Electronic device

Abstract

The embodiment of the utility model discloses electronic equipment, the electronic equipment comprises a body, a micropump and a heat exchange part, the micropump and the heat exchange part are respectively arranged in the body, the micropump is in sealing connection with the heat exchange part, the heat exchange part is internally provided with a flow channel, and the micropump can drive a working medium to flow in the flow channel. Therefore, the micropump can control and drive the working medium to circularly flow in the flow channel in the heat exchange part, so that the heat conduction efficiency can be enhanced, heat generated in the electronic equipment can be quickly transferred to the heat exchange part, heat exchange with the external environment is carried out through the heat exchange part, and the efficient heat exchange effect is achieved; and the use experience of the electronic equipment can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, and more specifically, to an electronic device. Background Art

[0002] With the increasing integration of electronic devices, the heat dissipation problem has become one of the key factors restricting the performance improvement. As an efficient heat dissipation component, the liquid cooling plate is widely used in various high-power density electronic devices.

[0003] However, for small electronic devices, due to the small internal space, the size of the liquid cooling plate is usually small, resulting in an unsatisfactory heat exchange effect, thereby affecting the user experience of the electronic device. Summary of the Utility Model

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide an electronic device.

[0005] According to one aspect of the present utility model, an electronic device is provided.

[0006] The electronic device includes:

[0007] A main body;

[0008] A micropump and a heat exchanger, the micropump and the heat exchanger are respectively arranged in the main body, and the micropump is hermetically connected to the heat exchanger. The heat exchanger has a flow channel, and the micropump can drive the working medium to flow in the flow channel.

[0009] Optionally, the thickness of the heat exchanger ranges from 0.2 mm to 0.4 mm.

[0010] Optionally, the thickness of the micropump ranges from 0.3 mm to 3 mm.

[0011] Optionally, the main body includes a first area and a second area, the heat exchanger can pass through the first area and the second area, and heat exchange is carried out between the first area and the second area.

[0012] Optionally, the main body includes a first main body and a second main body, the first area is located on the first main body, and the second area is located on the second main body.

[0013] Optionally, the main body further includes a connecting part, the connecting part is connected between the first main body and the second main body, and the first main body and the second main body are movably connected through the connecting part.

[0014] Optionally, the heat exchange member includes a deformation portion which is opposite to the connection portion in position. When the first body and the second body move relative to each other, the deformation portion deforms.

[0015] Optionally, the heat exchange member further includes a first heat exchange portion and a second heat exchange portion. One end of the deformation portion is connected to the first heat exchange portion, and the other end of the deformation portion is connected to the second heat exchange portion.

[0016] Optionally, both ends of the first body are respectively connected to the second body. The heat exchange member includes a deformation portion which is opposite to at least one of the first body and the second body in position. When the first body and the second body move relative to each other, the deformation portion deforms.

[0017] Optionally, the deformation portion is at least opposite to the connection region between the first body and the second body in position.

[0018] Optionally, the first body includes a first part and a second part. One end of the second body is movably connected to the first part, and the other end of the second body is movably connected to the second part.

[0019] Optionally, the heat exchange member includes two deformation portions. One deformation portion is at least opposite to the connection region between the second body and the first part in position, and the other deformation portion is at least opposite to the connection region between the second body and the second part in position. When the first body and the second body move relative to each other, at least one of the deformation portions deforms.

[0020] When the first body and the second body move relative to each other, at least one of the deformation portions deforms.

[0021] Optionally, the electronic device includes a VR device, an AR device, a laptop computer, a watch, and a tablet computer.

[0022] Optionally, the heat exchange member is attached to the inner wall of the body.

[0023] Optionally, the heat exchange member has a first working fluid inlet and a first working fluid outlet, the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively communicated with the flow channel, and the first working fluid inlet is communicated with the second working fluid outlet, and the first working fluid outlet is communicated with the second working fluid inlet.

[0024] One technical effect of the embodiments of the present disclosure is that:

[0025] The electronic device includes a body, a micropump, and a heat exchanger. The micropump and the heat exchanger are respectively disposed within the body, and the micropump is hermetically connected to the heat exchanger. The heat exchanger has a flow channel therein, and the micropump is capable of driving a working fluid to flow within the flow channel.

