Base for thermocompression bonding and thermocompression bonding equipment with same
By setting up an interlaced support island structure in the vacuum channel area of the hot-press bonding base, the problem of air beam impact caused by gas leakage between the substrate and the base is solved, ensuring the stability and success rate of the hot-press bonding process.
Patent Information
- Application Number
- CN202421965164.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-14
AI Technical Summary
During the hot press bonding process, gas leakage between the substrate and the base may cause the air beam to directly impact the substrate pad side components, or even blow away the components, affecting the normal operation of the device.
A base structure is designed in which the support islands of the vacuum channel area are arranged intertwined to form staggered channel paths to mitigate the impact of the air beam.
It effectively reduces the impact of the air beam on the substrate pad side components, prevents the components from being blown away, and ensures the stability and success rate of the hot press bonding process.
Smart Images
Figure CN223167444U_ABST
Abstract
Description
Technical Field
[0001] The utility model generally relates to a thermocompression bonding technology, and more specifically, to a base for thermocompression bonding and a thermocompression bonding device having the base. Background Art
[0002] Thermocompression bonding is a high-precision bonding process widely used in semiconductor packaging. The die is fixed to the substrate through the thermocompression bonding technology, thereby realizing high-density die packaging. As shown in FIG. 1(a), during the thermocompression bonding process, the substrate 102 coated with the flux 101 is vacuum adsorbed onto the base 103 of the thermocompression bonding device 100, and the bonding head 104 of the thermocompression bonding device 100 can pick up the die 105 and move it close to the substrate 102. At the moment when the substrate 102 contacts the die 105, the bonding head 104 switches from pressure-sensitive control to position-sensitive control. At this time, the die 105 is quickly heated (for example, 100 °C / s) to the critical melting temperature of the flux 101 by a heating device (not shown) on the bonding head 104, and the heat is conducted to the flux 101 on the substrate 102 to melt it. Then, the temperature of the bonding head 104 quickly cools (for example, -50 °C / s) below the melting point of the flux 101, making the flux 101 become solid phase. Then, the vacuum adsorption of the bonding head 104 to the die 105 is turned off, the die 105 is separated from the bonding head 104, and the die 105 is bonded to the substrate 102 and removed from the thermocompression bonding device 100, and the bonding is completed.
[0003] During thermocompression bonding, the substrate 102 needs to be placed flat on the base 103 of the thermocompression bonding device 100 to reduce warping. At this time, the component 106 on the pad side of the substrate needs to be placed below the top surface of the base 103 to avoid being squeezed. Therefore, a recess 107 for placing the component 106 (such as a capacitor or a resistor) on the pad side of the substrate is usually provided on one side of the base 103. A vacuum channel area (not shown) surrounding the recess 107 is also formed around the recess 107, and the vacuum channels in the vacuum channel area communicate with the recess 107. During thermocompression bonding, the substrate 102 is placed flat on the base 103 so that the recess 107 forms a sealed cavity, and the air in the sealed cavity is sucked through a plurality of vacuum holes 108 provided on the bottom surface of the recess 107 and the bottom surface of the vacuum channel to form a vacuum, so that the substrate 102 is adsorbed onto the base 103.
[0004] However, as shown in FIG. 1(b), if there is a foreign object between the substrate 102 and the base 103 or the substrate 102 is not pulled flat enough, there may be a gas leak between the substrate 102 and the base 103. When evacuating through the vacuum hole 108, there may be an air column 109 directly impacting the substrate pad side component 106 in the sealed cavity. In severe cases, the substrate pad side component 106 can even be blown away, resulting in the malfunction of the bonded device.
