Fluid treatment device and water purifier

Abstract

The utility model relates to the field of fluid treatment equipment, in particular to fluid treatment equipment and a water purifier. The fluid treatment equipment comprises an energy storage material, an equipment body and a semiconductor refrigeration assembly, the equipment body is provided with an energy storage cavity, the energy storage cavity is used for containing the energy storage material, the equipment body comprises a fluid pipeline, and the fluid pipeline is in heat conduction connection with the energy storage material; the semiconductor refrigeration assembly comprises a refrigeration part and a heating part, and the heating part is at least partially arranged in the energy storage cavity and makes contact with the energy storage material. Through the structure, heat emitted by the heating part of the semiconductor refrigeration assembly can be stored and utilized, and the energy utilization rate of the fluid treatment equipment is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of fluid treatment equipment, and particularly to fluid treatment equipment and water purifiers. Background Art

[0002] Fluid treatment equipment, especially water purifiers, is widely used in daily life. With the progress of technology, semiconductor refrigeration components can be configured in water purifiers to meet people's usage requirements. In common water purifiers, the low-temperature side of the semiconductor refrigeration component is used to cool the water passing through the water purifier, enabling users to obtain ice water for use. The heat-generating side of the semiconductor refrigeration component is usually connected to a radiator for rapid heat dissipation. Utility Model Content

[0003] In view of this, the present invention provides fluid treatment equipment and water purifiers that can collect and utilize the heat generated by the semiconductor refrigeration component.

[0004] To solve the above technical problems, a technical solution adopted by the present application is: to provide a fluid treatment equipment, including energy storage materials, a device main body, and a semiconductor refrigeration component. The device main body is provided with an energy storage cavity for accommodating the energy storage materials. The device main body includes a fluid pipeline that is thermally connected to the energy storage materials; a semiconductor refrigeration assembly, including a refrigeration part and a heat-generating part, at least part of the heat-generating part is disposed in the energy storage cavity and is in contact with the energy storage materials.

[0005] In a specific embodiment, the semiconductor refrigeration assembly includes at least one refrigeration chip. The refrigeration part is disposed on one side of the refrigeration chip, and the heat-generating part is disposed on the other side of the refrigeration chip. The side of at least one refrigeration chip with the heat-generating part faces the energy storage materials.

[0006] In a specific embodiment, the device main body includes an energy storage box. The energy storage cavity is formed inside the energy storage box. The energy storage box is provided with a heat transfer hole communicating with the energy storage cavity. The refrigeration chip is embedded and seals the heat transfer hole, and the side of the refrigeration chip with the heat-generating part faces the inside of the energy storage cavity.

[0007] In a specific embodiment, the energy storage materials include phase change energy storage materials, and the phase change energy storage materials include at least one of crystalline hydrates, molten salts, metals, alloys, paraffins, fatty acids, high-density polyethylene, and polyols.

[0008] In a specific embodiment, the energy storage materials include at least one of heat transfer oil and water.

[0009] In a specific embodiment, the device body further includes a driving member, the output end of the driving member is disposed in the energy storage cavity, and under the output of the driving member, the energy storage material circulates and moves in the energy storage cavity. In a specific embodiment, the semiconductor refrigeration assembly further includes a heat dissipation member, one end of the heat dissipation member is connected to the heat generating portion, and the other end is inserted into the energy storage cavity.

[0010] In a specific embodiment, the heat dissipation member includes a heat pipe and a refrigerant. The refrigerant is accommodated in the heat pipe. The heat pipe is coiled and laid in the energy storage cavity, and the energy storage material covers the outer periphery of the heat pipe.

[0011] In a specific embodiment, the heat dissipation member includes a heat pipe and a refrigerant. A heat exchange channel is formed in the energy storage material. One end of the heat pipe is connected to the heat generating portion, and the other end communicates with the heat exchange channel. The refrigerant is accommodated in the heat pipe and the heat exchange channel. Part of the fluid pipeline disposed in the energy storage cavity is disposed in the heat exchange channel, and the refrigerant contacts the outer surface of the fluid pipeline.

