Polishing, discharging and flushing device

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a polishing, discharging and flushing device which comprises a flushing table and a flushing frame, the flushing table and the flushing frame are arranged in a relative rotation mode, and the flushing frame comprises a flushing frame and a plurality of flushing side pipes used for being communicated with deionized water. One end of each flushing side pipe is fixedly connected with the flushing frame to form a flushing fixed end, the flushing fixed end is provided with a flushing port facing the flushing table, and the multiple flushing side pipes are arranged along the edge of the flushing frame at intervals. According to the wafer discharging and flushing device for polishing, single-hand wafer discharging of staff is avoided, the potential safety hazard of product fragments is reduced, the wafer discharging operation efficiency is improved, the wettability of wafers in the flushing and wafer discharging process is guaranteed, and the wafer yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer unloading flushing device for polishing. Background Art

[0002] The gallium arsenide wafer is made after processes such as cutting, grinding, polishing, and cleaning of gallium arsenide single crystal material. As an intermediate process, the polishing process not only removes the damaged layer brought by the grinding process but also creates the crystal surface of the wafer, laying a foundation for subsequent cleaning. Currently, the main polishing process is as follows: placing the wafer into the TP aperture attached to the ceramic disc, positioning the ceramic disc on the polishing machine, noting that the back of the wafer is facing downwards, starting to polish the wafer by turning on the polishing machine, placing the ceramic disc with the main surface of the wafer facing upwards in the flushing area after polishing, using a nozzle to flush the wafer clockwise for 1 - 2 minutes, and finally an employee flushing the wafer with a water gun in one hand and using a suction pen to unload the wafer in the other hand. The employee unloads the wafer with one hand, which has a safety hazard of product fragmentation. Moreover, during the wafer unloading process, the employee can only flush the wafer being removed. For employees with a slower wafer unloading operation, after the surface moisture of other wafers to be removed dries, defects such as chemical residue will occur. Content of the Utility Model

[0003] It aims to solve at least one of the technical problems existing in the prior art. The utility model provides a wafer unloading flushing device for polishing, which avoids the employee unloading the wafer with one hand, reduces the safety hazard of product fragmentation, improves the efficiency of the wafer unloading operation, ensures the wettability of the wafer during the flushing and wafer unloading processes, and improves the yield of the wafer.

[0004] To achieve the above object, the utility model provides a wafer unloading flushing device for polishing, which includes a flushing table and a flushing frame. The flushing table and the flushing frame are arranged to rotate relative to each other. The flushing frame includes a flushing frame body and a plurality of flushing side pipes for communicating with deionized water. One end of the flushing side pipe is fixedly connected to the flushing frame body to form a flushing fixed end. The flushing fixed end is provided with a flushing port facing the flushing table, and the plurality of flushing side pipes are arranged at intervals along the edge of the flushing frame.

[0005] As a preferred solution, the flushing table is provided with a connection fixed part for connecting with the ceramic disc.

[0006] As a preferred solution, the flushing table is provided with a flushing table surface facing the flushing port, and the connection fixed part is connected to the flushing table surface.

[0007] As a preferred solution, the number and position of the flushing side pipes and the flushing ports are respectively corresponding.

[0008] As a preferred solution, the flushing rack further includes a main flushing pipe for communicating with deionized water. A plurality of side pipe connection ports are provided on the outer periphery of the main flushing pipe, and adjacent side pipe connection ports are arranged at intervals in the circumferential direction. One end of the flushing side pipe away from the flushing fixed end is communicated with the side pipe connection port.

[0009] As a preferred solution, the side pipe connection port is arranged at the lower end of the main flushing pipe, and a closed bottom surface is connected to the lower end of the main flushing pipe.

[0010] As a preferred solution, the main flushing pipe is connected with a pressurizing device.

[0011] As a preferred solution, an inlet is provided at one end of the main flushing pipe away from the flushing side pipe, and a liquid inlet pipe is connected to the inlet communicating with the flushing port.