[0026] In this way, the micropump can control and drive the working fluid to circulate within the flow channel inside the heat exchanger, facilitating the enhancement of the heat conduction efficiency, enabling the heat generated inside the electronic device to be rapidly transferred to the heat exchanger, and performing heat exchange with the external environment through the heat exchanger, thereby achieving an efficient heat exchange effect and contributing to improving the usage experience of the electronic device.

[0027] Other features and advantages of the present invention will become clear through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. Brief Description of the Drawings

[0028] The drawings forming a part of the specification depict embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0029] Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0030] Figure 2 is a schematic diagram of a body according to an embodiment of the present disclosure;

[0031] Figure 3 is a schematic diagram of a heat exchanger according to an embodiment of the present disclosure;

[0032] Figure 4 is a schematic diagram of another body according to an embodiment of the present disclosure;

[0033] Figure 5 is a schematic diagram of yet another body according to an embodiment of the present disclosure.

[0034] Description of the Reference Numerals:

[0035] 1, body; 11, first body; 111, first part; 112, second part; 12, second body; 2, micropump; 3, heat exchanger; 31, first heat exchange part; 32, second heat exchange part; 33, deformation part. Detailed Description of the Embodiments

[0036] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0037] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present utility model, its applications, or uses.

[0038] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be regarded as part of the specification.

[0039] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0040] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0041] Embodiments of the present utility model provide an electronic device, which can be a small electronic device such as a tablet computer, a laptop computer, a VR (Virtual Reality) product, an AR (Augmented Reality) product, a watch, etc.

[0042] As Figure 1 shown, the electronic device provided by the embodiments of the present utility model includes:

[0043] A body 1;

[0044] A micropump 2 and a heat exchanger 3, the micropump 2 and the heat exchanger 3 are respectively disposed in the body 1, and the micropump 2 and the heat exchanger 3 are hermetically connected. The heat exchanger 3 has a flow channel, and the micropump 2 can drive the working fluid to flow in the flow channel.

[0045] In this embodiment, the body 1 can be the housing or casing of the electronic device. The body 1 is used to accommodate and install the micropump 2, the heat exchanger 3, and other structures, so as to facilitate the realization of the corresponding functions of the electronic device.

[0046] As Figure 1 shown, in this embodiment, by respectively disposing the micropump 2 and the heat exchanger 3 in the body 1, a heat exchange module composed of the micropump 2 and the heat exchanger 3 can be used to stably dissipate heat from the heat-generating components in the body 1, so as to reduce the operating temperature of the electronic device, thereby ensuring the normal operation of the electronic device, extending the service life of the electronic device, and improving the user experience of the electronic device. Among them, the heat-generating components in the body 1 include but are not limited to IC (Integrated Circuit), capacitors, and resistors.

[0047] In this embodiment, a heat exchange module is formed by sealingly connecting the micro pump 2 and the heat exchange member 3, which can reduce the occupation of the internal space of the electronic device and make the electronic device more compact and portable. Among them, the micro pump 2 and the heat exchange member 3 can be hermetically connected through an adhesive process, or the micro pump 2 and the heat exchange member 3 can be hermetically connected through welding processes such as laser welding, ultrasonic welding, thermocompression welding, friction welding, brazing, and diffusion welding, all of which can achieve the hermetic connection between the micro pump 2 and the heat exchange member 3, avoid problems such as liquid leakage and air leakage, and thus ensure the safe and stable operation of the electronic device.

[0048] Among them, the heat exchange member 3 has a flow channel, and the flow channel can be linear, serpentine, cross-shaped, S-shaped or other shapes to ensure that the working medium can perform heat exchange when flowing through, and thus ensure the heat exchange effect of the heat exchange member 3. Among them, the working medium is a heat exchange working medium, and the movement of the working medium can be used to achieve heat transfer, and then achieve the effect of equalizing the temperature of the electronic device, making the temperature distribution inside the electronic device more uniform, avoiding abnormalities caused by local high temperature or low temperature of the electronic device, and thus improving the overall reliability of the electronic device.

