Wafer bonding pressure head parallelism adjusting tool

Abstract

The utility model relates to the technical field of semiconductor material processing equipment, in particular to a wafer bonding pressure head parallelism adjusting tool which comprises a tool body, the tool body is provided with an upper surface, a lower surface and side faces, and the parallelism error of the upper surface and the lower surface is smaller than 1 micron; the sensor is arranged on the tool body, and the sensor is provided with a rotating shaft, a connecting arm connected with the rotating shaft and a spherical contact located at the tail end of the connecting arm; the sensor is configured to be capable of collecting the displacement amount of the spherical contact when the spherical contact is triggered; one end of the connecting piece is connected with the lower pressing head, and the other end of the connecting piece is provided with an adjusting nut. And the parallelism between the upper pressure head and the lower pressure head of the wafer bonding machine can be flexibly detected and adjusted. When the parallelism is adjusted, the upper pressing head and the lower pressing head do not need to be disassembled, detection can be directly carried out in the bonding chamber, and the working efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor material processing equipment, and particularly to a wafer bonding head parallelism adjustment tooling. Background Art

[0002] With the development of the integrated circuit industry, the wafer bonding process can achieve higher-layer stacking of devices, thus attracting more and more attention. However, due to the relatively short development history of wafer bonding devices, there are still many deficiencies compared with other semiconductor devices. Therefore, the development of wafer bonding devices has an increasingly significant impact on the future semiconductor industry.

[0003] Under the current technical conditions, when bonding wafers, ensuring the parallel fitting of the wafer surfaces plays a crucial role in the bonding quality. The wafers to be bonded are precisely processed, so the flatness of the wafers themselves is very high. The main factor causing poor parallelism comes from the upper and lower bonding heads of the bonding machine. If the parallelism between the upper and lower bonding heads is poor, it will result in the non-parallelism of the two wafers during bonding. On the one hand, when the wafers are not parallel, scratches and damages may occur on the edges or surfaces of the wafers after fitting, and then crystal slag may be introduced at the bonding interface, resulting in bubbles after bonding or scrapping of the wafers. On the other hand, non-parallel fitting of the wafers may introduce errors during the alignment process and may also cause relative slippage during fitting, resulting in misalignment beyond the allowable range after bonding. On the other hand, non-parallel fitting of the wafers will also lead to uneven bonding force, resulting in deformation due to excessive force in some areas and unbonding due to insufficient force in some areas, making the bonding effect very poor.

[0004] Therefore, a tooling for detecting and adjusting the parallelism of the upper and lower bonding heads of the bonding machine is required. Summary of the Utility Model

[0005] The purpose of the present utility model is to provide a tooling for detecting and adjusting the parallelism of the upper and lower bonding heads of the bonding machine, which is used to adjust the parallelism between the upper and lower bonding heads before wafer bonding.

[0006] To achieve this purpose, the present utility model adopts the following technical solutions:

[0007] A wafer bonding head parallelism adjustment tooling, comprising: a tooling body, the tooling body having an upper surface, a lower surface and a side surface, the parallelism error between the upper surface and the lower surface being less than 1 μm, preferably less than 0.5 μm, more preferably less than 0.1 μm;

[0008] A sensor, disposed on the tooling body, the sensor having a rotating shaft, a connecting arm connected to the rotating shaft and a spherical contact at the end of the connecting arm;

[0009] The sensor is configured such that when the spherical contact is touched, the sensor can collect the displacement of the spherical contact.

[0010] A connecting piece, one end of the connecting piece is connected to the lower pressing head, and an adjusting nut is provided at the other end of the connecting piece.

[0011] Preferably, a connecting rod is further included, and one end of the connecting rod is fixed on the side surface of the tooling body;

[0012] The sensor is mounted on the connecting rod.

[0013] Preferably, the position of the spherical contact is higher than the upper surface of the tooling body.

[0014] Preferably, the spherical contact is spaced apart from the tooling body.

[0015] Preferably, the number of the sensors is three.

[0016] Preferably, the three sensors are respectively connected to the side surface of the tooling body through connecting rods.

[0017] Preferably, the connecting piece and the sensor are relatively positioned in the vertical direction.

