Electronic component cleaning equipment and cleaning device

Abstract

The utility model provides electronic component cleaning equipment and a cleaning device, and relates to the technical field of electronic component production, and the cleaning device comprises filtering equipment, bagging equipment, conveying equipment and the electronic component cleaning equipment, the filtering equipment, the bagging equipment, the conveying equipment and the electronic element cleaning equipment are arranged in sequence; the filtering equipment is used for shaking off and screening out part of abrasive dust attached to the surface of the small electronic element in a vibration mode, and preliminary dust removal is carried out; the bagging equipment is used for loading the plurality of small electronic elements subjected to primary chip removal into a material bag; the conveying device is used for conveying the material bag containing the small electronic elements to the electronic element cleaning device to be cleaned. The electronic component cleaning equipment and the electronic component cleaning device are high in cleaning efficiency, good in cleaning effect and suitable for cleaning large-batch small electronic components, and it is guaranteed that the surface of each small electronic component is flat and smooth.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component production, in particular to an electronic component cleaning device and a cleaning apparatus. Background Art

[0002] Grinding and chamfering is one of the important processes in the production of small electronic components such as inductors. By grinding and chamfering small electronic components, the edges and corners of the small electronic components are rounded, and the surface of the small electronic components is made flat and smooth. Then, when the small electronic components are subjected to rolling spraying in the subsequent process, it is beneficial for the subsequent coating to be more uniform, and the produced small electronic components have stability.

[0003] When grinding and chamfering small electronic components, some of the grinding debris generated by grinding and chamfering will adhere to the surface of the small electronic components, resulting in the surface of the small electronic components not being flat and smooth enough, affecting the subsequent rolling spraying effect, and further resulting in unqualified small electronic components produced. Therefore, after grinding and chamfering small electronic components, it is necessary to remove the grinding debris adhering to the surface of the small electronic components to make the surface of the small electronic components flat and smooth. The prior art usually loads several small electronic components after grinding and chamfering into a material bag, and then puts the material bag containing the small electronic components into a drum-type cleaning device to clean the small electronic components in the material bag and wash off the grinding debris adhering to the surface of the small electronic components. However, when cleaning in the above manner, several small electronic components in the material bag will gather together and squeeze each other, and cannot be in full contact with the cleaning liquid, resulting in the grinding debris adhering to the surface of the small electronic components not being cleaned thoroughly, and there is still some grinding debris remaining, resulting in the surface of the small electronic components not being flat and smooth enough, affecting the subsequent rolling spraying effect, and further resulting in unqualified small electronic components produced. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an electronic component cleaning device and a cleaning apparatus to solve at least one of the above technical problems existing in the prior art.

[0005] In a first aspect, to solve the above technical problems, the utility model provides an electronic component cleaning device, comprising: a cleaning tank, a water tank, and a water pump;

[0006] The water inlet of the water pump is communicated with the water tank, and the water outlet of the water pump is communicated with the water inlet of the cleaning tank, for introducing the water in the water tank into the cleaning tank through the water pump;

[0007] The water return port of the cleaning tank is communicated with the water tank, and is used for the water in the cleaning tank to flow back to the water tank. Then, through the water pump, the water circulates between the cleaning tank and the water tank. During use, a material bag containing several small electronic components is placed into the water in the cleaning tank from the air. The buoyancy of the water is used to disperse the several small electronic components in the material bag. The small electronic components in the material bag are rinsed by the circulating water, and the abrasives attached to the surface of the small electronic components are rinsed off. The rinsed-off abrasives flow out of the material bag with the circulating water and flow towards the water tank. Among them, the small electronic components to be cleaned are usually inductors.

[0008] In this application, the water pump is used to make the water circulate between the cleaning tank and the water tank. A material bag containing several small electronic components is placed into the water in the cleaning tank from the air. The buoyancy of the water is used to disperse the several small electronic components in the material bag. The abrasives attached to the surface of the small electronic components are rinsed off by the circulating water, greatly improving the cleaning efficiency. It is suitable for the cleaning of a large number of small electronic components, ensuring that the surface of each small electronic component is flat and smooth. Then, when the small electronic components are subjected to rolling spraying later, it is beneficial for the subsequent coating to be more uniform, and the produced small electronic components have stability.