[0005] Therefore, a base for thermocompression bonding and a thermocompression bonding device having the base are needed, which can avoid the gas beam directly impacting or even blowing away the substrate pad side component placed in the sealed cavity when there is a gas leak between the substrate and the base. Summary of the Utility Model
[0006] According to an embodiment of the present invention, there is provided a base for thermocompression bonding. The base has a first surface and a second surface opposite to the first surface. The base includes: a recess that starts from the first surface and has a first depth; a vacuum channel region that surrounds the recess, and the vacuum channel region includes: a first vacuum channel region and a second vacuum channel region. The first vacuum channel region extends from the recess along a first direction and the second vacuum channel region extends from the recess along a direction opposite to the first direction. Both the first vacuum channel region and the second vacuum channel region include a first row of support islands and a second row of support islands that are arranged along a second direction perpendicular to the first direction and are flush with the first surface. A vacuum channel that communicates with the recess and has a second depth is provided between the first row of support islands and the second row of support islands and between adjacent two support islands in each row of support islands of the first row of support islands and the second row of support islands; and a third vacuum channel region and a fourth vacuum channel region. The third vacuum channel region extends from the recess along the second direction and the fourth vacuum channel region extends from the recess along a direction opposite to the second direction. Both the third vacuum channel region and the fourth vacuum channel region include a first row of support islands and a second row of support islands that are arranged along a direction parallel to the first direction and are flush with the first surface. A vacuum channel that communicates with the recess and has the second depth is provided between the first row of support islands and the second row of support islands and between adjacent two support islands in each row of support islands of the first row of support islands and the second row of support islands; and at least two vacuum holes that extend from the bottom surface of the recess and / or from the bottom surface of the vacuum channels in the vacuum channel region to the second surface. It is characterized in that, in each vacuum channel region of the first vacuum channel region and the second vacuum channel region, the vacuum channels between adjacent two support islands in the first row of support islands are staggered from each other along the second direction with the vacuum channels between adjacent two support islands in the second row of support islands; and in each vacuum channel region of the third vacuum channel region and the fourth vacuum channel region, the vacuum channels between adjacent two support islands in the first row of support islands are staggered from each other along the first direction with the vacuum channels between adjacent two support islands in the second row of support islands.
[0007] In some embodiments, the first row of support islands includes support islands of the same size and the second row of support islands includes support islands of the same size.
[0008] In some embodiments, the first row of support islands includes support islands of different sizes and the second row of support islands includes support islands of different sizes.
[0009] In some embodiments, the first row of support islands includes support islands of the same size and the second row of support islands includes support islands of the same size.
[0010] In some embodiments, the first row of support islands includes support islands of different sizes and the second row of support islands includes support islands of different sizes.
[0011] In some embodiments, the support islands have a circular, rectangular or square shape.
[0012] In some embodiments, the first depth is greater than the second depth.
[0013] In some embodiments, the recess has a rectangular, square or oval shape.
[0014] In some embodiments, the base is made of metal coated with a protective coating.
[0015] In some embodiments, the metal includes any one of iron or copper.
[0016] In some embodiments, the base has a rectangular or square shape.
[0017] According to an embodiment of the present invention, a thermocompression bonding device is provided, which includes the base according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The drawings are incorporated herein and form a part of the specification, illustrating embodiments of the present invention and, together with the specification, further serving to explain the principles of the present invention and enable those skilled in the relevant art to make and use the present invention.
[0019] FIG. 1(a) shows a schematic diagram of a substrate being vacuum-adsorbed onto the base during thermocompression bonding;
[0020] FIG. 1(b) shows a schematic diagram of gas leakage between the substrate and the base during thermocompression bonding;
[0021] Figure 2(a)-2(c) Shows a schematic diagram of a base for thermocompression bonding according to an embodiment of the present invention;
[0022] Figure 3(a)-3(b) Shows during the substrate and Figure 2(a)-2(c) The impact simulation result of the air beam on the substrate pad-side component when there is gas leakage between the shown base;
[0023] Figure 4 Shows a schematic diagram of a base for thermocompression bonding according to another embodiment of the present invention;
[0024] Figure 5(a)-5(b)shows the impact simulation results of the air beam on the components on the pad side of the substrate when there is gas leakage between the substrate and the Figure 4 base shown; and
[0025] Figure 6 shows a schematic diagram of a base for thermocompression bonding according to another embodiment of the present invention.