[0012] To solve the above technical problems, another technical solution adopted by this application is: to provide a water purifier, including a filtration component and the fluid processing device as described in any one of the above embodiments. A water path is formed in the filtration component, and the output end of the water path communicates with the fluid pipeline of the fluid processing device.

[0013] The beneficial effects of this application include: The fluid processing device provided in the embodiments of this application is provided with an energy storage material in the energy storage cavity, stores the heat dissipated by the heat generating portion of the semiconductor refrigeration assembly in the energy storage material of the energy storage cavity, and when it is necessary to heat the fluid passing through the fluid pipeline, the heat stored in the energy storage material can be released, thereby heating the fluid, achieving the effect of storing and utilizing the heat generated by the semiconductor refrigeration assembly, and improving the energy utilization efficiency of the fluid processing device. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0015] Figure 1 is a schematic cross-sectional structure diagram of the fluid processing device provided by this application;

[0016] Figure 2 is a schematic structure diagram of the energy storage box in this application;

[0017] Figure 3It is a schematic diagram of the assembly structure of the energy storage box and the thermoelectric cooler in this application;

[0018] Figure 4 It is a schematic diagram of the structure of the fluid processing equipment provided by this application;

[0019] Figure 5 It is a schematic diagram of the structure of the heat pipe in the energy storage cavity in this application;

[0020] Figure 6 It is another schematic diagram of the energy storage box in this application;

[0021] Figure 7 It is a schematic diagram of the assembly structure of the energy storage box and the semiconductor refrigeration component in this application;

[0022] Figure 8 It is another schematic diagram of the assembly structure of the energy storage box and the semiconductor refrigeration component in this application.

[0023] Explanation of reference numerals:

[0024] 1. Fluid processing equipment; 2. Energy storage material; 3. Equipment main body; 31. Energy storage box; 311. Energy storage cavity; 312. Heat transfer hole; 32. Fluid pipeline; 33. Driving member; 4. Semiconductor refrigeration component; 41. Thermoelectric cooler; 411. Refrigeration part; 412. Heating part; 42. Heat pipe; 421. Heat exchange channel; 422. Heat dissipation path; 43. Refrigerant. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] The terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0027] References herein to "embodiments" or "implementations" mean that a particular feature, structure, or characteristic described in connection with the embodiments or implementations can be included in at least one embodiment of the invention. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0028] With the progress of technology, people's requirements for the quality of life are getting higher and higher. Small fluid treatment devices such as water purifiers have entered daily life. Users can use the water purifier to treat daily water to obtain water with a purity and temperature that meet the requirements.

[0029] In the process of the progress of fluid treatment devices, meeting the user's demand for water temperature is an important improvement direction. By adding a refrigeration component, the fluid pipeline in the fluid device can be cooled, so as to output cold water to the user. In order to meet the requirement of miniaturization of fluid treatment devices, semiconductor refrigeration components are usually used for refrigeration. In common fluid treatment devices, the low-temperature side of the semiconductor refrigeration component is used for refrigeration, and its heating side is usually connected to a radiator, and the heat is directly dissipated to the outside through the radiator, resulting in waste of this part of heat.

[0030] In order to improve or solve the above technical problems, the inventors of the present application have conducted long-term research and proposed at least the following embodiments.

[0031] Refer to Figure 1 , Figure 1 which is a schematic cross-sectional structure diagram of the fluid treatment device provided by the present application. An embodiment of the present application provides a fluid treatment device 1, including an energy storage material 2, a device main body 3, and a semiconductor refrigeration component. The device main body 3 may be provided with an energy storage cavity 311 for accommodating the energy storage material 2. The device main body 3 may include a fluid pipeline 32, and the fluid pipeline 32 is thermally connected to the energy storage material 2 for heat exchange with the energy storage material 2. The semiconductor refrigeration assembly 4 includes a refrigeration part 411 and a heating part 412. The refrigeration part 411 is used to absorb the heat of the fluid to cool the fluid, and the heating part 412 is at least partially disposed in the energy storage cavity 311 and in contact with the energy storage material 2, so as to conduct the heat generated during the operation of the semiconductor refrigeration assembly 4 into the energy storage material 2. The energy storage material 2 stores the heat emitted by the heating part 412 of the semiconductor refrigeration assembly 4, and this part of the heat can be used to heat the fluid flowing through the fluid pipeline 32.

