Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the utility model discloses a heat exchange piece, a heat exchange module and electronic equipment, the heat exchange piece comprises a first cover plate, a second cover plate and a middle layer which are arranged in a stacked mode, a runner groove is formed in the middle layer, and the runner groove is arranged in the thickness direction of the middle layer in a penetrating mode; the middle layer comprises a liquid cooling layer and bonding layers arranged on the two sides of the liquid cooling layer, the liquid cooling layer and the bonding layers on the two sides jointly form the side wall of the flow channel groove, and the first cover plate and the second cover plate are connected with the liquid cooling layer in a sealed mode through the bonding layers. And the first cover plate, the second cover plate and the middle layer define a flow channel at the flow channel groove. Therefore, the bonding sealing of the first cover plate, the second cover plate and the liquid cooling layer can be realized by utilizing the bonding layer, the sealing process can be simplified, and the processing difficulty of the heat exchange piece is also reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer, and more specifically, to a heat exchange component, a heat exchange module and an electronic device. Background Art

[0002] With the increasing integration of electronic devices, the heat dissipation problem has become one of the key factors restricting the performance improvement. As an efficient heat dissipation element, the liquid cooling plate is widely used in various high-power density electronic devices.

[0003] For the current liquid cooling plate structure, the flow channel layer and the sealing layer are usually sealed by a hot pressing process. However, in the hot pressing and sealing process, due to the complexity and diversity of the flow channels in the flow channel layer, it is mostly necessary to design a positioning mold to position the flow channel layer and the sealing layer, resulting in a relatively complex processing technology for the liquid cooling plate. Summary of the Utility Model

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide a novel heat exchange component, a heat exchange module and an electronic device.

[0005] According to one aspect of the present utility model, a heat exchange component is provided.

[0006] The heat exchange component includes:

[0007] A first cover plate, a second cover plate and an intermediate layer which are stacked. A flow channel groove is formed on the intermediate layer, and the flow channel groove penetrates along the thickness direction of the intermediate layer. The intermediate layer includes a liquid cooling layer and adhesive layers arranged on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides together form the side wall of the flow channel groove. The first cover plate and the second cover plate are respectively hermetically connected to the liquid cooling layer through the adhesive layers, so that the first cover plate, the second cover plate and the intermediate layer enclose a flow channel at the flow channel groove.

[0008] Optionally, the adhesive layer includes at least one layer of adhesive. A bonding connection is formed between the first side of the liquid cooling layer and the first cover plate through the adhesive layer, and a bonding connection is formed between the second side of the liquid cooling layer and the second cover plate through the adhesive layer.

[0009] Optionally, the adhesive is formed into the adhesive layer by dispensing or screen printing.

[0010] Optionally, the adhesive includes polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot melt composite glue film, hot melt glue or thermosetting glue.

[0011] Optionally, the first cover plate includes at least one of a polymer material layer and a metal layer, and / or the second cover plate includes at least one of a polymer material layer and a metal layer.

[0012] Optionally, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0013] Optionally, the thickness of the adhesive layer ranges from 0.025 mm to 0.05 mm.

[0014] Optionally, along the thickness direction of the heat exchanger, the first cover plate, the first adhesive layer, the liquid cooling layer, the second adhesive layer, and the second cover plate are stacked in sequence. The first cover plate is hermetically connected to the first side of the liquid cooling layer through the first adhesive layer, and the second cover plate is hermetically connected to the second side of the liquid cooling layer through the second adhesive layer.

[0015] Optionally, the ratio of the thickness of the first cover plate to the thickness of the first adhesive layer ranges from 0.6 to 2, and / or the ratio of the thickness of the second cover plate to the thickness of the second adhesive layer ranges from 0.6 to 2.

[0016] Optionally, along the thickness direction of the heat exchanger, the edge of the adhesive layer is flush with the edge of the liquid cooling layer.

[0017] Optionally, the side of the adhesive layer close to the flow channel groove has a guiding portion for guiding the flow of the working medium in the flow channel.

[0018] Optionally, the first cover plate is a single-layer structure or a multi-layer structure;

[0019] and / or the second cover plate is a single-layer structure or a multi-layer structure.

[0020] According to another aspect of the present invention, a heat exchange module is provided, including a micro pump and the above-mentioned heat exchanger.

[0021] Optionally, the heat exchanger has a first working medium inlet and a first working medium outlet, the micro pump has a second working medium inlet and a second working medium outlet. The first working medium inlet and the first working medium outlet are respectively communicated with the flow channel, and the first working medium inlet is communicated with the second working medium outlet, and the first working medium outlet is communicated with the second working medium inlet.

