Rigid-flex multilayer circuit board

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By pasting thermal glue pads on the surface of the FPC board and setting heat dissipation fins, PCB board assists in heat dissipation, the problem of poor heat dissipation performance of the FPC board is solved, and more efficient heat transfer and heat dissipation effect is achieved.

CN223168468UActive Publication Date: 2025-07-29SHENZHEN SHIBOTONG TECH CO LTD

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Patent Information

Application Number: CN202422262191.0
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-09-14
Publication Date: 2025-07-29
Estimated Expiration: 2034-09-14

AI Technical Summary

Technical Problem

The heat dissipation performance of FPC boards is poor, which makes it difficult for heat to dissipate quickly, affecting the heat dissipation effect of electronic devices.

Method used

Stick the thermal glue pad on the surface of the FPC board, and heat dissipation fins are installed on the thermal glue pad. One end of the thermal glue pad extends to the blank space of the PCB board, and use the PCB board to assist in heat dissipation, reduce contact thermal resistance, and improve heat transfer efficiency.

Benefits of technology

Through the design of thermal glue pads and heat dissipation fins, the heat dissipation performance of the FPC board is significantly improved, the heat dissipation area is increased, and the problem of insufficient heat dissipation of the FPC board is solved.

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Abstract

The utility model provides a rigid-flex multilayer circuit board, which comprises a first PCB (printed circuit board), positioning holes and contacts, the first PCB is provided with a plurality of positioning holes and a plurality of contacts, FPC (flexible printed circuit) boards are attached to the contacts on the first PCB, and the end parts of the FPC boards are fixedly connected with joints. Compared with the prior art, the FPC board has the advantages that common problems during application of the FPC board are solved, a layer of heat conduction rubber mat is pasted on the surface of the FPC board, one end of the heat conduction rubber mat extends to the blank of the first PCB, the heat conduction rubber mat is made of silica gel materials, part of heat of the FPC board can be conducted to the first PCB, the first PCB is used for assisting heat dissipation, contact thermal resistance can be reduced, heat transfer efficiency is improved, and the service life of the FPC board is prolonged. And due to the design of a plurality of heat dissipation fins on the heat conduction rubber mat, the heat dissipation area of the FPC board is increased, the heat dissipation performance of the FPC board is effectively improved, and the problems existing in the prior art are effectively solved.

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Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a rigid-flexible multi-layer circuit board. Background Art

[0002] A rigid-flexible circuit board is a new type of circuit board that combines the characteristics of a rigid circuit board (PCB) and a flexible circuit board (FPC). The rigid-flexible circuit board is formed by combining a flexible circuit board and a rigid circuit board through processes such as lamination and assembling them together according to relevant process requirements. It combines the flexibility and bendability of the FPC, as well as the rigidity and stability of the PCB.

[0003] In a rigid-flexible circuit board, the FPC board has a common problem of poor heat dissipation performance. The reason is that the FPC has relatively poor thermal conductivity. This means that when an electronic device is working, the heat on the FPC is difficult to quickly dissipate to the surrounding environment through its own materials. Although the copper foil circuit and holes are good conductors of heat, in the FPC, the remaining rate of the copper foil and the number of heat conduction holes may be limited by the design and manufacturing processes, resulting in insufficient heat dissipation area of the FPC board. Summary of the Utility Model

[0004] The purpose of the utility model aims to solve at least one of the technical defects.

[0005] For this reason, an object of the utility model is to provide a rigid-flexible multi-layer circuit board to solve the problems mentioned in the background art and overcome the deficiencies in the prior art.

[0006] To achieve the above object, an embodiment of one aspect of the utility model provides a rigid-flexible multi-layer circuit board, including a first PCB board, positioning holes, and contacts. A plurality of positioning holes are opened on the first PCB board, and a plurality of contacts are arranged on the first PCB board;

[0007] An FPC board is attached to the contacts on the first PCB board, and a joint is fixedly connected to the end of the FPC board;

[0008] A second PCB board is fixedly connected to one side of the joint;

[0009] A heat-conducting gasket is fixedly connected to the blank part of the first PCB board, and the bottom surface of the heat-conducting gasket is attached to the top surface of the FPC board;

[0010] A plurality of heat dissipation fins are fixedly connected to the part of the heat-conducting gasket above the FPC board.