[0018] Preferably, the number of the adjusting nuts on the connecting piece is two.

[0019] Preferably, the number of the connecting pieces is three.

[0020] Preferably, the three connecting pieces are respectively connected to the lower pressing head.

[0021] The beneficial effects of the present utility model: The wafer bonding head parallelism adjustment tooling provided by the present application can flexibly detect and adjust the parallelism between the upper pressing head and the lower pressing head on the wafer bonder. When performing parallelism adjustment, there is no need to disassemble the upper pressing head and the lower pressing head, and the detection can be directly carried out in the bonding chamber, improving the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a three-dimensional structural schematic diagram of the wafer bonding head parallelism adjustment tooling of the present utility model;

[0023] Figure 2 is a structural schematic diagram of the wafer bonding head parallelism adjustment tooling of the present utility model;

[0024] Figure 3 is a partial structural schematic diagram of the wafer bonding head parallelism adjustment tooling of the present utility model at the sensor;

[0025] Figure 4 is a schematic diagram of the connection relationship between the wafer bonding head parallelism adjustment tooling of the present utility model and the lower pressing head;

[0026] Figure 5 It is a second-angle schematic diagram of the connection relationship between the wafer bonding head parallelism adjustment tooling of the present utility model and the lower pressing head;

[0027] Figure 6 It is a schematic diagram of the adjusting nut structure of the wafer bonding head parallelism adjustment tooling of the present utility model;

[0028] In the figure: 1. Detection tooling; 2. Upper pressing head; 3. Lower pressing head; 4. Tooling body; 5. Connecting piece; 6. Connecting rod; 7. Spherical contact; 8. Sensor; 9. Fastener; 10. Adjusting nut; 11. Gauge block; 12. Lower pressing plate; 13. Lower pressing plate seat; 14. Connecting arm; 15. Rotating shaft. Specific embodiments

[0029] The following is a preferred and detailed description of the present utility model in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the sake of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0030] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0031] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above and over", and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below and under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.

[0032] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "right", etc. are based on the orientation or positional relationships shown in the drawings. They are only for the convenience of description and simplifying the operations, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0033] Refer to Figure 1 , the embodiment of the present application provides a wafer bonding head parallelism adjustment tooling, including a detection tooling 1. The detection tooling 1 is installed on the lower head 3 and is used to detect and adjust the parallelism between the upper head 2 and the lower head 3.

[0034] Refer to Figures 2 to 5 , the detection tooling 1 includes a tooling body 4. The tooling body 4 is a disc-shaped structure made of metal. The tooling body 4 has an upper surface, a lower surface and a side surface. The parallelism error between the upper surface and the lower surface does not exceed 1 μm. In this embodiment, for the convenience of connecting other connectors to the tooling body 4, at least part of the side surface of the tooling body 4 is machined into a plane as the installation surface for other connectors.

[0035] In this embodiment, three connecting rods 6 are connected to the tooling body 4 from different directions. One end of the connecting rod 6 is connected to the side surface of the tooling body 4 through a fastener 9, and the other end of the connecting rod 6 is suspended. The sensor 8 is installed at the middle position of the connecting rod 6. One end of the sensor 8 has a rotating shaft 15, and a connecting arm 14 is installed on the rotating shaft 15. A spherical contact 7 pointing to the tooling body 4 is provided on the end surface of the connecting arm 14.

[0036] Refer to Figure 5 , there is a certain distance between the spherical contact 7 and the tooling body 4, and the horizontal position of the spherical contact 7 is higher than the upper surface of the tooling body 4. When the spherical contact 7 is pressed, the connecting arm 14 drives the rotating shaft 15 to rotate. The sensor 8 can receive the rotation angle of the rotating shaft 15 and calculate the moving distance of the spherical contact 7.

[0037] In this embodiment, the lower head 3 includes a lower pressing disc 12 and a lower pressing disc seat 13. The lower pressing disc seat 13 has an outer edge larger than that of the lower pressing disc 12. The lower pressing disc 12 is fixedly connected to the lower pressing disc seat 13 or can be an integral structure. The lower pressing disc seat 13 is fixed to the machine table through three connecting pieces 5.