[0009] Furthermore, the electronic component cleaning device further includes a filtering component, which is connected between the water tank and the water pump and is used to filter the abrasives in the water flowing out of the water tank to prevent the abrasives from entering the cleaning tank again, resulting in a reduction in cleaning efficiency and affecting the cleaning effect.

[0010] Furthermore, the electronic component cleaning device further includes a link mechanism, and a gripper is arranged on the link mechanism and is used to grab a material bag containing several small electronic components. Then, by controlling the link mechanism to lower the gripper, the gripper grabs the material bag and enters the water in the cleaning tank from the air to clean the several small electronic components in the material bag.

[0011] Furthermore, the electronic component cleaning device further includes a control component, which is used to control the gripper to grab the material bag, control the rotation of the link mechanism, and lift and lower the gripper by controlling the link mechanism. At the same time, by detecting the working state of the link mechanism, it controls the opening and closing of the water pump;

[0012] During use, by controlling the link mechanism to lower the gripper, the gripper grabs the material bag and enters the water in the cleaning tank from the air, and the water pump is controlled to start to rinse the small electronic components in the material bag. The rinsing usually lasts for 30 s. After the rinsing is completed, the water pump is controlled to close, and by controlling the link mechanism to raise the gripper, the gripper grabs the material bag and leaves the water in the cleaning tank, and the material bag is lifted to drain, and the rinsing process is repeated.

[0013] Preferably, the material bag is made of rubber, and pores are provided on the material bag for discharging the grinding debris.

[0014] In a second aspect, based on the same inventive concept, the present utility model provides an electronic component cleaning device, comprising: a filtering device, a bagging device, a conveying device, and the electronic component cleaning device as described above;

[0015] The filtering device, the bagging device, the conveying device, and the electronic component cleaning device are arranged in sequence;

[0016] The filtering device is used to shake off and screen out part of the grinding debris attached to the surface of small electronic components by vibration, for preliminary chip removal, thereby improving the cleaning efficiency and cleaning effect of the electronic component cleaning device;

[0017] The bagging device is used to load a plurality of small electronic components after preliminary chip removal into the material bag;

[0018] The conveying device is used to convey the material bag containing a plurality of small electronic components to the electronic component cleaning device for cleaning.

[0019] Further, the filtering device includes a filtering mechanism, and the filtering mechanism includes a vibration motor and a sieve box;

[0020] The vibration motor is arranged at the bottom of the sieve box and is used to drive the sieve box to vibrate, thereby shaking off part of the grinding debris attached to the surface of small electronic components;

[0021] A sieve mesh is arranged in the sieve box for screening small electronic components and grinding debris to preliminarily screen out the grinding debris;

[0022] A dust-proof cover is arranged on the sieve box to prevent the grinding debris or small electronic components from being discharged from the sieve box during vibration, resulting in environmental pollution and potential safety hazards;

[0023] During use, a plurality of small electronic components enter the sieve box from the feed port of the sieve box, and the dust-proof cover is closed; the vibration motor is started to drive the sieve box to vibrate, shaking off part of the grinding debris attached to the surface of small electronic components; the small electronic components and the grinding debris are screened through the sieve mesh to preliminarily screen out the grinding debris; a plurality of small electronic components after preliminary chip removal are discharged from the discharge port of the sieve box and are conveyed to the bagging device through a pipeline.

[0024] Further, a plurality of damping springs are arranged at the bottom of the sieve box, and the sieve box is connected to the vibration motor through the damping springs to reduce the vibration amplitude of the sieve box and ensure the stability and safety of the filtering mechanism.

[0025] Further, the filtering device includes a first filtering mechanism and a second filtering mechanism;

[0026] The discharge port of the first filtering mechanism is communicated with the feed port of the second filtering mechanism;

[0027] The aperture of the first screen of the first filtering mechanism is larger than the aperture of the second screen of the second filtering mechanism;

[0028] The first screen is used for screening small electronic components and large-particle-size abrasives, and preliminarily screening out the large-particle-size abrasives;

[0029] The second screen is used for screening small electronic components and small-particle-size abrasives, and preliminarily screening out the small-particle-size abrasives;

[0030] In use, a plurality of small electronic components first pass through the first screen of the first filtering mechanism to shake off and screen out the large-particle-size abrasives attached to the surface of the small electronic components, and then pass through the second screen of the second filtering mechanism to shake off and screen out the small-particle-size abrasives attached to the surface of the small electronic components.