[0022] According to still another aspect of the present invention, an electronic device is provided, including the above-mentioned heat exchanger or the above-mentioned heat exchange module.

[0023] One technical effect of the embodiments of the present disclosure is that:

[0024] The heat exchange component includes a first cover plate, a second cover plate and an intermediate layer arranged in a stacked manner. A flow channel groove is formed in the intermediate layer, and the flow channel groove penetrates through the intermediate layer in the thickness direction thereof. The intermediate layer includes a liquid cooling layer and adhesive layers arranged on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides together form the side walls of the flow channel groove. The first cover plate and the second cover plate are respectively hermetically connected to the liquid cooling layer through the adhesive layers, so that the first cover plate, the second cover plate and the intermediate layer enclose a flow channel at the flow channel groove. In this way, the adhesive layers can be used to achieve the adhesive sealing of the first cover plate, the second cover plate and the liquid cooling layer, which can simplify the sealing process and thus reduce the processing difficulty of the heat exchange component.

[0025] Other features and advantages of the present invention will become clear from the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings forming a part of the specification depict embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0027] Figure 1 is a schematic diagram of a heat exchange component according to an embodiment of the present disclosure.

[0028] DESCRIPTION OF THE REFERENCE NUMERALS

[0029] 1. First cover plate; 2. Intermediate layer; 21. Flow channel groove; 22. Liquid cooling layer; 23. Adhesive layer; 3. Second cover plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as a limitation on the present invention or its application or use.

[0032] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and devices should be regarded as part of the specification.

[0033] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0034] It should be noted that like reference numerals and letters denote like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0035] An embodiment of the present utility model provides a heat exchange member, which can be applied to heat exchange of electronic devices such as tablet computers, laptop computers, VR (Virtual Reality) products, AR (Augmented Reality) products, watches, etc.

[0036] As Figure 1 shown, the heat exchange member provided by the embodiment of the present utility model includes:

[0037] A first cover plate 1, a second cover plate 3 and an intermediate layer 2 which are stacked. A flow channel groove 21 is formed on the intermediate layer 2. The flow channel groove 21 runs through the intermediate layer 2 along the thickness direction thereof. The intermediate layer 2 includes a liquid cooling layer 22 and adhesive layers 23 disposed on both sides of the liquid cooling layer 22. The liquid cooling layer 22 and the adhesive layers 23 on both sides together form the side wall of the flow channel groove 21. The first cover plate 1 and the second cover plate 3 are respectively hermetically connected to the liquid cooling layer 22 through the adhesive layers 23, so that the first cover plate 1, the second cover plate 3 and the intermediate layer 2 enclose a flow channel at the flow channel groove 21.

[0038] As Figure 1 shown, the intermediate layer 2 is sandwiched between the first cover plate 1 and the second cover plate 3, so that the first cover plate 1 and the second cover plate 3 on both sides can support and protect the intermediate layer 2. In the embodiment of the present utility model, a flow channel groove 21 is formed on the intermediate layer 2. The flow channel groove 21 runs through the intermediate layer 2 along the thickness direction, so that the working medium can flow smoothly in the flow channel at the flow channel groove 21 and be in full contact with the liquid cooling layer 22, thereby realizing efficient heat conduction.

[0039] That is to say, the flow channel groove 21 is a through groove on the intermediate layer 2, which can simplify the opening process of the flow channel groove 21. Among them, according to actual design, the shape of the flow channel groove 21 includes but is not limited to linear, serpentine and spiral shapes to optimize the flow path of the working medium and the heat exchange efficiency. At the inlet and outlet of the flow channel, corresponding connectors or interfaces can also be provided to facilitate connection with external heat exchange systems such as water micro-pumps and radiators and form a complete heat exchange cycle.

[0040] In this embodiment, the intermediate layer 2 includes a liquid cooling layer 22 and adhesive layers 23 on both sides. One side of the liquid cooling layer 22 has a first adhesive layer, and the opposite side of the liquid cooling layer 22 has a second adhesive layer. The first adhesive layer, the liquid cooling layer 22, and the second adhesive layer together form the intermediate layer 2. During the processing of the flow channel groove 21, the first adhesive layer, the liquid cooling layer 22, and the second adhesive layer can be stacked to form the intermediate layer 2 first, and then the intermediate layer 2 is cut to form the flow channel groove 21. In this way, the first adhesive layer, the liquid cooling layer 22, and the second adhesive layer can jointly form the side wall of the flow channel groove 21, which can facilitate the formation of the flow channel groove 21 while strengthening the sealing performance of the side wall of the flow channel groove 21, and further ensure the sealing performance of the flow channel formed on the heat exchanger, thereby ensuring the heat exchange effect.