[0049] The heat exchange member 3 has a first working medium inlet and a first working medium outlet, the micro pump 2 has a second working medium inlet and a second working medium outlet, the first working medium inlet and the first working medium outlet are respectively communicated with the flow channel, and the first working medium inlet is communicated with the second working medium outlet, and the first working medium outlet is communicated with the second working medium inlet. In this way, the working medium can enter the flow channel through the second working medium outlet and the first working medium inlet and flow, and return to the micro pump 2 through the first working medium outlet and the second working medium inlet in the flow channel, thereby realizing the circulation of the working medium.

[0050] Among them, the micro pump 2 includes but is not limited to a piezoelectric pump and an electromagnetic pump. The thickness of the micro pump 2 can be between 0.3 mm and 3 mm, and the thickness of the heat exchange member 3 can be between 0.2 mm and 0.4 mm. The two are hermetically connected, so that the heat exchange module formed by the micro pump 2 and the heat exchange member 3 is also relatively thin and light, which can reduce the occupation of the internal space of the electronic device and facilitate meeting the requirements of miniaturization and thinness of the electronic device.

[0051] Moreover, the micro pump 2 can accurately control and drive the working medium to circulate in the flow channel inside the heat exchange member 3, which is convenient for enhancing the heat conduction efficiency, so that the heat generated inside the electronic device can be quickly and evenly transferred to the heat exchange member 3, and heat exchange is carried out with the external environment through the heat exchange member 3, thereby realizing an efficient heat exchange effect, which helps to improve the operation stability of the electronic device and also enhances the use experience of the electronic device.

[0052] In addition, the design of the micro pump 2 can provide a stable driving force for the working medium in the heat exchange member 3 and can easily adapt to complex flow channel designs to meet different heat exchange requirements of the electronic device.

[0053] Among them, the working state of the micro-pump 2 can be adjusted according to the actual temperature requirement of the electronic device. When the temperature of the electronic device is relatively high, the micro-pump 2 is adjusted to accelerate the flow of the working medium to improve the heat dissipation efficiency; while when the temperature of the electronic device is relatively low, the micro-pump 2 can be adjusted to reduce the flow rate or stop working to save energy, so that while effectively avoiding overheating, the energy consumption can be significantly reduced, and the energy efficiency ratio of the electronic device can also be improved.

[0054] Optionally, the thickness range of the heat exchanger 3 is 0.2 mm to 0.4 mm.

[0055] In this embodiment, setting the thickness of the heat exchanger 3 between 0.2 mm and 0.4 mm can make the heat exchange module composed of the micro-pump 2 and the heat exchanger 3 relatively thin and light, so as to reduce the occupation of the internal space of the electronic device and facilitate meeting the requirements of miniaturization and thinness of the electronic device.

[0056] Moreover, setting the heat exchanger 3 to be relatively thin can also reduce the thermal resistance in the flow channel while ensuring the sufficient structural strength of the heat exchanger 3. So that under the drive of the micro-pump 2, when the working medium flows in the flow channel, it can carry away heat more quickly, thereby realizing efficient heat conduction, which helps to ensure that the electronic device can maintain a relatively low working temperature during high-load operation, thereby extending the service life of the electronic device.

[0057] Optionally, the thickness range of the micro-pump 2 is 0.3 mm to 3 mm.

[0058] In this embodiment, setting the thickness of the micro-pump 2 between 0.3 mm and 3 mm can make the heat exchange module composed of the micro-pump 2 and the heat exchanger 3 relatively thin and light, so as to reduce the occupation of the internal space of the electronic device and facilitate meeting the requirements of miniaturization and thinness of the electronic device.

[0059] In one embodiment, the thickness of the micro-pump 2 can be designed to be 0.3 mm, which can realize an ultra-thin structure of the micro-pump 2 and help to meet the requirements of miniaturization and thinness of the electronic device.

