Elastic FPC board with heat dissipation function

Abstract

The utility model discloses an elastic FPC board with a heat dissipation function. The elastic FPC board comprises a PI film, a copper foil layer, a solder resist ink layer, a heat dissipation layer, a buffer layer, a waterproof layer and a cover film protection layer. The heat dissipation layer is arranged in the FPC board, the heat dissipation performance of the FPC board can be effectively enhanced, in the application of high-power electronic products, the FPC board can effectively dissipate heat, the temperature is prevented from being too high, the FPC board is not prone to being damaged, normal use of the FPC board is guaranteed, the performance of electronic elements and the service life of the electronic elements are guaranteed, the electronic elements are not prone to being damaged, and the service life of the electronic elements is prolonged. Normal work of the circuit is ensured, and convenience is brought to use of a user; and moreover, by arranging the buffer layer, the buffer performance of the product is effectively enhanced, so that the FPC board has better elasticity, and by arranging the waterproof layer, the waterproof performance of the product can be effectively enhanced, the functions are richer, the product quality is improved, and the existing requirements are met.

Description

Technical Field

[0001] The utility model relates to the technology in the field of FPC boards, in particular to an elastic FPC board with heat dissipation function. Background Art

[0002] With the continuous development of social economy, the electronics industry is becoming more and more developed, the quality of people's life is constantly improving, and electronic products are everywhere in our daily life and work. Many electronic products will apply FPC boards. FPC board is the abbreviation of Flexible Printed Circuit, which is a printed circuit board made of flexible insulating substrate and has high reliability and excellent flexibility. The FPC board provides excellent electrical performance, can meet the design requirements of smaller and higher density installation, and also helps to reduce the assembly process and enhance the reliability. The FPC board is a good solution to meet the miniaturization and mobility requirements of electronic products. It can be freely bent, wound, and folded, can withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to the space layout requirements, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection; the FPC board can greatly reduce the volume and weight of electronic products, and meet the needs of the development of electronic products towards high density, miniaturization, and high reliability.

[0003] At present, the general FPC board usually uses PI film as the substrate, sets a copper foil layer on the substrate, and then sets a cover film protection layer on the copper foil layer. The structure of this FPC board is relatively simple. Although it can basically realize the function of connecting and conducting the circuit of the FPC board, the current FPC board has a single function, poor heat dissipation performance. In the application of high-power electronic products, the FPC board needs to carry a large current and voltage, which will generate and accumulate more heat. Excessive temperature is easy to damage the FPC board, affect the normal use of the FPC board, reduce the performance of electronic components and shorten the life of electronic components, and even cause damage to electronic components, resulting in the circuit being unable to work normally, bringing inconvenience to the use of users; in addition, the current FPC board has poor elasticity and general product quality, which cannot meet the existing needs. Therefore, it is necessary to study a new technical solution to improve the current FPC board. Summary of the Utility Model

[0004] In view of this, in view of the deficiencies existing in the prior art, the main purpose of the utility model is to provide an elastic FPC board with heat dissipation function, which can effectively solve the problems that the existing FPC board has a single function, poor heat dissipation performance, poor elasticity, and general product quality.

[0005] To achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An elastic FPC board with heat dissipation function, comprising a PI film, a copper foil layer, a solder mask ink layer, a heat dissipation layer, a buffer layer, a waterproof layer and a cover film protective layer; the copper foil layer is laminated on the upper surface of the PI film, the solder mask ink layer is laminated on the upper surface of the copper foil layer, the heat dissipation layer is laminated on the upper surface of the solder mask ink layer, the buffer layer is laminated on the upper surface of the heat dissipation layer, the waterproof layer is laminated on the upper surface of the buffer layer, and the cover film protective layer is laminated on the upper surface of the waterproof layer.

[0007] As a preferred solution, a silk-screened character layer is further provided, which is arranged on the upper surface of the cover film protective layer. The silk-screened character layer can provide product and usage information. The silk-screened characters can include the product name, manufacturer information, production cycle, specifications, working voltage, production batch number, certification marks, etc., which facilitates use and maintenance.

[0008] As a preferred solution, the PI film and the copper foil layer are bonded through an adhesive layer.