[0041] Among them, the liquid cooling layer 22 can be made of a metal material, or the liquid cooling layer 22 can be made of a polymer material, or the liquid cooling layer 22 can also be made of a composite of a metal material and a polymer material, which can adapt to different application requirements.

[0042] The first adhesive layer and the second adhesive layer are respectively located on both sides of the liquid cooling layer 22. The first adhesive layer and the second adhesive layer can be made of an adhesive or a thin film material with good sealing performance and thermal conductivity. On the one hand, the adhesive layer 23 can firmly connect the cover plate to the liquid cooling layer 22, thereby forming the overall structure of the heat exchanger; on the other hand, the adhesive layers 23 on both sides can also ensure the sealing performance of the flow channel groove 21 and prevent poor heat exchange caused by the leakage of the working medium.

[0043] During the production and assembly process, the first cover plate 1 and the second cover plate 3 are respectively hermetically connected to the liquid cooling layer 22 through their respective adhesive layers 23, and the first cover plate 1, the second cover plate 3, and the intermediate layer 2 enclose a closed flow channel at the flow channel groove 21. A working medium flows in the flow channel, and thus the heat exchange function of the heat exchanger can be realized. In this way, the adhesive layer can be used to achieve the adhesive sealing between the first cover plate 1, the second cover plate 3 and the liquid cooling layer 22, which can simplify the sealing process and thus reduce the processing difficulty of the heat exchanger. Among them, special treatment can be carried out on the surfaces of the first cover plate 1 and the second cover plate 3 that are respectively in contact with the adhesive layer 23, such as surface roughening, etc., which can strengthen the adhesive strength between the first cover plate 1, the second cover plate 3 and the adhesive layer 23.

[0044] In addition, heat dissipation fins can be provided on the first cover plate 1 and / or the second cover plate 3 to increase the heat exchange area and promote air convection, further improving the heat exchange effect of the heat exchanger. Or, a more efficient working medium (such as a liquid with low viscosity and high thermal conductivity) or a phase change material can be used to further improve the heat exchange effect of the heat exchanger.

[0045] The heat exchanger provided in this embodiment can be widely applied to heat exchange of electronic devices such as tablet computers, laptop computers, smart glasses, smart watches, and smart headsets. It can effectively reduce the working temperature of the electronic devices, and improve the operation stability and service life of the electronic devices. It has a small thickness, light weight, high heat exchange efficiency, and is easy to process and install, having good market application prospects.

[0046] Optionally, the adhesive layer 23 includes at least one layer of adhesive. A bonding connection is formed between the first side of the liquid cooling layer 22 and the first cover plate 1 through the adhesive layer 23, and a bonding connection is formed between the second side of the liquid cooling layer 22 and the second cover plate 3 through the adhesive layer 23.

[0047] Specifically, according to actual design requirements, the adhesive layer 23 can include one layer, two layers or even multiple layers of adhesives to form different bonding effects. The adhesive layer 23 can include the same type of adhesive, and the adhesive layer 23 can also include different types of adhesives to meet different application requirements.

[0048] In this embodiment, both sides of the liquid cooling layer 22 are adhesively connected to the cover plate through the adhesive layer 23 to form the overall structure of the heat exchanger. Moreover, the adhesive layers 23 on both sides can also ensure the sealing of the flow channel grooves 21, preventing poor heat exchange caused by leakage of the working medium.

[0049] Optionally, the adhesive is formed into the adhesive layer 23 by dispensing or screen printing.

[0050] In this embodiment, in the dispensing and screen printing processes, the coating amount and distribution position of the adhesive can be precisely controlled to ensure that the thickness of the adhesive layer 23 on both sides of the liquid cooling layer 22 is uniform and only covers the areas that need to be bonded, which helps to reduce unnecessary material waste and improve the bonding strength and sealing performance. Among them, the coating shape and spacing of the adhesive can be adjusted according to needs to adapt to liquid cooling layers 22 and cover plates of different shapes and sizes, which helps to optimize the structure of the adhesive layer 23, increase the contact area and adhesion of the bonding interface, and thus enhance the overall bonding performance and sealing effect of the heat exchanger.