[0031] Further, the bagging device includes a storage box, a metering valve and a bagging mechanism;

[0032] The storage box is used for storing a plurality of small electronic components after preliminary deburring;

[0033] The metering valve is communicated with the discharge port of the storage box and is used for controlling the flow rate of the small electronic components, so as to ensure that the number of a plurality of small electronic components loaded into each bag is roughly the same and ensure the cleaning quality of the small electronic components;

[0034] The bagging mechanism is used for loading a specified number of small electronic components into a bag and sealing the bag mouth.

[0035] Further, the conveying device is a conveyor belt mechanism. The bag containing a plurality of small electronic components is conveyed to the electronic component cleaning device through the conveyor belt mechanism. The electronic component cleaning device controls the gripper to grab the bag through the control component, lowers the gripper through the control of the link mechanism, and the gripper grabs the bag and enters the water in the cleaning tank from the air. The water pump is automatically turned on, and the plurality of small electronic components in the bag are rinsed by the circulating water.

[0036] Adopting the above technical solutions, the utility model has the following beneficial effects:

[0037] The electronic component cleaning equipment and cleaning device provided by the utility model have high cleaning efficiency and good cleaning effect, are applicable to the cleaning of a large number of small electronic components, ensure that the surfaces of each small electronic component are flat and smooth, and thus are conducive to more uniform subsequent coating during the rolling spraying of small electronic components, and the produced small electronic components have stability. Description of the Drawings

[0038] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0039] Figure 1 Structural schematic diagram of the electronic component cleaning equipment provided by the embodiment of the present utility model;

[0040] Figure 2 Structural schematic diagram of the electronic component cleaning device provided by the embodiment of the present utility model;

[0041] Figure 3 is Figure 2 Structural schematic diagram of the filtering equipment of the electronic component cleaning device shown;

[0042] Figure 4 is Figure 2 Structural schematic diagram of the bagging equipment of the electronic component cleaning device shown.

[0043] Reference Signs:

[0044] 101 - vibration motor; 102 - sieve box; 103 - dust cover; 104 - damping spring; 11 - first filtering mechanism; 115 - first sieve mesh; 12 - second filtering mechanism; 125 - second sieve mesh; 21 - storage tank; 22 - metering valve; 23 - bagging mechanism; 30 - conveyor belt mechanism; 41 - cleaning tank; 42 - water tank; 43 - water pump; 44 - filtering component; 45 - connecting rod mechanism; 451 - gripper. Detailed Embodiments

[0045] The following will clearly and completely describe the technical solutions of the present utility model in conjunction with the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.

[0046] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0047] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0048] The following further explains and illustrates the present utility model in conjunction with specific embodiments.

[0049] It should also be noted that the following specific embodiments or specific implementation manners are a series of optimized setting manners listed by the present utility model to further explain the specific content of the utility model, and these setting manners can be combined with each other or used in association with each other.

[0050] Embodiment 1

[0051] As Figure 1 shown, an electronic component cleaning device provided in this embodiment includes: a cleaning tank 41, a water tank 42, and a water pump 43; the water inlet of the water pump 43 is communicated with the water tank 42, and the water outlet of the water pump 43 is communicated with the water inlet of the cleaning tank 41, for introducing the water in the water tank 42 into the cleaning tank 41 through the water pump 43; the water return port of the cleaning tank 41 is communicated with the water tank 42, for the water in the cleaning tank 4l to flow back to the water tank 42, and then through the water pump 43, the water circulates between the cleaning tank 41 and the water tank 42. When in use, a bag containing a number of small electronic components is placed into the water in the cleaning tank 41 from the air, and the buoyancy of the water is used to disperse the number of small electronic components in the bag. The small electronic components in the bag are rinsed by the circulating water, and the abrasives attached to the surface of the small electronic components are rinsed off. The rinsed-off abrasives flow out of the bag with the circulating water and flow to the water tank 42. In this embodiment, the small electronic components to be cleaned are inductors.

