Crystal oscillator assembly with high anti-seismic performance

Abstract

A packaging plate is arranged in the middle of an oscillation circuit board, mounting holes are formed in the packaging plate, crystal oscillators are fixedly arranged at the upper end of the packaging plate at intervals, damping claws are arranged on the crystal oscillators in a covering mode, supporting legs are fixedly connected with the oscillation circuit board, non-metallized holes are formed in the two sides of the supporting legs, and the supporting legs are fixedly connected with the oscillation circuit board. The non-metallized holes are uniformly distributed on the periphery of the crystal oscillator in pairs, and the opposite groups of non-metallized holes are connected with each other through the brocade silk threads to complete cross-shaped binding of the crystal oscillator, so that stress can be uniformly distributed, damage to the crystal oscillator caused by local stress concentration is avoided, and the service life of the crystal oscillator is prolonged. The crystal oscillator can be accurately installed at a specific position, and normal function exertion is ensured; the plated-through holes are formed in the two sides of the crystal oscillator at intervals, and the plated-through holes and the mounting holes are connected through the conductive leads, so that the influence of external vibration and impact on the crystal oscillator can be reduced to the greatest extent, and the working stability and reliability of the crystal oscillator are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal oscillators, and particularly relates to a crystal oscillator assembly with high anti-seismic performance. Background Art

[0002] A crystal oscillator, abbreviated as crystal, adopts special packaging materials and structural designs, adds materials with buffering performance inside the crystal chip, and firmly installs the crystal element inside the chip through precise fixing methods. At the same time, a balance sphere is designed to help the crystal oscillator maintain balance in a vibrating environment, so as to achieve the anti-seismic performance of the chip.

[0003] With the development of technology, various crystal oscillators with anti-seismic performance have been manufactured. However, during the operation of the crystal oscillator, due to the influence of high-frequency and high-amplitude vibrations and huge impact forces, the phenomenon of instability of the crystal oscillator still occurs.

[0004] Therefore, there is an urgent need to design a crystal oscillator assembly with high anti-seismic performance, which improves the stability of the crystal oscillator while ensuring the accuracy of the installation of the crystal oscillator, and becomes the direction of further improvement. Summary of the Utility Model

[0005] To solve the above technical problems, the utility model provides a crystal oscillator assembly with high anti-seismic performance.

[0006] The utility model provides the following technical solutions: A crystal oscillator assembly with high anti-seismic performance includes an oscillation circuit board, a crystal oscillator, shock-absorbing claw clips, non-metallized holes, and metallized holes. A packaging board is provided in the middle of the oscillation circuit board. Installation holes are opened on the packaging board. The crystal oscillator is fixedly arranged at intervals on the upper end of the packaging board. A shock-absorbing claw clip is covered on the crystal oscillator. Support feet are arranged at the bottom of the shock-absorbing claw clip, and the support feet are fixedly connected to the oscillation circuit board. Non-metallized holes are opened on both sides of the support feet. The non-metallized holes are evenly arranged in groups of two around the periphery of the crystal oscillator. The two opposite groups of non-metallized holes are connected to each other by brocade silk threads to complete a "cross" type lashing of the crystal oscillator. Metallized holes are arranged at intervals on both sides of the crystal oscillator, and the metallized holes are connected to the installation holes through conductive leads.

[0007] Preferably, a first silica gel sheet is filled between the bottom of the crystal oscillator and the oscillation circuit board.

[0008] Preferably, crystal oscillator pins are arranged at the bottom of the crystal oscillator, and pin pins are arranged on the oscillation circuit board. The crystal oscillator pins pass through the first silica gel sheet and are inserted into the pin pins for fixation.

[0009] Preferably, a second silica gel sheet is filled at intervals between the shock-absorbing claw clip and the crystal oscillator.

[0010] Preferably, a crystal oscillator circuit is provided on the oscillating circuit board, and the crystal oscillator circuit is connected in series with the crystal oscillator.

[0011] Preferably, the distance between the side of the crystal oscillator and the metallized hole is 10 mm.

[0012] Preferably, screw holes are provided on both the oscillating circuit board and the support leg, and a cross-recessed pan head screw is screwed into the screw hole to fix the oscillating circuit board and the support leg.

