Anti-warping pressing plate and substrate processing device

Abstract

The embodiment of the utility model discloses an anti-upwarp pressing plate and a substrate processing device, the anti-upwarp pressing plate comprises a pressing plate body, the lower side of the pressing plate body is provided with a pressing strip and an elastic abutting piece, and the lowest height of the elastic abutting piece is lower than the lowest height of the pressing strip. According to the anti-warping pressing plate, the elastic abutting piece is arranged on the lower side of the pressing plate body, so that when the pressing plate body is pressed downwards, the elastic abutting piece can firstly make contact with the base plate, and the elastic force to the base plate is gradually increased until the pressing strip is completely pressed on the upper side of the base plate, a cavity generated between the base plate and a vacuum adsorption plate is effectively reduced or avoided, and the pressing plate is prevented from warping. Therefore, the substrate is enabled to be stably and tightly adsorbed on the vacuum adsorption plate, and the processing precision and efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic device manufacturing, in particular to an anti-warping pressing plate and a substrate processing device. Background Art

[0002] With the development of modern electronic devices towards miniaturization and portability, the components integrated on the PCB are increasing continuously, and the internal space is becoming increasingly crowded. To meet the demand for large-capacity storage, the capacity of storage particles gradually becomes the mainstream with TB as the basic unit, and the chip stacking technology is widely adopted to save the horizontal space. However, with the increase of the stacking layers, the thickness of the packaging material is continuously thinned. Especially for the packaging substrate, the significant reduction in its thickness leads to a significant decrease in the bending resistance, and it is easy to bend and warp during the processing. This trend not only reduces the overall packaging height but also brings new challenges in the process, especially during the WB (welding process).

[0003] During the WB process, as Figure 1 shown, due to the height difference between the workbench track and the vacuum adsorption plate, the substrate bends and sags greatly between the workbench tracks. As Figure 2 shown, after the pressing plate is pressed, it is easy to form a cavity between the substrate and the vacuum adsorption plate, resulting in ineffective vacuum adsorption, which will have an adverse impact on the safety of the product and wire bonding. Summary of the Utility Model

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide an anti-warping pressing plate and a substrate processing device to solve the drawbacks that in the existing WB process, due to the height difference between the workbench track and the vacuum adsorption plate, the substrate bends and sags greatly between the workbench tracks, and after the pressing plate is pressed, it is easy to form a cavity between the substrate and the vacuum adsorption plate, resulting in ineffective vacuum adsorption, which will have an adverse impact on the safety of the product and wire bonding.

[0005] To achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An embodiment of the utility model provides an anti-warping pressing plate, which includes: a pressing plate body, a pressing strip and an elastic abutting member are arranged on the lower side of the pressing plate body, and the lowest height of the elastic abutting member is lower than the lowest height of the pressing strip.

[0007] As a preferred technical solution of the utility model, at least two elastic abutting members are provided.

[0008] As a preferred technical solution of the utility model, the elastic abutting member is a spring piece.

[0009] As a preferred technical solution of the utility model, the elastic abutting members are uniformly arranged in the first direction.

[0010] As a preferred technical solution of the present utility model, the elastic abutting member includes: a first connecting portion and a bending portion. A through hole for passing through the bending portion is provided on the pressing plate body. The first connecting portion is detachably connected to the upper side surface of the pressing plate body, and the bending portion extends downward through the through hole to the lower side of the pressing plate body.

[0011] As a preferred technical solution of the present utility model, at one end of the pressing plate body along the first direction, an elastic flow guiding member is further provided, and the lowest height of the elastic flow guiding member is lower than the height of the lower side surface of the pressing plate body.

[0012] As a preferred technical solution of the present utility model, the elastic flow guiding members are uniformly arranged along the second direction at one end of the pressing plate body along the first direction, and the second direction is perpendicular to the first direction.

[0013] As a preferred technical solution of the present utility model, the elastic flow guiding member includes: a second connecting portion and a curling portion. The second connecting portion is detachably connected to the upper side surface of the pressing plate body. One end of the curling portion is connected to the second connecting portion, and the other end curls inward, and the height of the middle curling portion is lower than the lower side surface of the pressing plate body.