[0052] In the present application, water is circulated between the cleaning tank 41 and the water tank 42 through a water pump 43, and a material bag containing several small electronic components is placed from the air into the water in the cleaning tank 41. The buoyancy of the water is used to disperse the several small electronic components in the material bag, and the grinding debris attached to the surface of the small electronic components is washed away by the circulating water, thereby greatly improving the cleaning efficiency. The application is suitable for cleaning large quantities of small electronic components, ensuring that the surface of each small electronic component is flat and smooth, and then when the small electronic components are subsequently roll-sprayed, it is beneficial for the subsequent station to coat more evenly, and the produced small electronic components are stable.

[0053] On the basis of the above technical solution, it is further preferred that the electronic component cleaning equipment also includes a filter component 44, which is connected between the water tank 42 and the water pump 43, and is used to filter the grinding debris in the water flowing out of the water tank 42 to prevent the grinding debris from entering the cleaning tank 41 again, resulting in reduced cleaning efficiency and affecting the cleaning effect.

[0054] Furthermore, the electronic component cleaning equipment also includes a connecting rod mechanism 45, and a gripper 451 is provided on the connecting rod mechanism 45 for grabbing a bag containing a plurality of small electronic components, and then the gripper 451 is controlled to descend by the connecting rod mechanism 45. The gripper 451 grabs the bag and enters the water in the cleaning tank 41 from the air to clean the plurality of small electronic components in the bag.

[0055] More preferably, the electronic component cleaning device further includes a control component for controlling the gripper 451 to grip the material bag, controlling the rotation of the connecting rod mechanism 45, and controlling the lifting and lowering of the gripper 451 by controlling the connecting rod mechanism 45, and controlling the turning on and off of the water pump 43 by detecting the working state of the connecting rod mechanism 45;

[0056] During use, the gripper 451 is lowered by controlling the connecting rod mechanism 45, and the gripper 451 grabs the material bag from the air and enters the water in the cleaning tank 41. The water pump 43 is controlled to start and the small electronic components in the material bag are rinsed. The rinsing usually lasts for 30 seconds. After 30 seconds, the water pump 43 is controlled to stop, and the gripper 451 is raised by controlling the connecting rod mechanism 45. The gripper 451 grabs the material bag and takes it out of the water in the cleaning tank 41. The material bag is lifted up to drain and the rinsing process is repeated.

[0057] In this embodiment, the material bag is made of rubber and is provided with holes for discharging grinding chips.

[0058] In this utility model, a water pump 43 is used to make water circulate between a cleaning tank 41 and a water tank 42. A material bag containing several small electronic components is placed into the water in the cleaning tank 41 from the air. The buoyancy of the water is utilized to disperse the several small electronic components in the material bag. The abrasive chips attached to the surfaces of the small electronic components are washed off by the circulating water, greatly improving the cleaning efficiency. It is applicable to the cleaning of a large number of small electronic components, ensuring that the surfaces of each small electronic component are flat and smooth. Furthermore, when the small electronic components are subjected to rotary spraying later, it is beneficial for the subsequent coating to be more uniform, and the produced small electronic components have stability.

[0059] Embodiment 2

[0060] As Figures 1-4 shown, an electronic component cleaning device provided in this embodiment includes: a filtering device, a bagging device, a conveying device, and the electronic component cleaning device as described above; the filtering device, the bagging device, the conveying device, and the electronic component cleaning device are arranged in sequence; the filtering device is used to shake off and screen out some of the abrasive chips attached to the surfaces of the small electronic components by vibration, for preliminary chip removal, thereby improving the cleaning efficiency and cleaning effect of the electronic component cleaning device; the bagging device is used to load several small electronic components after preliminary chip removal into a material bag; the conveying device is used to convey the material bag containing several small electronic components to the electronic component cleaning device for cleaning.

