Screen assembly and electronic equipment

Abstract

The utility model discloses a screen assembly and electronic equipment, and belongs to the technical field of electronic equipment. The screen assembly comprises a light-emitting layer assembly; the supporting layer is connected with the light-emitting layer assembly and used for supporting the light-emitting layer assembly; at least one part of the conductive assembly is arranged in the supporting layer, and the conductive assembly is used for being grounded; and the circuit board assembly is connected to the light-emitting layer assembly and the conductive assembly.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to a screen assembly and an electronic device. Background Art

[0002] Regarding the grounding requirements of electronic devices in the screen assembly of an electronic device, such as electronic devices like light-emitting diodes and circuit boards, during the operation of the screen assembly, grounding is required to ensure the normal operation of the screen assembly.

[0003] However, in the related art, as Figure 1 shown, the screen assembly is usually a stacked structure. On the back of the screen assembly, a layer of copper foil needs to be provided. The circuit board 106' in the screen assembly is grounded through the copper foil 102', and moreover, the copper foil 102' needs to be connected and fixed through a layer of conductive adhesive 104'. The setting of the copper foil 102' and the conductive adhesive 104' will cause an increase in the thickness of the screen assembly. Especially for foldable screens and curved screens, there are higher requirements for the thin and light design of the screen. Therefore, the method of grounding by setting the copper foil 102' will seriously affect the thin and light design of the electronic device. Summary of the Utility Model

[0004] This application aims to provide a screen assembly and an electronic device, which can solve the technical problem that the thickness of the screen assembly increases due to grounding by setting copper foil in the related art.

[0005] In a first aspect, an embodiment of this application provides a screen assembly, including:

[0006] A light-emitting layer assembly;

[0007] A support layer, connected to the light-emitting layer assembly and used to support the light-emitting layer assembly;

[0008] A conductive assembly, at least a part of the conductive assembly is disposed in the support layer, and the conductive assembly is used for grounding;

[0009] A circuit board assembly, the circuit board assembly is connected to the light-emitting layer assembly and the conductive assembly.

[0010] In a second aspect, an embodiment of this application provides an electronic device, including: the screen assembly as in the first aspect.

[0011] The screen component of the embodiment of the present application includes a light-emitting layer component, a support layer, a conductive component, and a circuit board component. Among them, both the light-emitting layer component and the circuit board component are grounded through the conductive component, and at least a part of the conductive component is arranged in the support layer, so that at least a part of the conductive component can be arranged by using the internal space of the support layer. By arranging at least a part of the conductive component in the support layer, there is no need to set copper foil and conductive adhesive as in the related art to meet the grounding requirements of the light-emitting layer component and the circuit board component. Compared with the screen component in the related art, the screen component of the present application can effectively reduce the thickness of the screen component on the basis of grounding the light-emitting layer component and the circuit board component through the conductive component, which is beneficial to the thin and light design of the screen component.

[0012] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0013] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0014] Figure 1 A schematic structural diagram of a screen component of the related art is shown;

[0015] Figure 2 A schematic structural diagram of a screen component of an embodiment of the present application is shown;

[0016] Figure 3 Shows Figure 2 A partial enlarged view of part A in;

[0017] Figure 4 A structural block diagram of an electronic device of an embodiment of the present application is shown.

[0018] Reference Signs:

[0019] 102' copper foil, 104' conductive adhesive, 106' circuit board;

[0020] 100 screen component, 102 light-emitting layer component, 104 support layer, 106 conductive component, 108 circuit board component, 110 carrier, 112 support fiber, 114 metal coating, 116 first conductive particle, 118 second conductive particle, 120 flexible circuit board, 122 connecting portion, 124 main body, 126 metal connection layer, 128 integrated circuit, 130 first support fiber, 132 second support fiber, 134 light-emitting layer, 136 connection layer, 138 protective layer, 140 support film, 142 pressure-sensitive adhesive, 144 polarizer, 146 glass layer, 148 optical adhesive, 150 PET cover plate, 200 electronic device. Detailed Description of the Embodiments

[0021] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0022] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0023] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0024] The following will be combined with Figures 2 to 4 Describe a screen assembly and an electronic device according to an embodiment of the present application.