[0014] An embodiment of the present utility model further provides a substrate processing device, which includes the anti-warping pressing plate as described above, and further includes a workbench track, a substrate, and a vacuum adsorption plate. The two side edges of the substrate are slidably connected to the workbench track. The anti-warping pressing plate is located above the substrate and is connected with a downward pressing driving device. The vacuum adsorption plate is located below the substrate and is connected with an upward driving device. The substrate moves along the first direction on the workbench track.

[0015] As a preferred technical solution of the present utility model, a material collecting frame is provided on the lower side of one end of the workbench track.

[0016] Compared with the prior art, for the anti-warping pressing plate of the present utility model, by providing an elastic abutting member on the lower side of the pressing plate body, when the pressing plate body is pressed downward, the elastic abutting member can first contact the substrate and gradually increase the elastic force on the substrate until the pressing strip is completely pressed on the upper side of the substrate, effectively reducing or avoiding the generation of cavities between the substrate and the vacuum adsorption plate, thereby ensuring that the substrate is stably and tightly adsorbed on the vacuum adsorption plate and improving the processing accuracy and efficiency.

[0017] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features and advantages of the present utility model more obvious and understandable, the following preferred embodiments are specifically given and described in detail as follows. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram when the pressing plate is not pressed down in the existing WB process;

[0020] Figure 2 It is a schematic structural diagram when the pressing plate is pressed down in the existing WB process;

[0021] Figure 3 It is the first three-dimensional view of an anti-warping pressing plate of the present utility model;

[0022] Figure 4 It is the second three-dimensional view of an anti-warping pressing plate of the present utility model;

[0023] Figure 5 It is the front view of an anti-warping pressing plate of the present utility model.

[0024] Explanation of the markings in the figure:

[0025] 10. Workbench track; 11. Vacuum adsorption plate; 12. Substrate; 13. Pressing plate; 14. Cavity;

[0026] 20. Anti-warping pressing plate; 21. Pressing plate body; 211. Wire bonding operation window; 22. Pressure bar; 23. Elastic abutting member; 231. First connecting portion; 232. Bending portion; 24. Elastic flow guiding member; 241. Second connecting portion; 242. Curling portion. Specific embodiments

[0027] In order to make the purpose, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the drawings and specific embodiments.

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0029] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is the orientation or positional relationship based on the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0030] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0031] In the present utility model, unless otherwise clearly defined and limited, the terms such as "mounted", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, it may be a connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.

[0033] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0034] In the WB process, as Figure 1 shown, due to the obvious drop between the workbench track 10 and the vacuum adsorption plate 11, this drop causes significant bending and sagging of the substrate 12 when it moves to the workbench track 10. This sagging not only affects the flatness of the substrate 12, but may also have an adverse impact on the subsequent processing process. As Figure 2 shown, when the pressing plate 13 presses the substrate 12, due to the aforementioned bending and sagging phenomenon, cavities 14 are easily formed between the substrate 12 and the vacuum adsorption plate 11. The existence of these cavities 14 makes the vacuum adsorption unable to achieve the expected effect, that is, it cannot effectively adsorb the substrate 12 tightly on the vacuum adsorption plate 11. This not only affects the stability and position accuracy of the substrate 12 during the processing process, but is more likely to have a serious adverse impact on the safety of the product and the wire bonding quality, thereby reducing the overall product quality and production efficiency. Therefore, the inventor has proposed the following improvement solutions through research, which will be described below.

[0035] An embodiment of the present utility model provides a substrate 12 processing device, which includes an anti-warping pressing plate 20, and also includes a workbench track 10, a substrate 12, and a vacuum adsorption plate 11. The two sides of the substrate 12 are slidably connected to the workbench track 10. The anti-warping pressing plate 20 is located above the substrate 12 and is connected with a downward pressing driving device. The vacuum adsorption plate 11 is located below the substrate 12 and is connected with a rising driving device. The substrate 12 moves along a first direction on the workbench track 10. Further, a receiving frame is provided on the lower side of one end of the workbench track 10.