[0061] Referring to Figure 2 、 Figure 3 shown, on the basis of the above technical solution, more preferably, the filtering device includes a filtering mechanism, and the filtering mechanism includes a vibration motor 101 and a screening box 102; the vibration motor 101 is arranged at the bottom of the screening box 102 and is used to drive the screening box 102 to vibrate, thereby shaking off some of the abrasive chips attached to the surfaces of the small electronic components; a screen mesh is arranged in the screening box 102 for screening small electronic components and abrasive chips to preliminarily screen out the abrasive chips; a dust-proof cover 103 is arranged on the screening box 102 to prevent abrasive chips or small electronic components from being discharged from the screening box 102 during vibration, resulting in environmental pollution and potential safety hazards;

[0062] During use, several small electronic components enter the screening box 102 from the feed inlet of the screening box 102, and the dust-proof cover 103 is closed; the vibration motor 101 is started to drive the screening box 102 to vibrate, shaking off some of the abrasive chips attached to the surfaces of the small electronic components; the small electronic components and the abrasive chips are screened through the screen mesh to preliminarily screen out the abrasive chips; several small electronic components after preliminary chip removal are discharged from the discharge outlet of the screening box 102 and are conveyed to the bagging device through a pipeline.

[0063] More preferably, a plurality of damping springs 104 are provided at the bottom of the screen box 102, and the screen box 102 is connected to the vibration motor 101 through the damping springs 104 to reduce the vibration amplitude of the screen box 102 and ensure the stability and safety of the filtering mechanism.

[0064] Reference Figure 3 As shown, the filtering device includes a first filtering mechanism 11 and a second filtering mechanism 12;

[0065] The discharge port of the first filtering mechanism 11 is connected to the feed port of the second filtering mechanism 12;

[0066] The pore size of the first screen 115 of the first filtering mechanism 11 is larger than the pore size of the second screen 125 of the second filtering mechanism 12;

[0067] The first screen 115 is used to separate small electronic components from large-sized wear debris, and preliminarily remove the large-sized wear debris;

[0068] The second screen 125 is used to separate small electronic components and small-sized wear debris, and preliminarily remove the small-sized wear debris;

[0069] During use, several small electronic components are first filtered through the first screen 115 of the first filtering mechanism 11 to shake off and screen out the large-particle wear debris attached to the surface of the small electronic components, and then filtered through the second screen 125 of the second filtering mechanism 12 to shake off and screen out the small-particle wear debris attached to the surface of the small electronic components.

[0070] Reference Figure 4 As shown, in this embodiment, the bagging equipment includes a storage box 21, a metering valve 22 and a bagging mechanism 23; the storage box 21 is used to store a plurality of small electronic components after preliminary desquamation; the metering valve 22 is connected to the discharge port of the storage box 21, and is used to control the flow of small electronic components, thereby ensuring that the number of small electronic components loaded into each bag is roughly the same, thereby ensuring the cleaning quality of the small electronic components; the bagging mechanism 23 is used to load a specified number of small electronic components into the bag and seal the bag opening.

[0071] Reference Figure 2 As shown, the conveying device is a conveyor belt mechanism 30, which conveys a material bag containing several small electronic components to the electronic component cleaning device through the conveyor belt mechanism 30. The electronic component cleaning device controls the gripper 451 to grab the material bag through the control component, and lowers the gripper 451 by controlling the connecting rod mechanism 45. The gripper 451 grabs the material bag from the air and enters the water in the cleaning tank 41. The water pump 43 is automatically turned on to rinse the several small electronic components in the material bag with the circulating water.

[0072] In this embodiment, the usage process of the electronic component cleaning device includes:

[0073] First, a number of small electronic components after grinding and chamfering are conveyed into the filtering device, and part of the abrasive chips attached to the surface of the small electronic components are shaken off and screened by vibration for preliminary chip removal. After the preliminary chip removal, the number of small electronic components is conveyed into the storage box 21 through a pipeline;

[0074] Then, the metering valve 22 is used to control a specified number of small electronic components to enter the bagging mechanism 23 for bagging or manual bagging, and the material bag containing a number of small electronic components is conveyed to the electronic component cleaning device through a conveying device;

[0075] Finally, the gripper 451 grabs the material bag, and the link mechanism 45 is controlled to lower the gripper 451. The gripper 451 holds the material bag and enters the water in the cleaning tank 41 from the air. The water pump 43 is controlled to start, and the small electronic components in the material bag are rinsed. The rinsing usually lasts for 30 s. After the rinsing is completed, the water pump 43 is controlled to close. By controlling the link mechanism 45 to raise the gripper 451, the gripper 451 holds the material bag and leaves the water in the cleaning tank 41, and the material bag is lifted to drain. The rinsing process is repeated.