[0032] Using the structure provided in this embodiment, the energy storage material 2 disposed in the energy storage cavity 311 can exchange energy with the heat generating part 412 of the thermoelectric cooling module 4, so as to store the heat dissipated by the heat generating part 412 in the energy storage material 2 of the energy storage cavity 311. When it is necessary to heat the fluid passing through the fluid pipeline 32, the heat stored in the energy storage material 2 can be released, and then conducted to the fluid pipeline 32 to heat the fluid, achieving the effect of storing and utilizing the heat generated by the thermoelectric cooling module 4, and improving the energy utilization efficiency of the fluid processing device 1. Among them, the heat conduction connection between the fluid pipeline 32 and the energy storage material 2 can be realized by directly burying the fluid pipeline 32 in the energy storage cavity 311 so that the fluid pipeline 32 is in direct contact with the energy storage material 2; it can also be realized by setting a heat conduction medium that is respectively connected to the fluid pipeline 32 and the energy storage material 2, so as to indirectly conduct heat between the fluid pipeline 32 and the energy storage material 2.

[0033] Optionally, one end of the heat conduction medium can be disposed in the energy storage cavity 311 to be in full contact with the energy storage material 2, and the other end can be disposed outside the energy storage cavity to connect and / or wrap the fluid pipeline 32; the other end of the heat conduction medium can also be directly inserted into the fluid pipeline 32 to contact the fluid in the fluid pipeline 32.

[0034] Optionally, the heat conduction medium can be prepared from materials with good heat conduction performance, such as at least one of materials such as metal, graphite, heat conductive silica gel, and heat conductive rubber. At least one of materials such as heat conductive insulating potting glue, heat conductive filler, flexible heat conductive pad, heat conduction tape, and heat conductive silicone grease can be provided between the heat conduction medium and the energy storage material 2 and the fluid pipeline 32 to assist in heat transfer.

[0035] Refer to Figure 2 、 Figure 3 , Figure 2 which is a schematic structural diagram of the energy storage box in this application. Figure 3 which is a schematic assembly structure diagram of the energy storage box and the refrigeration chip in this application. In an embodiment of this application, the thermoelectric cooling module 4 can include at least one refrigeration chip 41. The refrigeration part 411 can be specifically disposed on one side of the refrigeration chip 41, and the heat generating part 412 can be correspondingly disposed on the other side of the refrigeration chip 41. The side of at least one refrigeration chip 41 provided with the heat generating part 412 faces the energy storage material 2.

[0036] A thermoelectric cooler is a device that uses the thermoelectric effect of semiconductors to produce cooling capacity, also known as a thermoelectric refrigerator. Connect two different metals with a conductor and apply direct current, then the temperature at one junction decreases and the temperature at the other junction increases. The thermoelectric cooler has the characteristics of no noise, no vibration, no need for refrigerant, small volume, light weight, etc., and is reliable in operation, simple to operate, and easy to adjust the cooling capacity. The thermoelectric cooling structure in the form of the cooling sheet 41 is simple and reliable, and the cooling part 411 and the heating part 412 are arranged opposite to each other, which is convenient for the layout and installation of other components, can meet the requirements of miniaturization of the fluid processing device 1 while satisfying the refrigeration function, and improve the usability of the fluid processing device 1.

[0037] Optionally, the number of the cooling sheets 41 can be multiple. The multiple cooling sheets 41 are evenly arranged, and the multiple cooling parts 411 evenly absorb the heat of the fluid, making the fluid temperature more uniform, improving the refrigeration effect. At the same time, the heating parts 412 can also be evenly arranged for the energy storage material 2, reducing the probability of local overheating of the energy storage material 2, and improving the energy utilization efficiency of the fluid processing device 1.