[0036] In this embodiment, the anti-warping pressing plate 20 is located above the substrate 12. Its main function is to ensure that the substrate 12 remains flat during the processing, preventing the warping from affecting the processing accuracy. The anti-warping pressing plate 20 is connected to the downward pressing driving device. Through the control of the downward pressing driving device, the anti-warping pressing plate 20 can accurately adjust the pressure on the substrate 12 to ensure the tight fit between the substrate 12 and the vacuum adsorption plate 11. The vacuum adsorption plate 11 is located below the substrate 12. By connecting the rising driving device, the distance between the vacuum adsorption plate 11 and the substrate 12 can be accurately adjusted. During the processing, the vacuum adsorption plate 11 uses negative pressure to firmly adsorb the substrate 12 on its surface to ensure that the substrate 12 does not shift or shake during the processing. The workbench track 10 provides a stable and reliable moving platform for the substrate 12 to ensure that the substrate 12 can be transported along a predetermined path. A receiving frame is provided on the lower side of one end of the workbench track 10 for collecting the processed substrates 12, facilitating subsequent sorting and transportation. It should be explained that

[0037] Please refer to Figures 3 to 5 , the anti-warping pressing plate 20 includes: a pressing plate body 21. A pressing strip 22 and an elastic abutting member 23 are provided on the lower side of the pressing plate body 21. The lowest height of the elastic abutting member 23 is lower than the lowest height of the pressing strip 22.

[0038] In this embodiment, the pressing strip 22 is used to contact the substrate 12 and press the substrate 12 onto the vacuum adsorption plate 11. The elastic abutting member 23 is used to contact the substrate 12 to make the substrate 12 fit more tightly with the vacuum adsorption plate 11. When the pressing plate body 21 is pressed downward, the elastic abutting member 23 can first contact the substrate 12 and gradually increase the elastic force on the substrate 12 until the pressing strip 22 is completely pressed on the upper side of the substrate 12, effectively reducing or avoiding the generation of a cavity 14 between the substrate 12 and the vacuum adsorption plate 11.

[0039] Specifically, a wire bonding operation window 211 is opened on the pressing plate body 21. When the pressing plate body 21 presses the substrate 12 onto the vacuum adsorption plate 11, the upper surface of the substrate 12 can be wire-bonded through the wire bonding operation window 211.

[0040] Furthermore, the pressing strip 22 is arranged beside the wire bonding operation window 211 so that the substrate 12 in the area of the wire bonding operation window 211 is more closely attached to the vacuum adsorption plate 11 under the action of the pressing strip 22, facilitating the wire bonding operation. Preferably, the wire bonding operation window 211 is rectangular.

[0041] Further, there are at least two elastic abutting members 23. Optionally, the elastic abutting members 23 are evenly distributed on the lower side of the pressing plate body 21. It can be understood that, in order to ensure that the substrate 12 obtains more uniform and stable support during the pressing process, the number of elastic abutting members 23 provided on the anti-warping pressing plate 20 is designed to be at least two. These elastic abutting members 23 are evenly distributed on the lower side of the pressing plate body 21, and can come into contact with the substrate 12 first when the pressing plate body 21 is pressed down, and gradually apply elastic force until the pressing strip 22 is completely pressed on the upper side of the substrate 12. Through the combined action of multiple elastic abutting members 23, the cavity 14 between the substrate 12 and the vacuum adsorption plate 11 can be more effectively reduced, and the efficiency and stability of vacuum adsorption can be improved. This design not only improves the precision and efficiency of substrate 12 processing, but also helps to protect the substrate 12 from damage, ensuring the quality and reliability of the product.

[0042] Specifically, the elastic abutting member 23 is a spring piece. It can be understood that the elastic abutting member 23 has other options, such as a spring. Here, the elastic abutting member 23 is selected because the spring piece, as a commonly used elastic element, has excellent elasticity and recovery. It can deform when subjected to an external force and quickly return to its original state after the external force disappears. Moreover, the spring piece can be customized according to the size and shape of different substrates 12 to meet different processing requirements.