[0011] Preferably, at least two positioning holes are opened, and the positioning holes penetrate the first PCB board.

[0012] Adopting the above technical solution: This multi-layer circuit board consists of two PCB boards and a single FPC board, with a total of three layers, of which the FPC board is a flexible board, that is, a soft board, and the PCB board is a hard board.

[0013] Preferably, any of the above solutions is that the contacts are arranged in a row, and the base material of the FPC board is polyimide.

[0014] Preferably, from any of the above solutions, the FPC board is a flexible board, and the joints of the FPC board are bonded to the contacts of the first PCB board by adhesive.

[0015] The connection relationship between the FPC board and the first PCB board is that the end surface contact portion of the FPC board is attached to the contact point of the first PCB board and then glued;

[0016] The connection relationship between the FPC board and the second PCB board is that the connectors of the FPC board and the second PCB board are directly connected.

[0017] Rigid-flex PCBs enable high-density component assembly and complex wiring designs, helping to implement more circuit designs within limited space, increasing device integration and reducing size. By combining flexible and rigid PCBs, rigid-flex PCBs offer more functionality and connection points without increasing overall size, thus saving internal product space. Rigid-flex PCBs share the bendability and foldability of flexible PCBs, adapting to a variety of complex spatial structures and custom designs.

[0018] Preferably, any of the above solutions is that the base material of the second PCB board is a copper clad board, the material of the thermal conductive pad is silica gel, and the thermal conductive pad is soft.

[0019] Using the above technical solution, the core structure of this device consists of an FPC board, a thermally conductive adhesive pad, and heat sink fins. The core advantage of this device is that, to improve the heat dissipation performance of the FPC board and address common issues with FPC board applications, a layer of thermally conductive adhesive pad is affixed to the surface of the FPC board. One end of the thermally conductive adhesive pad extends to a blank area of the first PCB board. The thermally conductive adhesive pad is made of silicone and can transfer some of the heat from the FPC board to the first PCB board. This assists heat dissipation by using the first PCB board, reducing contact thermal resistance and increasing heat transfer efficiency, thereby enhancing the heat dissipation effect of the FPC board.

[0020] At the same time, the design of numerous heat dissipation fins on the thermal conductive pad increases the heat dissipation area of the FPC board, effectively improves its heat dissipation performance, and effectively solves the problems existing in the existing technology.

[0021] Preferably, any of the above solutions is that the thermally conductive adhesive pad is bonded to the top surface of the first PCB board, and the thermally conductive adhesive pad is bonded to the top surface of the FPC board.

[0022] Preferably, according to any of the above solutions, the heat dissipation fins are obliquely designed and linearly arrayed on the top surface of the FPC board.

[0023] Compared with the prior art, the advantages and beneficial effects of the present utility model are as follows:

[0024] 1. For this flexible-rigid multi-layer circuit board, through the cooperative arrangement of the FPC board, the thermal conductive gasket, and the heat dissipation fins, in order to improve the heat dissipation performance of the FPC board and solve the common problems in the application of the FPC board, a layer of thermal conductive gasket is pasted on the surface of the FPC board. One end of the thermal conductive gasket extends to the blank area of the first PCB board. The thermal conductive gasket is made of silica gel material, which can conduct part of the heat of the FPC board to the first PCB board, and with the assistance of the first PCB board for heat dissipation, the contact thermal resistance can be reduced, the heat transfer efficiency can be improved, and thus the heat dissipation effect of the FPC board can be improved.

[0025] 2. For this flexible-rigid multi-layer circuit board, the design of numerous heat dissipation fins on the thermal conductive gasket increases the heat dissipation area of the FPC board, effectively improves its heat dissipation performance, and effectively solves the problems existing in the prior art.

[0026] Additional aspects and advantages of the present utility model will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0027] The above and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0028] Figure 1 is a schematic structural diagram of the first perspective of the present utility model;

[0029] Figure 2 is a schematic structural diagram of the second perspective of the present utility model;

[0030] Figure 3 is a schematic structural diagram of the first PCB board of the present utility model;

[0031] Figure 4 is a schematic structural diagram of the FPC board of the present utility model.

