Circuit board bending performance testing device

Abstract

The utility model provides a circuit board bending performance testing device which comprises a base and a main body frame which are fixedly connected, the inner side of the top of the main body frame is fixedly connected with an upper guide frame, a pressure applying structure is slidably connected in the upper guide frame, and the outer end of the pressure applying structure and the inner side of the main body frame are fixedly connected with telescopic rods. A positioning structure is movably arranged on the outer side of the body frame, placing plates are fixedly connected to the two sides of the inner side of the body frame, the positioning structure is located on the outer sides of the placing plates, and an adjusting arm is connected to one side of the bottom of the body frame in a penetrating mode. The effect of placing a to-be-detected circuit board is achieved through a placing plate, the effect of supporting the two ends of the circuit board is achieved, and the effect of driving the whole positioning arm to be turned over and adjusted is achieved through cooperation of a sliding seat arranged in a sliding mode and a second hydraulic rod at the bottom. The effect of pressing and fixing the two ends of the circuit board placed on the placing plate is achieved through the positioning arm and the pressing head which can be adjusted in a turnover mode.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and more specifically, to a device for testing the bending performance of circuit boards. Background Art

[0002] In today's modern electronic product manufacturing, printed circuit boards are an indispensable component. Surface mounting and through-hole mounting in electronic packaging have become the main methods for high-density electronic device packaging. However, they also pose challenges to mechanical reliability. The use of high-density component packaging and complex layouts may cause PCBs to withstand mechanical stress and thermal stress during the assembly process, thereby increasing the risk of failure. Therefore, it is particularly important to understand the mechanical reliability of finished PCBs. Mechanical reliability testing of finished PCBs usually includes bending strength testing: the circuit board is usually bent to a certain angle, and then the bending strength of the circuit board at this angle is measured, which can ensure that the circuit board will not be damaged due to insufficient mechanical strength during use. For example, the Chinese utility model with the application number 202321850049.7 proposes a device for testing the bending performance of circuit boards, which relates to the field of circuit board testing equipment and includes a test bench and a test rack. The test rack is fixedly installed on the top of the test bench. Two retractable placement plates are respectively arranged on both sides of the test rack. Two opposite telescopic members are arranged on the top of the test rack. The output end of the telescopic member is fixedly connected with a pressing plate. Both ends of the pressing plate are respectively movably inserted into the through grooves on both sides of the test rack. Adjusting components for adjusting the punching force are respectively arranged on both sides of the test rack. Placement components for supporting the ends of the circuit board are respectively installed on the two placement plates. The telescopic movement of the telescopic member will drive the pressing plate to move up and down. The pressing plate moves downward and fits on the surface of the baffle. By rotating the sleeve to change the position of the baffle, the pushing force of the pressing plate can be conveniently adjusted. By changing the position of the baffle, different force bending tests can be carried out on the circuit board, and the test amplitude can be adjusted arbitrarily, which improves the accuracy of the test to a certain extent. However, the problems existing in the use of this device are:

[0003] When the bending angle of the circuit board is the same, the change in the positions of the force application point and the fulcrum will also affect the corresponding required pressure value. However, when the above device is in use, the position of the force application point cannot be well adjusted, which reduces the comprehensiveness and accuracy of the test during the actual test process. Especially when it is necessary to compare and understand the difference in the anti-bending performance between two groups or multiple groups of circuit boards through testing, it is easy to affect the accuracy and fairness of the comparison results.

[0004] Therefore, the utility model proposes a device for testing the bending performance of circuit boards. Content of the Utility Model

[0005] The purpose of the utility model is to solve the technical problems proposed in the above background art and provide a device for testing the bending performance of circuit boards, which can solve:

[0006] When the existing circuit board bending performance testing device is in use, it cannot well adjust the position of the stress point, which reduces the comprehensiveness and accuracy of the test during the actual test. Especially when it is necessary to compare and understand the difference in bending resistance performance between two groups or multiple groups of circuit boards through testing, it is easy to affect the accuracy and fairness of the comparison results.

