Solid state disk, electronic component and electronic equipment

Abstract

The utility model discloses a solid state disk, an electronic component and electronic equipment, and belongs to the technical field of solid state disks. The solid state disk comprises a first circuit board and a standby power capacitor. A through groove is formed in the first circuit board, the through groove penetrates through the first circuit board in the thickness direction of the first circuit board, and a first conductive part is arranged on one side of the first circuit board; the standby power capacitor comprises a body and a second conductive part, one side of the body is located on the side, close to the first conductive part, of the first circuit board, the other side of the body penetrates through the through groove and is arranged on the side, away from the first conductive part, of the first circuit board, and the second conductive part is electrically connected with the body and the first conductive part. According to the solid state disk provided by the invention, the body of the standby power capacitor is arranged on the two sides of the first circuit board respectively, so that the thickness of the standby power capacitor can be effectively increased while the thickness requirements of devices on the two sides of the first circuit board are met, and therefore, on one hand, the selection range of standby power capacitor specifications can be expanded; and on the other hand, the capacity and withstand voltage of the standby power capacitor can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of solid-state drives, and in particular, to a solid-state drive, an electronic component, and an electronic device. Background Art

[0002] Power backup is a hardware technology for data protection and is an essential component in most solid-state drive systems. An electronic device provides power to the solid-state drive system. The power supplies the power module through the backup power supply. The power module performs various power conversions and finally supplies power to the power-consuming modules. In addition, while the backup power supply supplies power to the power module, it also charges the backup capacitor in a high-voltage manner to store electrical energy. In this way, when the power supply provided by the electronic device to the solid-state drive system is interrupted due to an abnormality in the solid-state drive system, the electrical energy stored in the backup capacitor can continuously supply power to the solid-state drive system for a certain period of time, so that the solid-state drive system can complete the data protection operation.

[0003] In the related art, there are mainly two ways to install the backup capacitor on the solid-state drive: surface mount devices and plug-in electrolytic capacitors. Although plug-in electrolytic capacitors can save costs, their stability and reliability are too poor, so the surface mount device method is mostly used.

[0004] However, for electronic devices, especially those with a relatively thin thickness, the installation space reserved for the solid-state drive in the thickness direction is limited. Therefore, there are strict requirements for the thickness of the devices on the front and back sides of the solid-state drive, resulting in few available specifications for the backup capacitor. Even if there is a backup capacitor that meets the thickness requirements, its capacitance and withstand voltage are relatively low. Summary of the Utility Model

[0005] In view of this, the purpose of the present application is to overcome the deficiencies in the prior art and provide a solid-state drive.

[0006] To solve the above technical problems, the present application provides:

[0007] A solid-state drive, comprising:

[0008] A first circuit board, a through groove is formed in the first circuit board, the through groove penetrates the first circuit board along the thickness direction of the first circuit board, and a first conductive part is arranged on one side of the first circuit board;

[0009] A backup capacitor, the backup capacitor includes a body and a second conductive part. One side of the body is located on the side of the first circuit board close to the first conductive part, and the other side of the body penetrates through the through groove and is arranged on the side of the first circuit board far from the first conductive part. The second conductive part is electrically connected to the body and the first conductive part respectively.

[0010] In addition, the solid-state drive according to the present application may further have the following additional technical features:

[0011] In some embodiments of the present application, one end of the second conductive portion is disposed on the body and electrically connected to the body, and the end of the second conductive portion away from the body penetrates through the through groove and is disposed on the side of the first circuit board close to the first conductive portion, and is electrically connected to the first conductive portion.

[0012] In some embodiments of the present application, the second conductive portion includes a first horizontal section, an inclined section, and a second horizontal section. The inclined section is respectively connected to the first horizontal section and the second horizontal section. One end of the first horizontal section away from the inclined section is disposed on the body and electrically connected to the body. The inclined section penetrates through the through groove and is disposed on the side of the first circuit board close to the first conductive portion. One end of the second horizontal section away from the inclined section is electrically connected to the first conductive portion.

[0013] In some embodiments of the present application, the first horizontal section, the inclined section, and the second horizontal section are integrally formed.

[0014] In some embodiments of the present application, the thickness of the body is T1, the thickness of the first circuit board is T2, the distance between the side of the body close to the first conductive portion and the top surface of the first circuit board is T3, and the distance between the side of the body away from the first conductive portion and the bottom surface of the first circuit board is T4, satisfying the relationship: T1 = T3 + T2 + T4, T3 ≥ T4.