[0012] As a preferred solution, the flushing rack further includes a rotation driving member, and the main flushing pipe is in transmission connection with the rotation driving member.

[0013] As a preferred solution, the liquid inlet pipe is connected to the main flushing pipe through a bearing, the main flushing pipe is provided with a main pipe transmission part, and the main pipe transmission part is in transmission connection with the rotation driving member.

[0014] Compared with the prior art, the polishing wafer unloading flushing device in the embodiment of the present invention has the following beneficial effects: The flushing table is used to place the ceramic disc, and the flushing rack is used to flush the wafers in the ceramic disc placed on the flushing table. The flushing rack includes a flushing frame and a flushing side pipe. The flushing side pipe is communicated with deionized water, and the deionized water flushes the wafers through the flushing side pipe. One end of the flushing side pipe is fixedly connected to the flushing frame to form a flushing fixed end, which fixes the connection position of the flushing side pipe and improves the connection stability of the flushing side pipe. The flushing fixed end is provided with a flushing port facing the flushing table, and the flushing port is communicated with the flushing side pipe. A plurality of the flushing ports are arranged at intervals along the edge of the flushing rack, and a flushing port is arranged at the corresponding position of each wafer. After the flushing table stops rotating, during the wafer unloading process, each wafer has a corresponding flushing side pipe continuously flushing to keep the wettability of the wafer. The deionized water in the flushing port automatically and continuously flushes the wafers, avoiding the employee from operating the wafer unloading with one hand, reducing the safety hazard of product fragmentation, reducing the difficulty of the wafer unloading operation, improving the efficiency of the wafer unloading operation, and improving the yield of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the overall structural schematic diagram of the embodiment of the present invention.

[0016] Figure 2 is the structural schematic diagram of the flushing rack in the embodiment of the present invention.

[0017] Figure 3This is a schematic structural diagram of a flushing table with a ceramic plate placed thereon in an embodiment of the present utility model.

[0018] In the figure:

[0019] 10, flushing table; 11, connecting and fixing part; 12, flushing table surface;

[0020] 20, flushing frame; 21, flushing frame; 22, flushing side pipe; 23, flushing fixed end; 24, flushing port; 25, flushing main pipe; 26, side pipe connection port; 27, closed bottom surface; 28, pressure increasing device; 29, liquid inlet; 30, liquid inlet pipe; 31, rotation driving part; 32, main pipe transmission part; 40, ceramic plate; 41, wafer. Specific embodiments

[0021] The following combines the drawings and embodiments to further describe in detail the specific embodiments of the present utility model. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0022] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. in the present utility model is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0023] In the description of the present utility model, it should be understood that the terms "connected", "connected", "fixed", etc. used in the present utility model should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or a welded connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0024] As Figures 1 to 3 shown, a polishing wafer flushing device in a preferred embodiment of an embodiment of the present utility model includes a flushing table 10 and a flushing frame 20. The flushing table 10 and the flushing frame 20 are arranged to rotate relative to each other. The flushing frame 20 includes a flushing frame 21 and a flushing side pipe 22 for communicating with deionized water. One end of the flushing side pipe 22 is fixedly connected to the flushing frame 21 to form a flushing fixed end 23. The flushing fixed end 23 is provided with a plurality of flushing ports 24 facing the flushing table 10. The flushing ports 24 are communicated with the flushing side pipe 22, and the plurality of flushing ports 24 are arranged at intervals along the edge of the flushing frame 20.