[0060] In another embodiment, the thickness of the micro-pump 2 can be designed to be 1.2 mm, which can realize an ultra-thin structure of the micro-pump 2 and help to meet the requirements of miniaturization and thinness of the electronic device.

[0061] In yet another embodiment, the thickness of the micro-pump 2 can be designed to be 3 mm, which can realize an ultra-thin structure of the micro-pump 2 and help to meet the requirements of miniaturization and thinness of the electronic device.

[0062] In addition, while maintaining efficient heat dissipation, by optimizing the thickness of the micropump 2, the energy consumption during its operation can also be reduced, which helps to improve the energy efficiency ratio of the electronic device. Moreover, the thinner micropump 2 has higher efficiency in terms of material usage, manufacturing, etc., thereby helping to reduce production costs and enhance the market competitiveness of the electronic device.

[0063] Optionally, the body 1 includes a first region and a second region, and the heat exchange member 3 can pass through the first region and the second region and perform heat exchange between the first region and the second region.

[0064] In this embodiment, the body 1 can have two regions, namely a first region and a second region. The first region can be a high-temperature region, and the second region can be a low-temperature region. The heat exchange member 3 is arranged to pass through the first region and the second region, so that heat exchange can be carried out between the high-temperature region and the low-temperature region by using the heat exchange member 3, thereby realizing the temperature equalization of the first region and the second region and avoiding abnormalities such as local high temperature or local low temperature.

[0065] Among them, the first region can include a plurality of first sub-regions, and the second region can also include a plurality of second sub-regions. The heat exchange member 3 can be used to realize the temperature equalization of the plurality of first sub-regions and the plurality of second sub-regions, thereby ensuring the temperature consistency of the electronic device.

[0066] Among them, when the body 1 includes one structure, the first region and the second region can be different regions on this structure, such as different heat-generating areas of a tablet computer; when the body 1 includes a plurality of structures, the first region and the second region can be regions on different structures to enable heat exchange between different structures within the body 1, such as the screen side and the chip side of a laptop computer.

[0067] Optionally, the body 1 includes a first body 11 and a second body 12, the first region is located on the first body 11, and the second region is located on the second body 12.

[0068] In this embodiment, the body 1 can include two structures, namely a first body 11 and a second body 12. The first region is a high-temperature region on the first body 11, and the second region is a low-temperature region on the second body 12, so that heat exchange between the high-temperature region and the low-temperature region can be realized through the heat exchange member 3, which is convenient for reducing the operating temperature of the electronic device.

[0069] Among them, the first body 11 and the second body 12 can be movably connected, that is, the body 1 formed by the first body 11 and the second body 1 can be deformed; the first body 11 and the second body 12 can also be fixedly connected, that is, the body 1 formed by the first body 11 and the second body 1 has no deformation requirement.

[0070] Optionally, the body 1 further includes a connecting portion that is connected between the first body 11 and the second body 12, and the first body 11 and the second body 12 are movably connected through the connecting portion.

[0071] As Figure 2 shown, in this embodiment, when the electronic device is a laptop computer, the connecting portion can be a hinge structure in the middle. One of the first body 11 and the second body 12 is the screen side, and the other of the first body 11 and the second body 12 is the keyboard side. A chip is provided inside the keyboard side. During the operation of the laptop computer, the chip on the keyboard side generates heat, causing the temperature of the keyboard side to rise.

[0072] Setting the heat exchange member 3 to pass through the first body 11 and the second body 12 can transfer the heat on the keyboard side to the screen side through the heat exchange member 3, which is convenient for transferring it to the outside from the screen side, thereby enabling the laptop computer to cool down and ensuring the temperature consistency of the laptop computer.

[0073] Optionally, the heat exchange member 3 includes a deformation portion 33, and the deformation portion 33 is opposite to the connecting portion in position. When the first body 11 and the second body 12 move relative to each other, the deformation portion 33 deforms.

[0074] In this embodiment, the deformation portion 33 is usually a flexible structure, that is, the deformation portion 33 can be bent, stretched or deformed. For example, the deformation portion 33 can be made of polymer materials such as PET (Polyethylene terephthalate) and PBT (Polybutylene terephthalate), or the deformation portion 33 can also be made of elastic metal, so that it can deform following the deformation of the body 1, thereby being able to adapt to the deformation requirements of the electronic device and meet the requirements of different usage states of the electronic device.