[0025] In some embodiments of the present application, a screen assembly is provided. Figure 2 The structural schematic diagram of the screen assembly according to the embodiment of the present application is shown. Figure 3 Shown is Figure 2 The partial enlarged view at A in Figure 2 And Figure 3 As shown in

[0026] In an embodiment of the present application, the screen assembly 100 includes a light-emitting layer assembly 102 and a support layer 104. Among them, the light-emitting layer assembly 102 is used to emit light during the operation of the screen assembly 100 to achieve the display function of the screen assembly 100. Specifically, the light-emitting layer may include Active Matrix Organic Light Emitting Diode (AMOLED). The support layer 104 can be used to support the light-emitting layer to ensure the stability of the light-emitting layer assembly 102. Especially when the screen assembly 100 is a foldable screen or a curved screen, the support layer 104 can effectively support the light-emitting layer assembly 102 during the bending process of the screen, ensuring the structural stability of the light-emitting layer assembly 102.

[0027] Further, the screen assembly 100 further includes a circuit board assembly 108, and the circuit board assembly 108 is connected to the light-emitting layer assembly 102. Through the circuit board assembly 108, the control of the light-emitting layer assembly 102 can be realized, that is, the different brightness and combination modes of multiple Active Matrix Organic Light Emitting Diodes in the light-emitting layer assembly 102 are controlled, and then different contents are displayed on the screen assembly 100.

[0028] Further, the screen assembly 100 further includes a conductive assembly 106. The conductive assembly 106 is used for grounding. Moreover, both the light-emitting layer assembly 102 and the circuit board assembly 108 are connected to the conductive assembly 106, so that the light-emitting layer assembly 102 and the circuit board assembly 108 can be grounded through the conductive assembly 106, thereby ensuring the grounding requirements of the light-emitting layer assembly 102 and the circuit board assembly 108 to ensure the normal operation of the light-emitting layer assembly 102 and the circuit board assembly 108.

[0029] Moreover, at least a part of the conductive assembly 106 is disposed within the support layer 104, that is, at least a part of the conductive assembly 106 can be disposed by utilizing the internal space of the support layer 104, so that there is no need to provide an additional conductive layer to achieve grounding. That is, by disposing at least a part of the conductive assembly 106 within the support layer 104, there is no need to provide copper foil and conductive adhesive as in the related art to meet the grounding requirements of the light-emitting layer assembly and the circuit board. Therefore, compared with the screen assembly in the related art, the screen assembly 100 of the present application can effectively reduce the thickness of the screen assembly 100 on the basis of grounding the light-emitting layer assembly 102 and the circuit board assembly 108 through the conductive assembly 106, which is beneficial to the thin and light design of the screen assembly 100.

[0030] In addition, compared with the related art where grounding is achieved through copper foil and conductive adhesive, the screen assembly 100 of the present application does not require the setting of copper foil, thereby avoiding unnecessary electrical signals that may be generated when current passes through the copper foil during the operation of the screen assembly 100. That is, it avoids the interference caused by the unnecessary electrical signals generated by the copper foil to the operation of the screen assembly 100, and improves the stability of the operation of the screen assembly 100. At the same time, without the need to set copper foil and conductive adhesive, it also avoids the situation where the conductive adhesive peels off during the operation of the screen assembly 100 in a high-temperature and high-humidity environment, resulting in the inability of the copper foil to be stably grounded.

[0031] The screen assembly 100 of the embodiment of the present application includes a light-emitting layer assembly 102, a support layer 104, a conductive assembly 106, and a circuit board assembly 108. Among them, both the light-emitting layer assembly 102 and the circuit board assembly 108 are grounded through the conductive assembly 106, and at least a part of the conductive assembly 106 is disposed within the support layer 104, so that at least a part of the conductive assembly 106 can be disposed by utilizing the internal space of the support layer 104. By disposing at least a part of the conductive assembly 106 within the support layer 104, there is no need to set copper foil and conductive adhesive as in the related art to meet the grounding requirements of the light-emitting layer assembly and the circuit board. Compared with the screen assembly in the related art, the screen assembly 100 of the present application can effectively reduce the thickness of the screen assembly 100 on the basis of grounding the light-emitting layer assembly 102 and the circuit board assembly 108 through the conductive assembly 106, which is beneficial to the thin and light design of the screen assembly 100.

