Anti-oxidation circuit board

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses an anti-oxidation circuit board which comprises a board body, the board body comprises a first board layer and a second board layer, the two sides of the first board layer and the second board layer are connected with installation assemblies, the first board layer and the second board layer are connected with anti-oxidation assemblies, the anti-oxidation assemblies comprise heat conduction pipes, and the heat conduction pipes are connected with the installation assemblies. The heat conduction pipe is connected between the first plate layer and the second plate layer, connecting shells are fixed to the two ends of the heat conduction pipe, the tops of the connecting shells stretch out of the first plate layer and are fixedly provided with heat dissipation shells, the middle of each heat dissipation shell is connected with a dustproof heat dissipation net, and the heat conduction pipe, the connecting shells and the heat dissipation shells are communicated and internally provided with cooling liquid. The mounting assembly comprises two bottom plates, fixing plates are fixed to the two bottom plates, connecting sleeve shells are slidably connected to the outer sides of the fixing plates, and the two connecting sleeve shells are fixed to the two sides of the first plate layer and the two sides of the second plate layer; according to the utility model, the oxidation resistance and the space adaptability of the circuit board are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an antioxidant circuit board. Background Art

[0002] An antioxidant circuit board is a circuit board with antioxidant properties to extend the service life of the circuit board. Its components include a circuit board body, electronic components and connecting parts. The antioxidant circuit board has a wide range of applications and can be used in various electronic devices, such as mobile phones, computers, televisions, etc.

[0003] When the circuit board works for a long time, it is easy to generate more heat, and the high temperature will accelerate the chemical reaction of the metal components on the circuit board, resulting in the oxidation of the metal components on the circuit board, which is likely to reduce the conductivity and stability of the circuit, thereby reducing the service life of the circuit board.

[0004] Therefore, those skilled in the art have provided an antioxidant circuit board to solve the problems raised in the above background art. Content of the Utility Model

[0005] The purpose of the utility model is to provide an antioxidant circuit board to solve the following technical problems:

[0006] How to improve the antioxidant ability of the circuit board, avoid the circuit board working under high temperature conditions for a long time, and accelerate the oxidation reaction of the metal components on the circuit board.

[0007] The purpose of the utility model can be realized by the following technical solutions:

[0008] The antioxidant circuit board includes a board body, the board body includes a first board layer and a second board layer, installation components are connected to both sides of the first board layer and the second board layer, and an antioxidant component is connected between the first board layer and the second board layer;

[0009] The antioxidant component includes a heat conduction pipe, the heat conduction pipe is connected between the first board layer and the second board layer, connection shells are fixed at both ends of the heat conduction pipe, the top of the connection shell extends out of the first board layer and is fixed with a heat dissipation shell, a dust-proof and heat-dissipating net is connected in the middle of the heat dissipation shell, and the heat conduction pipe, the connection shell and the heat dissipation shell are communicated and internally provided with a coolant;

[0010] The installation component includes two bottom plates, fixing plates are fixed on both of the two bottom plates, connection sleeve shells are slidably connected to the outer sides of the fixing plates, and the two connection sleeve shells are fixed on both sides of the first board layer and the second board layer.

[0011] Furthermore, connection grooves are formed on the opposite sides of the first board layer and the second board layer, and the connection grooves are connected with the heat conduction pipe in a matching manner.

[0012] Furthermore, connection ports are provided on both sides above the first plate layer, the connection shell is arranged in an inverted T-shape, one side of the bottom of the connection shell is connected to the heat pipe, and the top of the connection shell is cooperatively connected with the connection port.

[0013] Furthermore, a supporting shell is fixedly connected between the top of the connecting shell and the heat dissipation shell, the supporting shell is arranged in a long strip shape, and the supporting shell is communicated with the connecting shell and the heat dissipation shell.

[0014] Furthermore, a cavity is provided in the fixing plate, a spring block is slidably connected in the cavity, a plurality of openings are provided on the outer side of the connecting sleeve, the plurality of openings are provided along the vertical direction, and the openings are cooperatively connected with the spring block.

[0015] Furthermore, mounting holes are provided on both sides of the two base plates, and the mounting holes are threaded holes. Connecting plates are fixedly connected to both sides of the lower side of the second plate layer, and multiple tension springs are fixedly connected between the connecting plates on both sides and one side of the two base plates.

[0016] Furthermore, the dustproof and heat dissipation net is formed by a staggered combination of a plurality of heat dissipation metal wires, and the dustproof and heat dissipation net is spaced apart from the first plate layer.