[0025] The wafer unloading and flushing device of the utility model, the flushing table 10 is used to place the ceramic disc 40, and the flushing frame 20 is used to flush the wafer 41 in the ceramic disc 40 placed on the flushing table 10. The flushing frame 20 includes a flushing frame 21 and a flushing side pipe 22. The flushing side pipe 22 is communicated with deionized water, and the deionized water flushes the wafer 41 through the flushing side pipe 22. One end of the flushing side pipe 22 is fixedly connected to the flushing frame 21 to form a flushing fixed end 23, so as to fix the connection position of the flushing side pipe 22 and improve the connection stability of the flushing side pipe 22. The flushing fixed end 23 is provided with a flushing port 24 facing the flushing table 10. The flushing port 24 is communicated with the flushing side pipe 22. A plurality of flushing ports 24 are arranged at intervals along the edge of the flushing frame 20, and a flushing port 24 is arranged at the corresponding position of each wafer 41. After the flushing table surface 12 stops rotating, during the wafer unloading process, each wafer 41 has a corresponding flushing side pipe 22 continuously flushing to keep the wettability of the wafer 41. The deionized water in the flushing port 24 realizes automatic and continuous flushing of the wafer 41, avoiding the employee from operating the wafer unloading with one hand, reducing the safety hazard of product fragmentation, reducing the difficulty of the wafer unloading operation, improving the efficiency of the wafer unloading operation, and improving the yield of the wafer 41.

[0026] Further, as Figure 1 and Figure 3 shown, the flushing table 10 is provided with a connection fixing part 11 for detachably connecting with the ceramic disc 40. The flushing table 10 is fixed to the ceramic disc 40 through the connection fixing part 11 to prevent the ceramic disc 40 from moving during the flushing process. After the wafer 41 in the ceramic disc 40 is flushed, the ceramic disc 40 is detached from the connection fixing part 11, and another ceramic disc 40 is replaced to flush a new batch of wafers 41.

[0027] As one embodiment, as Figure 1 and Figure 3 shown, the connection fixing part 11 can be a magic tape, or a first fixing piece is connected to one side of the ceramic disc 40. The fixing piece is provided with a first fixing hole, a second fixing piece is connected to the corresponding position of the flushing table 10, the fixing piece is provided with a second fixing hole, and the first fixing hole and the second fixing hole are connected by bolts and nuts.

[0028] Further, as Figure 1 and Figure 3 shown, the flushing table 10 is provided with a flushing table surface 12 facing the flushing port 24, and the connection fixing part 11 is connected to the flushing table surface 12. The flushing table surface 12 is used to place the ceramic disc 40 containing the wafer 41, and is fixed to the ceramic disc 40 through the connection fixing part 11 on the flushing table surface 12. Since the position of the connection fixing part 11 is relatively close to the ceramic disc 40, it is convenient for the fixing operation and improves the operation efficiency.

[0029] Further, asFigure 1 and Figure 3 As shown in Figure 3 , the number and positions of the flushing side pipes 22 and the flushing ports 24 are respectively set in correspondence. Each flushing port 24 is respectively supplied with deionized water by the flushing side pipe 22 corresponding to its position, shortening the flow path of the deionized water, improving the supply efficiency of the deionized water, and at the same time, ensuring the supply stability of the deionized water at each flushing port 24.

[0030] Furthermore, as Figures 1 to 3 shown in Figures 1 to 3 , the flushing frame 20 further includes a flushing main pipe 25 for communicating with deionized water. A plurality of side pipe connection ports 26 are provided on the outer periphery of the flushing main pipe 25, and the adjacent side pipe connection ports 26 are arranged at intervals in the circumferential direction. One end of the flushing side pipe 22 away from the flushing fixed end 23 is communicated with the side pipe connection port 26. The flushing main pipe 25 is communicated with deionized water, and the deionized water supplies the flushing side pipe 22 through the side pipe connection port 26 of the flushing main pipe 25. Among them, one end of the flushing side pipe 22 away from the flushing fixed end 23 is communicated with the side pipe connection port 26 and connected to the flushing main pipe 25, improving the connection stability of the flushing side pipe 22 in the flushing frame 20.

[0031] Furthermore, as Figures 1 to 3 shown in Figures 1 to 3 , the side pipe connection port 26 is arranged at the lower end of the flushing main pipe 25, and a closed bottom surface 27 is connected to the lower end of the flushing main pipe 25. The side pipe connection port 26 being located at the lower end of the flushing main pipe 25 helps the water flow to be more evenly distributed into each flushing side pipe 22. When the water flow in the flushing main pipe 25 passes through the side pipe connection port 26, due to the action of gravity and water flow dynamics, the water flow can be more naturally dispersed into each branch pipe, improving the flushing efficiency and effect.