[0038] In an embodiment of the present application, the device main body 3 includes an energy storage box 31, and the energy storage cavity 311 can be specifically formed inside the energy storage box 31. The energy storage box 31 can be provided with a heat transfer hole 312 communicating with the energy storage cavity 311, and the cooling sheet 41 can be embedded and block the heat transfer hole 312. The side of the cooling sheet 41 provided with the heating part 412 faces the inside of the energy storage cavity 311. The energy storage box 31 is used to accommodate the energy storage material 2, and the cooling sheet 41 is used to block the heat transfer hole 312, so as to reduce the speed of heat dissipation of the energy storage material 2 to the outside while realizing heat exchange, and improve the energy utilization efficiency of the fluid processing device 1.

[0039] Optionally, the energy storage box 31 can be made of a heat-insulating material, so as to reduce the speed of heat dissipation of the energy storage material 2 to the outside, improve the heat storage performance of the energy storage cavity 311, and improve the energy utilization efficiency of the fluid processing device 1. Optionally, the heat transfer hole 312 can be specifically opened on the lower side of the energy storage box 31, such as the surface of the energy storage box 31 facing vertically downward, or the lower end of the side surface of the energy storage box 31. Thus, the energy storage material 2 in the energy storage box 31 is in close contact with the heating part 412 under the action of gravity, improving the heat exchange efficiency. When the energy storage material 2 is in a state with strong fluidity such as liquid, solid-liquid mixture, gas, gas-liquid mixture, gas-liquid-solid mixture, etc., part of the energy storage material 2 that absorbs the heat of the heating part 412 and increases in temperature or undergoes a phase change can automatically move upward in the energy storage cavity 311, and the remaining part of the energy storage material 2 can be in contact with the heating part 412 and absorb heat, so that the temperature of the energy storage material 2 is more uniform, and the probability of local overheating affecting heat exchange is reduced, improving the energy utilization efficiency of the fluid processing device 1.

[0040] Optionally, the energy storage material 2 may include at least one of sensible heat energy storage material 2, phase change energy storage material 2, thermochemical energy storage material 2, and adsorption energy storage material 2. Among them, the sensible heat energy storage material 2 may include liquid energy storage material 2 and solid energy storage material 2, such as common heat storage media like water, soil, sand, gravel, concrete, aliphatic hydrocarbons, graphite, foamed resin, and mixed materials formed by high-temperature sintering of Li2O and Al2O3, TiO2, etc.

[0041] In an embodiment of the present application, the energy storage material 2 may specifically include a phase change energy storage material 2. Generally, the common sensible heat heat storage method generally stores energy by using the temperature rise and fall process of the energy storage material 2. The method is simple and has low cost, but the stored heat is small. The phase change energy storage material 2 can not only utilize the temperature rise and fall process, but also utilize the principle that substances absorb or release latent heat of phase change during processes such as solidification / melting, condensation / vaporization, sublimation / deposition, and other forms of phase change to achieve energy storage. The phase change energy storage material 2 per unit volume can store more energy compared to the sensible heat energy storage material 2. Occupying a smaller volume can meet the requirements of heat exchange and energy storage, thereby improving the heat storage density of the energy storage material 2 while meeting the demand for miniaturization of the fluid processing device 1 and enhancing the usability of the fluid processing device 1.

[0042] Among them, the phase change energy storage material 2 may specifically include at least one of crystalline hydrates, molten salts, metals, alloys, paraffins, fatty acids, high-density polyethylene, and polyols. Crystalline hydrates are usually an important type of medium- and low-temperature phase change energy storage materials, with advantages such as low price, large volume heat storage density, large heat of fusion, fixed melting point, higher thermal conductivity than organic phase change materials, and generally being neutral.

