Circuit board assembly and electric tool

Abstract

The utility model discloses a circuit board assembly and an electric tool, the circuit board assembly comprises a heat dissipation box and a printed circuit board, the heat dissipation box is made of a heat conduction material, and a containing cavity with an opening is formed in the heat dissipation box; the printed circuit board is arranged in the accommodating cavity; a plurality of ribs are arranged on the outer surface of the end, back to the opening, of the bottom plate in a protruding mode, the ribs longitudinally extend in the direction of one diagonal line of the heat dissipation box, and the ribs are arranged at intervals in the direction of the other diagonal line of the heat dissipation box. At least part of the heat dissipation box is made of the heat conduction material, and heat generated by the printed circuit board can be dissipated timely and effectively; the ribs extend and are arranged in the diagonal direction of the heat dissipation box, so that the overall attractiveness can be improved, the length of each rib can be longer, the number of the arranged ribs can be larger, the heat dissipation area can be increased, and the heat dissipation performance can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power tools, and particularly relates to a circuit board assembly and a power tool. Background Art

[0002] Power tools generally refer to tools that use electricity as the power source to achieve a certain operation purpose. They are widely used in construction, manufacturing, home repair, and personal hobby projects. These tools are usually more powerful and efficient than manual tools and can complete some tasks that are difficult for humans to perform. Specifically, they can be but are not limited to electric drills, electric saws, electric grinders, electric screwdrivers, electric wrenches, etc. To make the operation of power tools more intelligent and convenient, common power tools generally have built-in components such as a power module, a control module, etc. Among them, the control module includes, for example, a common printed circuit board. During operation, the printed circuit board may easily generate more heat due to reasons such as high power consumption of its own components, too thin traces, large resistance, or high external environmental temperature, resulting in problems such as component damage on the printed circuit board, affecting the stability and reliability of the entire system to which it is applied. Summary of the Utility Model

[0003] The main object of the utility model is to propose a circuit board assembly and a power tool, aiming to solve the problem of poor heat dissipation of traditional circuit board assemblies.

[0004] To achieve the above object, a circuit board assembly proposed by the utility model includes:

[0005] A heat dissipation box, at least partially made of a heat-conducting material. The heat dissipation box includes a bottom plate and side plates connected to the periphery of the bottom plate. The bottom plate and the side plates enclose a receiving cavity, and one end of the side plate away from the bottom plate forms an opening; and,

[0006] A printed circuit board, disposed in the receiving cavity;

[0007] Wherein, a plurality of ribs are convexly provided on the outer surface of the end of the bottom plate facing away from the opening. The ribs extend longitudinally along a diagonal direction of the heat dissipation box, and each rib is arranged at intervals along the other diagonal direction of the heat dissipation box.

[0008] Optionally, at least part of at least one outer surface of the printed circuit board is spaced from the corresponding cavity wall of the receiving cavity.

[0009] Optionally, the number of the side plates is at least two, and adjacent side plates are connected to form a corner;

[0010] The inner surface of the bottom plate is convexly provided with at least one first support rib, and at least one of the first support ribs is disposed at the corner portion. The printed circuit board is supported on the first support rib so that the printed circuit board is spaced apart from the bottom plate.

[0011] Optionally, the number of the side plates is at least two;

[0012] At least one of the inner surfaces of the side plates is convexly provided with at least one second support rib, and the second support rib abuts against the side surface of the corresponding printed circuit board so that the printed circuit board is spaced apart from the side plate.

[0013] Optionally, there are two second support ribs, and the two second support ribs are respectively disposed at two relatively arranged side plates; and / or,

[0014] A limiting groove is recessed at the position corresponding to the second support rib on the side surface of the printed circuit board, and the limiting groove is connected with the corresponding second support rib in a concave-convex fit manner.

[0015] Optionally, the circuit board assembly further includes a thermal conductive adhesive, and the thermal conductive adhesive is at least disposed at the open mouth of the heat dissipation box and covers the printed circuit board.

