Mould pressing equipment
By using centrifugal rotation and diffusion of the packaging rubber material of the moving stage in the molding equipment, the problem of the packaging colloid not filling the mold holes and air holes is solved, and the full coverage of the packaging colloid and high-quality molding effect are achieved.
Patent Information
- Application Number
- CN202422287163.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-11
- Filing Date
- 2024-09-19
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-19
AI Technical Summary
In existing molding operations, the encapsulated colloid heating time in the mold hole will increase viscosity and poor fluidity, resulting in the problem that the encapsulated colloid will not fill the mold hole or produce air holes.
After dispensing and installing packaging materials on the electronic module, centrifugal rotation diffusion distribution is performed using a moving platform, diffusion range is reached to most areas of the module, and then molding is carried out.
It solves the air hole problem caused by the pre-diffusion of the packaging rubber material, ensures that the packaging colloid fully covers the module, and improves the packaging quality.
Smart Images
Figure CN223167439U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor device, particularly a molding device. Background Art
[0002] In a packaging structure generally using a leadframe or a substrate as a carrier, after connecting a chip to the leadframe or the substrate through wire bonding or bumps in the manufacturing process, a molding operation is then used to seal the chip and the wire bonding (or bumps) with a packaging colloid to prevent the intrusion of external moisture.
[0003] Traditional molding operations are carried out using a molding machine. Existing molding machines usually include an upper mold and a lower mold. When performing the molding operation, first place the semiconductor module in the cavity between the upper mold and the lower mold, fill the cavity with a packaging colloid, then thermoset the packaging colloid, and finally perform demolding to take out the solidified packaging colloid and the semiconductor module it encapsulates.
[0004] However, in the aforementioned molding operation, it is often encountered that the packaging colloid is heated in the cavity for too long, resulting in an increase in viscosity and poor fluidity, causing problems such as the packaging colloid not filling the cavity completely or having air holes.
[0005] Therefore, how to overcome the problems of the above-mentioned prior art has actually become an urgent issue to be solved currently. Summary of the Utility Model
[0006] In view of the above-mentioned various deficiencies of the prior art, this application provides a molding device, including: a moving stage that distributes and spreads the packaging adhesive material provided at a local position of the electronic module onto the electronic module through a moving method; and a packaging mold for curing the packaging adhesive material to cover the electronic module.
[0007] This application also provides a molding method, including: placing an electronic module with a packaging adhesive material provided at a local position on the moving stage, and using the movement of the moving stage to cause the packaging adhesive material to spread and distribute onto the electronic module; and moving the electronic module into the packaging mold to cure the packaging adhesive material to cover the electronic module.
[0008] In the aforementioned molding device and method, the packaging adhesive material is provided at a local position of the electronic module through a dispensing device.
[0009] In the aforementioned molding device and method, the moving stage causes the packaging adhesive material to spread and distribute onto the electronic module through a vibrating method.
[0010] In the aforementioned molding device and method, the moving stage causes the packaging adhesive material to spread and distribute onto the electronic module through a centrifugal rotation method.
[0011] In the aforementioned molding equipment and method, the encapsulating adhesive material is diffusely distributed over 60% - 80% of the overall planar dimension of the electronic module.
[0012] In the aforementioned molding equipment and method, the encapsulating mold includes a first mold part and a second mold part, and a receiving space is formed between the first mold part and the second mold part to place the electronic module provided with the encapsulating adhesive material on the second mold part and within the receiving space.
[0013] In the aforementioned molding equipment and method, the encapsulating mold further includes a film placed between the first mold part and the second mold part.
[0014] In the aforementioned molding method, it further includes removing the encapsulating mold to form an encapsulating layer on the electronic module.
[0015] As can be seen from the above, for the molding equipment and method of the present application, after applying the encapsulating adhesive material by dispensing on the electronic module, the electronic module is placed on a moving carrier with the function of rotating and diffusing the encapsulating adhesive material before mold closing. The encapsulating adhesive material is first diffusely distributed over most areas of the electronic module by means of centrifugal rotation, and then the molding operation is carried out, so as to solve the drawbacks in the existing molding operation, such as the encapsulating adhesive material not being pre-diffused, which easily leads to air holes after molding. Description of the Drawings
[0016] Figures 1 to 4 It is a cross-sectional schematic view of the molding equipment and molding method of the present application.
[0017] Description of the Reference Numerals
[0018] 1 Molding Equipment
[0019] 11 Moving Carrier
[0020] 12 Encapsulating Mold
[0021] 120 Receiving Space
[0022] 121 First Mold Part
[0023] 122 Second Mold Part
[0024] 123 Film
[0025] 2 Electronic Module
[0026] 20 Substrate Unit
[0027] 21 Electronic Component
[0028] 3 Dispensing Device
[0029] 30 Encapsulating Adhesive Material
[0030] 31 Encapsulating Layer
[0031] 4 Mobile device. Detailed implementation
[0032] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.
[0033] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present application can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed in the present application can cover. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration, and are not used to limit the scope under which the present application can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope under which the present application can be implemented.
[0034] Please refer to Figures 1 to 4 , which is a cross-sectional schematic diagram of the molding method of the present application.
[0035] As Figure 1 shown, the electronic module 2 is arranged on the moving stage 11 of the molding device 1, and the dispensing device 3 is provided with a packaging adhesive 30 at a local position (such as the central position) on the electronic module 2.