[0043] Optionally, the phase change energy storage material 2 may further include composite phase change materials. The supporting materials of the composite phase change materials may include at least one of expanded graphite, ceramics, bentonite, and microcapsules. Expanded graphite is a porous worm-like substance composed of graphite microcrystals. In addition to retaining the good thermal conductivity of flake graphite, it also has good adsorption properties. Ceramic materials have advantages such as high temperature resistance, oxidation resistance, and chemical corrosion resistance, and are widely selected as industrial heat storage bodies. The ceramic materials may include at least one of quartz sand, silicon carbide, corundum, mullite, zircon, and cordierite. Bentonite has a unique nano-interlayer structure and can use the "intercalation method" to embed organic phase change materials into its layered space to prepare organic / inorganic nanocomposites. Microcapsule phase change materials are composite phase change materials prepared by microcapsule technology. In microcapsule phase change materials, the substances undergoing phase change are enclosed in spherical capsules, effectively solving problems such as leakage, phase separation, and corrosion of phase change materials, which is beneficial to improving the performance of the energy storage material 2 and enhancing the usability of the fluid processing device 1.

[0044] Optionally, when the energy storage material 2 is a crystalline hydrated salt, the profile shape of the energy storage box 31 can be a flat disc shape. When a disc-shaped container with a relatively shallow depth is placed horizontally, it helps to reduce the probability of supercooling and phase separation occurring in the energy storage material 2 during use.

[0045] Optionally, when the energy storage material 2 is a crystalline hydrated salt, a thickening agent and / or a nucleating agent can also be added to the energy storage cavity 311. The thickening agent and / or the nucleating agent act on the energy storage material 2, which can reduce the probability of component separation and have no impact on the phase change process.

[0046] In an embodiment of the present application, the energy storage material 2 can specifically include at least one of heat transfer oil and water. Heat transfer oil is a heat transfer medium, which is widely used in various industries. It has a low viscosity, a large density, a high specific heat capacity and a high thermal conductivity, good stability, is resistant to storage and has a high boiling point. The maximum use temperature can reach about 300 °C, which can meet the heat exchange requirements of the heating part 412 without undergoing a phase change, improving the availability and stability of the fluid processing device 1.

[0047] Refer to Figure 6 , Figure 6 is another schematic structural diagram of the energy storage box in the present application. In an embodiment of the present application, the device main body 3 can further include a driving member 33, and the output end of the driving member 33 is arranged in the energy storage cavity 311. Under the output of the driving member 33, the energy storage material 2 can circulate and move in the energy storage cavity 311, making the energy storage material 2 near the heating part 412 continuously move away from the heating part 412, reducing the temperature difference between the energy storage material 2 near the heating part 412 and the energy storage material 2 far from the heating part 412, thereby reducing the probability of local overheating affecting the heat exchange effect of the heating part 412, improving the heat exchange efficiency between the energy storage material 2 and the heating part 412, and further improving the energy utilization rate of the fluid processing device 1.

[0048] In Figure 6 , the output end of the driving member 33 is arranged in the energy storage cavity 311 in the form of a stirring member. The stirring member can stir the energy storage material 2 in the energy storage cavity 311, continuously disperse the heat absorbed therein, thereby reducing the temperature difference between the energy storage material 2 near the heating part 412 and the energy storage material 2 far from the heating part 412, reducing the probability of local overheating affecting the heat exchange effect of the heating part 412, improving the heat exchange efficiency between the energy storage material 2 and the heating part 412, and further improving the energy utilization rate of the fluid processing device 1.

[0049] Refer to Figure 4 , Figure 5 , Figure 4 is a schematic structural diagram of the fluid processing device provided by the present application. Figure 5It is a schematic structural diagram of the heat pipe in the energy storage cavity in this application. In an embodiment of this application, the semiconductor refrigeration component 4 may further include a heat dissipation component. The heating part 412 is arranged on the heat dissipation component, and a part of the heat dissipation component provided with the heating part 412 is inserted into the energy storage cavity 311. Thus, the heat generated by the semiconductor refrigeration component 4 is conducted into the energy storage cavity 311 by using the heat dissipation component, realizing the heat exchange process and improving the energy utilization rate of the fluid processing device 1.