[0007] To achieve the above object, the present utility model provides the following technical solutions: A circuit board bending performance testing device includes a base and a main body frame fixedly connected. An upper guide frame is fixedly connected to the inner side of the top of the main body frame. A pressing structure is slidably connected in the upper guide frame. An expansion rod is fixedly connected between the outer end of the pressing structure and the inner side of the main body frame. A positioning structure is movably arranged on the outer side of the main body frame. Placing plates are fixedly connected to both sides inside the main body frame. The positioning structure is simultaneously located outside the placing plates. One side of the bottom of the main body frame is connected through an adjusting arm. A support structure is fixedly connected to the inner end of the adjusting arm. The base is arranged in an "L" shape and is provided with an upward fold angle at the same end position as the adjusting arm.

[0008] A further preferred solution: The support structure includes a support plate fixedly connected to one end of the adjusting arm, and also includes an upper support roller and a spring rod fixedly connected. The upper support roller and the spring rod are simultaneously movably penetrated through one end of the adjusting arm and are vertically arranged. A pressure sensing mechanism is fixedly connected to the support plate. The bottom end of the spring rod is simultaneously fixedly connected to the pressure sensing mechanism.

[0009] A further preferred solution: The adjusting arm horizontally penetrates through one side of the bottom of the main body frame as a whole. At the same time, an electric push rod is provided in a supporting manner at the outer end of the adjusting arm. The outer end of the electric push rod is fixedly connected to the folded corner position of the upper section of the base.

[0010] A further preferred solution: The upper support roller is set as an arc-shaped hard plastic roller. The spring rod is set as a multi-section socket spring rod. A pressure sensing element is provided in a supporting manner between the bottom end and the pressure sensing mechanism.

[0011] A further preferred solution: The upper guide frame is set as a rectangular frame, horizontally arranged as a whole. Horizontal guide grooves are opened on both sides of its surface. Two groups of placing plates are provided, arranged in an "L" shape, and are located directly below the two ends of the upper guide frame.

[0012] A further preferred solution: The pressing structure includes an outer sleeve frame, a first hydraulic rod, a lower mounting seat and a contact roller fixedly connected from top to bottom. The lower mounting seat is vertically arranged in a "Z" shape. The contact roller is set as a rubber roller and is internally provided with a pressure sensing mechanism. The outer side of the outer sleeve frame is fixedly connected to the expansion rod.

[0013] A further preferred solution: A protruding guide block is fixedly connected to the surface of the first hydraulic rod. The guide block is simultaneously slidably embedded in the horizontal guide groove on the surface of the upper guide frame.

[0014] Further preferred solution: The positioning structure includes a support base and an outer guide plate fixedly connected. A sliding seat is slidably connected to the inner side of the outer guide plate. It also includes a second hydraulic rod fixedly connected to the surface of the support base, and the second hydraulic rod is simultaneously fixedly connected to the bottom of the sliding seat. A positioning arm is movably connected to the surface of the sliding seat. A pressing head is fixedly connected to the bottom of the outer end of the positioning arm. The middle position at the bottom of the positioning arm is simultaneously movably connected to an auxiliary arm, and the bottom end of the auxiliary arm is simultaneously movably connected to the surface of the support base.

[0015] Further preferred solution: One end of the outer guide plate is vertically connected to the support base. The outer guide plate and the sliding seat are slidably connected through a track assembly. The positioning arm and the sliding seat are pivotally connected through a shaft body. The upper and lower ends of the auxiliary arm are simultaneously pivotally connected to the corresponding positioning arm and the support base through a shaft body;

[0016] The pressing head is set as a rubber pressing head.

[0017] Further preferred solution: The support base is fixedly connected to the outer side of the main body frame, and an opening is provided on the outer surface of the main body frame corresponding to the positioning structure.

[0018] Beneficial effects:

[0019] 1. By adjusting the arm, the effect of controlling the entire support structure for horizontal telescopic adjustment is achieved. By the upper support roller, the effect of supporting the external circuit board from the bottom position is achieved. By the spring rod cooperating with the pressure sensing mechanism, the effect of detecting the pressure value received by the upper support roller is achieved.

[0020] 2. By the upper guide frame cooperating with the telescopic rod, the effect of facilitating the horizontal adjustment of the entire pressing structure along it is achieved. By the contact roller, the effect of pressing the surface of the external circuit board from the upper position is achieved. And the guide block on the surface of the first hydraulic rod facilitates ensuring the stability of the movement adjustment of the entire pressing structure.