[0032] In the figure: 1 - first PCB board, 2 - positioning hole, 3 - contact, 4 - FPC board, 5 - connector, 6 - second PCB board, 7 - thermal conductive gasket, 8 - heat dissipation fin. Detailed Embodiments

[0033] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation of the present utility model.

[0034] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0035] As Figures 1-4 shown, the present multi-layer circuit board combining hard and soft includes a first PCB board 1, positioning holes 2, and contacts 3. A plurality of positioning holes 2 are provided on the first PCB board 1, and a plurality of contacts 3 are provided on the first PCB board 1;

[0036] A FPC board 4 is attached to the contact 3 on the first PCB board 1, and a connector 5 is fixedly connected to the end of the FPC board 4;

[0037] A second PCB board 6 is fixedly connected to one side of the connector 5;

[0038] A heat-conducting gasket 7 is fixedly connected to the blank part of the first PCB board 1, and the bottom surface of the heat-conducting gasket 7 is attached to the top surface of the FPC board 4;

[0039] A plurality of heat dissipation fins 8 are fixedly connected to the part of the heat-conducting gasket 7 located above the FPC board 4. This multi-layer circuit board is composed of two PCB boards and a single FPC board 4, totaling three layers. Among them, the FPC board 4 is a flexible board, that is, a soft board, and the PCB board is a hard board. The contacts 3 are arranged in a row, and the base material of the FPC board 4 is polyimide. The FPC board 4 is flexible, and the connection part of the FPC board 4 and the contact 3 of the first PCB board 1 is bonded with glue. For the connection relationship between the FPC board 4 and the first PCB board 1, the contact part of the end face of the FPC board 4 is attached to the contact of the first PCB board 1, and then bonded with glue;

[0040] For the connection relationship between the FPC board 4 and the second PCB board 6, the FPC board 4 is directly connected to the connector 5 of the second PCB board 6.

[0041] Embodiment 1: The base material of the second PCB board 6 is a copper clad laminate, the material of the thermal conductive gasket 7 is silica gel, and the thermal conductive gasket 7 is flexible. In order to improve the heat dissipation performance of the FPC board 4 and solve the common problems in the application of the FPC board 4, a layer of thermal conductive gasket 7 is pasted on the surface of the FPC board 4. One end of the thermal conductive gasket 7 extends to the blank area of the first PCB board 1. The thermal conductive gasket 7 is made of silica gel, which can conduct part of the heat of the FPC board 4 to the first PCB board 1. With the assistance of the first PCB board 1 for heat dissipation, the contact thermal resistance can be reduced, the heat transfer efficiency can be improved, and thus the heat dissipation effect of the FPC board 4 can be improved. The thermal conductive gasket 7 is bonded to the top surface of the first PCB board 1 and the thermal conductive gasket 7 is bonded to the top surface of the FPC board 4.

[0042] Embodiment 2: The heat dissipation fins 8 are obliquely designed, and the heat dissipation fins 8 are linearly arrayed on the top surface of the FPC board 4. The design of numerous heat dissipation fins 8 on the thermal conductive gasket 7 increases the heat dissipation area of the FPC board 4, effectively improves its heat dissipation performance, and effectively solves the problems existing in the prior art.

[0043] The working principle of the present utility model is as follows:

[0044] This multi-layer circuit board is composed of two PCB boards and a single FPC board 4, with a total of three layers. Among them, the FPC board 4 is a flexible board, that is, a flexible board, and the PCB board is a rigid board;

[0045] The connection relationship between the FPC board 4 and the first PCB board 1 is that the end contact part of the FPC board 4 is attached to the contact point of the first PCB board 1, and then bonded with glue;

[0046] The connection relationship between the FPC board 4 and the second PCB board 6 is that the FPC board 4 is directly connected to the joint 5 of the second PCB board 6;