[0051] Optionally, the adhesive includes polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot-melt composite glue film, hot-melt glue or thermosetting glue.

[0052] In this embodiment, by designing the adhesive as any one of polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot-melt composite glue film, hot-melt glue and thermosetting glue, the bonding and sealing between the first cover plate 1 and the liquid cooling layer 22, and between the second cover plate 3 and the liquid cooling layer 22 can be achieved, thereby simplifying the forming process of the heat exchanger and reducing the processing difficulty of the heat exchanger.

[0053] Among them, the preferred adhesive is a pressure-sensitive hot-melt composite adhesive film. Using the pressure-sensitive hot-melt composite adhesive film to achieve the bonding of the first cover plate 1 and the liquid cooling layer 22, and the second cover plate 3 and the liquid cooling layer 22 can improve the reliability of bonding and sealing, and also improve its density, thereby improving the structural stability of the heat exchanger.

[0054] Optionally, the first cover plate 1 includes at least one of a polymer material layer and a metal layer, and / or the second cover plate 3 includes at least one of a polymer material layer and a metal layer.

[0055] In this embodiment, according to actual design requirements, the first cover plate 1 can be set to include a polymer material layer and / or a metal layer. For example, the first cover plate 1 can be set to include a metal layer, which can improve the overall strength and heat conduction performance of the heat exchanger, thereby ensuring the stability of the electronic device with the heat exchanger in a complex working environment and also reducing the working temperature of the electronic device; the first cover plate 1 can also be set to include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the carrying and use of the electronic device with the heat exchanger; the first cover plate 1 can also be set to include a polymer material layer and a metal layer, which can combine the characteristics of both to improve the comprehensive performance of the heat exchanger.

[0056] Similarly, according to actual design requirements, the second cover plate 3 can be set to include a polymer material layer and / or a metal layer. For example, the second cover plate 3 can be set to include a metal layer, which can improve the overall strength and heat conduction performance of the heat exchanger, thereby ensuring the stability of the electronic device with the heat exchanger in a complex working environment and also reducing the working temperature of the electronic device; the second cover plate 3 can also be set to include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the carrying and use of the electronic device with the heat exchanger; the second cover plate 3 can also be set to include a polymer material layer and a metal layer, which can combine the characteristics of both to improve the comprehensive performance of the heat exchanger.

[0057] Optionally, the liquid cooling layer 22 includes at least one of a polymer material layer and a metal layer.

[0058] In this embodiment, according to actual design requirements, the liquid cooling layer 22 can be set to include a polymer material layer and / or a metal layer. For example, the liquid cooling layer 22 can be set to include a metal layer, which can improve the strength and heat conduction performance of the liquid cooling layer 22, thereby improving the heat exchange efficiency of the heat exchanger, reducing the working temperature of the electronic device with the heat exchanger, and also facilitating the reduction of the thickness of the liquid cooling layer 22; the liquid cooling layer 22 can also be set to include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the carrying and use of the electronic device with the heat exchanger; the liquid cooling layer 22 can also be set to include a polymer material layer and a metal layer, which can combine the characteristics of both to improve the comprehensive performance of the heat exchanger.

[0059] For example, the liquid cooling layer 22 can be made of high thermal conductivity and corrosion-resistant metal materials such as copper, aluminum or stainless steel alloy, or can also be made of polymer materials such as PET (Polyethylene terephthalate) and PBT (Polybutylene terephthalate).

[0060] Optionally, the thickness range of the bonding layer 23 is 0.025 mm - 0.05 mm.

[0061] In this embodiment, in the dispensing or screen printing process, the thickness of the bonding layer 23 can be precisely controlled to be between 0.025 mm and 0.05 mm. While connecting the liquid cooling layer 22 with the cover plates on both sides by using the bonding layer 23, the thickness of the bonding layer 23 can also be reduced, so as to reduce the overall thickness of the heat exchanger, and further meet the requirement of thinness and lightness of the electronic device using this heat exchanger.

[0062] Among them, when the overall heat exchanger needs to be thinner, the thickness of the bonding layer 23 can be set to 0.025 mm; when there is a high demand for the connection strength of the heat exchanger, the thickness of the bonding layer 23 can be set to 0.05 mm.