[0015] In some embodiments of the present application, the second conductive portion includes a plurality of pins, and the plurality of pins are spaced apart along the width direction of the second conductive portion.

[0016] In some embodiments of the present application, a plurality of the second conductive portions are provided, and the plurality of second conductive portions are spaced apart along the circumferential direction of the body.

[0017] In some embodiments of the present application, the body includes a housing portion and a capacitor portion. The capacitor portion is disposed within the housing portion, and the end of the second conductive portion away from the first conductive portion penetrates through the housing portion and is electrically connected to the capacitor portion.

[0018] In a second aspect, the present application further provides an electronic component, including a second circuit board and the solid-state drive in any of the above embodiments, and the second circuit board is electrically connected to the solid-state drive.

[0019] In a third aspect, the present application further provides an electronic device, including the electronic component in the above embodiments.

[0020] Compared with the prior art, the beneficial effects of the present application are as follows:

[0021] The present application provides a solid-state drive, which includes a first circuit board and a backup power capacitor. The backup power capacitor includes a body and a second conductive part. By providing a first conductive part on one side of the first circuit board and electrically connecting the second conductive part to the body and the first conductive part respectively, the function of electrically connecting the backup power capacitor to the first circuit board is realized. Thus, when an abnormality occurs in the solid-state drive and the power supply provided by the electronic device to the solid-state drive is interrupted, the electric energy stored in the backup power capacitor can continuously supply power to the solid-state drive for a certain period of time, so that the solid-state drive can complete the operation of data protection.

[0022] At the same time, by opening a through groove penetrating the first circuit board along its thickness direction, one side of the body is arranged on the side of the first circuit board close to the first conductive part, and the other side of the body is arranged on the side of the first circuit board far from the first conductive part through the through groove. In this way, the body is located on both sides of the first circuit board respectively, playing the role of sinking the body to meet the thickness requirements of the components on both sides of the first circuit board, so that the thickness of the body can be designed to be maximized. Compared with the prior art where the backup power capacitor is arranged on one side of the first circuit board, in the present application, by arranging the body of the backup power capacitor on both sides of the first circuit board respectively, it is possible to effectively increase the thickness of the backup power capacitor while meeting the thickness requirements of the components on both sides of the first circuit board. Thus, on the one hand, the selection range of the backup power capacitor specifications can be expanded, and on the other hand, it is beneficial to improve the capacity and withstand voltage of the backup power capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0024] Figure 1 Shows a schematic structural diagram of the backup power capacitor of the solid-state drive in some embodiments of the present application;

[0025] Figure 2 Shows a schematic structural diagram of the solid-state drive in some embodiments of the present application.

[0026] MAIN ELEMENT SYMBOL DESCRIPTION:

[0027] 100 - Solid-state drive;

[0028] 110 - First circuit board; 111 - Through groove; 112 - First conductive part;

[0029] 120 - Backup capacitor; 121 - Body; 122 - Second conductive part; 1221 - First horizontal section; 1222 - Inclined section; 1223 - Second horizontal section. Detailed implementation manners

[0030] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

[0032] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0033] In the present application, unless otherwise clearly specified and defined, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0034] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] Embodiment 1

[0036] As Figure 1 and Figure 2 shown, an embodiment of the present application provides a solid-state drive 100, which is mainly applied to electronic components, and the electronic components are mainly applied to electronic devices. The solid-state drive 100 includes a first circuit board 110 and a backup capacitor 120.

[0037] Wherein, the first circuit board 110 is provided with a through groove 111, the through groove 111 penetrates the first circuit board 110 along the thickness direction of the first circuit board 110, and a first conductive part 112 is arranged on one side of the first circuit board 110.

[0038] The backup capacitor 120 includes a body 121 and a second conductive part 122. One side of the body 121 is located on the side of the first circuit board 110 close to the first conductive part 112, the other side of the body 121 is arranged on the side of the first circuit board 110 far from the first conductive part 112 through the through groove 111, and the second conductive part 122 is electrically connected to the body 121 and the first conductive part 112 respectively.