[0043] Further, in order to ensure that the substrate 12 obtains more uniform and stable support during the pressing process, the elastic abutting members 23 are evenly arranged in the first direction. This uniform arrangement method can ensure that when the pressing plate body 21 is pressed down, the pressure distribution in contact with the substrate 12 is more balanced, thus avoiding the situation where the substrate 12 is subjected to too much or too little local force.

[0044] Specifically, the elastic abutting member 23 includes: a first connecting portion 231 and a bending portion 232. The pressing plate body 21 is provided with a through hole for passing through the bending portion 232. The first connecting portion 231 is detachably connected to the upper side surface of the pressing plate body 21, and the bending portion 232 extends downward through the through hole to the lower side of the pressing plate body 21. It can be understood that the first connecting portion 231 is used to connect the elastic abutting member 23 to the pressing plate body 21, and the first connecting portion 231 is detachably connected to the upper side surface of the pressing plate body 21, which means that the elastic abutting member 23 can be conveniently installed or disassembled as needed. When the pressing plate body 21 is pressed down close to the substrate 12, due to the existence of the bending portion 232, the lowest point of the elastic abutting member 23, usually the end of the bending portion 232, will come into contact with the substrate 12 first. Optionally, the first connecting portion 231 can be detachably connected to the upper side of the pressing plate body 21 by screws or buckles.

[0045] It should be noted that generally, the design of the workbench track 10 is to ensure that the substrate 12 can move smoothly from one processing station to another until it finally slides out from the blanking end. However, in the existing design, the blanking end of the workbench track 10 is located below the pressing plate 13, which may cause some problems in actual operation. When the substrate 12 undergoes high and low temperature cycles during the welding process, internal stresses will be generated. These stresses may be due to the characteristics of thermal expansion and contraction of the material, or the different thermal expansion coefficients of different materials during the welding process. When the substrate 12 slides out from the blanking end of the workbench track 10, due to the release of internal stresses in the substrate 12, especially if the edge part of the substrate 12 has been unevenly heated or cooled during the welding process, the sliding-out end often warps upward due to the action of internal stresses. At this time, if the blanking end is located below the pressing plate 13, the warped edge of the substrate 12 is likely to rub against the lower side of the pressing plate 13. Such rubbing may not only cause scratches or damage to the surface of the substrate 12, but more importantly, it may directly damage the bonding wires on the substrate 12, affecting the performance and quality of the entire product. Therefore, in order to avoid this situation, the inventor has proposed the following improvement solutions through research, which will be described below.

[0046] In another embodiment, an elastic guiding member 24 is further provided at one end of the pressing plate body 21 along the first direction, that is, the elastic guiding member 24 is provided at one end of the pressing plate body 21 close to the blanking end of the workbench track 10, and the lowest height of the elastic guiding member 24 is lower than the height of the lower side surface of the pressing plate body 21. When the substrate 12 slides out from the blanking end of the workbench track 10, if the edge of the substrate 12 warps due to stress release, the elastic guiding member 24 can play a buffering and guiding role, guiding the warped edge of the substrate 12 downward to avoid direct rubbing against the lower side of the pressing plate body 21. By reducing rubbing, the elastic guiding member 24 not only reduces the risk of scratches or damage to the surface of the substrate 12, but more importantly, it avoids damage to the bonding wires on the substrate 12, ensuring the performance and quality of the entire product.

[0047] Furthermore, the elastic guiding members 24 are uniformly arranged along the second direction at one end of the pressing plate body 21 along the first direction, and the second direction is perpendicular to the first direction. Since the elastic guiding members 24 are uniformly arranged along the second direction, when the substrate 12 warps due to internal stress release, the uniformly arranged elastic guiding members 24 can more effectively guide the warped part downward, thereby avoiding rubbing against the lower side of the pressing plate body 21. This not only reduces the risk of scratches or damage to the surface of the substrate 12, but also reduces the possibility of damage to the bonding wires.