[0016] In addition, to achieve the above object, the present invention further provides a power tool, including:

[0017] A housing;

[0018] An electrode seat, which cooperates with the housing to form a receiving space, and the electrode seat is used for detachably connecting with a battery pack; and,

[0019] The circuit board assembly as described above, the circuit board assembly is received in the receiving space, the heat dissipation box is adjacent to and spaced from the electrode seat, and the printed circuit board is electrically connected to the electrode seat through an electrical connection member.

[0020] Optionally, a limiting rib is convexly provided on the inner cavity wall of the receiving space, and the limiting rib is in limiting abutment with the outer surface of the bottom plate and / or the corresponding side plate of the heat dissipation box; and / or,

[0021] A positioning rib is convexly provided on the inner cavity wall of the receiving space. The positioning rib includes a first rib segment extending along the height direction of the heat dissipation box and a second rib segment bent and extending from the free end of the first rib segment toward the side where the circuit board assembly is located. The second rib segment is disposed on the open side of the heat dissipation box to limit and stop the circuit board assembly.

[0022] Optionally, at least a part of the projection of the electrode seat on the plane where the bottom plate is located falls within the range of the bottom plate.

[0023] Optionally, the casing is penetrated with ventilation holes communicating with the accommodation space, and the ventilation holes are disposed adjacent to the circuit board assembly.

[0024] In the technical solution provided by the present utility model, on the one hand, the heat dissipation box can provide a relatively stable and safe installation space for the printed circuit board; on the other hand, since at least part of the heat dissipation box is made of a heat-conducting material, the heat generated by the printed circuit board itself can be dissipated in a timely and effective manner; the ribs extend along a diagonal direction of the heat dissipation box, which not only helps to improve the overall aesthetics, but also enables each rib to have a longer length and a larger number of ribs arranged, which helps to increase the heat dissipation area and improve the heat dissipation performance; the ribs are arranged at intervals along the other diagonal direction, so that the ribs are evenly spread out on almost the entire surface of the bottom plate, which also helps to increase the heat dissipation area and improve the heat dissipation performance. In addition, the sides of the ribs away from the bottom plate are flush, which is not only structurally regular and beautiful, but also convenient for the stable installation of the heat dissipation box, and ultimately helps to ensure the stability and reliability of the circuit board assembly and the electric tools it applies to, such as electric tools. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0026] Figure 1 Is a three-dimensional schematic diagram of an embodiment of an electric tool provided by the present utility model;

[0027] Figure 2 Is Figure 1 The three-dimensional schematic diagram after removing part of the casing of the electric vehicle in

[0028] Figure 3 Is Figure 2 The enlarged schematic diagram of the first perspective when the installation cavity is not assembled with the circuit board assembly in

[0029] Figure 4 Is Figure 2 The enlarged schematic diagram of the second perspective when the installation cavity is not assembled with the circuit board assembly in

[0030] Figure 5 Is Figure 2 The three-dimensional schematic diagram of the circuit board assembly in

[0031] Figure 6 Is Figure 5 The three-dimensional schematic diagram of the heat dissipation box in the third perspective in

[0032] Figure 7 is Figure 5 a three-dimensional schematic diagram of the heat dissipation box in the fourth perspective;

[0033] Figure 8 is Figure 5 a top view structural schematic diagram of the heat dissipation box.

[0034] Explanation of the reference numerals in the attached drawings:

[0035] 100 housing; 110 side shell plates; 111 first limiting ribs; 120 partition plates; 121 second limiting ribs; 130 positioning ribs; 131 first rib segment; 132 second rib segment; 140 ventilation holes; 210 electrode holders; 300 heat dissipation box; 310 bottom plate; 320 side plates; 330 first support ribs; 340 second support ribs; 350 rib strips; 361 marking area; 362 preset marking; 400 printed circuit board; 410 limiting grooves.