[0009] As a preferred solution, a 3M adhesive layer and a back adhesive paper are further provided. The 3M adhesive layer is laminated on the lower surface of the PI film, and the back adhesive paper is laminated on the lower surface of the 3M adhesive layer. The 3M adhesive layer has strong adhesion and extremely high bonding strength, can firmly bond various different materials, is convenient to use, and has good weather resistance and chemical resistance.

[0010] As a preferred solution, the heat dissipation layer is a high thermal conductivity silicone rubber layer, which has good thermal conductivity, heat dissipation performance, high temperature resistance performance, corrosion resistance performance, flexibility and extensibility.

[0011] As a preferred solution, the buffer layer is made of TPU material, which has good wear resistance, buffering performance, shock absorption performance, impact resistance performance, aging resistance performance, oil resistance, water resistance and mildew resistance, and has high elasticity and high extensibility.

[0012] As a preferred solution, the waterproof layer includes a polyvinyl chloride waterproof layer and a polyisobutene waterproof layer. The polyvinyl chloride waterproof layer is laminated on the upper surface of the buffer layer, the polyisobutene waterproof layer is laminated on the upper surface of the polyvinyl chloride waterproof layer, the cover film protective layer is laminated on the upper surface of the polyisobutene waterproof layer, and the polyvinyl chloride waterproof layer and the polyisobutene waterproof layer have good waterproof performance.

[0013] As a preferred solution, the cover film protective layer is a PI film or a PET film.

[0014] Compared with the prior art, the present utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solutions:

[0015] By arranging the heat dissipation layer in the FPC board, the heat dissipation performance of the FPC board can be effectively enhanced. In the application of high-power electronic products, the FPC board can effectively dissipate heat, avoid overheating, is not easily damaged, ensure the normal use of the FPC board, guarantee the performance of electronic components and the lifespan of electronic components, is not likely to cause damage to electronic components, ensure the normal operation of the circuit, and bring convenience to users. Moreover, by arranging the buffer layer, the buffer performance of the product is effectively enhanced, making the FPC board have better elasticity. By arranging the waterproof layer, the waterproof performance of the product can be effectively enhanced, with more abundant functions, improving the quality of the product and meeting the existing requirements.

[0016] To more clearly elaborate on the structural features and effects of the present invention, the following will combine the accompanying drawings and specific embodiments to detail the present invention. Brief Description of the Drawings

[0017] Figure 1 is a top view of a preferred embodiment of the present invention;

[0018] Figure 2 is a cross-sectional view of a preferred embodiment of the present invention.

[0019] Description of the Reference Numerals in the Drawings:

[0020] 10, PI film; 20, copper foil layer

[0021] 30, solder mask ink layer; 40, heat dissipation layer

[0022] 50, buffer layer; 60, waterproof layer

[0023] 61, polyvinyl chloride waterproof layer; 62, polyisobutene waterproof layer

[0024] 70, cover film protective layer; 80, silk screen character layer

[0025] 90, adhesive layer; 100, 3M adhesive layer

[0026] 110, back adhesive paper. Detailed Description of the Embodiments

[0027] Please refer to Figure 1 and Figure 2 as shown, which shows the specific structure of a preferred embodiment of the present invention, including a PI film 10, a copper foil layer 20, a solder mask ink layer 30, a heat dissipation layer 40, a buffer layer 50, a waterproof layer 60, and a cover film protective layer 70.

[0028] The copper foil layer 20 is laminated on the upper surface of the PI film 10; in this embodiment, the PI film 10 and the copper foil layer 20 are bonded through an adhesive layer 90; further, a 3M adhesive layer 100 and a backing paper 110 are provided. The 3M adhesive layer 100 is laminated on the lower surface of the PI film 10, and the backing paper 110 is laminated on the lower surface of the 3M adhesive layer 100. The 3M adhesive layer 100 has strong adhesion and extremely high bonding strength, can firmly bond various different materials, is convenient to use, and has good weather resistance and chemical resistance.

[0029] The solder mask ink layer 30 is laminated on the upper surface of the copper foil layer 20, and the heat dissipation layer 40 is laminated on the upper surface of the solder mask ink layer 30; in this embodiment, the heat dissipation layer 40 is a high thermal conductivity silicone rubber layer, and the high thermal conductivity silicone rubber layer has good thermal conductivity, heat dissipation performance, high temperature resistance, corrosion resistance, flexibility and stretchability.