[0047] The rigid-flex printed circuit board can achieve high-density component assembly and complex wiring design, which helps to implement more circuit designs in a limited space, improve the integration of the device and reduce the volume. By combining the flexible circuit board and the rigid circuit board, the rigid-flex printed circuit board can provide more functions and connection points without increasing the overall size, thus saving the internal space of the product. The rigid-flex printed circuit board has the flexibility and foldability of the flexible circuit board and can adapt to various complex space structures and special-shaped design requirements; a layer of thermal conductive gasket 7 is pasted on the surface of the FPC board 4. One end of the thermal conductive gasket 7 extends to the blank area of the first PCB board 1. The thermal conductive gasket 7 is made of silica gel, which can conduct part of the heat of the FPC board 4 to the first PCB board 1. With the assistance of the first PCB board 1 for heat dissipation, the contact thermal resistance can be reduced, the heat transfer efficiency can be improved, and the design of numerous heat dissipation fins 8 on the thermal conductive gasket 7 increases the heat dissipation area of the FPC board 4, effectively improving its heat dissipation performance.

[0048] Compared with the prior art, the utility model has the following beneficial effects relative to the prior art:

[0049] 1. For this multi-layer rigid-flex printed circuit board, through the cooperative setting of the FPC board 4, the thermal conductive gasket 7, and the heat dissipation fins 8, in order to improve the heat dissipation performance of the FPC board 4 and solve the common problems in the application of the FPC board 4, a layer of thermal conductive gasket 7 is pasted on the surface of the FPC board 4. One end of the thermal conductive gasket 7 extends to the blank area of the first PCB board 1. The thermal conductive gasket 7 is made of silica gel and can conduct part of the heat of the FPC board 4 to the first PCB board 1. With the help of the first PCB board 1 to assist in heat dissipation, the contact thermal resistance can be reduced, the heat transfer efficiency can be improved, and thus the heat dissipation effect of the FPC board 4 can be improved.

[0050] 2. For this multi-layer rigid-flex printed circuit board, the design of numerous heat dissipation fins 8 on the thermal conductive gasket 7 increases the heat dissipation area of the FPC board 4, effectively improves its heat dissipation performance, and effectively solves the problems existing in the prior art.

Claims

1. A rigid-flex multi-layer printed circuit board, characterized in that, It includes a first PCB board (1), positioning holes (2), and contacts (3). A number of positioning holes (2) are provided on the first PCB board (1), and a number of contacts (3) are arranged on the first PCB board (1). An FPC board (4) is attached to the contact (3) on the first PCB board (1), and a connector (5) is fixedly connected to the end of the FPC board (4). A second PCB board (6) is fixedly connected to one side of the connector (5). A heat-conducting gasket (7) is fixedly connected to the blank area of the first PCB board (1), and the bottom surface of the heat-conducting gasket (7) is attached to the top surface of the FPC board (4). A number of heat-dissipating fins (8) are fixedly connected to the part of the heat-conducting gasket (7) above the FPC board (4).

2. The multi-layer rigid-flex printed circuit board according to claim 1, wherein: At least two positioning holes (2) are provided, and the positioning holes (2) penetrate through the first PCB board (1).

3. The flexible-rigid multi-layer printed circuit board according to claim 2, wherein: The contacts (3) are arranged in a row, and the base material of the FPC board (4) is polyimide.

4. The flexible-rigid multi-layer printed circuit board according to claim 3, wherein: The FPC board (4) is a flexible board, and the joint of the FPC board (4) and the contact (3) on the first PCB board (1) is bonded with glue.

5. The flexible-rigid multi-layer printed circuit board according to claim 4, wherein: The base material of the second PCB board (6) is a copper-clad laminate, the material of the heat-conducting gasket (7) is silica gel, and the heat-conducting gasket (7) is soft.

6. The multi-layer rigid-flex printed circuit board according to claim 5, wherein: The heat-conducting gasket (7) is bonded to the top surface of the first PCB board (1), and the heat-conducting gasket (7) is bonded to the top surface of the FPC board (4).

7. The flexible-rigid multi-layer printed circuit board according to claim 6, wherein: The heat-dissipating fins (8) are obliquely designed, and the heat-dissipating fins (8) are linearly arrayed on the top surface of the FPC board (4).