Electromagnetic shielding module and electronic equipment

Abstract

The embodiment of the utility model provides an electromagnetic shielding module and electronic equipment. The electromagnetic shielding module comprises a substrate, a chip assembly and a packaging shell, wherein the chip assembly and the packaging shell are arranged on one side of the substrate; the substrate comprises at least one grounding area; the packaging shell is connected with the substrate, and the chip assembly is covered with the packaging shell; one side, close to the chip assembly, of the packaging shell and / or one side, far away from the chip assembly, of the packaging shell is provided with an electromagnetic shielding layer; the grounding area is electrically connected with the electromagnetic shielding layer.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electromagnetic shielding, and in particular, to an electromagnetic shielding module and an electronic device. Background Art

[0002] Electronic components such as sensors are easily affected by external electromagnetic fields. Usually, a metal shell is sleeved outside such electronic components as an electromagnetic interference (EMI) shielding cover to reduce external electromagnetic interference. However, directly sleeving a metal shell outside an electronic component has a series of problems such as too large volume, poor electromagnetic shielding effect, and causing optical crosstalk.

[0003] How to reduce the volume of the metal shell and improve the electromagnetic shielding ability of electronic components has become an urgent problem to be solved currently. Utility Model Content

[0004] In view of this, the embodiments of the present application provide an electromagnetic shielding module and an electronic device.

[0005] To achieve the above object, the technical solution of the embodiments of the present application is realized as follows:

[0006] The embodiments of the present application provide an electromagnetic shielding module, including: a substrate, a chip component disposed on one side of the substrate, and a packaging shell;

[0007] The substrate includes at least one grounding area;

[0008] The packaging shell is connected to the substrate, and the packaging shell covers the chip component;

[0009] An electromagnetic shielding layer is disposed on one side of the packaging shell close to the chip component, and / or on one side of the packaging shell away from the chip component;

[0010] Wherein, the grounding area is electrically connected to the electromagnetic shielding layer.

[0011] In some embodiments, the packaging shell is bonded to the substrate by an insulating adhesive;

[0012] The electromagnetic shielding module further includes at least one grounding wire, and the grounding wire is electrically connected to the grounding area and the electromagnetic shielding layer located on one side of the packaging shell close to the chip component.

[0013] In some embodiments, both ends of the grounding wire are electrically connected to the same grounding area, or both ends of the grounding wire are respectively electrically connected to different grounding areas;

[0014] The portion between the two ends of the grounding wire contacts the electromagnetic shielding layer, so that the grounding wire is electrically connected to the electromagnetic shielding layer and the grounding area.

[0015] In some embodiments, the electromagnetic shielding layer on the side of the encapsulation shell close to the chip component includes one or more contact portions that contact the grounding wire;

[0016] The contact portion is located on the top wall or the side wall of the electromagnetic shielding layer.

[0017] In some embodiments, the grounding wire and the contact portion are adhesively connected by a conductive adhesive.

[0018] In some embodiments, the chip component includes a first chip and a second chip distributed along a first direction; the first chip includes a light-emitting area for outputting emitted light, and the second chip includes a light-receiving area for receiving the reflected light of the emitted light; the projection of the grounding wire on the substrate is outside the projection areas of the light-emitting area and the light-receiving area on the substrate.

[0019] In some embodiments, the two grounding areas are respectively located on both sides of the chip component in a second direction; wherein, the second direction intersects with the first direction;

[0020] The encapsulation shell further includes an emission hole, a reception hole, and a protrusion structure;

[0021] The emission hole is located at the light-emitting position of the first chip; the reception hole is located at the light-receiving position of the second chip;

[0022] The protrusion structure is located between the emission hole and the reception hole and extends along the second direction; the protrusion structure is used for optically isolating the emitted light and the reflected light;

[0023] At least part of the grounding wire is fixed between the protrusion structure and the second chip.

[0024] In some embodiments, the encapsulation shell is adhesively bonded to the substrate by an insulating adhesive; at least part of the grounding area is located on the surface of the substrate outside the encapsulation shell.

[0025] The electromagnetic shielding layer on the side of the encapsulation shell away from the chip component is electrically connected to the grounding area.

[0026] In some embodiments, the encapsulation shell is adhesively bonded to the substrate by an insulating adhesive and a conductive adhesive; at least part of the grounding area is located on the surface of the substrate inside the encapsulation shell.