[0013] Preferably, a flat washer is provided between the bottom of the oscillating circuit board and the cross-recessed pan head screw.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] (1) In the present utility model, a packaging board is provided in the middle of the oscillating circuit board, mounting holes are provided on the packaging board, a crystal oscillator is fixedly arranged at intervals on the upper end of the packaging board, a damping claw clip is covered on the crystal oscillator, support legs are provided at the bottom of the damping claw clip, the support legs are fixedly connected with the oscillating circuit board, non-metallized holes are provided on both sides of the support legs, two non-metallized holes in a group are uniformly arranged around the crystal oscillator, and the two opposite groups of non-metallized holes are connected to each other by brocade silk threads to complete a "cross"-shaped binding of the crystal oscillator, which helps to evenly distribute stress, avoid damage to the crystal oscillator caused by local stress concentration, ensure the accurate installation of the crystal oscillator at a specific position, and ensure the normal function of the crystal oscillator.

[0016] (2) In the present utility model, metallized holes are provided at intervals on both sides of the crystal oscillator, and the metallized holes and the mounting holes are connected by conductive leads. Connecting the metallized holes and the mounting holes by conductive leads can minimize the influence of external vibration and impact on the crystal oscillator, and improve the working stability and reliability of the crystal oscillator.

[0017] (3) In the present utility model, a first silica gel sheet is filled between the bottom of the crystal oscillator and the oscillating circuit board, and a second silica gel sheet is filled at intervals between the damping claw clip and the crystal oscillator, which can better adapt to the possible structural deformation of the crystal oscillator in different environments, reduce the risk of crystal oscillator damage caused by structural changes, give the crystal oscillator a stable support, and enhance the overall structural strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a top view of the present utility model;

[0019] Figure 2 is a Figure 1 cross-sectional view of the present utility model;

[0020] Figure 3This is the bottom view of the oscillation circuit board of the present utility model. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0022] As Figures 1 to 3 shown, a crystal oscillator assembly with high seismic resistance performance includes an oscillation circuit board 1, a crystal oscillator 2, a damping claw clip 3, a non-metallized hole 4, a metallized hole 5, a mounting hole 6, a support leg 7, a brocade silk thread 8, a conductive lead 9, a first silicone sheet 10, a crystal oscillator pin 11, a pin 12, a second silicone sheet 13, a crystal oscillator circuit 14, a screw hole 15, a cross-recessed pan head screw 16, a flat washer 17, and a packaging board 18.

[0023] In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] As Figures 1 to 3 shown, a mounting hole 6 is provided in the middle of the oscillation circuit board 1, and the packaging board 18 is used to locate the installation position of the crystal oscillator 2 on the oscillation circuit board 1. A mounting hole 6 is provided on the packaging board 18, and the crystal oscillator 2 is fixedly provided at intervals at the upper end of the packaging board 18. A crystal oscillator circuit 14 is provided on the oscillation circuit board 1, and the crystal oscillator circuit 14 is connected in series with the crystal oscillator 2.

[0026] A shock-absorbing claw clip 3 is provided on the upper part of the crystal oscillator 2. The bottom of the shock-absorbing claw clip 3 is provided with support feet 7, and the support feet 7 are fixedly connected to the oscillation circuit board 1. Specifically, screw holes 15 are provided on both the oscillation circuit board 1 and the support feet 7, and a cross-recessed pan head screw 16 is screwed into the screw hole 15 to fix the oscillation circuit board 1 and the support feet 7. And a flat washer 17 is provided between the bottom of the oscillation circuit board 1 and the cross-recessed pan head screw 16.

[0027] Non-metallized holes 4 are provided on both sides of the support feet 7. Two non-metallized holes 4 in a group are evenly distributed around the periphery of the crystal oscillator 2. The two opposite groups of non-metallized holes 4 are connected to each other by brocade silk threads 8 to complete a "cross"-shaped binding of the crystal oscillator 2. As Figure 1 shown, the two opposite groups of non-metallized holes 4 refer to the two groups arranged at the upper and lower ends of the crystal oscillator 2 and the two groups arranged on the left and right sides. The binding of the brocade silk thread 8 to the crystal oscillator 2 is along the inside of the shock-absorbing claw clip 3. The "cross"-shaped binding helps to evenly distribute the stress, avoid damage to the crystal oscillator 2 caused by local stress concentration, ensure the accurate installation of the crystal oscillator 2 at a specific position, and ensure the normal functioning of its functions.