[0026] The embodiments will be described with reference to the accompanying drawings. Detailed Embodiments
[0027] Now, the subject matter described herein will be discussed with reference to example embodiments. It should be understood that discussing these embodiments is only to enable those skilled in the art to better understand and thus implement the subject matter described herein, and is not a limitation on the scope of protection, applicability, or examples set forth in the claims. Changes can be made to the functions and arrangements of the elements discussed without departing from the scope of protection of the content of this specification. Each example can omit, substitute, or add various processes or components as needed. Additionally, the features described relative to some examples can also be combined in other examples.
[0028] It should be noted that referring to "one embodiment", "embodiment", "some embodiments", etc. in the specification means that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment includes such specific features, structures, or characteristics. Moreover, such wording does not necessarily refer to the same embodiment. Additionally, when combining specific features, structures, or characteristics with an embodiment, implementing such features, structures, or characteristics in combination with other explicitly or implicitly described embodiments should be within the knowledge scope of those skilled in the relevant art.
[0029] The embodiments herein can be described with reference to the respective drawings. Unless explicitly stated, the dimensions of the drawings are intended to simplify the examples rather than describe relative dimensions. For example, unless otherwise indicated, the various lengths / widths / heights of the elements in the drawings may not be drawn to scale.
[0030] Now, embodiments of a base for thermocompression bonding and a thermocompression bonding device having the base according to the present invention will be described with reference to the accompanying drawings.
[0031] Figure 2(a)-2(c)FIG. 0 shows a schematic view of a base for thermocompression bonding according to an embodiment of the present utility model, wherein FIG. 2(a) shows a top view of the base for thermocompression bonding, FIG. 2(b) shows a cross-sectional view taken along line A-A' in FIG. 2(a), and FIG. 2(c) shows a cross-sectional view taken along line B-B' in FIG. 2(a). In addition, those skilled in the art should understand that the cross-sectional view taken along line C-C' in FIG. 2(a) is similar to the cross-sectional view taken along line A-A', and the cross-sectional view taken along line D-D' in FIG. 2(a) is similar to the cross-sectional view taken along line B-B'.
[0032] As shown in FIG. 2(b) or FIG. 2(c), the base 200 has a first surface 201 and a second surface 202 opposite to the first surface 201. In one embodiment, as shown in FIG. 2(a), the base 200 has a rectangular shape, but the present utility model is not limited thereto. For example, in some embodiments, the base 200 may also have a square shape. In one embodiment, the base 200 may be made of a metal such as iron or copper, and a protective coating is applied on its surface.
[0033] As Figure 2(a)-2(b) shown, the central region of the base 200 includes a recess 203 starting from the first surface 201 and having a first depth h1. In one embodiment, as shown in FIG. 2(a), the recess 203 has a rectangular shape, but the present utility model is not limited thereto. For example, in some embodiments, the recess 203 may have a square or oval shape.
[0034] As shown in FIG. 2(a), a vacuum channel region 204 is formed around the recess 203, and the vacuum channel region 204 includes a first vacuum channel region 204-1 and a second vacuum channel region 204-2. The first vacuum channel region 204-1 extends along the X direction starting from the recess 203, and the second vacuum channel region 204-2 extends along the direction opposite to the X direction starting from the recess 203. Both the first vacuum channel region 204-1 and the second vacuum channel region 204-2 include a first row of support islands, a second row of support islands, and a third row of support islands arranged along the Y direction and flush with the first surface 201. As shown in FIG. 2(a), in each of the first vacuum channel region 204-1 and the second vacuum channel region 204-2, vacuum channels are formed around each support island except for the four support islands adjacent to the recess 203, and vacuum channels are formed on three sides of the four support islands adjacent to the recess 203.
[0035] In the base 200 shown in FIG. 2(a), the support islands have a square shape, but the present utility model is not limited thereto. For example, in some embodiments, the support islands may have a circular or rectangular shape.
[0036] In addition, as shown in FIG. 2(a), the vacuum channel region 204 further includes a third vacuum channel region 204-3 and a fourth vacuum channel region 204-4. The third vacuum channel region 204-3 extends along the Y direction starting from the recess 203, and the fourth vacuum channel region 204-4 extends along the direction opposite to the Y direction starting from the recess 203. Both the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4 include a first row of support islands, a second row of support islands, and a third row of support islands that are arranged in a direction parallel to the X direction and flush with the first surface 201. As shown in FIG. 2(a), in each of the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4, a vacuum channel is formed around each support island except for the ten support islands adjacent to the recess 203, and a vacuum channel is formed on three sides of the ten support islands adjacent to the recess 203.