[0032] In some embodiments of the present application, the support layer 104 includes: a carrier 110 connected to the light-emitting layer assembly 102; a plurality of support fibers 112 disposed within the carrier 110; the conductive assembly 106 includes: a metal coating 114 disposed on the surface of the support fibers 112, and the metal coating 114 is used for grounding; a plurality of first conductive particles 116, and the plurality of conductive particles are disposed within the carrier 110, wherein adjacent metal coatings 114 are connected by the plurality of first conductive particles 116.

[0033] In the embodiment of the present application, as Figure 3 shown, the support layer 104 may include a carrier 110 and a plurality of support fibers 112 disposed within the carrier 110. By setting the plurality of support fibers 112, the structural strength of the support layer 104 during deformation can be improved, so that the support layer 104 can withstand greater deformation. By setting the carrier 110, the connection of the plurality of support fibers 112 is realized, thereby further improving the structural integrity of the support layer 104 and further improving the structural strength of the support layer 104. Specifically, the support fibers 112 may be carbon fibers to ensure the strength of the support fibers 112, and the carrier 110 may be a resin, specifically an epoxy resin material, that is, the carbon fibers are wrapped inside the resin material.

[0034] Further, the conductive component 106 may include a metal coating 114 and a plurality of first conductive particles 116. Among them, the metal coating 114 is disposed on the surface of the support fiber 112. At the same time, the plurality of first conductive particles 116 are disposed inside the carrier 110 so that adjacent metal coatings 114 can be connected through the plurality of first conductive particles 116.

[0035] It can be understood that the support fibers 112 are usually arranged in an orderly manner within the carrier 110, and a metal coating 114 is disposed on the surface of each support fiber 112. At the same time, by disposing a plurality of first conductive particles 116 between two adjacent support fibers 112, two adjacent support fibers 112 are connected in series through the plurality of first conductive particles 116. That is, the plurality of support fibers 112 within the carrier 110 can be connected in series through the plurality of first conductive particles 116, thereby reducing the impedance of the support layer 104. At the same time, grounding the metal coating 114 also realizes the grounding of the conductive component 106.

[0036] Further, both the light-emitting layer assembly 102 and the circuit board assembly 108 are connected to the plurality of first conductive particles 116, thereby realizing the grounding of the light-emitting layer assembly 102 and the circuit board assembly 108 through the conductive component 106, meeting the grounding requirements of the light-emitting layer assembly 102 and the circuit board assembly 108.

[0037] In the embodiment of the present application, by setting the conductive component 106 as the metal coating 114 and the plurality of first conductive particles 116, and grounding the metal coating 114, adjacent two metal coatings 114 are connected through the plurality of first conductive particles 116, realizing the setting of the conductive component 106 within the support layer 104. Thus, there is no need to provide copper foil and conductive adhesive as in the related art to meet the grounding requirements of the light-emitting layer assembly and the circuit board assembly. On the basis of realizing the grounding of the light-emitting layer assembly 102 and the circuit board assembly 108 through the conductive component 106, the thickness of the screen assembly 100 can be effectively reduced, which is beneficial to the thin and light design of the screen assembly 100.

[0038] In some embodiments of the present application, the conductive component 106 further includes: a plurality of second conductive particles 118. At least a part of the plurality of second conductive particles 118 protrudes from the carrier 110, and the plurality of second conductive particles 118 are connected to the plurality of first conductive particles 116.

[0039] In the embodiment of the present application, as Figure 3As shown, the conductive component 106 may further include a plurality of second conductive particles 118. The plurality of second conductive particles 118 are connected to the plurality of first conductive particles 116, and at least a part of the second conductive particles 118 protrudes outside the carrier 110. In this way, other electrical components in the screen component 100 can be connected to the second conductive particles 118, or when the screen component 100 is installed in an electronic device, the electrical components in the electronic device can also be connected to the second conductive particles 118, so as to achieve grounding, which facilitates the grounding of the electrical components in the screen component 100 and the electronic device.

[0040] In some embodiments of the present application, the circuit board assembly 108 includes: a flexible circuit board 120; at least one connecting portion 122 disposed on the flexible circuit board 120. At least a part of the connecting portion 122 is located within the carrier 110 and is connected to the plurality of first conductive particles 116.

[0041] In the embodiments of the present application, as Figure 2 and Figure 3 shown, the circuit board assembly 108 may include a flexible circuit board 120 and at least one connecting portion 122 disposed on the flexible circuit board 120. Through the arrangement of the flexible circuit board 120, when the screen component 100 is a bendable screen or a curved screen, bending can be achieved through the flexible circuit board 120 to ensure the normal operation of the flexible circuit board 120.