[0050] Optionally, the heat dissipation component may be a plurality of layers of heat exchange fins arranged in rows. The heat exchange fins are inserted into the energy storage material 2, and the heating part 412 is located on the surface of the multi-layer fins. Compared with the single surface heating part 412 of the refrigeration sheet 41, the form of the fins increases the area of the heating part 412, improves the contact area of the heat exchange process, can reduce the probability of local overheating of the energy storage material 2 affecting heat exchange, and improves the energy utilization rate of the fluid processing device 1.

[0051] In an embodiment of this application, the heat dissipation component may specifically include a heat pipe 42 and a refrigerant 43. The refrigerant 43 is accommodated in the heat pipe 42. Among them, the heat pipe 42 is coiled and laid in the energy storage cavity 311, and the energy storage material 2 covers the outer periphery of the heat pipe 42. The heat transfer can be realized through the refrigerant 43 in the heat pipe 42. The form of the heat pipe 42 increases the contact area of the heat exchange process, enables the refrigerant 43 to exchange heat with the energy storage material 2 more efficiently, can reduce the probability of local overheating of the energy storage material 2 affecting heat exchange, and improves the energy utilization rate of the fluid processing device 1. Among them, the structure of the heat pipe 42 in the energy storage cavity 311 can refer to Figure 5 .

[0052] In an embodiment of this application, the heat dissipation component includes a heat pipe 42, a refrigerant 43, and a heat exchange channel 421. The heat exchange channel 421 is formed in the energy storage material 2. The heating part 412 is arranged in the heat exchange channel 421, and the heat pipe 42 communicates with the heat exchange channel 421. The refrigerant 43 is accommodated in the heat pipe 42 and the heat exchange channel 421, and thus flows in the heat pipe 42 and the heat exchange channel 421, and conducts the heat dissipated by the semiconductor refrigeration component 4 into the energy storage cavity 311 through the heat exchange channel 421. Among them, a part of the fluid pipeline 32 arranged in the energy storage cavity 311 may be specifically arranged in the heat exchange channel 421, and the refrigerant 43 flowing into the heat exchange channel 421 can contact the outer surface of the fluid pipeline 32, thereby directly performing a heat exchange process on the fluid in the fluid passage.

[0053] Using the structure provided in this embodiment, when it is necessary to heat the fluid in the fluid pipeline 32, the heat of the heating part 412 does not need to be transferred to the fluid through the energy storage material 2 anymore, but can directly exchange heat with the fluid through the refrigerant 43 in the heat exchange channel 421, thereby reducing the heat loss in the heat transfer process. At the same time, since the refrigerant 43 has better thermal conductivity than the energy storage material 2, the efficiency of heating the fluid can also be improved.

[0054] Optionally, outside the direct-connection heat exchange channel 421, the heat pipe 42 can also be connected to a heat dissipation path 422, and the heat dissipation path 422 can interact with the outside world to achieve heat dissipation. Thus, when the heat stored in the energy storage material 2 is sufficient, the refrigerant 43 is directly used to dissipate heat to the outside world, reducing the influence of the excessively high temperature of the energy storage material 2 on the heat dissipation effect of the heat generating part 412 and the refrigeration effect of the refrigeration part 411, and improving the stability of the fluid processing device 1. Further, a valve body can be provided in the heat pipe 42 to control the on-off of the heat pipe 42 with the heat dissipation path 422 and the heat exchange channel 421, realizing a controllable heat exchange process and improving the usability of the fluid processing device 1.

[0055] Figure 7 It is a schematic assembly structure diagram of the energy storage box and the semiconductor refrigeration component in the present application. Figure 7 A possible assembly manner of the energy storage box 31 and the semiconductor refrigeration component 4 is shown. One of the semiconductor refrigeration components 4 can penetrate through the energy storage box 31, its refrigeration part 411 is arranged at the exposed two ends, and the heat generating part 412 is arranged in the middle section inside the energy storage box 31, so as to exchange heat with the energy storage material 2 inside the energy storage box 31, enabling the heat to be evenly transferred in multiple directions, improving the efficiency of the heat exchange process, and also making the temperature inside the energy storage material 2 more uniform.