[0037] As shown in FIG. 2(a), the first vacuum channel region 204-1, the second vacuum channel region 204-2, the third vacuum channel region 204-3, and the fourth vacuum channel region 204-4 together form a vacuum channel region 204 surrounding the recess 203. As shown in FIG. 2(a), the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4 are respectively sandwiched between the first vacuum channel region 204-1 and the second vacuum channel region 204-2 along the X direction. However, the embodiment shown in FIG. 2(a) is merely exemplary. In some embodiments, the first vacuum channel region 204-1 and the second vacuum channel region 204-2 may also be respectively sandwiched between the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4 along the Y direction.
[0038] As shown in FIG. 2(b), the vacuum channels in the vacuum channel region 204 have a second depth h2, and the second depth h2 is less than the first depth h1.
[0039] In one embodiment, as Figure 2(a)-2(b) shown, the base 200 further includes three vacuum holes 205. One vacuum hole 205 is disposed in the central region of the base 200 and extends from the bottom surface of the recess 203 to the second surface 202. Additionally, two vacuum holes 205 are disposed in the third vacuum channel region 204- . As described above, when the substrate is placed on the first surface 201 of the base 200, the recess 203 forms a sealed space, and the air in the sealed space is sucked through the vacuum holes 205 to form a vacuum, thereby flattening and adsorbing the substrate onto the base 200 for thermocompression bonding. For those skilled in the art, the number and positions of the vacuum holes 205 shown in FIG. 2(a) are merely exemplary.
[0040] As shown in FIG. 2(a), in each of the first vacuum channel region 204-1 and the second vacuum channel region 204-2, the vacuum channels between the corresponding adjacent two support islands among the first column of support islands, the second column of support islands, and the third column of support islands are arranged in a straight line along the X direction, and some of the vacuum channels therein are directly communicated with the recess 203. In each of the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4, the vacuum channels between the corresponding adjacent two support islands among the first row of support islands, the second row of support islands, and the third row of support islands are arranged in a straight line along the Y direction and are all directly communicated with the recess 203. In one embodiment, the first vacuum channel region 204-1 and the second vacuum channel region 204-2 may include at least two columns of support islands. For example, they may include two columns, four columns or more columns of support islands, rather than being limited to the three columns of support islands shown in FIG. 2(a). Similarly, the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4 may include at least two rows of support islands. For example, they may include two rows, four rows or more rows of support islands, rather than being limited to the three rows of support islands shown in FIG. 2(a).
[0041] In each of the first vacuum channel region 204-1 and the second vacuum channel region 204-2 of the base 200, (for example) five vacuum channels directly communicated with the recess 203 are all arranged in a straight line along the X direction; and in each of the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4 of the base 200, (for example) eleven vacuum channels directly communicated with the recess 203 are all arranged in a straight line along the Y direction. Therefore, during the thermocompression bonding process using the base 200, if there is air leakage between the substrate and the base 200 (for example) due to the presence of foreign objects, the air beam formed by evacuating the vacuum through the vacuum hole 205 will impact the substrate pad side component disposed in the recess 203 at high speed, and in serious cases, it can even blow away the substrate pad side component.
[0042] Figure 3(a)-3(b) Shows the situation when there is a gas leakage between the substrate and Figure 2(a)-2(c) the base 200 of the shown type, and the impact simulation result of the air beam on the substrate pad side component is presented. More specifically, Figure 3(a)-3(b) shows the impact simulation result of the air beam on the substrate pad side component when there is a gas leakage on the left side of the recess 203. It should be noted that FIG. 3(a) simulates the case where the base 200 has only one vacuum hole 205 in the central region, while FIG. 3(b) simulates the case where the base 200 has four vacuum holes 205 in the third vacuum channel region 204-3 and the fourth vacuum channel region 204-4. Figure 3(a)-3(b)The simulation results show that when the vacuum channels directly connected to the recess 203 are arranged in a straight line, the impact of the air beam caused by air leakage on the components on the substrate pad side is very large, and in severe cases, it can even blow away the components on the substrate pad side.