[0042] Furthermore, through the connecting portion 122, an electrical connection between the flexible circuit board 120 and the conductive component 106 can be achieved, that is, the flexible circuit board 120 is grounded through the conductive component 106. Specifically, at least a part of the connecting portion 122 can be disposed within the carrier 110 of the support layer 104, so that the connecting portion 122 can be connected to the plurality of first conductive particles 116 within the carrier 110, and further the flexible circuit board 120 is grounded through the first conductive particles 116 and the metal coating 114.

[0043] Specifically, the connecting portion 122 and the carrier 110 can be connected by hot pressing, so that at least a part of the connecting portion 122 can extend into the carrier 110 and be connected to the plurality of first conductive particles 116 within the carrier 110.

[0044] In some embodiments of the present application, the connecting portion 122 includes: a main body 124 disposed on the flexible circuit board 120; a metal connecting layer 126 covering the main body 124. At least a part of the metal connecting layer 126 is located within the carrier 110 and is connected to the plurality of first conductive particles 116.

[0045] In the embodiments of the present application, as Figure 3As shown, the connecting portion 122 may include a main body 124 and a metal connecting layer 126 covering the surface of the main body 124. Among them, the main body 124 may be a columnar structure, and the metal connecting layer 126 covers the surface of the columnar main body 124. By means of hot pressing, the top of the main body 124 can be pressed into the carrier 110, so that the metal connecting layer 126 on the surface of the main body 124 is connected to a plurality of first conductive particles 116, so as to realize the connection of the flexible circuit board 120 to the first conductive particles 116 through the connecting portion 122, and further realize the grounding of the flexible circuit board 120.

[0046] In some embodiments of the present application, the circuit board assembly 108 further includes: an integrated circuit 128, which is arranged on the flexible circuit board 120, and the integrated circuit 128 is connected to the light-emitting layer assembly 102 through the flexible circuit board 120.

[0047] In the embodiments of the present application, as Figure 2 shown, the circuit board assembly 108 further includes an integrated circuit 128. The integrated circuit 128 may be arranged on the flexible circuit board 120. Through the integrated circuit 128, the specific light-emitting mode of the light-emitting layer assembly 102 can be controlled to realize the control of the screen assembly 100 to display corresponding content, and further realize the display function of the screen assembly 100.

[0048] In some embodiments of the present application, the plurality of support fibers 112 include a plurality of first support fibers 130 and a plurality of second support fibers 132, wherein the extending directions of the first support fibers 130 and the second support fibers 132 are different.

[0049] In the embodiments of the present application, as Figure 3 shown, the plurality of support fibers 112 may include a plurality of first support fibers 130 and a plurality of second support fibers 132. It can be understood that the plurality of first support fibers 130 and the plurality of second support fibers 132 are both located inside the carrier 110.

[0050] Furthermore, the extending directions of the first support fibers 130 and the second support fibers 132 are different. That is, inside the carrier 110, the plurality of first support fibers 130 and the plurality of second support fibers 132 extend alternately, so that the anti-bending performance of the support layer 104 in multiple directions can be effectively improved, and further the overall strength of the support layer 104 can be ensured, and the support effect of the support layer 104 on the light-emitting layer assembly 102 can be improved.

[0051] In some embodiments of the present application, the light-emitting layer assembly 102 includes: a light-emitting layer 134, which is connected to the circuit board assembly 108; a connecting layer 136, which is respectively connected to the support layer 104 and the light-emitting layer 134.

[0052] In the embodiments of the present application, as Figure 2As shown, the light-emitting layer assembly 102 may include a light-emitting layer 134 and a connection layer 136. Among them, the light-emitting layer 134 is connected to the circuit board assembly 108, so as to achieve different light-emitting modes under the control of the circuit board assembly 108, and then realize the display function of the screen assembly 100. The connection part is located between the light-emitting layer 134 and the support layer 104 to realize the connection between the light-emitting layer 134 and the support layer 104, so as to ensure the connection stability between the light-emitting layer 134 and the support layer 104.

[0053] Exemplarily, as Figure 2 shown, the connection layer 136 may include a support film 140 (Back plate film, BPF) and a pressure-sensitive adhesive 142 (Pressure sensitive adhesive, PSA). Among them, the pressure-sensitive adhesive 142 covers the surface of the support layer 104, the support film 140 covers the surface of the pressure-sensitive adhesive 142, and the light-emitting layer 134 covers the surface of the support film 140.

