Water retaining structure for thin film electroplating

Abstract

The utility model discloses a water retaining structure for thin film electroplating, which is applied to an electroplating bath for thin film electroplating, a partition plate and a water retaining roller are arranged in the electroplating bath, the partition plate separates a plating solution bath and a transition bath of the electroplating bath, and the water retaining structure is characterized in that the water retaining roller is arranged above the partition plate along the length direction of the partition plate, and the water retaining structure for thin film electroplating is arranged at the top end of the partition plate. The water retaining structure for thin film electroplating is provided with a flexible surface, the distance between the flexible surface and the surface of the water retaining roller is adjustable, and when the distance is reduced to zero, the flexible surface is connected with the surface of the water retaining roller. The flexible surface of the water retaining structure for thin film electroplating is opposite to the surface of the water retaining roller, and when the water retaining structure is closest to the water retaining roller, the water retaining structure and the water retaining roller form surface-to-surface contact, so that the water retaining structure is prevented from scratching the surface of the water retaining roller, and the service life of the water retaining roller is prolonged. And the surface of the water retaining roller is kept smooth, so that the electroplating uniformity of the surface of an electroplated film is improved, and the electroplating quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film electroplating equipment, in particular to a water blocking structure for thin film electroplating. Background Art

[0002] In thin film electroplating, a water blocking roller is provided in the electroplating tank for thin film electroplating. The main functions of the water blocking roller are as follows: 1) By rotating the water blocking roller, the electroplating solution can be guided to flow in a preset direction, avoiding the disorderly flow or splashing of the electroplating solution in the electroplating tank; 2) The surface design of the water blocking roller can ensure the uniform distribution of the electroplating solution in the tank, avoiding the phenomenon of uneven film coating caused by too fast or too slow liquid flow in some areas; 3) Through the blocking effect of the water blocking roller, the electroplating solution can be prevented from splashing out of the electroplating tank due to too fast flow or height difference; 4) In some cases, the water blocking roller also acts as an auxiliary electrode to help form a uniform electric field distribution and affect the uniformity of the film coating. The water blocking roller plays a key role in the thin film electroplating process, and its performance and state directly affect the quality and effect of electroplating. Therefore, it is necessary to regularly check and maintain the water blocking roller to ensure its normal operation and extend its service life.

[0003] The water blocking roller makes a transition between the tanks of the electroplating tank. Since there is a certain gap between the water blocking roller and the partition in the electroplating tank, the electroplating solution is likely to flow out from this gap. In order to ensure the water blocking effect at the position of the water blocking roller, a water blocking structure is provided at this position, such as Figure 2 As shown, in the existing water blocking structure, the top end of the water blocking piece 120 directly abuts against the surface of the water blocking roller 300. As the water blocking roller 300 rotates, the water blocking piece 120 rubs against the surface of the water blocking roller 300, which is likely to scratch the surface of the water blocking roller 300 and cause wrinkles on the surface of the electroplated thin film.

[0004] The above problems need to be solved urgently. Summary of the Utility Model

[0005] In order to overcome the deficiency that the existing water blocking piece is easy to damage the surface of the water blocking roller, the utility model provides a water blocking structure for thin film electroplating.

[0006] The technical solution of the utility model is as follows:

[0007] A water blocking structure for thin film electroplating is applied to the electroplating tank for thin film electroplating. A partition and a water blocking roller are provided in the electroplating tank. The partition separates the plating solution tank and the transition tank of the electroplating tank. Along the length direction of the partition, the water blocking roller is arranged above the partition. The water blocking structure for thin film electroplating is arranged at the top end of the partition. The water blocking structure for thin film electroplating has a flexible surface, and the distance between the flexible surface and the surface of the water blocking roller is adjustable. When the distance decreases to zero, the flexible surface abuts against the surface of the water blocking roller.

[0008] Further, in one embodiment, the water-blocking structure for thin-film electroplating can be adjusted vertically on the partition board, and the gap width between the flexible surface and the surface of the water-blocking roller decreases as the position height of the water-blocking structure for thin-film electroplating increases.

[0009] Further, in one embodiment, the water-blocking structure for thin-film electroplating includes a movable baffle and a water-blocking sheet. The movable baffle is installed at the top end of the partition board, the water-blocking sheet is fixed to the side of the movable baffle close to the water-blocking roller, the movable end of the water-blocking sheet inclines upward, and the side surface of the movable end of the water-blocking sheet faces the surface of the adjacent water-blocking roller, and the water-blocking sheet has flexibility.