[0075] In addition, the design of the deformation portion 33 also makes the heat exchange member 3 no longer limited to a fixed shape and angle, and can easily cope with various complex installation environments and space limitations, facilitating adaptation to electronic devices with different usage requirements, and also enhancing the adaptability and flexibility of the heat exchange member 3.

[0076] Optionally, the heat exchange member 3 further includes a first heat exchange portion 31 and a second heat exchange portion 32. One end of the deformation portion 33 is connected to the first heat exchange portion 31, and the other end of the deformation portion 33 is connected to the second heat exchange portion 32.

[0077] As Figure 3As shown, in this embodiment, when the deformation part 33 deforms, the deformation part 33 can drive at least one of the first heat exchange part 31 and the second heat exchange part 32 to move, so that an included angle is formed between the first heat exchange part 31 and the second heat exchange part 32, thereby changing the overall shape of the heat exchange member 3, facilitating the application of the heat exchange member 3 in electronic devices with deformation requirements, adapting to different usage states of the electronic devices, and also improving the flexibility of the heat exchange member 3.

[0078] Specifically, according to actual design requirements, the first heat exchange part 31 can be set to include a polymer material layer and / or a metal layer. For example, the first heat exchange part 31 can be set to include a metal layer, which can improve the strength and heat conduction performance of the first heat exchange part 31, thereby improving the heat exchange efficiency of the heat exchange member 3, reducing the working temperature of the electronic device with the heat exchange member 3, and also facilitating the reduction of the thickness of the first heat exchange part 31; the first heat exchange part 31 can also be set to include a polymer material layer, which can meet the lightweight design requirements of the heat exchange member 3, thereby facilitating the carrying and use of the electronic device with the heat exchange member 3; the first heat exchange part 31 can also be set to include a polymer material layer and a metal layer, which can combine the characteristics of both to improve the comprehensive performance of the heat exchange member 3.

[0079] Similarly, according to actual design requirements, the second heat exchange part 32 can be set to include a polymer material layer and / or a metal layer. For example, the second heat exchange part 32 can be set to include a metal layer, which can improve the strength and heat conduction performance of the second heat exchange part 32, thereby improving the heat exchange efficiency of the heat exchange member 3, reducing the working temperature of the electronic device with the heat exchange member 3, and also facilitating the reduction of the thickness of the second heat exchange part 32; the second heat exchange part 32 can also be set to include a polymer material layer, which can meet the lightweight design requirements of the heat exchange member 3, thereby facilitating the carrying and use of the electronic device with the heat exchange member 3; the second heat exchange part 32 can also be set to include a polymer material layer and a metal layer, which can combine the characteristics of both to improve the comprehensive performance of the heat exchange member 3.

[0080] When the heat exchange member 3 is applied to a laptop computer, one of the first heat exchange part 31 and the second heat exchange part 32 can be opposite to the chip side, and the other of the first heat exchange part 31 and the second heat exchange part 32 can be opposite to the screen side. The deformation part 33 is at least opposite to the intermediate connection structure, so that the heat exchange member 3 can adapt to the folding of the laptop computer, and the heat transfer between the first heat exchange part 31 and the second heat exchange part 32 can also be realized through the deformation part 33, so that the heat generated on the chip side can be transferred to the screen side through the deformation part 33, facilitating the cooling of the laptop computer, and further ensuring the normal operation of the laptop computer.

[0081] Optionally, both ends of the first body 11 are respectively connected to the second body 12. The heat exchange member 3 includes a deformation part 33, and the deformation part 33 is opposite to at least one position of the first body 11 and the second body 12. When the first body 11 and the second body 12 perform relative movement, the deformation part 33 deforms.

[0082] In this embodiment, the heat exchange member 3 can be applied to electronic devices such as VR (Virtual Reality) headsets or watches.