[0032] Furthermore, as Figures 1 to 3 shown in Figures 1 to 3 , a pressurizing device 28 is connected to the flushing main pipe 25. The pressurizing device 28 can increase the water flow pressure in the flushing main pipe 25, making the water flow more powerful. This enhanced water flow can more effectively flush the dirt and residues on the wafer 41, improving the thoroughness and efficiency of the flushing.

[0033] Furthermore, as Figures 1 to 3 shown in Figures 1 to 3 , an inlet 29 is provided at one end of the flushing main pipe 25 away from the flushing side pipe 22, and an inlet pipe 30 is connected to the inlet 29 that is communicated with the flushing port 24. The water source can centrally enter the flushing main pipe 25 through the inlet 29, and then be distributed to each flushing side pipe 22 through the flushing main pipe 25. This centralized water supply method improves the water supply efficiency and reduces the dispersion and loss of the water flow at multiple inlets. By controlling the water flow speed and pressure at the inlet 29, the water flow distribution of the entire flushing system is effectively managed, ensuring that each flushing side pipe 22 obtains balanced and sufficient water volume. The centralized inlet 29 design reduces the number of pipe connection points, thereby reducing the risk of water leakage caused by improper connection or aging.

[0034] Further, as Figures 1 to 3 shown, the flushing rack 20 further includes a rotary drive member 31, and the main flushing pipe 25 is in transmission connection with the rotary drive member 31. By the transmission connection between the rotary drive member 31 and the main flushing pipe 25, the whole flushing rack 20 can be rotated. Before the wafers are taken out, in the prior art, a water gun is manually held to flush the wafers. Since the water gun has only one nozzle, only one wafer 41 can be flushed at the same time. During the flushing process, the water gun needs to be moved clockwise along the ceramic tray 40. This manual method has instability in flushing. The rotary drive member 31 rotates the main flushing pipe 25, and the flushing rack 20 is set to rotate a set number of turns. By adopting the automatic flushing method, each wafer 41 can be evenly flushed, ensuring the flushing effect of the wafer 41.

[0035] As one embodiment, the rotary drive member 31 is a motor.

[0036] Further, as Figures 1 to 3 shown, the liquid inlet pipe 30 is connected to the main flushing pipe 25 through a bearing. When the main flushing pipe 25 rotates, the liquid inlet pipe 30 rotates relative to the main flushing pipe 25 through the bearing, making the relative rotation between the liquid inlet pipe 30 and the main flushing pipe 25 smoother, ensuring the smooth rotation and flushing of the flushing rack 20 for the wafer 41. The main flushing pipe 25 is provided with a main pipe transmission part 32, and the main pipe transmission part 32 is in transmission connection with the rotary drive member 31. The main pipe transmission part 32 is connected to the main flushing pipe 25 to realize the transmission connection with the rotary drive member 31.

[0037] As one embodiment, as Figures 1 to 3 shown, the main pipe transmission part 32 is coaxially connected to the main flushing pipe 25. The main pipe transmission part 32 is located at one end of the main flushing pipe 25 away from the flushing frame 21, and the main pipe transmission part 32 is coaxially connected to the drive shaft of the rotary drive member 31. The drive shaft of the motor drives the main flushing pipe 25 to rotate through the main pipe transmission part 32.

[0038] As another embodiment, the main pipe transmission part 32 surrounds the outer periphery of the main flushing pipe 25. The main pipe transmission part 32 is a synchronous belt. The drive shaft of the rotary drive member 31 is arranged along the axial direction of the main flushing pipe 25. The drive shaft of the rotary drive member 31 is connected with a drive gear, and the drive gear meshes with the main pipe transmission part 32 for transmission. The motor drives the drive gear to rotate, and the drive gear meshes with the main pipe transmission part 32 for transmission, thereby driving the main flushing pipe 25 to rotate.