[0043] Figure 4 FIG. shows a schematic diagram of a base 300 for thermocompression bonding according to another embodiment of the present invention. Compared with Figure 2(a)-2(c) the shown base 200, the difference is only that in each vacuum channel area of the first vacuum channel area 304-1 and the second vacuum channel area 304-2 of the base 300, the vacuum channels between adjacent two support islands in the first column of support islands are staggered from each other in the Y direction with respect to the vacuum channels between adjacent two support islands in the second column of support islands, and the vacuum channels between adjacent two support islands in the second column of support islands are staggered from each other in the Y direction with respect to the vacuum channels between adjacent two support islands in the third column of support islands; and in each vacuum channel area of the third vacuum channel area 304-3 and the fourth vacuum channel area 304-4 of the base 300, the vacuum channels between adjacent two support islands in the first row of support islands are staggered from each other in the X direction with respect to the vacuum channels between adjacent two support islands in the second row of support islands, and the vacuum channels between adjacent two support islands in the second row of support islands are staggered from each other in the X direction with respect to the vacuum channels between adjacent two support islands in the third row of support islands.
[0044] Regarding Figure 4 each part of the shown base 300, reference can be made to Figure 2(a)-2(c) the parts described herein, and details will not be repeated here.
[0045] Figure 5(a)-5(b) FIG. shows the simulation results of the impact of the air beam on the components on the substrate pad side when there is gas leakage between the substrate and Figure 4 the base 300 of the shown type. More specifically, Figure 5(a)-5(b) FIG. shows the simulation results of the impact of the air beam on the components on the substrate pad side when there is gas leakage on the left side of the recess 303. It should be noted that FIG. 5(a) simulates the case where the base 300 has only one vacuum hole 305 in the central area, while FIG. 5(b) simulates the case where the base 300 has four vacuum holes 305 in the third vacuum channel area 304-3 and the fourth vacuum channel area 304-4. Figure 5(a)-5(b)The simulation results show that when there is gas leakage only on the left side of the recess 303, when the support islands in the first vacuum channel region 304-1 and the second vacuum channel region 304-2 are no longer arranged in a regular array as shown in Fig. 2(a), the staggered support island columns in the first vacuum channel region 304-1 and the second vacuum channel region 304-2 change the vacuum channels from "straight lines" in the X direction to "zigzags", and the air beam will be blocked and decelerated by the staggered support islands, so that the impact of the air beam on the components on the pad side of the substrate can be greatly reduced.
[0046] Figure 6 Fig. 4 shows a schematic diagram of a base 400 for thermocompression bonding according to another embodiment of the present invention. Compared with Figure 4 the base 300 shown, the difference is only that in each vacuum channel region of the first vacuum channel region 404-1 and the second vacuum channel region 404-2 of the base 400, each of the support islands in the first column, the second column, and the third column of support islands no longer has support islands of the same size, but has support islands of different sizes; in each vacuum channel region of the third vacuum channel region 404-3 and the fourth vacuum channel region 404-4 of the base 400, each of the support islands in the first row, the second row, and the third row of support islands also no longer has support islands of the same size, but has support islands of different sizes.
[0047] Those skilled in the art should understand that the size of the base for thermocompression bonding according to the present invention can be set according to the size of the substrate to be bonded, and the number, position, and depth of the recesses in the base for thermocompression bonding according to the present invention can be set according to the number, position, and height of the components on the pad side of the substrate to be bonded.
[0048] In the base for thermocompression bonding according to the present invention and the thermocompression bonding device having the base, in each vacuum channel region of the first vacuum channel region and the second vacuum channel region, the vacuum channels between adjacent two support islands in at least the first column of support islands are staggered from each other in the Y direction with the vacuum channels between adjacent two support islands in the second column of support islands; and in each vacuum channel region of the third vacuum channel region and the fourth vacuum channel region, the vacuum channels between adjacent two support islands in at least the first row of support islands are staggered from each other in the X direction with the vacuum channels between adjacent two support islands in the second row of support islands. Therefore, when there is air leakage between the substrate and the base, the air beam will be blocked and decelerated by the staggered support islands, so that the impact of the air beam on the components on the pad side of the substrate can be greatly reduced.
