Assembly equipment for spring probe
By forming a negative pressure in the inner cavity of the spring probe and providing preload force for the top piston pillar using a vacuum adsorption mechanism, the problem of separation of spring probe parts is solved, and an efficient assembly process and low defect rate is achieved.
Patent Information
- Application Number
- CN202422430231.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-10-09
AI Technical Summary
Parts of existing spring probes are easily separated or dispersed during assembly, resulting in poor products during stamping.
A vacuum adsorption mechanism is used to communicate with the inner cavity through the sliding fitting gap between the barrel body of the spring probe and the tail piston pillar, forming a negative pressure to provide preload for the top piston pillar and prevent parts from being separated.
Effectively prevent the top piston pillar, spring and tail piston pillar from disengaging or translocation from the barrel body, reducing the defect rate of finished products and improving production efficiency.
Smart Images

Figure CN223160465U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of assembly equipment, in particular to an assembly equipment for spring probes. Background Art
[0002] With the continuous development of semiconductor chip packaging structures and technologies, the sizes and spacings of the pins and bumpers of some chips have become smaller and smaller, which has put higher and higher requirements on the structure and accuracy of the spring probes for chip packaging testing. The current design structures of the above spring probes generally consist of four parts: a top piston column 1, a spring 2, a barrel 3, and a tail piston column 4 as shown in Figure 1 The assembly process is as follows: First, with the help of auxiliary tools, the above four parts are pre-assembled to the state shown in Figure 2 Then, the pre-assembled spring probe is transferred to a stamping (or riveting) mechanism for stamping or riveting to finally form a finished spring probe.
[0003] However, during the process of placing the pre-assembled spring probe into the stamping (or riveting) mechanism, since there is no relative fixation between the parts, and there are sliding fit clearances between the top piston column 1 and the barrel 3, and between the tail piston column 4 and the barrel 3, both the top piston column 1 and the tail piston column 4 can relatively slide axially with respect to the barrel 3. Therefore, the pre-assembled parts are likely to separate or spread out, resulting in defective products easily generated during the stamping process.
[0004] Therefore, there is an urgent need for an assembly equipment for spring probes that can prevent the parts of the pre-assembled spring probe from separating or spreading out. Summary of the Utility Model
[0005] In order to solve the above problems, the utility model provides an assembly equipment for spring probes. By setting a vacuum adsorption mechanism connected to the inner cavity of the spring probe, a pre-tightening force is provided for the top piston column, avoiding the problem that the parts of the pre-assembled spring probe are likely to separate or spread out.
[0006] To achieve the above object, the utility model provides the following solution:
[0007] An assembly equipment for spring probes, comprising: a vacuum adsorption mechanism and a stamping mechanism. The vacuum adsorption mechanism is connected to the inner cavity of the spring probe through the sliding fit clearance between the barrel of the spring probe and the tail piston column, and the stamping mechanism corresponds to the position to be stamped on the spring probe.
[0008] Preferably, it further includes a positioning groove for accommodating the spring probe. A connection through-hole is provided at the center of the bottom of the positioning groove. The diameter of the connection through-hole is larger than the diameter of the tail-end piston column, and the diameter of the connection through-hole is smaller than the diameter of the barrel. The vacuum adsorption mechanism is arranged below the connection through-hole and is communicated with the connection through-hole.
[0009] Preferably, the vacuum adsorption mechanism includes a vacuum suction nozzle. A connection channel is arranged between the vacuum suction nozzle and the connection through-hole. The length of the connection channel is larger than the length of the exposed section of the tail-end piston column. The upper end of the vacuum suction nozzle is communicated with the connection channel, and the lower end of the vacuum suction nozzle is communicated with a negative pressure pump.
[0010] Preferably, it further includes a centering mechanism. The centering mechanism includes a centering pressure rod that can move up and down. A centering pressure head is arranged at the lower end of the centering pressure rod, and the centering pressure head is correspondingly arranged with the top piston column of the spring probe.
[0011] Preferably, a positioning protrusion is arranged at the lower end of the centering pressure head, and the positioning protrusion is matched with the first groove at the end of the top piston column.
[0012] Preferably, the centering mechanism further includes a position adjustment mechanism, and the centering mechanism is connected to the position adjustment mechanism through a connecting arm.
[0013] Preferably, it further includes a monitoring mechanism for monitoring the spring probe and the centering pressure head, and the monitoring mechanism is correspondingly arranged with the positioning groove.
[0014] Preferably, the stamping mechanism includes at least two stamping rods. The stamping rods are connected to a stamping cylinder, and the stamping ends of the stamping rods are evenly arranged around the spring probe.
[0015] Preferably, it further includes a sensor for detecting the spring probe, and the sensor is electrically connected to the vacuum adsorption mechanism.