[0017] Beneficial effects of the utility model:

[0018] (1) The utility model is provided with an anti-oxidation component. The heat dissipation shell, the connecting shell and the heat conducting pipe are interconnected and have built-in coolant. The heat conducting pipe is arranged in the middle of the board body to better absorb the heat inside the board body. Then the heat conducting pipe passes through the connecting shell connected at both ends to conduct the heat to the heat dissipation shell on the top of the board body for heat dissipation. The dust-proof heat dissipation net connected in the middle of the heat dissipation shell can further improve the heat conduction and heat dissipation efficiency of the heat dissipation shell, and avoid high temperature accelerating the oxidation of the circuit board. At the same time, the dust-proof heat dissipation net and the heat dissipation shell can also prevent dust from falling directly onto the outer surface of the board body, and avoid accelerating the oxidation of the circuit board.

[0019] (2) The utility model is provided with an installation component. During installation, the connecting sleeve can drive the board body to slide on the fixed plate to adjust the height, thereby increasing the distance between the board body and the device, increasing the heat dissipation space of the board body, and being able to adjust the distance between the bottom of the circuit board and the device according to the size of the internal space of the device, thereby improving the spatial adaptability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 This is a schematic diagram of the disassembly of the connection structure of the utility model;

[0023] Figure 3 is a schematic internal structure diagram of the present utility model;

[0024] Figure 4 is a three-dimensional structure diagram of the antioxidant component of the present utility model.

[0025] Reference numerals:

[0026] 1, plate body; 11, first plate layer; 12, second plate layer; 2, mounting component; 3, antioxidant component; 21, bottom plate; 22, connecting sleeve; 23, spring catch; 24, opening; 25, mounting hole; 26, fixing plate; 27, tension spring; 28, connecting plate; 31, heat dissipation shell; 32, dust-proof and heat-dissipating net; 33, connecting shell; 34, heat-conducting tube; 35, support shell; 111, connecting groove; 121, connecting port; 261, cavity. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Please refer to the attached Figures 1-4 , the antioxidant circuit board in the embodiment of the present utility model includes a plate body 1, the plate body 1 includes a first plate layer 11 and a second plate layer 12, mounting components 2 are connected to both sides of the first plate layer 11 and the second plate layer 12, and an antioxidant component 3 is connected to the first plate layer 11 and the second plate layer 12;

[0029] The antioxidant component 3 includes a heat-conducting tube 34, the heat-conducting tube 34 is connected between the first plate layer 11 and the second plate layer 12, connection shells 33 are fixed at both ends of the heat-conducting tube 34, the top of the connection shell 33 extends out of the first plate layer 11 and a heat dissipation shell 31 is fixed, a dust-proof and heat-dissipating net 32 is connected to the middle of the heat dissipation shell 31, the heat-conducting tube 34, the connection shell 33 and the heat dissipation shell 31 are communicated and internally provided with a coolant;

[0030] The mounting component 2 includes two bottom plates 21, fixing plates 26 are fixed on both of the two bottom plates 21, connecting sleeves 22 are slidably connected to the outer sides of the fixing plates 26, and the two connecting sleeves 22 are fixed on both sides of the first plate layer 11 and the second plate layer 12.

[0031] Connection grooves 111 are respectively formed on the opposite sides of the first plate layer 11 and the second plate layer 12, and the connection grooves 111 are in mating connection with the heat-conducting tube 34.

[0032] Connection ports 121 are provided on both sides of the upper side of the first plate layer 11 . The connection shell 33 is arranged in an inverted T-shape. One side of the bottom of the connection shell 33 is connected to the heat pipe 34 , and the upper side of the connection shell 33 is cooperatively connected to the connection port 121 .

[0033] A supporting shell 35 is fixedly connected between the upper portion of the connecting shell 33 and the heat dissipation shell 31 . The supporting shell 35 is arranged in a long strip shape and is communicated with the connecting shell 33 and the heat dissipation shell 31 .

[0034] A cavity 261 is provided in the fixed plate 26, and a spring block 23 is slidably connected in the cavity 261. One side of the spring block 23 is tilted, so that when the internal space of the device is large and the distance between the plate body 1 and the device can be adjusted, the plate body 1 can be directly lifted upward, and then the opening 24 of the connecting shell 22 can press the inclined surface of the spring block 23, so that the spring block 23 can be retracted into the fixed plate 26 after being subjected to force, and then when it reaches the next corresponding opening 24, the spring block 23 will pop out under the action of the spring and connect with the corresponding opening 24. A plurality of openings 24 are provided on the outer side of the connecting shell 22, and the plurality of openings 24 are opened in the vertical direction, so that the distance between the plate body 1 and the device can be effectively adjusted, and the opening 24 and the spring block 23 are connected with each other in a cooperative manner.