[0027] The electromagnetic shielding layer on the side of the encapsulation shell close to the chip component is electrically connected to the grounding area through the conductive adhesive.

[0028] An embodiment of the present application further provides an electronic device, including the above-mentioned electromagnetic shielding module.

[0029] In the electromagnetic shielding module in the embodiment of the present application, compared with directly sleeving a metal shell outside the light-sensing component as a metal shielding cover, the electromagnetic shielding layer can be directly formed on the inner side and / or the outer side of the encapsulation shell through electromagnetic sputtering and the like, which can reduce the space requirement of the electromagnetic shielding layer and reduce the volume of the electromagnetic shielding module. Description of the Drawings

[0030] Figure 1 Structural schematic of the electromagnetic shielding module provided by the embodiment of the present application Figure 1 ;

[0031] Figures 2A - 2C Structural schematic diagrams two to four of the electromagnetic shielding module provided by the embodiment of the present application;

[0032] Figure 3A Structural schematic diagram five of the electromagnetic shielding module provided by the embodiment of the present application;

[0033] Figure 3B Top view of the substrate panel provided by the embodiment of the present application;

[0034] Figure 3C Structural schematic of the electromagnetic shielding module provided by the embodiment of the present application Figure 6 ;

[0035] Figure 4 Structural schematic of the electromagnetic shielding module provided in the embodiment of the present application Figure 7 ;

[0036] Figures 5A - 5B Connection schematic of the grounding wire in the electromagnetic shielding module provided by the embodiment of the present application Figure 1 to two;

[0037] Figure 6 Connection schematic diagram three of the grounding wire in the electromagnetic shielding module provided by the embodiment of the present application;

[0038] Figure 7 Connection schematic of the grounding wire in the electromagnetic shielding module provided by the embodiment of the present application Figure 4 ;

[0039] Figure 8 Connection schematic diagram five of the grounding wire in the electromagnetic shielding module provided by the embodiment of the present application;

[0040] Figures 9A - 9CSchematic diagram of the position of the grounding area in the electromagnetic shielding module provided by the embodiment of the present application Figure 1 to three;

[0041] Figure 10A Schematic comparison diagram of the electromagnetic shielding module and the substrate provided by the embodiment of the present application;

[0042] Figures 10B - 10C Cross-sectional view of the electromagnetic shielding module along the AA` section provided by the embodiment of the present application Figure 1 to two;

[0043] Figure 11 Schematic diagram of the structure of the electronic device provided by the embodiment of the present application Figure 1 ;

[0044] Figure 12 Second schematic diagram of the structure of the electronic device provided by the embodiment of the present application. Detailed implementation manners

[0045] Next, in combination with the embodiments and the accompanying drawings of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0046] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some well-known technical features are not described; that is, not all features of the actual embodiments are described here, and the well-known functions and structures are not described in detail.

[0047] The purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present application. When used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups. When used herein, the term "and / or" includes any and all combinations of the related listed items.

[0048] To thoroughly understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solutions of this application. The preferred embodiments of this application are described in detail below. However, in addition to these detailed descriptions, this application may have other implementation manners.

[0049] Sensitive electronic components such as sensors, microprocessors, and RF modules often need to be provided with a grounded metal shell as an electromagnetic interference shielding cover outside them to reduce the interference of external electromagnetic fields on internal electronic components, prevent the leakage of electromagnetic radiation generated inside, ensure the normal operation of internal electronic components, and improve the device stability.

[0050] In related technologies, as Figure 1 shown, generally, a metal shell 101 is sleeved outside the electronic component 100 as an EMI shielding cover. However, the method of directly sleeving a metal shell outside the electronic component has the following problems: First, the thickness of the metal shell 101 is generally relatively large, which will increase the size of the device after packaging and is not conducive to the miniaturization of the device. Second, the sleeved metal shell 101 may not perfectly seal the electronic component 100. Especially near the bottom of the electronic component and the bottom of the metal shell, there are often gaps or discontinuities between the electronic component 100 and the metal shell 101, thereby reducing the electromagnetic shielding effect of the metal shell. Third, the metal shell generally has a high reflectivity. If it is arranged on the upper side of the emission hole and / or the reception hole, the metal shell reflects and scatters the light emitted by the emission end, increasing the probability of non-target light entering the reception end, thereby leading to the occurrence of optical crosstalk.