[0010] Further, in one embodiment, on the side of the movable baffle close to the water-blocking sheet, the top surface and the side surface of the movable baffle are arc-connected.

[0011] Further, in one embodiment, the material of the movable baffle is PP, PVC or stainless steel.

[0012] Further, in one embodiment, the movable baffle is installed on the side of the plating solution tank, and the lower end of the water-blocking sheet is located between the movable baffle and the partition board.

[0013] Further, in one embodiment, the water-blocking sheet is a strip-shaped object made of an acid and alkali resistant rubber thin sheet.

[0014] Further, in one embodiment, the water-blocking structure for thin-film electroplating is a rectangular plate, the top end of the rectangular plate close to the water-blocking roller is an arc surface, and the surface of the water-blocking sheet has flexibility.

[0015] Further, in one embodiment, it further includes a pressure roller adjusting mechanism. The pressure roller adjusting mechanism is fixed on the wall of the electroplating tank and is connected to the water-blocking roller to adjust the position height of the water-blocking roller.

[0016] Further, in one embodiment, the lowest point of the surface of the lowermost water-blocking roller is higher than the top surface of the partition board.

[0017] For the utility model according to the above solution, its beneficial effect lies in that the flexible surface of the water-blocking structure and the surface of the water-blocking roller are arranged opposite to each other. When the water-blocking structure is closest to the water-blocking roller, the water-blocking structure and the water-blocking roller form surface-to-surface contact, preventing the water-blocking structure from scratching the surface of the water-blocking roller and prolonging the service life of the water-blocking roller. And keeping the surface of the water-blocking roller smooth helps to improve the uniformity of electroplating on the surface of the electroplated thin film and improve the electroplating quality. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of an electroplating tank;

[0019] Figure 2 Schematic cross-sectional structure diagram of an existing water retaining structure;

[0020] Figure 3 Schematic cross-sectional structure diagram of the first embodiment of the present invention;

[0021] Figure 4 Schematic cross-sectional structure diagram of the second embodiment of the present invention.

[0022] In the figure, 100 is a water retaining structure for thin film electroplating; 110 is a movable baffle; 120 is a water retaining piece; 200 is a partition; 300 is a water retaining roller; 400 is an electroplating tank; 410 is a plating solution tank; 420 is a transition tank; 500 is a pressure roller adjusting mechanism. Detailed implementation manners

[0023] The present invention will be further described below in conjunction with the accompanying drawings and implementation manners. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer" and similar expressions used in this specification are only for the purpose of illustration. The meaning of "a plurality" is two or more. The term "comprising" and any of its variations mean non-exclusive inclusion, and there may be or be added one or more other features, integers, steps, operations, units, components and / or their combinations.

[0024] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. All the technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not used to limit the present invention.

[0025] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] The present application provides a water-blocking structure for thin-film electroplating. The water-blocking structure for thin-film electroplating is applied in an electroplating tank for thin-film electroplating. A partition and a water-blocking roller are provided in the electroplating tank. The partition separates the plating solution tank and the transition tank of the electroplating tank. Along the length direction of the partition, the water-blocking roller is arranged above the partition. The water-blocking structure for thin-film electroplating is arranged at the top end of the partition. The water-blocking structure for thin-film electroplating has a flexible surface, and the distance between the flexible surface and the surface of the water-blocking roller is adjustable. When the distance is reduced to zero, the flexible surface is in contact with the surface of the water-blocking roller. The flexible surface of the water-blocking structure for thin-film electroplating is arranged opposite to the surface of the water-blocking roller. When the water-blocking structure for thin-film electroplating is closest to the water-blocking roller, the water-blocking structure for thin-film electroplating and the water-blocking roller are in surface-to-surface contact, preventing the water-blocking structure from scratching the surface of the water-blocking roller and extending the service life of the water-blocking roller. And keeping the surface of the water-blocking roller smooth helps to improve the uniformity of electroplating on the surface of the electroplated thin film and improve the electroplating quality.