[0021] 3. By the placement plate, the effect of placing the circuit board to be detected is achieved, and the effect of supporting both ends of the circuit board is achieved. By the slidably arranged sliding seat cooperating with the second hydraulic rod at the bottom, the effect of driving the entire positioning arm to perform flipping adjustment is achieved. By the flip-adjustable positioning arm and the pressing head, the effect of pressing and fixing both ends of the circuit board placed on the placement plate is achieved. By the auxiliary arm, the effect of ensuring the stability of the flipping and pressing of the positioning arm is achieved. Description of the drawings

[0022] Figure 1 Front view of the overall structure of the present utility model;

[0023] Figure 2 Front view of the connection of the pressing structure of the present utility model;

[0024] Figure 3 Front elevation view of the connection of the positioning structure of the present utility model;

[0025] Figure 4 Of the present utility model Figure 1 Enlarged view of the structure at position A.

[0026] Figures 1-4 In which: 1, base; 2, main body frame; 3, upper guide frame; 4, pressing structure; 5, telescopic rod; 6, positioning structure; 7, adjusting arm; 8, first hydraulic rod; 9, outer sleeve frame; 10, lower mounting seat; 11, contact roller; 12, support seat; 13, outer guide plate; 14, sliding seat; 15, positioning arm; 16, pressing head; 17, auxiliary arm; 18, second hydraulic rod; 19, support plate; 20, pressure sensing mechanism; 21, upper support roller; 22, spring rod; 23, placement plate. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the attached Figures 1-4 drawings in the embodiments of the present utility model.

[0028] Please refer to Figures 1-4 , in the embodiment of the present utility model, a circuit board bending performance testing device includes a fixedly connected base 1 and a main body frame 2. An upper guide frame 3 is fixedly connected to the inner side of the top of the main body frame 2. A pressing structure 4 is slidably connected in the upper guide frame 3. An outer end of the pressing structure 4 and the inner side of the main body frame 2 are fixedly connected with a telescopic rod 5. A positioning structure 6 is movably arranged outside the main body frame 2. Both sides of the inner side of the main body frame 2 are fixedly connected with a placement plate 23. The positioning structure 6 is located outside the placement plate 23 at the same time. One side of the bottom of the main body frame 2 is penetrated and connected with an adjusting arm 7. An inner end of the adjusting arm 7 is fixedly connected with a support structure. During the detection process, the user can select different contact points of the pressing structure 4 and the support structure on the circuit board, and then complete the pressure test at different positions. The test result is read through the pressure sensing mechanism provided in the present device, and then the bending test of the circuit board is completed.

[0029] In the embodiment of the present utility model, the support structure includes a support plate 19 fixedly connected to one end of the adjusting arm 7, and further includes an upper support roller 21 and a spring rod 22 fixedly connected. The upper support roller 21 and the spring rod 22 simultaneously pass through one end of the adjusting arm 7 vertically. A pressure sensing mechanism 20 is fixedly connected to the support plate 19, and the bottom end of the spring rod 22 is simultaneously fixedly connected to the pressure sensing mechanism 20. The base 1 is arranged in an "L" shape and is bent upward at the same end position as the adjusting arm 7. The adjusting arm 7 horizontally penetrates through one side of the bottom of the main body frame 2 as a whole. At the same time, an electric push rod is provided at the outer end of the adjusting arm 7, and the outer end of the electric push rod is fixedly connected to the bent position of the upper section of the base 1. The upper support roller 21 is set as an arc-shaped hard plastic roller, the spring rod 22 is set as a multi-stage socket spring rod, and a pressure sensing element is provided between the bottom end and the pressure sensing mechanism 20. The adjusting arm 7 is used to control the entire support structure to perform horizontal telescopic adjustment. The upper support roller 21 is used to support the external circuit board from the bottom position. The spring rod 22 cooperates with the pressure sensing mechanism 20 to detect the pressure value received by the upper support roller 21.

[0030] When supporting the bottom of the external circuit board, the user can freely adjust the length of the adjusting arm 7 in the main body frame 2, and then drive the entire support structure to select different support points on the bottom of the circuit board. During the detection process, different position bending performance tests of the circuit board can be carried out through different support points of the upper support roller 21 on the circuit board.