[0051] In view of this, an embodiment of this application provides an electromagnetic shielding module, as Figures 2A to 2C shown, the electromagnetic shielding module 200 includes: a substrate 201, a chip component 202 and a packaging shell 203 arranged on one side of the substrate 201;

[0052] The substrate 201 includes at least one grounding area 204;

[0053] The packaging shell 203 is connected to the substrate 201, and the packaging shell 203 covers the chip component 202;

[0054] On one side of the packaging shell 203 close to the chip component 202, and / or on one side of the packaging shell 203 far from the chip component 202, an electromagnetic shielding layer 205 is provided;

[0055] Wherein, the grounding area 204 is electrically connected to the electromagnetic shielding layer 205.

[0056] In some embodiments, the encapsulation shell 203 can be used as a carrier of the electromagnetic shielding layer 205, and an electromagnetic shielding layer 205 is formed on the inner surface and / or outer surface of the encapsulation shell 203 by electromagnetic sputtering. Compared with using an outer metal shell as an electromagnetic shielding cover, the electromagnetic shielding layer formed by electromagnetic sputtering can reduce subsequent assembly work and simplify the installation process. Moreover, the electromagnetic shielding layer formed by electromagnetic sputtering requires extremely little space and does not need to reserve additional assembly space, which can further reduce the volume of the device. The material of the electromagnetic shielding layer 205 can be a metal with good electrical conductivity. For example, gold, silver, copper, aluminum, nickel, etc.

[0057] The substrate 201 provided with the chip component 202 is adhered to the encapsulation shell 203 through at least part of insulating glue. Specifically, it can be adhered completely through insulating glue; or adhered together through conductive glue and insulating glue. Near the sensitive area of the substrate 201 (for example, the wire bonding area of the chip component 202), if the encapsulation shell 203 and the substrate 201 are directly adhered through conductive glue, since the conductive glue has a certain fluidity before curing, excessive use or uneven application of the glue is likely to cause the problem of glue overflow. This may cause the conductive glue to overflow into the sensitive area, forming an accidental conduction path, and further causing the failure of the electromagnetic shielding module function. Compared with adhering completely through conductive glue, in the electromagnetic shielding module provided by the embodiment of the present application, the encapsulation shell 203 and the substrate 201 are adhered through insulating glue in the sensitive area (non-grounding area) of the substrate 201, and adhered through insulating glue or conductive glue in the grounding area 204, and there will be no short circuit caused by glue overflow, improving the yield and stability of the electromagnetic shielding module.

[0058] In one embodiment, continue to refer to Figure 2A , the electromagnetic shielding layer 205 is arranged inside the encapsulation shell 203 (including the bottom of the encapsulation shell 203). The inner electromagnetic shielding layer 205 and the upper surface of the grounding area 204 can be bonded through conductive glue to achieve the grounding connection of the electromagnetic shielding layer 205.

[0059] In another embodiment, continue to refer to Figure 2B , the electromagnetic shielding layer 205 is arranged outside the encapsulation shell 203. The outer electromagnetic shielding layer 205 can be directly in contact connection with the side surface of the grounding area 204 to achieve the grounding connection of the electromagnetic shielding layer 205.

[0060] In yet another embodiment, continue to refer to Figure 2C, the electromagnetic shielding layer 205 is disposed on both the inner and outer sides of the package case 203. The outer electromagnetic shielding layer 205 can be directly contact-connected to the side surface of the grounding region 204 and the inner electromagnetic shielding layer 205 to achieve the grounding connection of the electromagnetic shielding layer 205. In this way, the inner and outer electromagnetic shielding layers can provide more reliable electromagnetic shielding protection for the chip component 202, further improving the electromagnetic shielding ability of the electromagnetic shielding module and enhancing the working stability of the chip component 202.

[0061] In some embodiments, as Figure 3A shown, the package case 203 is adhered to the substrate 201 by an insulating adhesive; at least a part of the grounding region 204 is located on the surface of the substrate 201 outside the package case 203;

[0062] The electromagnetic shielding layer 205 on the side of the package case 203 away from the chip component 202 is electrically connected to the grounding region 204.