[0027] Embodiment 1

[0028] As Figure 1 and Figure 3 shown in the figure, Embodiment 1 of a water-blocking structure 100 for thin-film electroplating is provided in the present application. In Embodiment 1, the water-blocking structure 100 for thin-film electroplating is applied in an electroplating tank 400 for thin-film electroplating. A partition 200 and a water-blocking roller 300 are provided in the electroplating tank 400. The partition 200 separates the plating solution tank 410 and the transition tank 420 of the electroplating tank 400. Along the length direction of the partition 200, the water-blocking roller 300 is arranged above the partition 200. The water-blocking structure 100 for thin-film electroplating is arranged at the top end of the partition 200. The water-blocking structure 100 for thin-film electroplating includes a movable baffle 110 and a water-blocking piece 120. The movable baffle 110 is installed at the top end of the partition 200. The water-blocking piece 120 is fixed to the side of the movable baffle 110 close to the water-blocking roller 300. The movable end of the water-blocking piece 120 inclines upward, and the side surface of the movable end of the water-blocking piece 120 faces the surface of the adjacent water-blocking roller 300. The water-blocking piece 120 has flexibility. The movable end of the water-blocking piece 120 inclines upward to block the electroplating solution in the plating solution tank 410 from flowing into the transition tank 420 through the gap between the water-blocking roller 300 and the partition 200. The water-blocking piece 120 is flexible, and the water-blocking piece 120 and the water-blocking roller 300 are in surface-to-surface contact, which can significantly reduce the damage of the water-blocking piece 120 to the surface of the water-blocking roller 300, help to extend the service life of the water-blocking roller 300, and improve the uniformity of the thin-film electroplating surface.

[0029] In this embodiment, the position of the water-blocking structure 100 for thin-film electroplating on the partition 200 can be adjusted up and down, and the width of the gap between the flexible surface formed by the water-blocking piece 120 and the surface of the water-blocking roller 300 decreases as the position height of the water-blocking structure 100 for thin-film electroplating increases.

[0030] In this embodiment, on the side of the movable baffle 110 close to the water baffle 120, the top surface of the movable baffle 110 is arc-connected to the side surface. The top end of the movable baffle 110 is set as an arc surface, and the arc surface reduces the damage to the surface of the water baffle 120 when extrusion occurs between the top end of the movable baffle 110 and the water baffle 120, and can prevent the water baffle 120 from deforming due to multiple or strong extrusion, which helps to extend the service life of the water blocking structure 100 for thin film electroplating.

[0031] In this embodiment, the material of the movable baffle 110 is PP, PVC or stainless steel. The material of the movable baffle 110 can be selected according to actual production requirements. Generally, the movable baffle 110 made of light materials such as PP or PVC is light in weight, which is convenient for the up and down adjustment of the position of the movable baffle 110 on the partition plate 200; the movable baffle 110 made of stainless steel is large in mass but not easily damaged and has a long service life, which can effectively reduce the maintenance and replacement frequency of the water blocking structure 100 for thin film electroplating.

[0032] In this embodiment, the movable baffle 110 is installed inside the electroplating tank 400, and the lower end of the water baffle 120 is located between the movable baffle 110 and the partition plate 200. Fixing the water baffle 120 on the movable baffle 110 facilitates the synchronous up and down movement of the water baffle 120 and the movable baffle 110, and is convenient for adjusting the gap between the surface of the water baffle 120 and the water blocking roller 300.

[0033] In this embodiment, the water baffle 120 is a long strip-shaped object made of an acid and alkali-resistant rubber sheet. The acid and alkali-resistant rubber sheet can be selected as insulating silicone rubber. The insulating silicone rubber has excellent insulation, flexibility, surface cleaning and antibacterial properties, etc., and is not easily aged and has a long service life. The excellent insulation prevents the electroplating solution from forming a coating on the surface of the water baffle 120 and prevents the progress of electroplating on the surface of the thin film; the excellent flexibility prevents the water baffle 120 from scratching the surface of the water blocking roller 300 when the water baffle 120 contacts the water blocking roller 300, which helps to extend the service life of the water blocking roller 300 and improve the uniformity of the electroplating layer on the surface of the thin film; the excellent surface cleaning and antibacterial properties ensure the cleanliness of the surface of the water baffle 120 and prevent the adhesion of pollutants on the water baffle 120 from causing defects in the electroplating layer on the surface of the thin film.

[0034] As Figure 1 shown, in this embodiment, it further includes a pressure roller adjusting mechanism 500. The pressure roller adjusting mechanism 500 is fixed on the wall of the electroplating tank 400 and is connected to the water blocking roller 300 to adjust the position height of the water blocking roller 300. The pressure roller adjusting mechanism 500 adjusts the distance between the water blocking roller 300 and the partition plate 200, thereby changing the gap between the flexible surface of the water baffle 120 and the surface of the underlying water blocking roller 300, making the adjustment of the position of the water blocking roller 300 more convenient.