[0030] The buffer layer 50 is laminated on the upper surface of the heat dissipation layer 40; in this embodiment, the buffer layer 50 is made of TPU material, and the TPU material has good wear resistance, buffering performance, shock absorption performance, impact resistance, aging resistance, oil resistance, water resistance and mildew resistance, and has high elasticity and high extensibility.

[0031] The waterproof layer 60 is laminated on the upper surface of the buffer layer 50; in this embodiment, the waterproof layer 60 includes a polyvinyl chloride waterproof layer 61 and a polyisobutene waterproof layer 62. The polyvinyl chloride waterproof layer 61 is laminated on the upper surface of the buffer layer 50, the polyisobutene waterproof layer 62 is laminated on the upper surface of the polyvinyl chloride waterproof layer 61, the covering film protection layer 70 is laminated on the upper surface of the polyisobutene waterproof layer 62, and the polyvinyl chloride waterproof layer 61 and the polyisobutene waterproof layer 62 have good waterproof performance.

[0032] The covering film protection layer 70 is laminated on the upper surface of the waterproof layer 60; in this embodiment, the covering film protection layer 70 is a PI film or a PET film; further, a screen printing character layer 80 is provided. The screen printing character layer 80 is provided on the upper surface of the covering film protection layer 70, and the screen printing characters can provide product and usage information. The screen printing characters can include the product name, manufacturer information, production cycle, specifications, working voltage, production batch number, certification marks, etc., which provides convenience for use and maintenance.

[0033] The design focus of the present utility model lies in:

[0034] By arranging the heat dissipation layer in the FPC board, the heat dissipation performance of the FPC board can be effectively enhanced. In the application of high-power electronic products, the FPC board can effectively dissipate heat, avoid overheating, is not easily damaged, ensure the normal use of the FPC board, ensure the performance of electronic components and the service life of electronic components, is not easily cause damage to electronic components, ensure the normal operation of the circuit, and bring convenience to the use of users; and, by arranging the buffer layer, the buffer performance of the product is effectively enhanced, making the FPC board have better elasticity. By arranging the waterproof layer, the waterproof performance of the product can be effectively enhanced, the function is more abundant, the quality of the product is improved, and the existing requirements are met.

[0035] The above is only a preferred embodiment of the present invention, and does not impose any limitation on the technical scope of the present invention. Therefore, any minor modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An elastic FPC board with heat dissipation function, characterized in that: It includes a PI film, a copper foil layer, a solder mask ink layer, a heat dissipation layer, a buffer layer, a waterproof layer, and a cover film protective layer; the copper foil layer is laminated on the upper surface of the PI film, the solder mask ink layer is laminated on the upper surface of the copper foil layer, the heat dissipation layer is laminated on the upper surface of the solder mask ink layer, the buffer layer is laminated on the upper surface of the heat dissipation layer, the waterproof layer is laminated on the upper surface of the buffer layer, and the cover film protective layer is laminated on the upper surface of the waterproof layer.

2. The elastic FPC board with heat dissipation function according to claim 1, wherein: A silk screen character layer is further provided, and the silk screen character layer is arranged on the upper surface of the cover film protective layer.

3. The flexible FPC board with heat dissipation function according to claim 1, characterized in that: The PI film and the copper foil layer are bonded through an adhesive layer.

4. The flexible FPC board with heat dissipation function according to claim 1, wherein: A 3M adhesive layer and a backing paper are further provided. The 3M adhesive layer is laminated on the lower surface of the PI film, and the backing paper is laminated on the lower surface of the 3M adhesive layer.

5. The elastic FPC board with heat dissipation function according to claim 1, wherein: The heat dissipation layer is a high thermal conductivity silicone rubber layer.

6. The flexible FPC board with heat dissipation function according to claim 1, characterized in that: The buffer layer is made of TPU material.

7. The flexible FPC board with heat dissipation function according to claim 1, characterized in that: The waterproof layer includes a polyvinyl chloride waterproof layer and a polyisobutylene waterproof layer. The polyvinyl chloride waterproof layer is laminated on the upper surface of the buffer layer, the polyisobutylene waterproof layer is laminated on the upper surface of the polyvinyl chloride waterproof layer, and the cover film protective layer is laminated on the upper surface of the polyisobutylene waterproof layer.

8. The elastic FPC board with heat dissipation function according to claim 1, characterized in that: The cover film protective layer is a PI film or a PET film.

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