[0063] At least a part of the grounding region 204 is located on the surface of the substrate 201 outside the package case 203, that is, at least a part of the grounding region 204 is located on the side surface of the substrate 201 (for example, the four side surfaces of left, right, front and back). After the package case 203 and the substrate 201 are completely adhered by the insulating adhesive, a layer of electromagnetic shielding layer 205 can be sputtered on the outer surface of the package case 203. The electromagnetic shielding layer 205 is directly connected to the grounding region 204 at the edge of the substrate 201 to achieve the grounding connection of the electromagnetic shielding layer 205. Specifically, as Figure 3B shown, the grounding region 204 on the substrate panel can be extended to the dicing channel 301. After dicing the substrate panel, the side surface of the grounding region 204 is exposed. After the substrate 201 and the package case 203 are adhered by the insulating adhesive, an electromagnetic shielding layer 205 is formed on the outer surface of the package case 203, and the electromagnetic shielding layer 205 is directly connected to the exposed grounding region 204 on the side surface of the substrate 201 for grounding. Since the package case 203 and the substrate 201 are completely adhered by the insulating adhesive, even if there is an overglue problem, it will not cause the failure of the function of the electromagnetic shielding module. The precision requirement for the amount of glue used is reduced, and the yield and stability of the electromagnetic shielding module are improved.

[0064] In some embodiments, as Figure 3CAs shown, the encapsulation shell 203 is completely bonded to the substrate 201 through insulating glue. Electromagnetic shielding layers 205 are provided on both the inner and outer surfaces of the encapsulation shell 203. Specifically, before the encapsulation shell 203 is bonded to the substrate 201, the electromagnetic shielding layer 205 is formed on the inner side (including the bottom surface) of the encapsulation shell 203. The grounding area 204 on the substrate panel extends to the scribe lane. After the substrate panel is cut, the side surface of the grounding area 204 is exposed. After the substrate 201 is bonded to the encapsulation shell 203 through insulating glue, the electromagnetic shielding layer 205 is only formed on the outer side wall surface of the encapsulation shell 203, and the electromagnetic shielding layer 205 formed on the inner side is connected to the grounding area 204 exposed on the side surface of the substrate 201 to achieve the grounding connection of the electromagnetic shielding layer 205.

[0065] In some embodiments, the encapsulation shell 203 is bonded to the substrate 201 through insulating glue and conductive glue;

[0066] The grounding area 204 is at least partially located on the surface of the substrate 201 inside the encapsulation shell 203;

[0067] The electromagnetic shielding layer 205 on the side of the encapsulation shell 203 close to the chip component 202 is electrically connected to the grounding area 204 through the conductive glue.

[0068] The grounding area 204 is at least partially located on the surface of the substrate 201 inside the encapsulation shell 203, that is, the grounding area 204 is at least partially located on the upper surface of the substrate 201. The bottom of the encapsulation shell 203 and the grounding area 204 of the substrate 201 are bonded through conductive glue, and other areas are bonded through insulating glue. The electromagnetic shielding layer 205 at the bottom of the encapsulation shell 203 is grounded through conductive glue. Since the grounding area 204 is not adjacent to the sensitive area of the substrate 201, the conductive glue on the grounding area 204 will not overflow to the sensitive area, resulting in the failure of the electromagnetic shielding module function.

[0069] In some embodiments, as Figure 4 shown, the encapsulation shell 203 is bonded to the substrate 201 through insulating glue; the electromagnetic shielding module 200 further includes at least one ground wire 214, and the ground wire 214 is electrically connected to the grounding area 204 and the electromagnetic shielding layer on the side of the encapsulation shell 203 close to the chip component 202.

[0070] The electromagnetic shielding layer 205 is electrically connected to the grounding area 204 on the substrate 201 through the ground wire 214. Such a grounded electromagnetic shielding layer provides a low-impedance path, so that any electromagnetic field attempting to penetrate the electromagnetic shielding layer can be guided to the ground, thereby protecting the chip component 202 inside the encapsulation shell 203 from external electromagnetic interference, and protecting external components from the electromagnetic interference of the chip component 202 inside the encapsulation.

[0071] The bottom of the encapsulation case 203 and the upper surface of the substrate 201 are adhesively sealed with insulating glue, so that the bottom sealing performance of the electromagnetic shielding module is good, which can effectively prevent electromagnetic waves from entering / leaving the space for accommodating the chip component through the bottom gaps or holes. In addition, the conductive glue has a certain fluidity before curing. If it is used in excess or the glue application is uneven, it is easy to have the problem of glue overflow, which may cause the conductive glue to overflow into the sensitive area, forming an accidental conduction path, and thus causing the failure of the electromagnetic shielding module function. Compared with bonding with conductive glue, using insulating glue will not cause short circuits due to glue overflow, reduces the bonding accuracy requirements, and improves the yield and stability of the electromagnetic shielding module.