[0036] The realization, functional characteristics and advantages of the purpose of the present utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings. Specific embodiments

[0037] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0038] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0039] In addition, if the descriptions such as "first" and "second" are involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0040] Please refer to Figures 1 to 8 , the present utility model provides a circuit board assembly, which includes a heat dissipation box 300 and a printed circuit board 400. Among them, at least a part of the heat dissipation box 300 is made of a heat-conducting material. The heat dissipation box 300 includes a bottom plate 310 and side plates 320 connected to the periphery of the bottom plate 310. The bottom plate 310 and the side plates 320 enclose a receiving cavity, and an opening is formed at one end of the side plate 320 away from the bottom plate 310. The printed circuit board 400 is arranged in the receiving cavity; a plurality of rib strips 350 protrude from the outer surface of the end of the bottom plate 310 facing away from the opening; among them, the rib strips 350 extend longitudinally along a diagonal direction of the heat dissipation box 300, and each rib strip 350 is arranged at intervals along the other diagonal direction of the heat dissipation box 300.

[0041] In the technical solution provided by the present utility model, on the one hand, the heat dissipation box 300 can provide a relatively stable and safe installation space for the printed circuit board 400; on the other hand, since at least part of the heat dissipation box 300 itself is made of a heat-conducting material, the heat generated by the printed circuit board 400 itself can be dissipated in a timely and effective manner; the rib strips 350 are arranged and extended along a diagonal direction of the heat dissipation box 300, which not only helps to improve the overall aesthetics, but also enables each rib strip 350 to have a longer length and a larger number of rib strips 350 arranged, which helps to increase the heat dissipation area and improve the heat dissipation performance; each rib strip 350 is arranged at intervals along the other diagonal direction, so that each rib strip 350 is evenly spread out on almost the entire plate surface of the bottom plate 310, which also helps to increase the heat dissipation area and improve the heat dissipation performance. In addition, the sides of each rib strip 350 away from the bottom plate 310 are flush, which is not only structurally regular and beautiful, but also convenient for the stable installation of the heat dissipation box 300, and ultimately helps to ensure the stability and reliability of the circuit board assembly and the electric tools it is applied to, etc.

[0042] It can be understood that the bottom plate 310 of the heat dissipation box 300 is formed with at least two diagonals, and the two diagonals do not coincide, but form an angle greater than 0° and less than or equal to 90°.

[0043] In a further solution, the middle part of at least one rib 350 is recessed to define at least an identification area 361 at least at the recessed part. The identification area 361 is used for setting a preset identification 362, and the protruding height of the preset identification 362 does not exceed the protruding height of the rib 350. Since the identification area is recessed in the middle area of the rib 350, the rib 350 will not affect the overall support height of the heat dissipation box 300, ensuring the stable placement of the heat dissipation box 300 on the plane to be installed. The identification area 361 can be used for setting the preset identification 362. The preset identification 362 can be, but is not limited to, the product brand name, product specification name, product prompt slogan, product placement orientation indication, etc. The preset identification can be a sticker set later, or integrally formed with the identification area 361.

[0044] In addition, in actual application, in order to further improve the heat dissipation performance, at least part of at least one outer surface of the printed circuit board 400 is kept at a distance from the corresponding cavity wall of the receiving cavity. Since the heat dissipation box 300 is not completely enclosed and is preset with an opening, and at least part of at least one outer surface of the printed circuit board 400 is kept at a distance from the corresponding cavity wall of the receiving cavity, the overall heat dissipation effect of the circuit board assembly is better, which ultimately helps to ensure the stability and reliability of the circuit board assembly and the electric tool it applies to, for example.

[0045] It can be understood that the shape of the printed circuit board 400 is generally regular, having a front surface mainly for connecting electronic components, a back surface opposite to the front surface, and a side surface connecting the front surface and the back surface.

[0046] In order to make the placement of the printed circuit board 400 in the heat dissipation box 300 more adaptable and stable, the main body shape of the heat dissipation box 300 can be directly designed to be the same as that of the printed circuit board 400. Or, the main body shape of the heat dissipation box 300 is set to be a general type, and then by setting concave-convex structures on the inner wall of the heat dissipation box 300, printed circuit boards 400 of various specifications can be stably placed in the heat dissipation box 300.