[0039] The solid-state drive 100 provided by the embodiment of the present application realizes the function of electrically connecting the backup capacitor 120 to the first circuit board 110 by arranging the first conductive part 112 on one side of the first circuit board 110 and electrically connecting the second conductive part 122 to the body 121 and the first conductive part 112 respectively. Thus, when an abnormality occurs in the solid-state drive 100 resulting in the power supply provided by the electronic device to the solid-state drive 100 being interrupted, the electric energy stored in the backup capacitor 120 can continuously supply power to the solid-state drive 100 for a certain period of time, so that the solid-state drive 100 can complete the operation of data protection.

[0040] Meanwhile, by providing a through slot 111 penetrating the first circuit board 110 in its thickness direction, one side of the body 121 is disposed on the side of the first circuit board 110 close to the first conductive portion 112, and the other side of the body 121 is disposed on the side of the first circuit board 110 away from the first conductive portion 112 by passing through the through slot 111. In this way, the body 121 is located on both sides of the first circuit board 110 respectively, playing a role in sinking the body 121 to meet the thickness requirements of the components on both sides of the first circuit board 110, so that the thickness of the body 121 can be designed to be maximized. Compared with the prior art in which the backup capacitor is disposed on one side of the first circuit board, in this application, by disposing the body 121 of the backup capacitor 120 on both sides of the first circuit board 110 respectively, it is possible to double the thickness of the backup capacitor 120 while meeting the thickness requirements of the components on both sides of the first circuit board 110. Thus, on the one hand, the selection range of the backup capacitor 120 specifications can be doubled, and on the other hand, it is beneficial to increase the capacitance and withstand voltage of the backup capacitor 120.

[0041] It should be noted that, generally under the same conditions, the capacitance of the backup capacitor 120 is proportional to its thickness. By doubling the thickness of the backup capacitor 120, the capacitance of the backup capacitor 120 can be effectively increased. At the same time, generally, the thickness of the backup capacitor 120 is proportional to the product of its capacitance and withstand voltage. By doubling the thickness of the backup capacitor 120, the withstand voltage can be increased under the condition of constant capacitance, or the capacitance can be increased under the condition of constant withstand voltage, thereby effectively reducing the manufacturing difficulty and cost of the backup capacitor 120.

[0042] In addition, since the backup capacitor in the prior art is disposed on one side of the first circuit board, the thickness of the backup capacitor is relatively thin, so that when the backup capacitor is mounted on one side of the first circuit board, it is likely to crack and fail. In this application, by doubling the thickness of the backup capacitor 120, the backup capacitor 120 can be made of a better encapsulation material, thereby effectively improving the production yield of the solid-state drive 100.

[0043] As Figure 1 and Figure 2 shown, in an embodiment of the present application, optionally, one end of the second conductive portion 122 is disposed on the body 121 and electrically connected to the body 121, and the end of the second conductive portion 122 away from the body 121 passes through the through slot 111 and is disposed on the side of the first circuit board 110 close to the first conductive portion 112 and is electrically connected to the first conductive portion 112.

[0044] In this embodiment, one end of the second conductive part 122 is arranged on the main body 121 and electrically connected to the main body 121, and the end of the second conductive part 122 far from the main body 121 is arranged on one side of the first circuit board 110 close to the first conductive part 112 through the through groove 111 and electrically connected to the first conductive part 112. In this way, on the one hand, the function of electrically connecting the backup capacitor 120 to the first circuit board 110 can be realized under the action of the electrical connection between the second conductive part 122 and the first conductive part 112. Thus, when an abnormality occurs in the solid-state drive 100 and the power supply provided by the electronic device to the solid-state drive 100 is interrupted, the electric energy stored in the backup capacitor 120 can continuously supply power to the solid-state drive 100 for a certain period of time, so that the solid-state drive 100 can complete the operation of data protection.

[0045] On the other hand, it can also make the backup capacitor 120 be stably installed on the first circuit board 110 and sink the main body 121, so that the main body 121 is respectively located on both sides of the first circuit board 110 to meet the thickness requirements of the components on both sides of the first circuit board 110. Thus, the thickness of the main body 121 can be designed to be maximized, and then the selection range of the specifications of the backup capacitor 120 can be expanded, and the capacitance and withstand voltage of the backup capacitor 120 can be improved.