[0016] Preferably, the vacuum adsorption mechanism and the stamping mechanism are arranged on the same operating table, and a chamfer structure is arranged at the edge of the operating table.
[0017] The present utility model has achieved the following technical effects compared with the prior art:
[0018] The assembly device of the spring probe disclosed in this application is provided with a vacuum adsorption mechanism. The vacuum adsorption mechanism is connected to the inner cavity of the spring probe through the sliding fit gap between the barrel of the spring probe and the tail-end piston column. The vacuum adsorption mechanism can form a negative pressure in the inner cavity of the spring probe through the sliding fit gap, and the negative pressure can provide a pre-tightening force for the top piston column pointing to the tail-end piston column, thereby tightly adsorbing the top piston column at the end of the barrel, effectively preventing the top piston column, the spring and the tail-end piston column from detaching or being displaced from the barrel, ensuring that all parts remain in the predetermined positions during the subsequent stamping process, reducing the defective rate of the finished product, and eliminating the need for manual straightening of the unstably connected parts, ensuring the efficient progress of the spring probe assembly process. Description of the Drawings
[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0020] Attached Figure 1 is an exploded view of the spring probe for chip package testing;
[0021] Attached Figure 2 is an installation diagram of the spring probe for chip package testing;
[0022] Attached Figure 3 is a schematic diagram of an embodiment of the present invention;
[0023] Attached Figure 4 is Attached Figure 3 a schematic diagram from another perspective;
[0024] Attached Figure 5 is Attached Figure 4 a cross-sectional schematic diagram of;
[0025] Attached Figure 6 is Attached Figure 5 a partial enlarged schematic diagram of;
[0026] Among them, 1. top piston column; 2. spring; 3. barrel; 4. tail-end piston column; 5. first groove; 6. second groove; 7. positioning groove; 8. vacuum suction nozzle; 9. connection channel; 10. straightening pressure rod; 11. straightening pressure head; 12. positioning protrusion; 13. adjustment mechanism; 14. connecting arm; 15. stamping rod; 16. operating table; 17. electric control box. Detailed Embodiments
[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.
[0028] The purpose of the present invention is to provide an assembly device for spring probes. By means of a vacuum adsorption mechanism, a pre-tightening force is provided for the top piston column, avoiding the problem that the parts of the pre-assembled spring probe are easily separated or scattered.
[0029] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0030] Referring to Figures 1-6 , the assembly device for spring probes disclosed in the embodiments of the present invention includes: a vacuum adsorption mechanism and a stamping mechanism. The vacuum adsorption mechanism is connected to the inner cavity of the spring probe through the sliding fit clearance between the barrel 3 of the spring probe and the tail-end piston column 4, and the stamping mechanism corresponds to the position to be stamped on the spring probe. During use, the vacuum adsorption mechanism can form a negative pressure in the inner cavity of the pre-assembled spring probe through the sliding fit clearance. This negative pressure can provide a pre-tightening force for the top piston column 1 pointing to the tail-end piston column 4, and then tightly adsorb the top piston column 1 at the end of the barrel 3. Under the restriction of the top piston column 1, the spring 2 and the tail-end piston column 4 cannot be separated from the barrel 3, effectively preventing the top piston column 1, the spring 2, and the tail-end piston column 4 from being separated or displaced from the barrel 3. At this time, by stamping the position to be stamped through the stamping mechanism, the top piston column 1 can be fixed at the end of the barrel 3 to form a finished spring probe; through the vacuum adsorption mechanism, each part can be stabilized at a predetermined position during the stamping process to successfully complete the stamping, reducing the defective rate of the finished product, and there is no need for manual alignment of the unstably connected parts throughout the process. After the vacuum adsorption mechanism sucks the top piston column 1 tightly, stamping can be directly carried out, improving the production efficiency of the spring probe.
[0031] As a preferred embodiment, it further includes a positioning groove 7 for accommodating the pre-assembled spring probe. A connecting through-hole is provided at the center of the bottom of the positioning groove 7. The diameter of the connecting through-hole is larger than the diameter of the part of the tail-end piston column 4 extending out of the barrel 3 and smaller than the diameter of the barrel 3. The vacuum adsorption mechanism is arranged below the connecting through-hole and is communicated with the connecting through-hole. During use, the pre-assembled spring probe is placed in the positioning groove 7, and one end of the tail-end piston column 4 faces the connecting through-hole. The part of the tail-end piston column 4 extending out of the barrel 3 can pass through the connecting through-hole. Since the diameter of the connecting through-hole is larger than the diameter of the part of the tail-end piston column 4 extending out of the barrel 3 and smaller than the diameter of the barrel 3, the sliding fit gap between the barrel 3 and the tail-end piston column 4 can be exposed to the negative pressure environment provided by the vacuum adsorption mechanism. Furthermore, under the action of the vacuum adsorption mechanism, a negative pressure can be generated in the inner cavity of the barrel 3 of the pre-assembled spring probe, pressing the top piston column 1 against one end of the barrel 3.