[0083] Taking a VR headset as an example. As Figure 4 shown, a VR headset generally includes a head-mounted display and a strap. That is, one of the first body 11 and the second body 12 is the head-mounted display, and the other of the first body 11 and the second body 12 is the strap, and the head-mounted display and the strap are movably connected. One of the first heat exchange part 31 and the second heat exchange part 32 is opposite to the head-mounted display, and the other of the first heat exchange part 31 and the second heat exchange part 32 is opposite to the strap. The deformation part 33 is at least opposite to the connection area of the head-mounted display and the strap, so that the heat exchange member 3 can adapt to the wearing and use of the VR headset, and can also realize the heat transfer between the first heat exchange part 31 and the second heat exchange part 32 through the deformation part 33, so as to transfer the heat generated on the head-mounted display to the strap, so as to facilitate the cooling of the VR headset, and further ensure the normal operation of the VR headset.

[0084] Optionally, the deformation part 33 is at least opposite to the connection area of the first body 11 and the second body 12, so that the deformation part 33 can adapt to the relative movement of the first body 11 and the second body 12, thereby meeting the deformation requirements of the electronic device.

[0085] Optionally, the first body 11 includes a first part 111 and a second part 112. One end of the second body 12 is movably connected to the first part 111, and the other end of the second body 12 is movably connected to the second part 112.

[0086] As Figure 5 shown, in this embodiment, the heat exchange member 3 can also be applied to AR (Augmented Reality) glasses. AR glasses generally include two temple arms, and the two temple arms are movably connected through a middle frame to meet the folding requirements of the AR glasses. That is, the first part 111 and the second part 112 are respectively the two temple arms, and the second body 12 is the middle frame.

[0087] When the heat exchange member 3 is applied, one of the first heat exchange portion 31 and the second heat exchange portion 32 can be opposed to one temple, and the other of the first heat exchange portion 31 and the second heat exchange portion 32 can be opposed to the other temple. The deformation portion 33 is at least opposed to the middle frame, so that the heat exchange member 3 can meet the folding requirement of the AR glasses, and heat transfer between the first heat exchange portion 31 and the second heat exchange portion 32 can also be achieved through the deformation portion 33, so that the heat generated on one temple can be transferred to the other temple, facilitating the cooling of the AR glasses, and further ensuring the normal operation of the AR glasses.

[0088] Optionally, the heat exchange member 3 includes two deformation portions 33. One deformation portion 33 is at least opposed to the connection region between the second body 12 and the first portion 111, and the other deformation portion 33 is at least opposed to the connection region between the second body 12 and the second portion 112;

[0089] When the first body 11 and the second body 12 move relative to each other, at least one of the deformation portions 33 deforms.

[0090] In this embodiment, according to the actual deformation requirements of the electronic device, the number of the deformation portions 33 can be adjusted. For example, as Figure 5 shown, when only the folding between the first portion 111 and the second body 12 is required, the deformation portion 33 can be arranged corresponding to the connection region between the first portion 111 and the second body 12; when folding is required both between the first portion 111 and the second body 12 and between the second portion 112 and the second body 12, a deformation portion 33 can be arranged corresponding to the connection region between the first portion 111 and the second body 12 and the connection region between the second portion 112 and the second body 12.

[0091] Optionally, the electronic device includes a VR device, an AR device, a laptop computer, a watch, and a tablet computer. The heat exchange module composed of the micro pump 2 and the heat exchange member 3 can dissipate heat from the heat generating components in the electronic device, so as to reduce the operating temperature of the electronic device, thereby ensuring the normal operation of the electronic device and extending the service life of the electronic device.

[0092] Optionally, the heat exchange member 3 is attached to the inner wall of the body 1. For example, the heat exchange member 3 can be attached to the inner wall of the body 1 through a heat conductive adhesive, which can increase the contact area between the heat exchange member 3 and the body 1 and quickly transfer the heat in the body 1 to the heat exchange member 3, thereby improving the heat exchange effect of the heat exchange member 3.