[0047] For the sake of easy understanding, in the structure shown in Figures 5 to 8 , the main body shape of the heat dissipation box 300 is set to be adapted to that of the printed circuit board 400. Specifically, the heat dissipation box 300 forms a receiving cavity with an opening. Among them, the opening of the receiving cavity can be set at any position of the heat dissipation box 300. For example, it can be set at the shell plate of the heat dissipation box 300 corresponding to the front surface, back surface, or any side surface of the printed circuit board 400. And specifically, the opening can occupy all or part of the surface of that side of the heat dissipation box 300.

[0048] It can be understood that there may be height differences among the electronic components provided on the front side of the printed circuit board 400. And when the printed circuit board 400 is operating, heat may be generated by the electronic components. Therefore, as Figure 5 shown, in specific applications, the opening of the receiving cavity can be provided on the entire shell plate of the heat dissipation box 300 corresponding to the front side of the printed circuit board 400. Specifically, the printed circuit board 400 can be laid out along the opening. In this way, the opening can expose a part or all of the front side of the printed circuit board 400, and sufficient space is reserved for the electronic components on the front side of the printed circuit board 400 to be erected.

[0049] Specifically, when the printed circuit board 400 is placed in the receiving cavity, its back side faces the bottom plate 310, and its respective side surfaces face the respective side plates 320. The bottom plate 310 and at least one side plate 320, and / or between at least two side plates 320 can be integrally formed; or they can be obtained by detachable or non-detachable connections after being separately formed. Non-detachable connections can be, but are not limited to, welding, hot pressing, etc.; detachable connections can be, but are not limited to, screwing, buckling, magnetic attraction, vacuum adsorption, bonding, etc.

[0050] At least a part of the heat dissipation box 300 is made of a heat-conducting material. For example, the bottom plate 310 and / or at least one side plate 320 of the heat dissipation box 300 can be made of a heat-conducting material. The heat-conducting material can specifically be a metal material, which not only has good heat-conducting performance but also can provide sufficient structural strength for the heat dissipation box 300. The metal material can specifically be aluminum. Aluminum has a relatively light mass, which helps to reduce the overall mass of the circuit board assembly.

[0051] In actual applications, at least a part of at least one outer surface of the printed circuit board 400 is spaced from the corresponding cavity wall of the receiving cavity. Specifically, for example, at least a part of the back side of the printed circuit board 400 is spaced from the bottom plate 310; and / or at least a part of at least one side surface of the printed circuit board 400 is spaced from the corresponding side plate 320. It can be understood that when there is at least one spacing, a path for the heat dissipation air flow can be formed at this spacing, combined with the heat conduction and dissipation of the heat dissipation box 300 for the printed circuit board 400, which is more conducive to improving the heat dissipation effect.

[0052] Specifically, in one embodiment, at least one first support rib 330 protrudes from the inner surface of the bottom plate 310, and the printed circuit board 400 is supported on the first support rib 330 so that the printed circuit board 400 is spaced apart from the bottom plate 310. Specifically, the back surface of the printed circuit board 400 is spaced apart from the bottom plate 310. The first support rib 330 can be integrally formed with the bottom plate 310, or can be detachably or non-detachably connected after being formed separately. When the first support rib 330 can be separately formed from the bottom plate 310, the material of the first support rib 330 and the material of the bottom plate 310 can be set to be the same or different. For example, the material of the first support rib 330 can be a rubber material that can enhance shock absorption and buffering, a material that can expand when heated, a high molecular resin material that can expand when absorbing water, etc.

[0053] Wherein, the shape of the support surface of the first support rib 330 is set to be adapted to the shape of the back surface of the printed circuit board 400 at the position where it is located.

[0054] The number of the first support ribs 330 can be set as needed. When multiple first support ribs 330 are provided, the protruding height of each first support rib 330 can be specifically set according to the concave and convex features of the back surface of the printed circuit board 400 at the position where it is located. For example, when the back surface of the printed circuit board 400 is substantially a flat surface, the protruding height of each first support rib 330 can be set to be substantially the same to ensure that the printed circuit board 400 is substantially parallel to the bottom plate 310. Or the protruding height of the first support rib 330 in a certain area is higher than the protruding height of the first support rib 330 in another area, so that the printed circuit board 400 is inclined relative to the bottom plate 310 to accommodate a printed circuit board with a larger layout in the receiving cavity.