[0046] [[ID=E]]As Figure 1 and Figure 2 shown, in the above embodiment of the present application, optionally, the second conductive part 122 includes a first horizontal section 1221, an inclined section 1222 and a second horizontal section 1223. The inclined section 1222 is respectively connected to the first horizontal section 1221 and the second horizontal section 1223. One end of the first horizontal section 1221 far from the inclined section 1222 is arranged on the main body 121 and electrically connected to the main body 121. The inclined section 1222 is arranged on one side of the first circuit board 110 close to the first conductive part 112 through the through groove 111. One end of the second horizontal section 1223 far from the inclined section 1222 is electrically connected to the first conductive part 112.

[0047] Therefore, on the one hand, the function of electrically connecting the backup capacitor 120 to the first circuit board 110 is realized under the connection action of the first horizontal section 1221, the inclined section 1222, the second horizontal section 1223 and the first conductive part 112. Thus, when an abnormality occurs in the solid-state drive 100 and the power supply provided by the electronic device to the solid-state drive 100 is interrupted, the electric energy stored in the backup capacitor 120 can continuously supply power to the solid-state drive 100 for a certain period of time, so that the solid-state drive 100 can complete the operation of data protection.

[0048] On the other hand, by passing the inclined section 1222 through the through groove 111 and arranging it on the side of the first circuit board 110 close to the first conductive part 112, the second horizontal section 1223 connected to the inclined section 1222 is arranged on the side of the first circuit board 110 close to the first conductive part 112 and electrically connected to the first conductive part 112. Thus, the backup capacitor 120 is stably mounted on the first circuit board 110 and the body 121 sinks, so that the body 121 is located on both sides of the first circuit board 110 respectively, to meet the device thickness requirements on both sides of the first circuit board 110, and further enable the thickness of the body 121 to be designed to be maximized.

[0049] In the above embodiment of the present application, optionally, the first horizontal section 1221, the inclined section 1222 and the second horizontal section 1223 are integrally formed.

[0050] In this embodiment, by integrally forming the first horizontal section 1221, the inclined section 1222 and the second horizontal section 1223, the installation steps between the first horizontal section 1221, the inclined section 1222 and the second horizontal section 1223 can be omitted, effectively improving the installation efficiency and installation stability.

[0051] Exemplarily, the first horizontal section 1221, the inclined section 1222 and the second horizontal section 1223 can be integrally formed by stamping, injection molding or 3D printing.

[0052] In an embodiment of the present application, optionally, the thickness of the body 121 is T1, the thickness of the first circuit board 110 is T2, the distance between the side of the body 121 close to the first conductive part 112 and the top surface of the first circuit board 110 is T3, and the distance between the side of the body 121 far from the first conductive part 112 and the bottom surface of the first circuit board 110 is T4, satisfying the relational expressions: T1 = T3 + T2 + T4, T3 ≥ T4.

[0053] Specifically, when the application board type is M.2, the thickness T2 of the first circuit board 110 is 0.8 mm, and the heights T3 and T4 of the devices on the top surface and the bottom surface of the first circuit board 110 are both required not to exceed 1.5 mm. Thus, the thickness T1 of the body 121 does not exceed 3.8 mm. Compared with the prior art where the backup capacitor 120 is arranged on one side of the first circuit board 110 with a thickness not exceeding 1.5 mm, the present application doubles the thickness of the backup capacitor 120.

[0054] When the application board type is mSATA, the thickness T2 of the first circuit board 110 is 1 mm. The heights T3 and T4 of the devices on the top and bottom surfaces of the first circuit board 110 are required not to exceed 2.4 mm and 1.35 mm respectively, so that the thickness T1 of the body 121 does not exceed 4.75 mm. Compared with the prior art where the backup capacitor 120 is arranged on one side of the first circuit board 110 with a thickness not exceeding 2.4 mm, the thickness of the backup capacitor 120 in this application is doubled.

[0055] In any of the above embodiments of the present application, optionally, the second conductive part 122 includes a plurality of pins, and the plurality of pins are arranged at intervals along the width direction of the second conductive part 122.

[0056] In this embodiment, by setting the second conductive part 122 to include a plurality of pins and arranging the plurality of pins at intervals along the width direction of the second conductive part 122, the functions of signal transmission, support and installation are achieved under the connection action of the plurality of pins and the first conductive part 112, so as to ensure an efficient and stable connection between the backup capacitor 120 and the first circuit board 110.

[0057] As Figure 1 and Figure 2 shown, in any of the above embodiments of the present application, optionally, a plurality of the second conductive parts 122 are provided, and the plurality of second conductive parts 122 are arranged at intervals along the circumferential direction of the body 121.