[0049] It should be noted that not all units in the above devices are necessary, and some units can be ignored according to actual needs. The device structures described in the above embodiments can be physical structures or logical structures. That is, some units may be implemented by the same physical entity, or some units may be implemented by multiple physical entities, or some components in multiple independent devices may be jointly implemented.
[0050] The above description of the present invention is provided to enable any ordinary person skilled in the art to implement or use the present disclosure. Various modifications to the present invention will be obvious to those of ordinary skill in the art, and the general principles defined by the present invention can also be applied to other variations without departing from the protection scope of the present invention. Therefore, the present invention is not limited to the examples and designs described herein, but is consistent with the broadest scope that conforms to the principles and novel features disclosed herein.
Claims
1. A base for thermocompression bonding, the base having a first surface and a second surface opposite to the first surface, the base comprising: A recess that starts from the first surface and has a first depth; A vacuum channel area that surrounds the recess, and the vacuum channel area comprises: A first vacuum channel area and a second vacuum channel area. The first vacuum channel area extends from the recess along a first direction and the second vacuum channel area extends from the recess along a direction opposite to the first direction. Both the first vacuum channel area and the second vacuum channel area comprise a first column of support islands and a second column of support islands that are arranged along a second direction perpendicular to the first direction and are flush with the first surface. Vacuum channels that communicate with the recess and have a second depth are provided between the first column of support islands and the second column of support islands and between adjacent two support islands in each column of the first column of support islands and the second column of support islands; and A third vacuum channel area and a fourth vacuum channel area. The third vacuum channel area extends from the recess along the second direction and the fourth vacuum channel area extends from the recess along a direction opposite to the second direction. Both the third vacuum channel area and the fourth vacuum channel area comprise a first row of support islands and a second row of support islands that are arranged along a direction parallel to the first direction and are flush with the first surface. Vacuum channels that communicate with the recess and have the second depth are provided between the first row of support islands and the second row of support islands and between adjacent two support islands in each row of the first row of support islands and the second row of support islands; and At least two vacuum holes that extend from the bottom surface of the recess and / or from the bottom surface of the vacuum channels in the vacuum channel area to the second surface, Characterized in that, in each vacuum channel area of the first vacuum channel area and the second vacuum channel area, the vacuum channels between adjacent two support islands in the first column of support islands are staggered from each other along the second direction with respect to the vacuum channels between adjacent two support islands in the second column of support islands; and in each vacuum channel area of the third vacuum channel area and the fourth vacuum channel area, the vacuum channels between adjacent two support islands in the first row of support islands are staggered from each other along the first direction with respect to the vacuum channels between adjacent two support islands in the second row of support islands.
2. The base according to claim 1, characterized in that, The first column of support islands comprises support islands of the same size and the second column of support islands comprises support islands of the same size.
3. The base according to claim 1, characterized in that, The first column of support islands comprises support islands of different sizes and the second column of support islands comprises support islands of different sizes.
4. The base according to claim 2 or 3, characterized in that, The first row of support islands comprises support islands of the same size and the second row of support islands comprises support islands of the same size.
5. The base according to claim 2 or 3, characterized in that, The first row of support islands comprises support islands of different sizes and the second row of support islands comprises support islands of different sizes.
6. The base according to claim 1, characterized in that, The support islands have a circular, rectangular or square shape.
7. The base according to claim 1, characterized in that, The first depth is greater than the second depth.
8. The base according to claim 1, characterized in that, The recessed portion has a rectangular, square or oval shape.
9. The base according to claim 1, characterized in that, The base is made of metal coated with a protective coating.
10. The base according to claim 9, characterized in that, The metal includes any one of iron or copper.
11. The base according to claim 1, characterized in that, The base has a rectangular or square shape.
12. A thermocompression bonding device, which comprises a base according to any one of claims 1-11.