[0039] In summary, the embodiment of the present utility model provides a polishing and unloading flushing device. The flushing table 10 is used to place the ceramic disc 40, and the flushing frame 20 is used to flush the wafer 41 in the ceramic disc 40 placed on the flushing table 10. The flushing frame 20 includes a flushing frame 21 and a flushing side pipe 22. The flushing side pipe 22 is communicated with deionized water, and the deionized water flushes the wafer 41 through the flushing side pipe 22. One end of the flushing side pipe 22 is fixedly connected to the flushing frame 21 to form a flushing fixed end 23, which fixes the connection position of the flushing side pipe 22 and improves the connection stability of the flushing side pipe 22. The flushing fixed end 23 is provided with a flushing port 24 facing the flushing table 10. The flushing port 24 is communicated with the flushing side pipe 22. A plurality of flushing ports 24 are arranged at intervals along the edge of the flushing frame 20, and a flushing port 24 is arranged at the corresponding position of each wafer 41. After the flushing table surface 12 stops rotating, during the unloading process, each wafer 41 has a corresponding flushing side pipe 22 continuously flushing, maintaining the wettability of the wafer 41. The deionized water in the flushing port 24 automatically and continuously flushes the wafer 41, avoiding the employee from operating the unloading with one hand, reducing the safety hazard of product fragmentation, reducing the difficulty of the unloading operation, improving the efficiency of the unloading operation, and improving the yield of the wafer 41.

[0040] The above is only the preferred embodiment of the present utility model. It should be noted that for those of ordinary skill in the art of this technology, without departing from the technical principle of the present utility model, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present utility model.

Claims

1. A polishing and unloading flushing device, characterized in that: It includes a flushing table and a flushing rack. The flushing table and the flushing rack are arranged to rotate relative to each other. The flushing rack includes a flushing frame and a plurality of flushing side pipes for communicating with deionized water. One end of each flushing side pipe is fixedly connected to the flushing frame to form a flushing fixed end. A flushing water outlet facing the flushing table is provided at the flushing fixed end. The plurality of flushing side pipes are arranged at intervals along the edge of the flushing rack.

2. The polishing lower wafer flushing device according to claim 1, wherein: The flushing table is provided with a connection fixed part for connecting with a ceramic disc.

3. The polishing lower wafer flushing device according to claim 2, characterized in that: The flushing table is provided with a flushing table surface facing the flushing water outlet, and the connection fixed part is connected to the flushing table surface.

4. The polishing lower wafer flushing device according to claim 1, wherein: The number and positions of the flushing side pipes and the flushing water outlets are respectively correspondingly arranged.

5. The polishing lower wafer flushing device according to claim 2, wherein: The flushing rack further includes a flushing main pipe for communicating with deionized water. A plurality of side pipe connection ports are provided on the outer periphery of the flushing main pipe. The adjacent side pipe connection ports are arranged at intervals in the circumferential direction. One end of the flushing side pipe far from the flushing fixed end is communicated with the side pipe connection port.

6. The polishing lower wafer flushing device according to claim 5, wherein: The side pipe connection ports are arranged at the lower end of the flushing main pipe, and a closed bottom surface is connected to the lower end of the flushing main pipe.

7. The polishing lower wafer flushing device according to claim 5, characterized in that: A boosting device is connected to the flushing main pipe.

8. The polishing lower wafer flushing device according to claim 5, characterized in that: An inlet is provided at one end of the flushing main pipe far from the flushing side pipe. An inlet pipe is connected to the inlet which is communicated with the flushing water outlet.

9. The polishing lower wafer flushing device according to claim 8, characterized in that: The flushing rack further includes a rotation driving member, and the flushing main pipe is in transmission connection with the rotation driving member.

10. The polishing lower wafer flushing device according to claim 9, characterized in that: The inlet pipe is connected to the flushing main pipe through a bearing. The flushing main pipe is provided with a main pipe transmission part, and the main pipe transmission part is in transmission connection with the rotation driving member.

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