[0072] In some embodiments, a grounding wire can be formed in the grounding area through a wire bonding process. Specifically, by using a metal wire (such as a gold wire, a copper wire, an aluminum wire, etc.), and using methods such as thermocompression and ultrasonic, a suspended grounding wire 214 is formed above the grounding area 204. After the substrate 201 and the encapsulation case 203 are bonded, the suspended grounding wire 214 can be in contact connection with the electromagnetic shielding layer 205 to achieve the grounding connection of the electromagnetic shielding layer 205.

[0073] Specifically, after removing the solder mask layer on the positive paving area of the substrate 201, the grounding area 204 of the substrate 201 can be exposed. A grounding wire 214 for electrically connecting with the electromagnetic shielding layer 205 is formed on the grounding area 204 through a wire bonding process. Compared with connecting the electromagnetic shielding layer 205 and the grounding area 204 through conductive glue, connecting the electromagnetic shielding layer 205 and the grounding area 204 through the grounding wire 214, and adhesively bonding the encapsulation case 203 and the substrate 201 with insulating glue further avoids the occurrence of the situation that an accidental conduction path is formed due to the conductive glue overflowing into the sensitive area, reduces the accuracy requirements for the amount of glue used, and improves the yield and stability of the electromagnetic shielding module.

[0074] In some embodiments, before the encapsulation case 203 is bonded to the substrate 201, the vertical height of the grounding wire 214 is greater than the vertical height of the chip component 202. Specifically, since the height of the grounding wire 214 is greater than the height of the chip component 202, when the encapsulation case 203 is bonded to the substrate 201, the electromagnetic shielding layer 205 sputtered on the inner surface of the encapsulation case 203 contacts and presses down the suspended grounding wire 214, and the electromagnetic shielding layer 205 realizes the grounding connection through the grounding wire 214.

[0075] In some embodiments, both ends of the grounding wire 214 are electrically connected to the same grounding area 204, or both ends of the grounding wire 214 are respectively electrically connected to different grounding areas 204;

[0076] The portion between the two ends of the ground wire 214 contacts the electromagnetic shielding layer 205, so that the ground wire 214 is electrically connected to the electromagnetic shielding layer 205 and the grounding area 204.

[0077] In some embodiments, as Figure 5A shown, one end of the ground wire 214 is connected to the grounding area 204, and the other end is connected to the same grounding area 204. The middle portion of the ground wire 214 is electrically connected to the electromagnetic shielding layer 205 to achieve the grounding connection of the electromagnetic shielding layer 205. In other embodiments, as Figure 5B shown, ground wires 214 are provided on multiple grounding areas 204. Both ends of each ground wire 214 are connected to the same grounding area 204. It can be understood that multiple ground wires 214 can also be led out from the same grounding area 204 and electrically connected to the electromagnetic shielding layer 205.

[0078] In some embodiments, as Figure 6 shown, one end of the ground wire 214 is connected to a grounding area 204 on the left side, and the other end of the ground wire 214 is connected to another grounding area 204 on the right side. Before the encapsulation shell 203 is bonded to the substrate 201, the ground wire 214 is suspended. After the encapsulation shell 203 is bonded to the substrate 201, the middle portion of the ground wire 214 is connected to the electromagnetic shielding layer 205 to achieve the grounding connection of the electromagnetic shielding layer 205. It should be noted that Figures 5A to 6 the rectangular grounding area shown is for illustrative purposes, and the embodiments of the present application do not limit the specific shape of the grounding area 204.

[0079] In some embodiments, the electromagnetic shielding layer 205 includes one or more contact portions that contact the ground wire 214; the contact portions are located on the top wall or the side wall of the electromagnetic shielding layer 205.

[0080] In some embodiments, there is a contact portion at the top wall of the electromagnetic shielding layer 205. A suspended ground wire 214 can be formed through a wire bonding process, and the height of the ground wire 214 is set to be higher than the height of the space for accommodating the chip component 202, that is, the height of the ground wire 214 is greater than the distance from the upper surface of the substrate 201 to the inner top wall of the encapsulation shell 203. When the encapsulation shell 203 is bonded to the substrate 201, the suspended ground wire 214 is pressed down by the encapsulation shell 203, and the ground wire 214 is in contact connection with the electromagnetic shielding layer 205 on the inner side of the top wall of the encapsulation shell 203.