[0056] Heat transfer holes 312 can be further opened on the peripheral side of the energy storage box 31 to arrange the refrigeration sheets 41. The refrigeration sheets 41 transfer heat from the outer periphery of the energy storage material 2 to the center of the energy storage material 2, while the semiconductor refrigeration component 4 inserted into the energy storage box 31 can transfer heat from the center of the energy storage material 2 to the outside. By using two-way heat transfer, the mutual penetration process of energy is improved, the energy storage efficiency of the energy storage material 2 can be improved, and the temperature inside the energy storage material 2 can be made more uniform.

[0057] Optionally, when most of the energy storage material 2 is in a solid phase, since the solid-phase material has weak fluidity, the heat transfer efficiency inside the energy storage material 2 will be relatively low. At this time, the temperature difference between the internal semiconductor refrigeration component 4 and the external refrigeration sheet 41 can be controlled to be relatively low for heat transfer with a low internal and external temperature difference, so as to make the temperature of the energy storage material 2 more uniform. When most of the energy storage material 2 is in a liquid phase, at this time the fluidity of the energy storage material 2 is stronger, and the relative temperature difference convection phenomenon inside the energy storage material 2 is more obvious. At this time, the temperature difference between the internal semiconductor refrigeration component 4 and the external refrigeration sheet 41 can be controlled to be relatively large to utilize the temperature difference convection for high-temperature difference heat transfer inside and outside, so as to improve the heat transfer efficiency.

[0058] Optionally, Figure 6 The driving part 33 in the illustrated embodiment can be used in the structure provided in this embodiment, thereby accelerating the heat transfer process between the outside and the inside, accelerating the mutual penetration of energy, and improving the heat transfer efficiency inside the energy storage material 2.

[0059] Optionally, in this embodiment, there may be multiple heat transfer holes 312 and multiple Peltier elements 41, corresponding to multiple sides of the energy storage tank 31, to improve the heat transfer efficiency.

[0060] Figure 8 It is another schematic assembly structure diagram of the energy storage tank and the semiconductor refrigeration component in the present application. Refer to Figure 8 , where the number of Peltier elements 41 can be multiple. The multiple Peltier elements 41 are arranged side by side and evenly. The multiple Peltier elements 41 share the refrigeration task, thereby reducing the absolute temperature value of the heating part 412 of a single Peltier element 41, and ensuring that no over-temperature reaction occurs during the heat transfer process. Among them, the multiple Peltier elements 41 can be connected to a temperature control system, so as to control the temperature value within a suitable range under the control of the temperature control system.

[0061] Optionally, Figure 4 、 Figure 7 For the structure in which a part of the semiconductor refrigeration component 4 shown in

[0062] is sleeved with the energy storage cavity 311, a circular sleeve or a rectangular flat sleeve can be used. Moreover, the number of a part of the semiconductor refrigeration components 4 sleeved therein can be multiple and arranged evenly, so as to save space and improve the heat exchange efficiency. Further, on the surface of this part of the semiconductor refrigeration component 4 facing the energy storage cavity 311, various structures such as fins, corrugations, and winding nets can be provided to increase the contact area between the semiconductor refrigeration component 4 and the energy storage material 2 in the energy storage cavity 311, thereby improving the heat transfer efficiency.

[0063] Using the structure provided in this embodiment, the energy storage material 2 provided in the energy storage cavity 311 of the fluid processing device 1 can exchange energy with the heating part 412 of the semiconductor refrigeration component 4, so as to store the heat dissipated by the heating part 412 in the energy storage material 2 of the energy storage cavity 311. When it is necessary to heat the fluid passing through the fluid pipeline 32, the heat stored in the energy storage material 2 can be released, and then conducted to the fluid pipeline 32 to heat the fluid, achieving the effect of storing and utilizing the heat generated by the semiconductor refrigeration component 4, improving the energy utilization efficiency of the fluid processing device 1, and further improving the usability of the water purifier.