[0093] Optionally, the heat exchanger 3 is provided with a first working fluid inlet and a first working fluid outlet, the micro pump 2 is provided with a second working fluid inlet and a second working fluid outlet, the first working fluid inlet and the first working fluid outlet are respectively communicated with the flow channel, and the first working fluid inlet is communicated with the second working fluid outlet, and the first working fluid outlet is communicated with the second working fluid inlet. In this way, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet and flow therein, and return to the micro pump 2 through the first working fluid outlet and the second working fluid inlet in the flow channel, thereby realizing the circulation of the working fluid.

[0094] The differences between the above embodiments are mainly described. As long as the different optimization features between the embodiments do not conflict, they can be combined to form a better embodiment. Considering the simplicity of the text, it will not be elaborated here.

[0095] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. An electronic device, characterized in that, Comprising: A body (1); A micropump (2) and a heat exchanger (3), the micropump (2) and the heat exchanger (3) are respectively arranged in the body (1), and the micropump (2) is hermetically connected to the heat exchanger (3). The heat exchanger (3) has a flow channel, and the micropump (2) can drive the working medium to flow in the flow channel.

2. The electronic device according to claim 1, wherein The thickness of the heat exchanger (3) ranges from 0.2 mm to 0.4 mm.

3. The electronic device according to claim 1, characterized in that The thickness of the micropump (2) ranges from 0.3 mm to 3 mm.

4. The electronic device according to claim 1, wherein The body (1) includes a first region and a second region. The heat exchanger (3) can pass through the first region and the second region and exchange heat between the first region and the second region.

5. The electronic device according to claim 4, wherein The body (1) includes a first body (11) and a second body (12). The first region is located on the first body (11), and the second region is located on the second body (12).

6. The electronic device according to claim 5, characterized in that, The body (1) further includes a connecting portion. The connecting portion is connected between the first body (11) and the second body (12), and the first body (11) and the second body (12) are movably connected through the connecting portion.

7. The electronic device according to claim 6, wherein The heat exchanger (3) includes a deformation portion (33). The deformation portion (33) is opposite to the connecting portion in position. When the first body (11) and the second body (12) move relative to each other, the deformation portion (33) deforms.

8. The electronic device according to claim 7, wherein The heat exchanger (3) further includes a first heat exchange portion (31) and a second heat exchange portion (32). One end of the deformation portion (33) is connected to the first heat exchange portion (31), and the other end of the deformation portion (33) is connected to the second heat exchange portion (32).

9. The electronic device according to claim 5, wherein Both ends of the first body (11) are respectively connected to the second body (12). The heat exchanger (3) includes a deformation portion (33). The deformation portion (33) is opposite to at least one of the first body (11) and the second body (12) in position. When the first body (11) and the second body (12) move relative to each other, the deformation portion (33) deforms.

10. The electronic device according to claim 9, characterized in that, The deformation portion (33) is at least opposite to the connection region between the first body (11) and the second body (12) in position.

11. The electronic device according to claim 5, characterized in that, The first body (11) includes a first part (111) and a second part (112). One end of the second body (12) is movably connected to the first part (111), and the other end of the second body (12) is movably connected to the second part (112).

12. The electronic device according to claim 11, characterized in that, The heat exchanger (3) includes two deformation portions (33). One deformation portion (33) is at least opposite to the connection region between the second body (12) and the first part (111) in position, and the other deformation portion (33) is at least opposite to the connection region between the second body (12) and the second part (112) in position; When the first body (11) and the second body (12) move relative to each other, at least one of the deformation portions (33) deforms.

13. The electronic device according to claim 1, wherein The electronic device includes VR devices, AR devices, laptops, watches, and tablets.

14. The electronic device according to claim 1, wherein The heat exchanger (3) is attached to the inner wall of the body (1).

15. An electronic device according to any one of claims 1 to 14, characterized in that The heat exchanger (3) has a first working fluid inlet and a first working fluid outlet, the micro pump (2) has a second working fluid inlet and a second working fluid outlet, the first working fluid inlet and the first working fluid outlet are respectively communicated with the flow channel, and the first working fluid inlet is communicated with the second working fluid outlet, and the first working fluid outlet is communicated with the second working fluid inlet.

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