[0058] In this embodiment, by setting the number of the second conductive parts 122 to be a plurality and arranging the plurality of second conductive parts 122 at intervals along the circumferential direction of the body 121, the stability and reliability of the electrical connection and mechanical connection between the backup capacitor 120 and the first circuit board 110 can be further improved.

[0059] In any of the above embodiments of the present application, optionally, the body 121 includes a housing part and a capacitor part, the capacitor part is arranged in the housing part, and one end of the second conductive part 122 far from the first conductive part 112 penetrates through the housing part and is electrically connected to the capacitor part.

[0060] In this embodiment, by arranging the capacitor part in the housing part, the functions of placing, fixing, sealing, protecting the capacitor part and enhancing the electrothermal performance are achieved under the action of the housing part. At the same time, by making one end of the second conductive part 122 far from the first conductive part 112 penetrate through the housing part and be electrically connected to the capacitor part, the function of electrically connecting the backup capacitor 120 and the first circuit board 110 is realized under the action of the second conductive part 122 being electrically connected to the capacitor part and the first conductive part 112 respectively.

[0061] Embodiment Two

[0062] An embodiment of the present application further provides an electronic component, including a second circuit board and the solid-state drive 100 described in the above embodiments, and the second circuit board is electrically connected to the solid-state drive 100.

[0063] This electronic component has the solid-state drive 100 in any of the above embodiments, and thus has all the beneficial effects of the solid-state drive 100, which will not be elaborated here one by one.

[0064] Embodiment III

[0065] An embodiment of the present application further provides an electronic device, including the electronic component described in the above embodiments.

[0066] This electronic device has the electronic component in the above embodiments, and thus has all the beneficial effects of the electronic component, which will not be elaborated here one by one.

[0067] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0068] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A solid-state drive, characterized in that, Comprising: A first circuit board, a through groove is formed in the first circuit board, the through groove penetrates the first circuit board along the thickness direction of the first circuit board, and a first conductive part is arranged on one side of the first circuit board; A backup capacitor, the backup capacitor includes a body and a second conductive part, one side of the body is located on the side of the first circuit board close to the first conductive part, the other side of the body is arranged on the side of the first circuit board far from the first conductive part through the through groove, and the second conductive part is electrically connected to the body and the first conductive part respectively.

2. The solid-state drive according to claim 1, characterized in that One end of the second conductive part is arranged on the body and electrically connected to the body, the end of the second conductive part far from the body penetrates the through groove and is arranged on the side of the first circuit board close to the first conductive part, and is electrically connected to the first conductive part.

3. The solid state drive according to claim 2, wherein The second conductive part includes a first horizontal section, an inclined section and a second horizontal section, the inclined section is connected to the first horizontal section and the second horizontal section respectively, one end of the first horizontal section far from the inclined section is arranged on the body and electrically connected to the body, the inclined section penetrates the through groove and is arranged on the side of the first circuit board close to the first conductive part, and one end of the second horizontal section far from the inclined section is electrically connected to the first conductive part.

4. The solid-state drive according to claim 3, wherein, The first horizontal section, the inclined section and the second horizontal section are integrally formed.

5. The solid-state drive according to claim 1, wherein The thickness of the body is T1, the thickness of the first circuit board is T2, the distance between one side of the body close to the first conductive part and the top surface of the first circuit board is T3, and the distance between the other side of the body far from the first conductive part and the bottom surface of the first circuit board is T4, satisfying the relational expression: T1 = T3 + T2 + T4, T3 ≥ T4.

6. The solid-state drive according to any one of claims 1 to 5, characterized in that The second conductive part includes a plurality of pins, and the plurality of pins are arranged at intervals along the width direction of the second conductive part.

7. The solid state drive according to any one of claims 1 to 5, characterized in that A plurality of the second conductive parts are provided, and the plurality of second conductive parts are arranged at intervals along the circumferential direction of the body.

8. The solid-state drive according to any one of claims 1 to 5, characterized in that The body includes a housing part and a capacitor part, the capacitor part is arranged in the housing part, and the end of the second conductive part far from the first conductive part penetrates the housing part and is electrically connected to the capacitor part.

9. An electronic component, characterized in that, Comprising a second circuit board and the solid-state drive according to any one of claims 1 to 8, the second circuit board is electrically connected to the solid-state drive.

10. An electronic device, characterized in that, Comprising the electronic component according to claim 9.

Images