[0054] In some embodiments of the present application, the light-emitting layer assembly 102 further includes: a protective layer 138, covering the side of the light-emitting layer 134 away from the connection layer 136.

[0055] In the embodiments of the present application, as Figure 2 shown, the light-emitting layer assembly 102 may further include a protective layer 138. The protective layer 138 covers the side of the light-emitting side away from the connection layer 136, so as to protect the light-emitting layer 134 and prevent the light-emitting layer 134 from being impacted by external objects. In addition, the protective layer 138 can also refract or reflect light to improve the visual effect of the screen assembly 100.

[0056] Exemplarily, as Figure 2 shown, the protective layer 138 may include a polarizer 144 (Polarizer, POL), covering the surface of the light-emitting layer 134, which can block the reflected light to improve the visual effect of the screen assembly 100. A glass layer 146 (utra thinglass, UTG), covering the surface of the polarizer 144. An optical adhesive 148 (Optically Clear Adhesive, OCA) may also be provided between the polarizer 144 and the glass layer 146 to realize the bonding between the polarizer 144 and the glass layer 146. Further, a PET cover plate 150 (Polyethylene terephthalate) may be provided on the surface of the glass layer 146 to protect the glass layer 146. Correspondingly, an optical adhesive 148 may also be provided between the PET cover plate 150 and the glass layer 146 to realize the bonding between the two.

[0057] The embodiments of the present application further provide an electronic device 200. Figure 4 The block diagram of the electronic device according to the embodiments of the present application is shown; as Figure 4 shown, the electronic device 200 includes a screen assembly 100 according to any one of the above embodiments.

[0058] Since the electronic device 200 proposed in this embodiment has the screen assembly 100 according to any one of the above embodiments, it has the beneficial effects of any one of the above embodiments, which will not be elaborated here one by one.

[0059] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0060] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A screen component, characterized in that, Comprising: A light-emitting layer assembly; A support layer, connected to the light-emitting layer assembly for supporting the light-emitting layer assembly; A conductive assembly, at least a part of the conductive assembly being disposed within the support layer, the conductive assembly being used for grounding; A circuit board assembly, the circuit board assembly being connected to the light-emitting layer assembly and the conductive assembly.

2. The screen component according to claim 1, wherein The support layer comprises: A carrier, connected to the light-emitting layer assembly; A plurality of support fibers, disposed within the carrier; The conductive assembly comprises: A metal coating, disposed on the surface of the support fibers, the metal coating being used for grounding; A plurality of first conductive particles, the plurality of first conductive particles being disposed within the carrier, wherein adjacent metal coatings are connected by the plurality of first conductive particles.

3. The screen assembly according to claim 2, wherein The conductive assembly further comprises: A plurality of second conductive particles, at least a part of the plurality of second conductive particles protruding from the carrier, the plurality of second conductive particles being connected to the plurality of first conductive particles.

4. The screen assembly according to claim 2, wherein The circuit board assembly comprises: A flexible circuit board; At least one connecting portion, disposed on the flexible circuit board, at least a part of the connecting portion being located within the carrier and connected to the plurality of first conductive particles.

5. The screen component according to claim 4, characterized in that The connecting portion comprises: A main body, disposed on the flexible circuit board; A metal connecting layer, covering the main body, at least a part of the metal connecting layer being located within the carrier and connected to the plurality of first conductive particles.

6. The screen assembly according to claim 5, wherein The circuit board assembly further comprises: An integrated circuit, disposed on the flexible circuit board, the integrated circuit being connected to the light-emitting layer assembly through the flexible circuit board.

7. The screen component according to claim 2, characterized in that The plurality of support fibers include a plurality of first support fibers and a plurality of second support fibers, wherein the extending directions of the first support fibers and the second support fibers are different.

8. The screen assembly according to any one of claims 1 to 7, characterized in that, The light-emitting layer assembly comprises: A light-emitting layer, connected to the circuit board assembly; A connecting layer, respectively connected to the support layer and the light-emitting layer.

9. The screen assembly according to claim 8, wherein The light-emitting layer assembly further comprises: A protective layer, covering the side of the light-emitting layer away from the connecting layer.

10. An electronic device, characterized in that, Comprising: The screen assembly according to any one of claims 1 to 9.

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