Clamp assembly for automatic test of COC chip

Abstract

The utility model provides a clamp assembly for automatic testing of a COC chip. The clamp assembly comprises a clamping block (1), an adjustable positioning plate (2), an extension spring (3), a heat dissipation base (4) and a supporting base (5). The heat dissipation base (4) and the supporting base (5) are connected in a fastened mode. The adjustable positioning plate (2) is limited between the clamping block (1) and the heat dissipation base (4), and the clamping block (1), the adjustable positioning plate (2) and the heat dissipation base (4) are connected through pins; the clamping block (1) is connected with the heat dissipation base (4) in the horizontal direction through the extension spring (3), and the clamping block (1) and the heat dissipation base (4) are fixedly connected through a connecting piece in the vertical direction. The clamp is convenient to disassemble a chip, has high positioning precision, and is used for improving the testing efficiency and stability.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication and laser chip testing, in particular to a fixture assembly for automatic testing of COC chips. Background Art

[0002] The telecommunications industry has been making continuous progress in the field of optical communication, driving the rapid replacement of optical modules. The internal core device of an optical module is an optical chip, and a light-emitting element (COC) based on the principle of electro-optical conversion is a common form of optical chip. To ensure the stable operation of the optical chip, it is necessary to use a collimating lens to perform collimating and focusing tests on each COC and measure the spectrum of the chip. At the same time, due to the high requirements for the positioning accuracy of the chip during the testing process by the automatic testing equipment for COC chips;

[0003] Currently, there are mainly three solutions for positioning and clamping COC chips. The first is to use a limiting angle to position the axial direction of the COC chip, clamp it with a push rod at the rear, and set the light output path for batch testing (202311100942.2); the second is to use a spring to clamp the COC chip in the horizontal axial and vertical longitudinal directions (202223072441.1); the third is to use a lever and a wedge block to position and clamp the device with a COC chip in the package (202010393694.5);

[0004] As described above, the existing automatic testing fixtures for COC chips have problems in space utilization, specifically including the following aspects:

[0005] 1. There is an obstruction directly in front of the light output port of the chip, and it cannot be close to the collimating lens during collimating and focusing.

[0006] 2. When using a multi-directional clamping scheme, there are problems with repeat positioning accuracy.

[0007] 3. The adaptability to special-shaped or unpackaged optical chips is poor. If a special-shaped COC chip is used, accurate positioning and coupling cannot be achieved. Summary of the Utility Model

[0008] In view of this, the purpose of the utility model is to provide a fixture assembly for automatic testing of COC chips, a fixture that is convenient for disassembling the chip and has high positioning accuracy, for improving the testing efficiency and stability.

[0009] To achieve the above object, the utility model adopts the following technical solutions: A fixture assembly for automatic testing of COC chips, comprising a clamping block (1), an adjustable positioning plate (2), a tension spring (3), a heat dissipation base (4) and a support base (5); The heat dissipation base (4) and the support base 5 are firmly connected; The adjustable positioning plate (2) is limited between the clamping block (1) and the heat dissipation base (4), and the clamping block (1), the adjustable positioning plate (2) and the heat dissipation base (4) are connected by a pin; The clamping block (1) is horizontally connected to the heat dissipation base (4) through a tension spring (3), and the clamping block (1) and the heat dissipation base (4) are firmly connected in the vertical direction by a connecting piece.

[0010] In a preferred embodiment, it further includes a heat dissipation plate (7); The heat dissipation plate (7) is directly bonded to the heat dissipation base (4) through a thermal conductive adhesive; A COC chip (6) is placed on the heat dissipation plate (7).

[0011] In a preferred embodiment, the clamping block (1) is restricted by the adjustable positioning plate (2) to move in the direction defined by the positioning pin of the heat dissipation base (4); The clamping block (1) is connected to the heat dissipation base (4) through a tension spring (3). When the clamping block (1) is pushed to release the loading space of the COC chip (6), the tension spring (3) will be stretched. After releasing the clamping block (1), the contraction of the tension spring (3) will reduce the loading space of the COC chip (6). When there is a COC chip (6), after releasing the clamping block (1), the contraction of the tension spring (3) will clamp the COC chip (6), and due to the presence of the heat dissipation base (4) and the adjustable positioning plate (2), the COC chip (6) is accurately positioned and clamped to a suitable position.

[0012] In a preferred embodiment, the heat dissipation base (4) and the support base 5 are fastened by screws.

[0013] In a preferred embodiment, the clamping block (1) and the heat dissipation base (4) are fastened by screws.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The light-emitting area of the COC chip defined by the clamping block structure is unobstructed, which is suitable for placing a collimating lens in a very small space to collimate and focus the light emitted by the chip.

[0016] 2. The clamping direction is restricted by the combined structure of the clamping block, the tension spring and the heat dissipation base, and the COC chip is accurately positioned by the heat dissipation base and the adjustable positioning plate, with high repeat positioning accuracy.