[0055] And more specifically, when corners are formed by connecting two adjacent side plates 320, at least one first support rib 330 can be arranged at the corners. In this way, on the basis of ensuring that each first support rib 330 has a good supporting effect on the printed circuit board 400, the number of the first support ribs 330 can be minimized as much as possible.

[0056] In addition, at least one second support rib 340 protrudes from the inner surface of at least one side plate 320, and the second support rib 340 abuts against the side surface of the corresponding printed circuit board 400 so that the side surface of the printed circuit board 400 is spaced apart from the side plate 320. The second support rib 340 can be set to be one or several according to actual needs. The setting of the second support rib 340 is similar to that of the above-mentioned first support rib 330 and will not be elaborated.

[0057] It should be noted that since multiple side surfaces of the printed circuit board 400 and side plates 320 of the heat dissipation box 300 can be provided respectively. Therefore, in practical applications, the second support ribs 340 provided on a certain side plate 320 can be used to space apart the side plate 320 from the corresponding side surface of the printed circuit board 400; or alternatively, the second support ribs 340 provided on a certain side plate 320 can also be used to space apart other side plates 320 connected to the side plate 320 from the corresponding side surface of the printed circuit board 400.

[0058] In a specific embodiment, two second support ribs 340 are provided, and the two second support ribs 340 are respectively arranged at two relatively arranged side plates 320, so that the two second support ribs 340 can apply opposite acting forces to the printed circuit board 400, which is more helpful for the stable support of the printed circuit board 400.

[0059] And / or, a limiting groove 410 is recessed at the corresponding position of the second support rib 340 on the side surface of the printed circuit board 400, and the limiting groove 410 is connected to the corresponding second support rib 340 in a concave-convex fit manner. In this way, the second support rib 340 can not only achieve the purpose of spacing apart at least one side surface of the printed circuit board 400 from the corresponding side plate 320, but further, through the concave-convex fit of the second support rib 340 and the limiting groove 410, it can also play a positioning and limiting function for the installation of the printed circuit board 400 in the heat dissipation box 300.

[0060] The first support rib 330 and the second support rib 340 can be provided alternatively, or can be provided in the same heat dissipation box 300 at the same time. Among them, when the first support rib 330 and the second support rib 340 are provided in the same heat dissipation box 300 at the same time, it can space apart the back surface of the printed circuit board 400 from the bottom plate 310 and at least one side surface of the printed circuit board 400 from the corresponding side plate 320, thereby helping to form a circulation path from outside the receiving cavity to inside the receiving cavity for the heat dissipation air flow to circulate.

[0061] In addition, the first support rib 330 and the second support rib 340 can keep the printed circuit board 400 in contact with the heat dissipation box. When the first support rib 330 and the second support rib 340 are made of a heat-conducting material, for example, when the first support rib 330 and the second support rib 340 and the bottom plate 310 and the side plates 320 are integrally formed by a heat-conducting material, the heat dissipation between the heat dissipation box 300 and the printed circuit board 400 is based on the direct heat conduction of the heat-conducting material, which is more conducive to quick heat dissipation.

[0062] In view of the above, the circuit board assembly further includes thermal conductive adhesive, which is disposed at least at the open end of the heat dissipation box 300 and covers the printed circuit board 400. That is, the thermal conductive adhesive covers at least the front surface of the printed circuit board 400, and can further fill the entire open end of the heat dissipation box 300, and can further fill to cover all outer surfaces of the printed circuit board 400; and / or fill the gap between the outer surface of the printed circuit board 400 and the cavity wall of the receiving cavity. According to actual needs, the heat conduction characteristics of the thermal conductive adhesive are fully utilized to improve the heat dissipation effect. When the gap between the printed circuit board 400 and the receiving cavity wall is not filled with thermal conductive adhesive, heat dissipation is achieved through air circulation. When the gap between the printed circuit board 400 and the receiving cavity wall is filled with thermal conductive adhesive, the heat of the printed circuit board 400 is conducted to the heat dissipation box 300 through the thermal conductive adhesive and then dissipated. The two heat dissipation methods can be selected or used in combination.