[0081] In other embodiments, the electromagnetic shielding layer 205 includes multiple contact portions that contact one ground wire 214. The contact portions are located on the top wall of the electromagnetic shielding layer 205 (including the electromagnetic shielding layer on the lower surface of the convex structure), or the contact portions are located on the side wall of the electromagnetic shielding layer 205 (including the electromagnetic shielding layer on the left and right sides of the convex structure). Exemplarily, asFigure 7 As shown, the top wall and both side walls of the electromagnetic shielding layer 205 are in contact with the ground wire 214. Connecting to the ground wire 214 through multiple contact parts can reduce the risk of disconnection between the ground wire 214 and the electromagnetic shielding layer 205, thereby increasing the grounding stability.

[0082] In some embodiments, the ground wire 214 and the contact part are adhesively connected by conductive adhesive.

[0083] When the electromagnetic shielding module is collided, dropped or vibrated, the contact points between the ground wire and the electromagnetic shielding layer connected by contact may fall off or separate, resulting in the failure of grounding the electromagnetic shielding layer.

[0084] Before bonding and encapsulating the housing 203 and the substrate 201, according to the specific setting position of the grounding area 204, conductive adhesive can be dot-coated at the corresponding positions (contact parts) on the electromagnetic shielding layer 205 first. After the housing 203 and the substrate 201 are bonded, the ground wire 214 is connected to the electromagnetic shielding layer 205 through the conductive adhesive. Subsequently, the conductive adhesive can be cured through a baking process. The conductive adhesive can fix the ground wire 214 and reduce the risk of disconnection between the ground wire 214 and the electromagnetic shielding layer 205.

[0085] Exemplarily, as Figure 8 shown, fixing the ground wire 214 and the electromagnetic shielding layer 205 on the top wall through the conductive adhesive 801 can effectively reduce the risk of contact point detachment and increase the connection stability between the ground wire 214 and the electromagnetic shielding layer 205. The conductive adhesive 801 is only dot-coated on the inner top of the electromagnetic shielding layer 205. Even if there is glue overflow, it will not cause a short-circuit risk to the wire bonding on the substrate 201. It can be understood that in some other embodiments, the conductive adhesive 801 can also be dot-coated on the inner side wall of the housing 203. In some embodiments, the chip component 202 includes one or more functional chips, and the vertical projection of any functional chip on the substrate 201 does not overlap with the grounding area 204 on the substrate 201.

[0086] In some embodiments, as Figures 9A - 9B shown, the chip component 202 includes a first chip 901 and a second chip 902 distributed along the first direction; the first chip 901 is used to output emitted light, and the second chip 902 is used to receive the reflected light of the emitted light;

[0087] The projections of the first chip 901 and the second chip 902 on the substrate 201 do not overlap with the grounding area 204.

[0088] The arrangement areas of the first chip 901 and the second chip 902 on the substrate 201 are staggered from the grounding area 204. In one embodiment, continue to refer to Figure 9A, the grounding region 204 may be located between the first chip 901 and the second chip 902. In some embodiments, continuing to refer to Figure 9B and Figure 9C , the grounding region 204 may be located on a side of the chip assembly 202 close to the edge of the substrate 201.

[0089] The chip assembly 202 can be used to generate and receive optical signals to implement the optical sensing function. Among them, the first chip 901 can generate optical signals by current or voltage drive. For example, the first chip 901 is a Vertical Cavity Surface-Emitting Laser (VCSEL) chip or an Edge Emitting Laser (EEL) chip. The light-emitting unit of the VCSEL chip includes a laser diode, and the light emitted by it is perpendicular to the chip surface. Compared with the EEL chip, the VCSEL chip is more conducive to realizing large-scale arrays and integration. The second chip 902 can receive optical signals and convert them into electrical signals for subsequent processing. For example, the second chip 902 is an Application-Specific Integrated Circuit (ASIC) chip. The emitted light can be output through the first chip 901, and the reflected light after being reflected by the object to be measured is received by the second chip 902, and the electromagnetic shielding module can sense relevant information of the object to be measured through the emitted light and the reflected light.

[0090] Along the first direction ( Figure 9A the lateral direction shown), the substrate 201 is sequentially provided with the first chip 901, the grounding region 204, and the second chip 902 from left to right. The width of the grounding region 204 in the first direction is less than the distance between the first chip 901 and the second chip 902. The embodiments of the present application do not limit the length of the grounding region 204 perpendicular to the first direction.