[0028] Metalized holes 5 are provided at intervals on both sides of the crystal oscillator 2. The distance between the side of the crystal oscillator 2 and the metalized holes 5 is 10 mm. The metalized holes 5 and the mounting holes 6 are connected by conductive leads 9. Connecting the metalized holes 5 and the mounting holes 6 through the conductive leads 9 can minimize the influence of external vibration and impact on the crystal oscillator 2, improve the working stability and reliability of the crystal oscillator 2, and achieve the effect of high seismic resistance.

[0029] In this embodiment, a first silica gel sheet 10 is filled between the bottom of the crystal oscillator 2 and the oscillation circuit board 1, and a second silica gel sheet 13 is filled at intervals between the shock-absorbing claw clip 3 and the crystal oscillator 2, so that the device can better adapt to the possible structural deformation of the crystal oscillator 2 in different environments, reduce the risk of crystal oscillator damage caused by structural changes, give the crystal oscillator 2 a stable support, and enhance the overall structural strength of the assembly.

[0030] The bottom of the crystal oscillator 2 is provided with crystal oscillator pins 11, and the oscillation circuit board 1 is provided with pin pins 12. The crystal oscillator pins 11 pass through the first silica gel sheet 10 and are inserted into the pin pins 12 for fixation.

[0031] The above embodiments are only the preferred embodiments of the present invention and cannot be used to limit the scope of the rights of the present invention. Therefore, modifications, equivalent changes, improvements, etc. made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A crystal oscillator assembly with high shock resistance, characterized by: The invention comprises an oscillating circuit board (1), a crystal oscillator (2), a shock-absorbing claw clamp (3), a non-metalized hole (4) and a metalized hole (5); a packaging board (18) is provided in the middle of the oscillating circuit board (1); a mounting hole (6) is provided on the packaging board (18); a crystal oscillator (2) is fixedly provided at an interval on the upper end of the packaging board (18); a shock-absorbing claw clamp (3) is provided on the upper cover of the crystal oscillator (2); a support foot (7) is provided at the bottom of the shock-absorbing claw clamp (3); the support foot (7) is connected to the oscillating circuit board ( 1) Fixed connection, non-metallized holes (4) are provided on both sides of the support leg (7), and the non-metallized holes (4) are evenly distributed in groups of two around the four sides of the crystal oscillator (2), and the two opposite groups of non-metallized holes (4) are connected to each other by a silk thread (8) to complete the "cross" binding of the crystal oscillator (2); metallized holes (5) are provided on both sides of the crystal oscillator (2) at intervals, and the metallized holes (5) and the mounting holes (6) are connected by conductive leads (9).

2. The crystal oscillator assembly with high shock resistance according to claim 1, characterized in that: A first silicone sheet (10) is filled between the bottom of the crystal oscillator (2) and the oscillation circuit board (1).

3. The crystal oscillator assembly with high seismic performance according to claim 2, characterized in that: The bottom of the crystal oscillator (2) is provided with a crystal oscillator pin (11), the oscillation circuit board (1) is provided with a plug pin (12), and the crystal oscillator pin (11) passes through the first silicone sheet (10) and is inserted into the plug pin (12) to be fixed.

4. A crystal oscillator assembly with high seismic performance according to claim 3, characterized in that: The interval between the shock-absorbing claw clamp (3) and the crystal oscillator (2) is filled with a second silicone sheet (13).

5. A crystal oscillator assembly with high shock resistance according to claim 3 or 4, characterized in that: A crystal oscillator circuit (14) is provided on the oscillation circuit board (1), and the crystal oscillator circuit (14) is connected in series with the crystal oscillator (2).

6. The crystal oscillator assembly with high seismic performance according to claim 5, characterized in that: The distance between the side of the crystal oscillator (2) and the metallized hole (5) is 10 mm.

7. A crystal oscillator assembly with high seismic performance according to claim 6, characterized in that: The oscillating circuit board (1) and the supporting foot (7) are both provided with screw holes (15), and cross pan head screws (16) are screwed into the screw holes (15) to fix the oscillating circuit board (1) and the supporting foot (7).

8. The crystal oscillator assembly with high seismic performance according to claim 7, characterized in that: A flat washer (17) is provided between the bottom of the oscillation circuit board (1) and the cross pan head screw (16).

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