the bottom of the inner cavity of the support frame 1. Enhanced conduction aluminum columns 8 are provided on the tray 7. The top of the enhanced conduction aluminum columns 8 extends to the bottom of the circuit board main body 2. Several heat dissipation arc fins 9 are distributed on the outer side of the enhanced conduction aluminum columns 8, and a card slot 10 is provided on each heat dissipation arc fin 9. Several support bars 13 are provided on the outer side of the tray 7, and each support bar 13 is engaged with the card slot 10. A misaligned opening 11 is provided through the support frame 1, and a heat dissipation aluminum strip 12 is provided in the misaligned opening 11.

[0028] During use according to the above structure, the staff installs the device at a designated position. During installation, the circuit board main body 2 can be fixed on the support frame 1 through the mounting blocks 3, enabling the enhanced conduction aluminum columns 8 to be in contact with the circuit board main body 2. When the circuit board main body 2 operates, the heat generated is thermally conducted through the enhanced conduction aluminum columns 8 and the heat dissipation arc fins 9, enabling the heat to be quickly dispersed;

[0029] At the same time, through the setting of the enhanced flow guiding frame 5, it is convenient for air to enter the support frame 1 through the enhanced flow guiding frame 5 and the enhanced air flow combing fins 6, and the enhanced flow guiding frame 5 and the enhanced air flow combing fins 6 can transfer the heat transferred from the circuit board main body 2 to the support frame 1, improving the heat dissipation efficiency of the device during use;

[0030] When the device is in use, heat is easily dissipated from the circuit board main body 2 through the external fins 4 on the circuit board main body 2. With the arrangement of the heat dissipation aluminum strip 12, heat on the support frame 1 is conveniently dissipated through the heat dissipation aluminum strip 12, thereby improving the heat dissipation efficiency and effect of the device during use.

[0031] Different from the prior art, the present application discloses a circuit board with centralized heat dissipation. The enhanced conduction aluminum column 8 can be in contact with the circuit board main body 2. Heat generated during the operation of the circuit board main body 2 is thermally conducted through the enhanced conduction aluminum column 8 and the heat dissipation arc fins 9, enabling the heat to be quickly dispersed. At the same time, with the arrangement of the enhanced flow guiding frame 5, air is conveniently guided through the enhanced flow guiding frame 5 and the enhanced air flow combing fins 6 into the support frame 1, and the enhanced flow guiding frame 5 and the enhanced air flow combing fins 6 can transfer the heat transferred from the circuit board main body 2 to the support frame 1, improving the heat dissipation efficiency of the device during use.

[0032] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A circuit board with centralized heat dissipation, comprising a circuit board body (2), characterized in that: A heat dissipation component is provided on the circuit board body (2); The heat dissipation component includes a support frame body (1) arranged at the bottom of the circuit board body (2), an external fin (4) is arranged on the outer side of the circuit board body (2), two strengthened flow guiding frame bodies (5) are arranged on the outer side of the support frame body (1), and a plurality of strengthened air flow combing fin plates (6) are arranged in each of the strengthened flow guiding frame bodies (5); The strengthened flow guiding frame body (5) is communicated with the support frame body (1).

2. The circuit board with centralized heat dissipation according to claim 1, wherein: A plurality of mounting blocks (3) are arranged on the outer side of the circuit board body (2), and each of the mounting blocks (3) is fixedly connected to the circuit board body (2), and the mounting block (3) and the support frame body (1) are detachably connected by bolts.

3. The circuit board with centralized heat dissipation according to claim 1, characterized in that: A tray (7) is arranged at the bottom of the inner cavity of the support frame body (1), a strengthened conduction aluminum column (8) is arranged on the tray (7), and the top of the strengthened conduction aluminum column (8) extends to the bottom of the circuit board body (2).

4. The circuit board with centralized heat dissipation according to claim 3, characterized in that: A plurality of heat dissipation arc fins (9) are distributed on the outer side of the strengthened conduction aluminum column (8), and a card slot (10) is formed in each of the heat dissipation arc fins (9).

5. The circuit board with centralized heat dissipation according to claim 4, characterized in that: A plurality of support bars (13) are arranged on the outer side of the tray (7), and each of the support bars (13) is clamped with the card slot (10).

6. The circuit board with centralized heat dissipation according to claim 1, characterized in that: A dislocation opening (11) is formed through the support frame body (1), and a heat dissipation aluminum strip (12) is arranged in the dislocation opening (11).

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