[0035] Mounting holes 25 are provided on both sides of the two base plates 21, and the mounting holes 25 are threaded holes. Connecting plates 28 are fixedly connected to the two sides below the second plate layer 12, and multiple tensioning springs 27 are fixedly connected between the connecting plates 28 on both sides and one side of the two base plates 21. The tensioning springs 27 can pull to maintain the downward force. At this time, the horizontal surface of the spring block 23 and the opening 24 are pressed against each other, which can enhance the tightness and stability of the connection.

[0036] The dustproof heat dissipation net 32 is composed of a plurality of heat dissipation metal wires staggered together, which is convenient for helping the heat dissipation shell 31 to dissipate heat, improves the heat dissipation efficiency of the heat dissipation shell 31, and prevents dust in the device from falling directly onto the board body 1. Dust usually contains water-soluble salts such as chloride ions, sulfate ions, and nitrate ions. These salts will promote the formation of water film on the metal surface, thereby accelerating the occurrence of metal corrosion, causing the insulation impedance of the circuit board to decrease, avoiding affecting the heat dissipation of the board body 1, and also avoiding accelerating the oxygen reaction of the board body 1. The dustproof heat dissipation net 32 and the heat dissipation shell 31 are spaced apart from the first board layer 11, thereby avoiding affecting the normal operation of components on the circuit board due to being too close, and at the same time facilitating the absorption of heat from electronic components on the board body 1, thereby improving the reliability and stability of heat dissipation.

[0037] The above has described in detail an embodiment of the present utility model, but the above content is only a preferred embodiment of the present utility model and cannot be considered as defining the scope of implementation of the present utility model. All equivalent changes and improvements made according to the scope of application of the present utility model should still fall within the scope covered by the patent of the present utility model.

Claims

1. Antioxidant circuit board, comprising a board body (1), characterized in that, The plate body (1) comprises a first plate layer (11) and a second plate layer (12), the first plate layer (11) and the second plate layer (12) are connected to mounting components (2) on both sides, and the first plate layer (11) and the second plate layer (12) are connected to anti-oxidation components (3); The anti-oxidation component (3) comprises a heat conducting pipe (34), the heat conducting pipe (34) is connected between the first plate layer (11) and the second plate layer (12), connecting shells (33) are fixed at both ends of the heat conducting pipe (34), the top of the connecting shell (33) extends out of the first plate layer (11) and is fixed with a heat dissipation shell (31), the middle of the heat dissipation shell (31) is connected with a dustproof heat dissipation net (32), and the heat conducting pipe (34), the connecting shell (33) and the heat dissipation shell (31) are connected and have a built-in coolant; The mounting assembly (2) comprises two base plates (21), a fixing plate (26) being fixed on each of the two base plates (21), a connecting sleeve (22) being slidably connected to the outer side of each of the fixing plates (26), and the two connecting sleeves (22) being fixed on both sides of the first plate layer (11) and the second plate layer (12).

2. The antioxidant circuit board according to claim 1, wherein: A connection groove (111) is provided on the opposite side of the first plate layer (11) and the second plate layer (12), and the connection groove (111) and the heat conduction pipe (34) are mutually connected.

3. The antioxidant circuit board according to claim 1, wherein: Both sides of the upper side of the first plate layer (11) are provided with connection ports (121); the connection shell (33) is arranged in an inverted T-shape; one side of the bottom of the connection shell (33) is connected to the heat conducting pipe (34); and the upper side of the connection shell (33) is cooperatively connected to the connection port (121).

4. The antioxidant circuit board according to claim 1, wherein: A support shell (35) is fixedly connected between the top of the connection shell (33) and the heat dissipation shell (31); the support shell (35) is arranged in a long strip shape, and the support shell (35) is in communication with the connection shell (33) and the heat dissipation shell (31).

5. The antioxidant circuit board according to claim 1, wherein: A cavity (261) is provided in the fixing plate (26), a spring block (23) is slidably connected in the cavity (261), a plurality of openings (24) are provided on the outer side of the connecting sleeve (22), the plurality of openings (24) are provided in a vertical direction, and the openings (24) and the spring block (23) are connected in a cooperative manner with each other.

6. The antioxidant circuit board according to claim 1, wherein: Both sides of the two bottom plates (21) are provided with mounting holes (25), and the mounting holes (25) are threaded holes. Connecting plates (28) are fixedly connected to both sides below the second plate layer (12), and a plurality of tension springs (27) are fixedly connected between the connecting plates (28) on both sides and one side of the two bottom plates (21).

7. The antioxidant circuit board according to claim 1, wherein: The dustproof and heat dissipation net (32) is formed by a staggered combination of a plurality of heat dissipation metal wires, and the dustproof and heat dissipation net (32) is arranged at intervals from the first plate layer (11).

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