[0031] The upper guide frame 3 is set as a rectangular frame and is arranged horizontally as a whole. Horizontal guide grooves are opened on both of its side surfaces. The pressing structure 4 includes an outer sleeve frame 9, a first hydraulic rod 8, a lower mounting seat 10 and a contact roller 11 fixedly connected from top to bottom. The lower mounting seat 10 is arranged vertically in a "Z" shape. The contact roller 11 is set as a rubber roller and is internally provided with a pressure sensing mechanism. The outer side of the outer sleeve frame 9 is fixedly connected to the telescopic rod 5. A protruding guide block is fixedly connected to the surface of the first hydraulic rod 8, and the guide block simultaneously slides into the horizontal guide groove on the surface of the upper guide frame 3. The upper guide frame 3 cooperates with the telescopic rod 5 to facilitate the horizontal adjustment of the entire pressing structure 4 along it. The contact roller 11 is used to perform a pressing operation on the surface of the external circuit board from the upper position. The guide block on the surface of the first hydraulic rod 8 facilitates ensuring the stability of the movement and adjustment of the entire pressing structure 4.

[0032] During the pressing process, the user can slide and adjust the entire pressing structure 4 along the upper guide frame 3 to select different contact points with the surface of the circuit board for the bending performance test. During the test, the pressing force of the first hydraulic rod 8 can be read and tested through the pressure sensing mechanism built in the contact roller 11.

[0033] There are two sets of placement plates 23, which are arranged in an "L" shape and are located directly below the two ends of the upper guide frame 3. The positioning structure 6 includes a support base 12 and an outer guide plate 13 that are fixedly connected. A sliding seat 14 is slidably connected to the inner side of the outer guide plate 13. It also includes a second hydraulic rod 18 fixedly connected to the surface of the support base 12. The second hydraulic rod 18 is also fixedly connected to the bottom of the sliding seat 14. A positioning arm 15 is movably connected to the surface of the sliding seat 14. A pressing head 16 is fixedly connected to the bottom of the outer end of the positioning arm 15. A middle position at the bottom of the positioning arm 15 is also movably connected to an auxiliary arm 17. The bottom end of the auxiliary arm 17 is also movably connected to the surface of the support base 12. The outer guide plate 13 is vertically connected to one end of the support base 12. The outer guide plate 13 and the sliding seat 14 are slidably connected through a track assembly. The positioning arm 15 and the sliding seat 14 are pivotally connected through a shaft. The upper and lower ends of the auxiliary arm 17 are pivotally connected to the corresponding positioning arm 15 and the support base 12 through shafts. The pressing head 16 is set as a rubber pressing head. The support base 12 is fixedly connected to the outer side of the main body frame 2. An opening is provided on the outer surface of the main body frame 2 corresponding to the positioning structure 6. The placement plate 23 is used to place the circuit board to be detected, achieving the effect of supporting both ends of the circuit board. By the slidably arranged sliding seat 14 cooperating with the second hydraulic rod 18 at the bottom, the effect of driving the overall flipping adjustment of the positioning arm 15 is achieved. By the flip-adjustable positioning arm 15 and the pressing head 16, the effect of pressing and fixing both ends of the circuit board placed on the placement plate 23 is achieved. By the auxiliary arm 17, the effect of ensuring the stability of the flipping and pressing of the positioning arm 15 is achieved.

[0034] When using this device, the external circuit board is first placed on the placement plate 23. Then, the second hydraulic rod 18 is started to drive the sliding seat 14 to slide and adjust along the inner side of the outer guide plate 13. The downward sliding of the sliding seat 14 drives the positioning arm 15 to flip and press down with the connection point with the sliding seat 14 as the fulcrum, so that the pressing head 16 presses and fixes both ends of the circuit board. The auxiliary arm 17 adaptively adjusts according to the flipping of the positioning arm 15. After the basic positioning of the circuit board, the user adjusts the length of the adjusting arm 7 to drive the support structure to support the bottom surface of the circuit board. Then, the telescopic rod 5 is extended and retracted to drive the pressing structure 4 to move and adjust along the upper guide frame 3 to select the contact point with the top surface of the circuit board. Then, the first hydraulic rod 8 is started to drive the contact roller 11 to press on the top surface of the circuit board to complete the detection.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered by the scope of the claims and the description of the present invention.