[0038] Refer to Figure 6, One end of the connecting piece 5 is fixed on the lower pressing plate seat 13 through a fastener, and the other end of the connecting piece 5 is connected to the machine table through an adjusting nut 10. The parallelism between the lower pressing plate 12 and the machine table can be adjusted through the adjusting nut 10. In order to improve the adjustment accuracy of the adjusting nut 10, a plurality of adjusting nuts 10 can be arranged on the connecting piece 5. In this embodiment, the number of adjusting nuts 10 on a single connecting piece 5 is 2.

[0039] During daily use, the connecting piece 5 can be connected to the lower pressing plate seat 13 and the machine table for a long time, which is convenient for adjusting the angle of the lower pressing head 3 at any time.

[0040] The method for adjusting the parallelism of the upper and lower pressing heads by using the tooling provided in this embodiment includes: connecting the lower pressing plate seat 13 and the machine table (not shown in the figure) through the connecting piece 5, and screwing the connecting piece 5 and the machine table through the adjusting nut 10. Place the detection tooling 1 on the lower pressing head 3 so that the three groups of sensors on the detection tooling 1 correspond to the positions of the three connecting pieces respectively. Take a gauge block 11 with high flatness, press the spherical contact 7 and the upper surface of the tooling body 4 through the gauge block 11 to make the upper surfaces of the spherical contact 7 and the tooling body 4 flush, and perform initial data calibration. After calibrating the data, remove the gauge block 11, and the spherical contact 7 automatically returns to its original position. After the initial data calibration of all three groups of sensors, start pressing down the upper pressing head 2. If the upper pressing head 2 and the lower pressing head 3 are not parallel, the upper pressing head 2 must first touch one of the spherical contacts 7 during the pressing process. When all three spherical contacts are touched, due to the different sequences of touching, the strokes of each spherical contact are different, so the readings on the sensors are also different. At this time, by adjusting the adjusting nut 10 on the connecting piece 5 corresponding to each spherical contact 7, the angle of the lower pressing head can be adjusted. Repeat the above actions until the difference in the readings of the three groups of sensors when the upper pressing head 2 is pressed down is within the allowable range. After the adjustment is completed, remove the detection tooling 1 and then the keying operation can be started.

[0041] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, and are not intended to limit the embodiments of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Wafer bonding head parallelism adjustment tooling, characterized in that, Comprising: A tooling body having an upper surface, a lower surface and a side surface; A sensor disposed on the tooling body, the sensor having a rotating shaft, a connecting arm connected to the rotating shaft, and a spherical contact at the end of the connecting arm; The sensor is configured such that when the spherical contact is touched, the sensor can collect the displacement of the spherical contact; A connecting piece, one end of the connecting piece is connected to a pressing head, and the other end is provided with an adjusting nut.

2. The wafer bonding collet parallelism adjustment tooling according to claim 1, wherein: It further includes a connecting rod, one end of the connecting rod is fixed on the side surface of the tooling body; The sensor is mounted on the connecting rod.

3. The wafer bonding head parallelism adjustment tooling according to claim 2, characterized in that: The position of the spherical contact is higher than the upper surface of the tooling body; The spherical contact is spaced apart from the tooling body.

4. The wafer bonding collet parallelism adjustment tooling according to claim 1, wherein: The parallelism error between the upper surface and the lower surface of the tooling body is less than 1 μm.

5. The wafer bonding collet parallelism adjustment tooling according to claim 3, characterized in that: The number of the sensors is three.

6. The wafer bonding head parallelism adjustment tooling according to claim 5, characterized in that: The three sensors are respectively connected to the side surface of the tooling body through connecting rods.

7. The wafer bonding head parallelism adjustment tooling according to claim 1, characterized in that: The connecting piece and the sensor are relatively positioned in the vertical direction.

8. The wafer bonding collet parallelism adjustment tooling according to claim 7, characterized in that: The number of adjusting nuts on the connecting piece is two.

9. The wafer bonding collet parallelism adjustment tooling according to claim 8, wherein: The number of the connecting pieces is three.

10. The wafer bonding collet parallelism adjustment tooling according to claim 9, characterized in that: The three connecting pieces are respectively connected to the pressing head.

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