[0048] Specifically, the elastic flow guide member 24 includes a second connection portion 241 and a curling portion 242. The second connection portion 241 is detachably connected to the upper side surface of the pressing plate body 21. One end of the curling portion 242 is connected to the second connection portion 241, and the other end curls inward. The height of the middle section of the curling portion 242 is lower than the lower side surface of the pressing plate body 21. The detachable connection of the second connection portion 241 to the upper side surface of the pressing plate body 21 enables the elastic flow guide member 24 to be conveniently installed or disassembled as required. The curling design of the curling portion 242 enables the elastic flow guide member 24 to generate a certain elastic deformation when the substrate 12 passes through, thereby playing a role in buffering and guiding. The height of the middle section of the curling portion 242 is lower than the lower side surface of the pressing plate body 21, ensuring that when the substrate 12 slides out from the discharging end of the workbench track 10, even if the edge of the substrate 12 warps due to stress release, the curling portion 242 can effectively guide it under the pressing plate body 21 to avoid scratching the lower side of the pressing plate body 21. Optionally, the second connection portion 241 can be detachably connected to the upper side of the pressing plate body 21 by screws or buckles.

[0049] Compared with the prior art, in the anti-warping pressing plate of the present utility model, by providing an elastic abutting member on the lower side of the pressing plate body, when the pressing plate body is pressed down, the elastic abutting member can first contact the substrate and gradually increase the elastic force on the substrate until the pressing strip is completely pressed against the upper side of the substrate, effectively reducing or avoiding the generation of cavities between the substrate and the vacuum adsorption plate, thereby ensuring that the substrate is stably and tightly adsorbed on the vacuum adsorption plate, improving the processing accuracy and efficiency.

[0050] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims

1. A warping prevention pressing plate, characterized in that, Comprising: A pressing plate body, a pressing strip and an elastic abutting member are provided on the lower side of the pressing plate body, and the lowest height of the elastic abutting member is lower than the lowest height of the pressing strip; the elastic abutting member includes: a first connecting portion and a bending portion, a through hole for passing through the bending portion is provided on the pressing plate body, the first connecting portion is detachably connected to the upper side surface of the pressing plate body, and the bending portion extends downward from the pressing plate body through the through hole.

2. The anti-warping pressing plate according to claim 1, wherein There are at least two elastic abutting members.

3. The anti-warping pressing plate according to claim 1, characterized in that The elastic abutting member is a spring piece.

4. The anti-warping pressing plate according to claim 1, wherein The elastic abutting members are arranged uniformly in the first direction.

5. The anti-warping pressure plate according to claim 1, characterized in that: An elastic diversion member is further provided at one end of the pressing plate body in the first direction, and the lowest height of the elastic diversion member is lower than the height of the lower side surface of the pressing plate body.

6. The anti-warping pressure plate according to claim 5, characterized in that: The elastic diversion members are arranged uniformly in the second direction at one end of the pressing plate body in the first direction, and the second direction is perpendicular to the first direction.

7. The anti-warping pressing plate according to claim 5, wherein, The elastic diversion member includes: a second connecting portion and a curling portion, the second connecting portion is detachably connected to the upper side surface of the pressing plate body, one end of the curling portion is connected to the second connecting portion, the other end curls inward, and the height of the middle curling portion is lower than the lower side surface of the pressing plate body.

8. A substrate processing apparatus, characterized in that, Comprising the anti-warping pressing plate according to any one of claims 1-7, further comprising a workbench track, a substrate, and a vacuum adsorption plate, two side edges of the substrate are slidably connected to the workbench track, the anti-warping pressing plate is located above the substrate and is connected with a downward pressing driving device, the vacuum adsorption plate is located below the substrate and is connected with an upward driving device, and the substrate moves in the first direction on the workbench track.

9. A substrate processing apparatus according to claim 8, wherein A material collecting frame is provided on the lower side of one end of the workbench track.

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