[0063] In addition, the present utility model further provides a power tool, which includes the circuit board assembly as described above. It should be noted that the detailed structure of the circuit board assembly in the power tool can refer to the embodiments of the above circuit board assembly, which will not be elaborated here; since the above circuit board assembly is used in the power tool of the present application, therefore, the embodiments of the power tool of the present application include all technical solutions of all embodiments of the above circuit board assembly, and the achieved technical effects are the same, which will not be elaborated here.

[0064] The power tool may further include a housing 100 and an electrode seat 210. The electrode seat 210 cooperates with the housing 100 to form a receiving space, and the electrode seat 210 is used for detachably connecting with a battery pack; the circuit board assembly is received in the receiving space, the heat dissipation box 300 is adjacent to and spaced from the electrode seat 210, and the printed circuit board 400 is electrically connected to the electrode seat 210 through an electrical connector.

[0065] The electrode seat 210 is electrically connected to the printed circuit board 400 in the circuit board assembly, and the battery pack provides power for the printed circuit board 400 through the electrode seat 210, or further provides power for other modules connected thereto through the printed circuit board 400.

[0066] The electrode seat 210 and the circuit board assembly can be disposed at any position of the housing 100. For example, when the housing 100 is erected vertically on a platform, both the electrode seat 210 and the circuit board assembly can be disposed at the bottom of the housing 100. After installing the battery pack, the overall center of gravity of the power tool can be lowered, which helps the overall power tool to be stably placed on the platform. Taking this orientation as an example, at least part of the circuit board assembly can be supported above the electrode seat 210. Preferably, the projection of the electrode seat 210 on the plane of the bottom plate 310 of the heat dissipation box 300 at least partially falls within the range of the bottom plate 310, which can not only shorten the length of the electrical connector between the two for convenient installation, but also make the structure of the entire power tool more compact.

[0067] In practical applications, limiting ribs are convexly provided on the inner cavity wall of the receiving space, and the limiting ribs are in limiting abutment with the outer surface of the bottom plate 310 and / or the corresponding side plates 320 of the heat dissipation box 300; and / or positioning ribs 130 are convexly provided on the inner cavity wall of the receiving space. The positioning ribs 130 include a first rib segment 131 extending along the height direction of the heat dissipation box 300 and a second rib segment 132 extending by bending from the free end of the first rib segment 131 toward the side where the circuit board assembly is located. The second rib segment 132 is provided on the open side of the heat dissipation box 300 to limit and stop the circuit board assembly.

[0068] It can be understood that at least part of the circuit board assembly needs to be supported on the corresponding inner cavity wall of the housing 100. Specifically, for example, the housing 100 includes a side shell plate 110 located beside the circuit board assembly and extending substantially in the vertical direction, and a partition plate 120 located at the bottom side of the circuit board assembly and extending substantially in the horizontal direction. The side shell plate 110 and the remaining shell plates of the housing 100, and / or the partition plate 120 and the remaining shell plates of the housing 100 can be integrally formed, or can be detachably or non-detachably connected after being separately formed.

[0069] Based on this, the limiting ribs can include at least one first limiting rib 111 convexly provided on the side shell plate 110 and / or at least one second limiting rib 121 convexly provided on the partition plate 120. The first limiting rib 111 can perform limiting abutment on the peripheral side of the circuit board assembly, and the second limiting rib 121 can perform limiting abutment on the bottom side of the circuit board assembly. And compared with the side shell plate 110 directly abutting against the side surface of the circuit board assembly and the partition plate 120 abutting against the bottom surface of the circuit board assembly, it has a better heat dissipation effect. Preferably, the extending direction of the second limiting rib 121 is relatively inclined (instead of parallel) to the extending direction of the rib strips 350 provided on the bottom plate 310 of the heat dissipation box 300 to avoid the second limiting rib 121 being stuck in the gap between the two rib strips 350, resulting in inconvenient installation.