[0063] Optionally, along the thickness direction of the heat exchanger, the first cover plate 1, the first bonding layer, the liquid cooling layer 22, the second bonding layer and the second cover plate 3 are sequentially stacked. The first cover plate 1 is hermetically connected to the first side of the liquid cooling layer 22 through the first bonding layer, and the second cover plate 3 is hermetically connected to the second side of the liquid cooling layer 22 through the second bonding layer.

[0064] In this way, a five-layer stacked structure of the heat exchanger can be formed. According to the actual design requirements, the thickness of each layer structure can be adjusted to reduce the overall thickness of the heat exchanger, and further meet the requirement of thinness and lightness of the electronic device using this heat exchanger.

[0065] Among them, the overall thickness range of the heat exchanger is between 0.2 mm and 0.4 mm, the thickness range of the first cover plate 1 is between 0.03 mm and 0.05 mm, the thickness range of the second cover plate 3 is between 0.03 mm and 0.05 mm, the thickness range of the first bonding layer is between 0.025 mm and 0.05 mm, the thickness range of the second bonding layer is between 0.025 mm and 0.05 mm, and the thickness range of the liquid cooling layer 22 is between 0.09 mm and 0.2 mm.

[0066] Optionally, the ratio of the thickness of the first cover plate 1 to the first bonding layer ranges from 0.6 to 2, and / or the ratio of the thickness of the second cover plate 3 to the second bonding layer ranges from 0.6 to 2.

[0067] In this embodiment, according to the connection strength requirement and size requirement of the heat exchange component, the thickness ratio of the first cover plate 1 to the first adhesive layer and the thickness ratio of the second cover plate 3 to the second adhesive layer can be adjusted, and the problem of glue overflow caused by the over-thick adhesive layer 23 can also be avoided, thereby improving the reliability of the heat exchange component.

[0068] Optionally, along the thickness direction of the heat exchange component, the edge of the adhesive layer 23 is flush with the edge of the liquid cooling layer 22. As Figure 1 shown, setting the edge of the adhesive layer 23 to be aligned with the edge of the liquid cooling layer 22 can reduce the flow resistance of the working medium in the flow channel, thereby ensuring the heat exchange effect of the heat exchange component.

[0069] Optionally, the side of the adhesive layer 23 close to the flow channel groove 21 has a guiding portion for guiding the flow of the working medium in the flow channel.

[0070] In this embodiment, a guiding portion, such as one or more rounded corners, can also be provided on the side of the adhesive layer 23 close to the flow channel groove 21. The flow resistance of the working medium in the flow channel can be reduced by means of smooth transition, which helps to reduce energy loss, can also reduce the pressure drop in the flow channel, further improve the fluidity of the working medium, and thus ensure the heat exchange effect of the heat exchange component.

[0071] Optionally, the first cover plate 1 is a single-layer structure or a multi-layer structure;

[0072] and / or, the second cover plate 3 is a single-layer structure or a multi-layer structure.

[0073] In this embodiment, the first cover plate 1 can be provided to include a single layer or multiple layers of sealing layers. The first cover plate 1 forms an adhesive seal with the first side of the liquid cooling layer 22 through the adhesive layer 23; the first cover plate 1 also includes a sealing layer and a barrier layer, and the barrier layer is arranged close to the flow channel groove 21. The first cover plate 1 forms an adhesive seal with the first side of the liquid cooling layer 22 through the adhesive layer 23, and at the same time, the barrier layer can also block foreign matters such as water and dust.

[0074] Similarly, the second cover plate 3 can be provided to include a single layer or multiple layers of sealing layers. The second cover plate 3 forms an adhesive seal with the second side of the liquid cooling layer 22 through the adhesive layer 23; the second cover plate 3 also includes a sealing layer and a barrier layer, and the barrier layer is arranged close to the flow channel groove 21. The second cover plate 3 forms an adhesive seal with the second side of the liquid cooling layer 22 through the adhesive layer 23, and at the same time, the barrier layer can also block foreign matters such as water and dust.

[0075] The embodiment of the present invention also provides a heat exchange module, including a micro pump and the foregoing heat exchange component. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micro pump and form a complete heat exchange cycle.

[0076] Optionally, a first working fluid inlet and a first working fluid outlet are provided on the heat exchange member, a second working fluid inlet and a second working fluid outlet are provided on the micro pump, the first working fluid inlet and the first working fluid outlet are respectively communicated with the flow channel, and the first working fluid inlet is communicated with the second working fluid outlet, and the first working fluid outlet is communicated with the second working fluid inlet. In this way, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet to flow, and return to the micro pump from the flow channel through the first working fluid outlet and the second working fluid inlet, so as to realize the circulation of the working fluid.