[0032] As a preferred embodiment, the vacuum adsorption mechanism includes a vacuum suction nozzle 8 and a negative pressure pump. A connecting channel 9 is hermetically connected between the vacuum suction nozzle 8 and the connecting through-hole. The length of the connecting channel 9 is greater than the length of the exposed section of the tail-end piston column 4 (the part of the tail-end piston column 4 extending out of the barrel 3). The upper end of the vacuum suction nozzle 8 is communicated with the connecting channel 9, and the lower end of the vacuum suction nozzle 8 is communicated with the negative pressure pump. During operation, the exposed section of the tail-end piston column 4 can be accommodated through the connecting channel 9 to prevent the exposed section from blocking the vacuum suction nozzle 8. The negative pressure pump serves as a negative pressure source to provide negative pressure suction for the vacuum suction nozzle 8 to form a negative pressure inside the barrel 3.
[0033] As a preferred embodiment, it further includes a centering mechanism. The centering mechanism includes a centering pressure rod 10 that can move up and down. A centering pressure head 11 is provided at the lower end of the centering pressure rod 10, and the centering pressure head 11 is correspondingly arranged with the top piston column 1 of the spring probe. After the vacuum adsorption mechanism sucks and tightens the top piston column 1, a downward extrusion force can be provided for the top piston column 1 through the centering pressure head 11, which can prevent the problem that the top piston column 1 is stuck at one end of the barrel 3 at an inclined angle (here, inclined means not coaxial with the barrel 3) due to improper operation during the pre-assembly process and cannot be directly adsorbed in place by the vacuum adsorption mechanism.
[0034] Furthermore, the centering pressure head 11 is coaxially arranged with the connecting through-hole. Thus, under the combined action of the centering pressure head 11 and the connecting through-hole, each pre-assembled spring probe to be stamped can be stabilized on the line connecting the two, ensuring the consistency of the stamping position.
[0035] As a preferred method, a positioning protrusion 12 is provided at the lower end of the centering press head 11. The positioning protrusion 12 matches the first groove 5 at the end of the top piston rod 1. During the process of the centering press head 11 pressing against the top piston rod 1, the first groove 5 can play a certain guiding role, enabling the centering press head 11 and the top piston rod 1 to be accurately docked together; preferably, the centering press head 11 is in a conical shape adapted to the first groove 5.
[0036] As a preferred method, the centering mechanism further includes a position adjustment mechanism 13. The centering mechanism is connected to the position adjustment mechanism 13 through a connecting arm 14. The position of the centering press head 11 can be adjusted through the adjustment mechanism 13, so as to facilitate the debugging of the equipment and enable the equipment to adapt to workpieces to be processed of different models or sizes.
[0037] Among them, the adjustment mechanism 13 is an existing robotic arm, as long as it can achieve X, Y, and Z axis movements. Since the robotic arm is an existing technology, it will not be elaborated here.
[0038] As a preferred method, a monitoring mechanism is further included. The monitoring mechanism is correspondingly arranged with the positioning groove 7. Through the monitoring mechanism, the pre-assembled spring probe placed in the positioning groove 7 and the centering press head 11 above the positioning groove 7 can be monitored, and then the position information of the centering press head 11, the movement speed information of the centering press head 11, and the position information of the top piston rod 1 can be transmitted to the computer terminal, so as to facilitate the operator to debug the device and obtain the working state of the device in real time.
[0039] Preferably, the monitoring mechanism is a microscopic magnifying lens or a camera.
[0040] More preferably, the stamping mechanism includes at least two stamping rods 15. The stamping rods 15 are connected to a stamping cylinder. The stamping ends of the stamping rods 15 are evenly arranged around the spring probe. The movement direction of the stamping rods 15 is perpendicular to the axis of the barrel 3 of the spring probe. The stamping ends of the stamping rods 15 correspond to the second grooves 6 provided on the side wall of the top piston rod 1 to stamp the barrel 3 of the spring probe and press the side wall of the barrel 3 of the spring probe into the second grooves 6, thereby connecting the barrel 3 and the top piston rod 1 together.
[0041] As a preferred method, a sensor is further included. The sensor is electrically connected to the vacuum adsorption mechanism. Further, the sensor is arranged in the positioning groove 7. Through the sensor, it can be detected whether the pre-assembled spring probe has been placed in the positioning groove 7. When it is determined that the spring probe has been placed in the positioning groove 7, a signal can be transmitted to the vacuum adsorption mechanism. After receiving the signal, the vacuum adsorption mechanism starts to work, thereby realizing the automatic opening of the vacuum adsorption mechanism.