[0064] References to "embodiments" or "implementation manners" in the present invention mean that specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present invention. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described in the present invention may be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in the various embodiments of the present invention may be combined arbitrarily with each other without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of the present invention.

[0065] Finally, it should be noted that the above implementation manners are only used to illustrate the technical solution of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above preferred implementation manners, those of ordinary skill in the art should understand that modifications or equivalent replacements can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A fluid treatment device, characterized in that, Comprising: Energy storage material (2); A device main body (3) provided with an energy storage cavity (311) for accommodating the energy storage material (2), the device main body (3) includes a fluid pipeline (32), and the fluid pipeline (32) is thermally connected to the energy storage material (2); A semiconductor refrigeration component (4) including a refrigeration part (411) and a heating part (412), at least part of the heating part (412) is arranged in the energy storage cavity (311) and is in contact with the energy storage material (2).

2. The fluid processing device according to claim 1, wherein The semiconductor refrigeration component (4) includes at least one refrigeration chip (41), the refrigeration part (411) is arranged on one side of the refrigeration chip (41), the heating part (412) is arranged on the other side of the refrigeration chip (41), and the side of at least one refrigeration chip (41) provided with the heating part (412) faces the energy storage material (2).

3. The fluid processing device according to claim 2, wherein The device main body (3) includes an energy storage box (31), the energy storage cavity (311) is formed in the energy storage box (31), the energy storage box (31) is provided with a heat transfer hole (312) communicating with the energy storage cavity (311), the refrigeration chip (41) is embedded and seals the heat transfer hole (312), and the side of the refrigeration chip (41) provided with the heating part (412) faces the inside of the energy storage cavity (311).

4. The fluid processing device according to claim 1, wherein The energy storage material (2) includes a phase change energy storage material (2), and the phase change energy storage material (2) includes at least one of crystal hydrate salts, molten salts, metals, alloys, paraffins, fatty acids, high-density polyethylene, and polyols.

5. The fluid processing device according to claim 1, wherein The energy storage material (2) includes at least one of heat transfer oil and water.

6. The fluid processing device according to any one of claims 1 to 5, wherein The device main body (3) further includes a driving member (33), the output end of the driving member (33) is arranged in the energy storage cavity (311), and under the output of the driving member (33), the energy storage material (2) circulates and moves in the energy storage cavity (311).

7. The fluid processing device according to any one of claims 1 to 5, wherein The semiconductor refrigeration component (4) further includes a heat dissipation member, the heating part (412) is arranged on the heat dissipation member, and the part of the heat dissipation member provided with the heating part (412) is inserted into the energy storage cavity (311).

8. The fluid processing device according to claim 7, wherein The heat dissipation member includes a heat pipe (42) and a refrigerant (43), the refrigerant (43) is accommodated in the heat pipe (42), the heat pipe (42) is coiled and laid in the energy storage cavity (311), and the energy storage material (2) covers the outer periphery of the heat pipe (42).

9. The fluid processing device according to claim 7, wherein The heat dissipation component includes a heat pipe (42), a refrigerant (43), and a heat exchange channel (421). The heat exchange channel (421) is formed in the energy storage material (2). The heating part (412) is arranged in the heat exchange channel (421). The heat pipe (42) communicates with the heat exchange channel (421). The refrigerant (43) is accommodated in the heat pipe (42) and the heat exchange channel (421). A part of the fluid pipeline (32) arranged in the energy storage cavity (311) is arranged in the heat exchange channel (421). The refrigerant (43) contacts the outer surface of the fluid pipeline (32).

10. A water purifier, characterized in that, It includes a filtration assembly and the fluid treatment device according to any one of claims 1 to 9. A water path is formed in the filtration assembly. The output end of the water path communicates with the fluid pipeline (32) of the fluid treatment device (1).

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