[0091] Continuing to refer to Figure 9A , a suspended grounding wire 214 can be formed through a wire bonding process, and the height of the grounding wire 214 is set to be higher than the height of the space for accommodating the chip assembly 202. When the encapsulation shell is bonded to the substrate 201 and a space for accommodating the chip assembly 202 is formed, the encapsulation shell 203 can press down the suspended grounding wire 214. Furthermore, the electromagnetic shielding layer 205 inside the encapsulation shell 203 can be in contact with the grounding wire 214 to achieve the grounding connection of the electromagnetic shielding layer 205. Figure 10A shows a comparison schematic diagram of the electromagnetic shielding module and the substrate in the embodiments of the present application. In some embodiments, as Figure 10A shown, the two grounding regions 204 are respectively located on both sides of the chip assembly 202 in the second direction; the second direction intersects with the first direction.

[0092] The encapsulation shell 203 further includes an emission hole 1001, a reception hole 1002, and a protrusion structure 1003;

[0093] The emission hole 1001 is located at the light-emitting position of the first chip 901; the reception hole 1002 is located at the light-receiving position of the second chip 902;

[0094] The protrusion structure 1003 is located between the emission hole 1001 and the reception hole 1002 and extends along the second direction; the protrusion structure 1003 is used for optically isolating the emitted light and the reflected light;

[0095] Both ends of the ground wire 214 are respectively connected to the ground regions 204 on both sides in the second direction;

[0096] At least a part of the ground wire 214 is fixed between the protrusion structure 1003 and the second chip 902.

[0097] A suspended ground wire 214 can be formed by a wire bonding process, and the height of the ground wire 214 is set to be higher than the height of the second chip 902. Figure 10B For Figure 10A the cross-sectional view along the AAˋ section of the illustrated embodiment, as Figure 10B shown, the ground wire 214 extends across the second chip 902 in the second direction ( Figure 10B the lateral direction shown), one end of the ground wire 214 is connected to the ground region 204 on the left side of the second chip 902, and the other end of the ground wire 214 is connected to the ground region 204 on the right side of the second chip 902. After the encapsulation shell 203 is bonded to the substrate 201, the protrusion structure 1003 presses part of the ground wire 214 onto the upper surface of the second chip 902. The protrusion structure 1003 abuts against the second chip 902, and the electromagnetic shielding layer 205 on the lower surface of the protrusion structure 1003 is connected to part of the ground wire 214 to achieve the grounding connection of the electromagnetic shielding layer 205. In another embodiment, as Figure 10C shown, the ground wire 214 is not only in contact connection with the small surface of the protrusion structure 1003, but also in contact connection with the inner side wall of the encapsulation shell 203.

[0098] It should be noted that a passivation layer is provided on the upper surface of the second chip 902, and pressing the ground wire 214 onto the second chip 902 will not cause a short-circuit risk to the second chip 902. In some embodiments, the electromagnetic shielding layer on the surface of the protrusion structure 1003 is in direct contact connection with the ground region 204 of the substrate 201.

[0099] Continue to refer to Figure 10A, since the electromagnetic shielding layer 205 is located inside the encapsulation case 203, and the emission hole 1001 provided on the encapsulation case 203 is located above the electromagnetic shielding layer 205, the emitted light rays led out through the emission hole 1001 will not enter the receiving hole 1002 after being reflected or scattered by the electromagnetic shielding layer 205. Compared with the metal case of the outer sleeve, the electromagnetic shielding layer located inside the encapsulation case can effectively reduce the risk of optical crosstalk problems.

[0100] In some embodiments, the electromagnetic shielding module further includes a first light filtering unit (e.g., a filter) disposed between the receiving hole 1002 and the second chip 902. The first light filtering unit covers the lower surface of the receiving hole 1002 and is used to filter out other light rays except the reflected light rays, reduce the interference generated by ambient light, etc., and improve the working performance of the electromagnetic shielding module.

[0101] In some embodiments, the electromagnetic shielding module further includes a second light filtering unit (e.g., a filter) disposed between the emission hole 1001 and the first chip 901. The second light filtering unit covers the lower surface of the emission hole 1001 and is used to filter out other light rays except the emitted light rays, and can also further improve the working performance of the electromagnetic shielding module.