[0042] Of course, the vacuum adsorption mechanism also includes a manual switch, and the opening and closing states of the vacuum adsorption mechanism can be controlled by the manual switch when necessary.
[0043] Preferably, the sensor is an existing photoelectric sensor.
[0044] As a preferred method, the vacuum adsorption mechanism and the stamping mechanism are arranged on the same operating table 16, and the edge of the operating table 16 is provided with a chamfered structure to prevent the edge structure from scratching the operator and interfering with the production operation, which is ergonomic.
[0045] Furthermore, the positioning groove 7 , the straightening mechanism and the monitoring mechanism are all arranged on the operating table 16 .
[0046] Furthermore, a protective upper cover is provided above the operating table 16, and a through hole is provided in the middle of the protective upper cover for the pre-assembled spring probe to enter the positioning groove 7. The protective upper cover can prevent foreign objects from falling into the machine.
[0047] As a preferred embodiment, the present application further includes a PLC electronic control system, which is electrically connected to the vacuum adsorption mechanism, the straightening mechanism, the monitoring mechanism and the sensor respectively.
[0048] Preferably, the terminal of the electric control system is set in the electric control box 17, and the operating table 16 and the electric control box 17 are arranged in a T shape. The T-shaped structural layout is conducive to placing the parts and / or tools necessary for processing on the left and right sides of the operating table 16 and / or the electric control box 17, thereby improving space utilization.
[0049] Adaptive changes based on actual needs are all within the protection scope of this utility model.
[0050] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all perspectives, the embodiments should be considered as illustrative and non-restrictive. The scope of the present invention is defined by the appended claims, not the foregoing description, and it is intended that all variations within the meaning and range of equivalents of the claims be included within the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.
Claims
1. An assembly device for a spring probe, characterized in that, It includes a vacuum adsorption mechanism and a stamping mechanism. The vacuum adsorption mechanism is communicated with the inner cavity of the spring probe through the sliding fit clearance between the barrel (3) and the tail-end piston column (4) of the spring probe. The stamping mechanism corresponds to the position of the spring probe to be stamped.
2. The assembly device of the spring probe according to claim 1, characterized in that, It further includes a positioning groove (7) for accommodating the spring probe. A connection through-hole is provided at the center of the bottom of the positioning groove (7). The diameter of the connection through-hole is larger than the diameter of the tail-end piston column (4), and the diameter of the connection through-hole is smaller than the diameter of the barrel (3). The vacuum adsorption mechanism is arranged below the connection through-hole and is communicated with the connection through-hole.
3. The assembly device of the spring probe according to claim 2, characterized in that, The vacuum adsorption mechanism includes a vacuum suction nozzle (8). A connection channel (9) is arranged between the vacuum suction nozzle (8) and the connection through-hole. The length of the connection channel (9) is larger than the length of the exposed section of the tail-end piston column (4). The upper end of the vacuum suction nozzle (8) is communicated with the connection channel (9), and the lower end of the vacuum suction nozzle (8) is communicated with a negative pressure pump.
4. The assembling device of the spring probe according to claim 2, characterized in that, It further includes a straightening mechanism. The straightening mechanism includes a straightening pressure rod (10) capable of moving up and down. A straightening pressure head (11) is arranged at the lower end of the straightening pressure rod (10), and the straightening pressure head (11) is correspondingly arranged with the top piston column (1) of the spring probe.
5. The assembly device of the spring probe according to claim 4, characterized in that, A positioning protrusion (12) is arranged at the lower end of the straightening pressure head (11), and the positioning protrusion (12) is matched with the first groove (5) at the end of the top piston column (1).
6. The assembly device of the spring probe according to claim 4, characterized in that, The straightening mechanism further includes a position adjustment mechanism (13). The straightening mechanism is connected with the position adjustment mechanism (13) through a connecting arm (14).
7. The assembly device of the spring probe according to claim 4, characterized in that It further includes a monitoring mechanism for monitoring the spring probe and the straightening pressure head (11). The monitoring mechanism is correspondingly arranged with the positioning groove (7).
8. The assembly device of the spring probe according to claim 1, characterized in that, The stamping mechanism includes at least two stamping rods (15). The stamping rods (15) are connected with a stamping cylinder, and the stamping ends of the stamping rods (15) are evenly arranged around the spring probe.
9. The assembly device of the spring probe according to claim 1, characterized in that, It further includes an inductor for detecting the spring probe. The inductor is electrically connected with the vacuum adsorption mechanism.
10. The assembly device of the spring probe according to claim 1, characterized in that, The vacuum adsorption mechanism and the stamping mechanism are arranged on the same operating table (16), and a chamfer structure is arranged at the edge of the operating table (16).