[0036] In this embodiment, the electronic module 2 has a wafer structure, which includes a plurality of substrate units 20 and electronic components 21 provided on each of the substrate units 20. The substrate unit 20 is, for example, a packaging substrate (substrate) having a core layer and a circuit layer, or a circuit structure without a core layer (coreless), or other bearing units for bearing electronic components such as chips, such as a leadframe, without particular limitation. The electronic component 21 is, for example, an active component, a passive component, or a combination of the two. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. Specifically, the electronic component 21 can be electrically connected to the substrate unit 20 in a flip-chip manner, a wire bonding manner, or other manners.
[0037] The packaging adhesive 30 is, for example, polyimide (abbreviated as PI), dry film, epoxy resin, etc.
[0038] As Figure 2As shown, the moving stage 11 is vibrated or rotated to cause the encapsulation adhesive 30 provided on the electronic module 2 to be diffusely distributed on the electronic module 2.
[0039] In this embodiment, the moving stage 11 mainly rotates to diffusely distribute the encapsulation adhesive 30 over a range of 60% to 80% of the overall planar dimension of the electronic module 2 by means of centrifugal rotation.
[0040] As Figure 2 and 3 shown, then the electronic module 2 provided with the encapsulation adhesive 30 is moved to the encapsulation mold 12 of the molding device 1 by the moving device 4 for molding operation.
[0041] In this embodiment, the moving device 4 is, for example, a robotic arm for moving the electronic module 2 having the encapsulation adhesive 30 disposed on its upper surface from the moving stage 11 to the encapsulation mold 12. The encapsulation mold 12 includes a first mold part (upper mold) 121 and a second mold part (lower mold) 122, and an accommodation space 120 is formed between the first mold part 121 and the second mold part 122 to place the electronic module 2 provided with the encapsulation adhesive 30 on the second mold part 122 and within the accommodation space 120, and to cause the first mold part 121 to engage the second mold part 122 for hot pressing, so that the encapsulation adhesive 30 is heated and cured.
[0042] As Figure 4 shown, a demolding operation is performed to remove the encapsulation mold 12 to form an encapsulation layer 31 covering the plurality of electronic components 21 on the electronic module 2.
[0043] Through the foregoing molding method, the present application also discloses a molding device 1 including a moving stage 11 and an encapsulation mold 12.
[0044] Please also refer to the foregoing Figures 1 to 4 , the moving stage 11 diffusely distributes the encapsulation adhesive 30 provided at a partial position of the electronic module 2 on the electronic module 2 by means of movements such as vibration or rotation. Preferably, the encapsulation adhesive 30 is diffusely distributed over a range of 60% to 80% of the overall planar dimension of the electronic module 2 by means of centrifugal rotation.
[0045] The encapsulation mold 12 is used to cure the encapsulation adhesive 30 to cover the electronic module 2. The encapsulation mold 12 includes a first mold part (upper mold) 121 and a second mold part (lower mold) 122, and an accommodation space 120 is formed in the closed mold state during molding operation to allow the electronic module 2 (object to be encapsulated) having the encapsulation adhesive 30 disposed on its upper surface to be located therein.
[0046] In addition, the encapsulation mold 12 further includes a film 123 sandwiched between the first module 121 and the second module 122. During the molding operation, the film 123 is first placed on the first module 121, and then the first module 121 and the second module 122 are closed, so that the electronic module 2 with the encapsulation adhesive 30 disposed on its upper surface is located in the accommodation space 120. After the encapsulation adhesive 30 is cured, when demolding, only by pulling up the film 123, the electronic module 2 can be separated from the accommodation space 120 along with the film 123.
[0047] In summary, for the molding equipment and method of the present application, after applying the encapsulation adhesive on the electronic module, before closing the mold, the electronic module is disposed on the moving carrier table with the function of rotating and spreading the encapsulation adhesive. By means of centrifugal rotation, the encapsulation adhesive is first spread to most areas of the electronic module, and then the molding operation is carried out, so as to solve the disadvantages in the existing molding operation, such as the encapsulation adhesive not being pre-spread, which easily leads to air holes after molding.
[0048] The above embodiments are used to exemplarily illustrate the principle and its effects of the present application, rather than to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the rights protection of the present application should be as listed in the claims.
Claims
1. A molding device, characterized in that, Comprising: A moving stage that, through a moving manner, spreads and distributes encapsulating adhesive material disposed at a partial position of an electronic module onto the electronic module; And An encapsulation mold for curing the encapsulating adhesive material to cover the electronic module.
2. The molding device according to claim 1, wherein The encapsulating adhesive material is disposed at a partial position of the electronic module through a dispensing device.
3. The molding device according to claim 1, characterized in that, The moving stage spreads and distributes the encapsulating adhesive material onto the electronic module through a vibration manner.
4. The molding device according to claim 1, characterized in that, The moving stage spreads and distributes the encapsulating adhesive material onto the electronic module through a centrifugal rotation manner.
5. The molding device according to claim 1, wherein The encapsulating adhesive material spreads and distributes over 60% - 80% of the overall planar dimension of the electronic module.
6. The molding device according to claim 1, characterized in that, The encapsulation mold includes a first module and a second module, and a receiving space is formed between the first module and the second module to place the electronic module provided with the encapsulating adhesive material on the second module and within the receiving space.
7. The molding device according to claim 6, characterized in that, The encapsulation mold further includes a film disposed between the first module and the second module.