[0035] In this embodiment, the lowest point of the surface of the bottommost water-blocking roller 300 is higher than the top surface of the partition 200. This structural design makes it easier to observe the gap between the water-blocking roller 300 and the flexible surface of the water-blocking sheet 120, and makes it more convenient to adjust the gap between the water-blocking roller 300 and the flexible surface of the water-blocking sheet 120.

[0036] Embodiment 2

[0037] like Figure 4 As shown, the present application provides a second embodiment of a water retaining structure 100 for thin film electroplating. Unlike the first embodiment, the water retaining structure 100 for thin film electroplating is a rectangular plate, and the top of the rectangular plate close to the water retaining roller 300 is an arc-shaped surface, and the surface of the water retaining sheet is flexible. Generally, the material of the water retaining structure 100 for thin film electroplating is thick soft glue, which has a certain hardness so that it can be fixed on the partition 200, and the flexibility of the soft glue makes the surface in contact with the water retaining roller 300 a flexible surface. The arc surface structure at the top can replace the water retaining sheet 120 of the first embodiment to provide a flexible surface, that is, the arc surface at the top of the water retaining structure 100 for thin film electroplating is a flexible surface in contact with the surface of the water retaining roller 300. The integrated design simplifies the structure of the water retaining structure 100 for thin film electroplating, making it simple and convenient to prepare and install.

[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0039] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A water-blocking structure for thin-film electroplating, which is applied in an electroplating tank for thin-film electroplating. There are partition plates and water-blocking rollers in the electroplating tank, and it is characterized in that, The partition is used to separate the plating solution tank and the transition tank of the electroplating tank. Along the length direction of the partition, the water retaining roller is arranged above the partition, and the water retaining structure for thin film electroplating is arranged at the top end of the partition. The water retaining structure for thin film electroplating has a flexible surface, and the distance between the flexible surface and the surface of the water retaining roller is adjustable. When the distance decreases to zero, the flexible surface is in contact with the surface of the water retaining roller.

2. The water-blocking structure for thin-film electroplating according to claim 1, wherein The position of the water retaining structure for thin film electroplating on the partition can be adjusted up and down, and the width of the gap between the flexible surface and the surface of the water retaining roller decreases as the position height of the water retaining structure for thin film electroplating increases.

3. The water-blocking structure for thin-film electroplating according to claim 1, wherein The water retaining structure for thin film electroplating includes a movable baffle and a water retaining piece. The movable baffle is installed at the top end of the partition, and the water retaining piece is fixed on the side of the movable baffle close to the water retaining roller. The movable end of the water retaining piece inclines upward, and the side surface of the movable end of the water retaining piece faces the surface of the adjacent water retaining roller. The water retaining piece is flexible.

4. The water-blocking structure for thin-film electroplating according to claim 3, characterized in that On the side of the movable baffle close to the water retaining piece, the top surface and the side surface of the movable baffle are arc-connected.

5. The water-blocking structure for thin-film electroplating according to claim 3, characterized in that, The material of the movable baffle is PP, PVC or stainless steel.

6. The water-blocking structure for thin-film electroplating according to claim 3, characterized in that, The movable baffle is installed on the side of the plating solution tank, and the lower end of the water retaining piece is located between the movable baffle and the partition.

7. The water-blocking structure for thin-film electroplating according to claim 3, characterized in that, The water retaining piece is a long strip-shaped object made of an acid and alkali resistant rubber sheet.

8. The water-blocking structure for thin-film electroplating according to claim 3, characterized in that, The water retaining structure for thin film electroplating is a rectangular plate. The top end of the rectangular plate close to the water retaining roller is an arc surface, and the surface of the water retaining piece is flexible.

9. The water-blocking structure for thin-film electroplating according to claim 1, wherein It further includes a pressure roller adjusting mechanism. The pressure roller adjusting mechanism is fixed on the wall of the electroplating tank and is connected to the water retaining roller to adjust the position height of the water retaining roller.

10. The water-blocking structure for thin-film electroplating according to claim 9, characterized in that, The lowest point of the surface of the lowermost water retaining roller is higher than the top surface of the partition.

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