[0077] The embodiment of the present invention further provides an electronic device, including the foregoing heat exchange member or the foregoing heat exchange module. The electronic device may be a small electronic device, such as a tablet computer, a notebook computer, smart glasses, a smart watch, a smart headgear, etc.

[0078] In the above embodiments, the differences between the embodiments are mainly described. As long as the different optimization features between the embodiments do not conflict, they can be combined to form a more optimal embodiment. For the sake of brevity of the description, they will not be elaborated here.

[0079] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A heat exchange component, characterized in that, Comprising: A first cover plate (1), a second cover plate (3) and an intermediate layer (2) which are stacked, a flow channel groove (21) is formed on the intermediate layer (2), the flow channel groove (21) runs through along the thickness direction of the intermediate layer (2), the intermediate layer (2) includes a liquid cooling layer (22) and adhesive layers (23) arranged on both sides of the liquid cooling layer (22), the liquid cooling layer (22) and the adhesive layers (23) on both sides together form the side wall of the flow channel groove (21), the first cover plate (1) and the second cover plate (3) are respectively hermetically connected to the liquid cooling layer (22) through the adhesive layers (23), so that the first cover plate (1), the second cover plate (3) and the intermediate layer (2) enclose a flow channel at the flow channel groove (21).

2. The heat exchange member according to claim 1, wherein The adhesive layer (23) includes at least one layer of adhesive, a bonding connection is formed between the first side of the liquid cooling layer (22) and the first cover plate (1) through the adhesive layer (23), and a bonding connection is formed between the second side of the liquid cooling layer (22) and the second cover plate (3) through the adhesive layer (23).

3. The heat exchange member according to claim 2, characterized in that, The adhesive is formed into the adhesive layer (23) by dispensing or screen printing.

4. The heat exchange member according to claim 2, wherein, The adhesive includes polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot-melt composite glue film, hot-melt glue or thermosetting glue.

5. The heat exchange member according to claim 1, characterized in that, The first cover plate (1) includes at least one of a polymer material layer and a metal layer, and / or, the second cover plate (3) includes at least one of a polymer material layer and a metal layer.

6. The heat exchange member according to claim 1, wherein, The liquid cooling layer (22) includes at least one of a polymer material layer and a metal layer.

7. A heat exchange component according to claim 1, characterized in that, The thickness range of the adhesive layer (23) is 0.025mm - 0.05mm.

8. The heat exchange member according to claim 1, characterized in that, Along the thickness direction of the heat exchanger, the first cover plate (1), the first adhesive layer, the liquid cooling layer (22), the second adhesive layer and the second cover plate (3) are sequentially stacked, the first cover plate (1) is hermetically connected to the first side of the liquid cooling layer (22) through the first adhesive layer, and the second cover plate (3) is hermetically connected to the second side of the liquid cooling layer (22) through the second adhesive layer.

9. The heat exchange element according to claim 8, characterized in that, The ratio of the thickness of the first cover plate (1) to the first adhesive layer ranges from 0.6 to 2, and / or, the ratio of the thickness of the second cover plate (3) to the second adhesive layer ranges from 0.6 to 2.

10. A heat exchange component according to claim 1, characterized in that, Along the thickness direction of the heat exchanger, the edge of the adhesive layer (23) is flush with the edge of the liquid cooling layer (22).

11. A heat exchange member according to claim 1, characterized in that, One side of the adhesive layer (23) close to the flow channel groove (21) has a guiding portion, and the guiding portion is used to guide the flow of the working medium in the flow channel.

12. A heat exchange element according to claim 1, characterized in that, The first cover plate (1) is a single-layer structure or a multi-layer structure; and / or, the second cover plate (3) is a single-layer structure or a multi-layer structure.

13. A heat exchange module, characterized in that, Comprising a micropump and the heat exchanger according to any one of claims 1 to 12.

14. A heat exchange module according to claim 13, characterized in that, The heat exchanger has a first working fluid inlet and a first working fluid outlet, the micropump has a second working fluid inlet and a second working fluid outlet, the first working fluid inlet and the first working fluid outlet are respectively communicated with the flow channel, and the first working fluid inlet is communicated with the second working fluid outlet, and the first working fluid outlet is communicated with the second working fluid inlet.

15. An electronic device, characterized in that, Comprising the heat exchanger according to any one of claims 1 to 12 or the heat exchange module according to any one of claims 13 to 14.

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