[0070] The positioning ribs 130 are convexly provided on the partition plate 120, wherein the first rib segment 131 can perform circumferential limiting and stopping on the circuit board assembly; the second rib segment 132 can perform top-side limiting and stopping on the circuit board assembly, and can also play a certain positioning and indicating function during the process of installing the circuit board assembly into the above-mentioned receiving space, and has the characteristics of simple structure and convenient installation. Compared with the scheme of positioning by means of, for example, screws, etc., the positioning ribs 130 do not need to occupy the space of the heat dissipation box 300 for fixation, and do not affect the arrangement of the rib strips 350 arranged on the bottom plate 310 of the heat dissipation box 300.

[0071] In addition, in one embodiment, the housing 100 is provided with ventilation holes 140 communicating with the accommodation space, and the ventilation holes 140 are disposed adjacent to the circuit board assembly. The ventilation holes 140 can achieve air circulation inside and outside the accommodation space, thereby helping to dissipate the heat inside the accommodation space to the outside and guiding the relatively low-temperature air outside the accommodation space inward, which helps to further improve the heat dissipation effect of the circuit board assembly.

[0072] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A circuit board assembly, characterized in that, include: A heat dissipation box, at least partially made of a heat-conducting material, comprising a bottom plate and a side plate connected to the periphery of the bottom plate, wherein the bottom plate and the side plate are enclosed to form a receiving cavity, and an end of the side plate away from the bottom plate forms an opening; and A printed circuit board is placed in the receiving cavity; A plurality of ribs are protruding from the outer surface of one end of the bottom plate facing away from the opening, the ribs extend longitudinally along a diagonal direction of the heat dissipation box, and the ribs are arranged at intervals along another diagonal direction of the heat dissipation box.

2. The circuit board assembly according to claim 1, wherein, At least a portion of at least one outer surface of the printed circuit board is spaced apart from a corresponding cavity wall of the receiving cavity.

3. The circuit board assembly according to claim 2, wherein The number of the side panels is at least two, and two adjacent side panels are connected to form a corner; At least one first supporting rib is protruding from the inner surface of the bottom plate, and at least one first supporting rib is arranged at the corner. The printed circuit board is supported on the first supporting rib so that the printed circuit board is spaced apart from the bottom plate.

4. The circuit board assembly according to claim 2, wherein The number of the side panels is at least two; At least one second supporting rib is protruding from the inner surface of at least one of the side plates, and the second supporting rib abuts against the side surface of the corresponding printed circuit board so that the printed circuit board is spaced apart from the side plate.

5. The circuit board assembly according to claim 4, wherein, There are two second supporting ribs, and the two second supporting ribs are respectively arranged at two oppositely arranged side panels; and / or, A limiting groove is concavely provided on the side surface of the printed circuit board corresponding to the second supporting rib, and the limiting groove is concave-convexly matched with the corresponding second supporting rib.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that, The circuit board assembly also includes heat-conducting adhesive, which is arranged at least at the opening of the heat dissipation box and covers the printed circuit board.

7. An electric tool, characterized in that, include: chassis; An electrode seat, which cooperates with the housing to form a receiving space, and the electrode seat is used to be detachably connected to the battery pack; as well as, According to the circuit board assembly as described in any one of claims 1 to 6, the circuit board assembly is accommodated in the accommodating space, the heat dissipation box is adjacent to the electrode seat and is spaced apart, and the printed circuit board is electrically connected to the electrode seat through an electrical connector.

8. The power tool according to claim 7, characterized in that, The inner cavity wall of the receiving space is provided with a limiting rib, and the limiting rib is in limiting contact with the outer surface of the bottom plate and / or the corresponding side plate of the heat dissipation box; and / or, The inner cavity wall of the accommodating space is protrudingly provided with positioning ribs, and the positioning ribs include a first rib segment extending along the height direction of the heat dissipation box, and a second rib segment bent and extended from the free end of the first rib segment toward the side where the circuit board assembly is located, and the second rib segment is arranged on the open side of the heat dissipation box to limit and stop the circuit board assembly.

9. The power tool according to claim 7, wherein The projection of the electrode seat on the plane where the bottom plate is located at least partially falls within the range of the bottom plate.

10. The power tool according to claim 7, characterized in that, The housing is provided with a ventilation hole communicating with the receiving space, and the ventilation hole is arranged adjacent to the circuit board assembly.

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