[0102] It should be noted that in the embodiments where an electromagnetic shielding layer is provided on the outer side of the encapsulation case and in the embodiments where conductive adhesive is coated in the grounding area, a grounding wire may not be provided for connecting the grounding area and the electromagnetic shielding layer. Among them, the outer electromagnetic shielding layer can be directly in contact with the grounding area of the substrate; or the electromagnetic shielding layer is connected to the grounding area of the substrate through conductive adhesive.

[0103] Based on the same inventive concept, the embodiments of the present application further provide an electronic device. As Figure 11 shown, the electronic device 300 includes the electromagnetic shielding module 200 in any of the above embodiments.

[0104] Since the electronic device 300 includes the above electromagnetic shielding module 200, the electronic device 300 has the same or similar beneficial effects as the electromagnetic shielding module, so the beneficial effects of the electronic device will not be elaborated here.

[0105] In some embodiments, as Figure 12 shown, the electronic device 300 further includes a foam 1201 and a glass panel 1202 disposed on one side of the electromagnetic shielding module 200. The foam 1201 has good shock absorption and pressure reduction performance, which can not only protect the electromagnetic shielding module together with the transparent panel, but also keep a proper air gap between the electromagnetic shielding module 200 and the glass panel 1202, thereby ensuring the optical performance of the electronic device.

[0106] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An electromagnetic shielding module, characterized in that, Comprising: a substrate, a chip component disposed on one side of the substrate, and a package shell; the substrate includes at least one grounding region; the package shell is connected to the substrate, and the package shell covers the chip component; an electromagnetic shielding layer is provided on one side of the package shell close to the chip component, and / or on one side of the package shell away from the chip component; wherein, the grounding region is electrically connected to the electromagnetic shielding layer.

2. The electromagnetic shielding module according to claim 1, wherein The package shell is bonded to the substrate by an insulating adhesive; the electromagnetic shielding module further includes at least one grounding wire, and the grounding wire is electrically connected to the grounding region and the electromagnetic shielding layer on the side of the package shell close to the chip component.

3. The electromagnetic shielding module according to claim 2, wherein Both ends of the grounding wire are electrically connected to the same grounding region, or both ends of the grounding wire are respectively electrically connected to different grounding regions; The portion between both ends of the grounding wire contacts the electromagnetic shielding layer, so that the grounding wire electrically connects the electromagnetic shielding layer and the grounding region.

4. The electromagnetic shielding module according to claim 2, wherein, The electromagnetic shielding layer on the side of the package shell close to the chip component includes one or more contact portions in contact with the grounding wire; The contact portion is located on the top wall or the side wall of the electromagnetic shielding layer.

5. The electromagnetic shielding module according to claim 4, wherein, The grounding wire and the contact portion are adhesively connected by a conductive adhesive.

6. The electromagnetic shielding module according to claim 2, wherein, The chip component includes a first chip and a second chip distributed along a first direction; the first chip includes a light-emitting region for outputting emitted light, and the second chip includes a light-receiving region for receiving the reflected light of the emitted light; the projection of the grounding wire on the substrate is outside the projection regions of the light-emitting region and the light-receiving region on the substrate.

7. The electromagnetic shielding module according to claim 6, characterized in that, The two grounding regions are respectively located on both sides of the chip component in a second direction; wherein, the second direction intersects with the first direction; The package shell further includes an emission hole, a reception hole, and a convex structure; The emission hole is located at the light-emitting position of the first chip; the reception hole is located at the light-receiving position of the second chip; The convex structure is located between the emission hole and the reception hole and extends along the second direction; the convex structure is used for optically isolating the emitted light and the reflected light; At least a part of the grounding wire is fixed between the convex structure and the second chip.

8. The electromagnetic shielding module according to claim 1, wherein The package shell is bonded to the substrate by an insulating adhesive; at least a part of the grounding region is located on the surface of the substrate outside the package shell; The electromagnetic shielding layer on the side of the package shell away from the chip component is electrically connected to the grounding region.

9. The electromagnetic shielding module according to claim 1, wherein, The package shell is bonded to the substrate by an insulating adhesive and a conductive adhesive; at least a part of the grounding region is located on the surface of the substrate inside the package shell; The electromagnetic shielding layer on the side of the package shell close to the chip component is electrically connected to the grounding region through the conductive adhesive.

10. An electronic device, characterized in that, Comprising the electromagnetic shielding module according to any one of claims 1 to 9.

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