[0017] 3. By adjusting the contact area between the adjustable positioning plate and the COC chip, the adaptation to the special-shaped COC chip is achieved, and the external geometry of the COC chip is not restricted. Brief Description of the Drawings

[0018] Figure 1 is the front view of the preferred embodiment of the present invention;

[0019] Figure 2 is the top view of the preferred embodiment of the present invention. Detailed Description of the Preferred Embodiment

[0020] The present invention will be further described below with reference to the drawings and embodiments.

[0021] It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application; as used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0023] A fixture assembly for automatic testing of COC chips, referring to Figure 1-2 , includes a clamping block 1, an adjustable positioning plate 2, a tension spring 3, a heat dissipation base 4, and a support base 5; the heat dissipation base 4 and the support base 5 are fastened by screws, and the precise positioning between the clamping block 1, the adjustable positioning plate 2, and the heat dissipation base 4 is achieved by pins. The adjustable positioning plate 2 is limited between the clamping block 1 and the heat dissipation base 4. The clamping block 1 is connected to the heat dissipation base 4 by a spring 3, and the clamping block 1 and the heat dissipation base 4 are fastened by screws; the support base 5 is fastened to the outside by screws.

[0024] The COC chip 6 realizes radial positioning and axial positioning by using the heat dissipation base 4 and the adjustable positioning plate 2 respectively. The clamping block 1 is restricted by the guiding structure and can only move in the direction defined by the positioning pin of the heat dissipation base 4; there is a spring connection between the clamping block 1 and the heat dissipation base 4. When the clamping block 1 is pushed to release the chip loading space, the spring 3 will be stretched. After releasing the clamping block 1, the spring 3 will contract to reduce the chip loading space. When there is a COC chip 6, after releasing the clamping block 1, the spring 3 will contract to clamp the chip, and due to the presence of the heat dissipation base and the adjustable positioning plate 2, the chip is precisely positioned and clamped to the appropriate position.

[0025] The heat dissipation plate 7 is directly bonded to the heat dissipation base 4 through a thermal conductive adhesive; the COC chip 6 is directly placed on the heat dissipation plate 7, and the heat dissipation base 4 and the adjustable positioning plate 2 are used to achieve axial and radial positioning, and the clamping block 1 is used to achieve clamping, so as to achieve the positioning and fastening of the chip, and does not block the light-emitting area of the chip, so that the collimating lens can collimate the light emitted by the chip at the front end of the chip.

[0026] The structure composed of the clamping block 1, the spring 3 and the heat dissipation base 4 has self-locking property, and the COC chip 6 can be positioned and clamped without additional locking screws or pulling the positioning block.

[0027] The clamping block 1 can be used to clamp the COC chip and has no blockage to the COC chip, and can be used for the collimation test of the COC chip at a very short distance.

[0028] The adjustable positioning plate 2 can adaptively adjust the geometric shape of the COC chip by rotating, moving, etc., by changing the size of the contact surface with the COC part, not limited to Figure 2 the parallelogram structure of the COC chip shown.

Claims

1. A fixture assembly for automatic testing of COC chips, characterized in that It includes a clamping block (1), an adjustable positioning plate (2), a tension spring (3), a heat dissipation base (4), and a support base (5); the heat dissipation base (4) and the support base (5) are fixedly connected; the adjustable positioning plate (2) is limited between the clamping block (1) and the heat dissipation base (4), and the clamping block (1), the adjustable positioning plate (2), and the heat dissipation base (4) are connected by a pin; the clamping block (1) is horizontally connected to the heat dissipation base (4) through the tension spring (3), and the clamping block (1) and the heat dissipation base (4) are fixedly connected in the vertical direction using a connecting piece.

2. The fixture assembly for automatic testing of COC chips according to claim 1, wherein, It further includes a heat dissipation plate (7); the heat dissipation plate (7) is directly bonded to the heat dissipation base (4) through a thermal conductive adhesive; a COC chip (6) is placed on the heat dissipation plate (7).

3. A fixture assembly for automated testing of COC chips according to claim 2, characterized in that, The clamping block (1) is restricted by the adjustable positioning plate (2) to move in the direction defined by the positioning pin of the heat dissipation base (4); the clamping block (1) is connected to the heat dissipation base (4) through the tension spring (3). When the clamping block (1) is pushed to release the loading space for the COC chip (6), the tension spring (3) will be stretched. After releasing the clamping block (1), the contraction of the tension spring (3) will reduce the loading space for the COC chip (6). When there is a COC chip (6), after releasing the clamping block (1), the contraction of the tension spring (3) will clamp the COC chip (6), and due to the presence of the heat dissipation base (4) and the adjustable positioning plate (2), the COC chip (6) is accurately positioned and clamped to the appropriate position.

4. A fixture assembly for automatic testing of COC chips according to claim 1, characterized in that, The heat dissipation base (4) and the support base (5) are fastened by screws.

5. A fixture assembly for automated testing of COC chips according to claim 1, characterized in that, The clamping block (1) and the heat dissipation base (4) are fastened using screws.

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