Claims

1. A circuit board bending performance testing device, characterized in that: It includes a base (1) and a main body frame (2) fixedly connected. An upper guide frame (3) is fixedly connected to the inner side of the top of the main body frame (2). A pressing structure (4) is slidably connected in the upper guide frame (3). An expansion rod (5) is fixedly connected between the outer end of the pressing structure (4) and the inner side of the main body frame (2). A positioning structure (6) is movably arranged on the outer side of the main body frame (2). Placing plates (23) are fixedly connected to both sides inside the main body frame (2). The positioning structure (6) is located outside the placing plates (23) at the same time. One side of the bottom of the main body frame (2) is connected through an adjusting arm (7). A support structure is fixedly connected to the inner end of the adjusting arm (7). The base (1) is arranged in an "L" shape and is provided with an upward fold angle at the same end position as the adjusting arm (7).

2. The circuit board bending performance testing device according to claim 1, wherein: The support structure includes a support plate (19) fixedly connected to one end of the adjusting arm (7), and also includes an upper support roller (21) and a spring rod (22) fixedly connected. The upper support roller (21) and the spring rod (22) both movably penetrate through one end of the adjusting arm (7) and are vertically arranged. A pressure sensing mechanism (20) is fixedly connected to the support plate (19). The bottom end of the spring rod (22) is fixedly connected to the pressure sensing mechanism (20) at the same time.

3. The circuit board bending performance testing device according to claim 2, wherein: The adjusting arm (7) horizontally penetrates through one side of the bottom of the main body frame (2) as a whole. At the same time, an electric push rod is provided in a matching manner at the outer end of the adjusting arm (7). The outer end of the electric push rod is fixedly connected to the folded corner position of the upper section of the base (1).

4. The circuit board bending performance testing device according to claim 2, wherein: The upper support roller (21) is set as an arc-shaped hard plastic roller. The spring rod (22) is set as a multi-section socketed spring rod. A pressure sensing element is provided in a matching manner between the bottom end and the pressure sensing mechanism (20).

5. The circuit board bending performance testing device according to claim 1, wherein: The upper guide frame (3) is set as a rectangular frame, horizontally arranged as a whole. Horizontal guide grooves are opened on both sides of its surface. There are two groups of placing plates (23), arranged in an "L" shape, and located directly below both ends of the upper guide frame (3).

6. The circuit board bending performance testing device according to claim 1, wherein: The pressing structure (4) includes an outer sleeve frame (9), a first hydraulic rod (8), a lower mounting seat (10) and a contact roller (11) fixedly connected from top to bottom. The lower mounting seat (10) is vertically arranged in a "Z" shape. The contact roller (11) is set as a rubber roller and is internally provided with a pressure sensing mechanism. The outer side of the outer sleeve frame (9) is fixedly connected to the expansion rod (5).

7. The circuit board bending performance testing device according to claim 6, characterized in that: A protruding guide block is fixedly connected to the surface of the first hydraulic rod (8). The guide block is simultaneously slidably embedded in the horizontal guide groove on the surface of the upper guide frame (3).

8. A circuit board bending performance testing device according to claim 1, characterized in that: The positioning structure (6) includes a support seat (12) and an outer guide plate (13) fixedly connected. A sliding seat (14) is slidably connected to the inner side of the outer guide plate (13). It also includes a second hydraulic rod (18) fixedly connected to the surface of the support seat (12). The second hydraulic rod (18) is simultaneously fixedly connected to the bottom of the sliding seat (14). A positioning arm (15) is movably connected to the surface of the sliding seat (14). A pressing head (16) is fixedly connected to the bottom of the outer end of the positioning arm (15). An auxiliary arm (17) is simultaneously movably connected to the middle section of the bottom of the positioning arm (15). The bottom end of the auxiliary arm (17) is simultaneously movably connected to the surface of the support seat (12).

9. A circuit board bending performance testing device according to claim 8, characterized in that: The outer guide plate (13) is vertically connected to one end of the support seat (12). The outer guide plate (13) and the sliding seat (14) are slidably connected through a track assembly. The positioning arm (15) and the sliding seat (14) are pivotally connected through a shaft body. The upper and lower ends of the auxiliary arm (17) are simultaneously pivotally connected to the corresponding positioning arm (15) and the support seat (12) through a shaft body; The pressing head (16) is set as a rubber pressing head.

10. A circuit board bending performance testing device according to claim 8, characterized in that: The support seat (12) is fixedly connected to the outer side of the main body frame (2), and an opening is formed on the outer surface of the main body frame (2) corresponding to the positioning structure (6).

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