[0076] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic component cleaning device, characterized in that, Comprising: A cleaning tank, a water tank and a water pump; The water inlet of the water pump is communicated with the water tank, and the water outlet of the water pump is communicated with the water inlet of the cleaning tank, for introducing the water in the water tank into the cleaning tank through the water pump; The water return port of the cleaning tank is communicated with the water tank, for the water in the cleaning tank to flow back to the water tank, and then through the water pump, the water circulates between the cleaning tank and the water tank, and the small electronic components in the material bag are washed by the circulating water, and the abrasive chips attached to the surface of the small electronic components are washed off, and the washed abrasive chips flow out of the material bag with the circulating water and flow to the water tank.

2. The electronic component cleaning device according to claim 1, wherein It further includes a filtering component, which is connected between the water tank and the water pump, for filtering the abrasive chips in the water flowing out of the water tank.

3. The electronic component cleaning device according to claim 1, wherein It further includes a link mechanism, on which a gripper is provided, for gripping a material bag containing a plurality of small electronic components, and then by controlling the link mechanism to lower the gripper, the gripper grabs the material bag and enters the water in the cleaning tank from the air, and cleans the plurality of small electronic components in the material bag.

4. The electronic component cleaning device according to claim 3, characterized in that, It further includes a control component, for controlling the gripper to grab the material bag, controlling the rotation of the link mechanism, and by controlling the link mechanism to lift and lower the gripper, and at the same time by detecting the working state of the link mechanism, controlling the opening and closing of the water pump.

5. An electronic component cleaning device, characterized in that, Comprising: A filtering device, a bagging device, a conveying device and the electronic component cleaning device according to any one of claims 1 to 4; The filtering device, the bagging device, the conveying device and the electronic component cleaning device are arranged in sequence; The filtering device is used for shaking off and screening out part of the abrasive chips attached to the surface of the small electronic components by vibration to perform preliminary chip removal; The bagging device is used for loading a plurality of small electronic components after preliminary chip removal into a material bag; The conveying device is used for conveying the material bag containing a plurality of small electronic components to the electronic component cleaning device for cleaning.

6. The electronic component cleaning device according to claim 5, wherein, The filtering device includes a filtering mechanism, and the filtering mechanism includes a vibration motor and a sieve box; The vibration motor is arranged at the bottom of the sieve box, for driving the sieve box to vibrate, and then shaking off part of the abrasive chips attached to the surface of the small electronic components; A sieve mesh is arranged in the sieve box for screening small electronic components and abrasive chips to preliminarily screen out the abrasive chips; A dust-proof cover is arranged on the sieve box, for preventing the abrasive chips or small electronic components from being discharged from the sieve box during vibration.

7. The electronic component cleaning device according to claim 6, characterized in that, A plurality of damping springs are arranged at the bottom of the sieve box, and the sieve box is connected with the vibration motor through the damping springs, for reducing the vibration amplitude of the sieve box.

8. The electronic component cleaning device according to claim 6, wherein, The filtering device includes a first filtering mechanism and a second filtering mechanism; The discharge port of the first filtering mechanism is communicated with the feed port of the second filtering mechanism; The aperture of the first sieve mesh of the first filtering mechanism is larger than the aperture of the second sieve mesh of the second filtering mechanism; The first sieve mesh is used for screening small electronic components and large-particle-size abrasive chips to preliminarily screen out the large-particle-size abrasive chips; The second sieve mesh is used for screening small electronic components and small-particle-size abrasive chips to preliminarily screen out the small-particle-size abrasive chips.

9. The electronic component cleaning device according to claim 5, wherein The bagging device includes a storage bin, a metering valve, and a bagging mechanism; The storage bin is used to store a number of small electronic components after preliminary deslagging; The metering valve is connected to the discharge port of the storage bin and is used to control the flow rate of small electronic components; The bagging mechanism is used to load a specified number of small electronic components into a material bag and seal the bag opening.

10. The electronic component cleaning device according to claim 5, wherein, The conveying device is a conveyor belt mechanism.

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